JPH03200525A - Bottom material mark system - Google Patents

Abstract

PURPOSE:To make it possible to mark a defective part of a bottom material or embossed part at every designated quantity by a method wherein a marking device, which marks an applicable part on a bottom material conforming to e signal from a counter or inspection section, is equipped. CONSTITUTION:When a defective part is detected on a manufactured bottom material 71 by an embossed bottom part inspection device 53, flange part inspection device 54, embossing pitch inspection device 55, position inspection device 60 or punch hole inspection device 30, etc., defective signals for the bottom material from these inspection devices 53, 54, 55, 60, 30 are transmitted to a cylinder control unit 65. By the cylinder control unit 65, a pressing cylinder 22a is operated, a plurality of embossed parts 72 in the vicinity of the defective part are crushed between the pressing cylinder 22a and a bearing body 22b. Thus, defective parts of the bottom material 71 are marked, and marking is placed at every designated quantity of embossed parts, excepting these defective parts. By this method, the product accuracy can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Objective of the Invention] (Industrial Application Field) The present invention is a bottom material marking system for marking defective portions or embossed portions of a predetermined number of bottom materials of an electronic component carrier.

(Prior Art) Conventionally, electronic component carriers made of synthetic resin are known that package and transport a large number of electronic components such as ICs.

This electronic component carrier includes a bottom material that accommodates electronic components such as ICs, and a flat lid material that covers the bottom material. Among these, the bottom material consists of an embossed part of the electronic component carrier and a flange part opening at the upper end of the embossed part, and the lid material is heat-sealed to this flange part. Further, a large number of embossed portions are provided in 111 consecutive rows, and each embossed portion is connected by a flange portion at an opening at the upper end of the embossed portion.

In the electronic component carrier having such a configuration, the IC
Electronic components such as the above are housed in each embossed portion of the bottom material, and then a flat lid material is heat-sealed to the flange portion of the bottom material to package the electronic components.

(Problems to be Solved by the Invention) By the way, the above-mentioned bottom material is made by using a synthetic resin sheet plate as a material, forming an embossed part on this sheet plate using a forming device, and further forming punch holes using a punching device. Created by Among these, the punch holes are for transporting the bottom material, and are formed continuously at a predetermined pitch in the flange portion adjacent to the embossed portion.

However, when creating a bottom material from a sheet plate, the molded embossed portions or punched holes may have poor molding thickness, molding pitch, or the like. Further, there are cases where it is desired to group the created bottom material into a predetermined number of embossed portions.

The present invention has been made in consideration of these points,
It is an object of the present invention to provide a bottom material marking system capable of marking defective portions or embossed portions of a predetermined number of bottom materials.

[Structure of the invention]

(Means for Solving the Problems) The present invention includes a counter that sequentially counts the number of embossed portions of a synthetic resin bottom material to be transferred until a predetermined number is reached;
When a predetermined number of embossed portions are counted by the inspection device that inspects the quality or defectiveness of the bottom material and the counter,
or a marking device that marks a corresponding portion of the bottom material based on a signal from the counter or the inspection section when a defect in the bottom material is discovered by the inspection device. It is a material mark system.

(Function) According to the present invention, it is possible to easily and easily mark each predetermined number of embossed portions and defective portions of the created bottom material.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

First, the electronic component carrier will be explained with reference to FIGS. 7 and 8. In FIGS. 7 and 8, the electronic component carrier 70 includes a bottom material 71 that accommodates an electronic component 77 such as an IC, and a lid material 75 that covers the bottom material 71. Also, bottom material 7
1 consists of an embossed part 72 for storing electronic parts and a flange part 73 opening at the upper end of the embossed part 72, and the lid member 75 is heat-sealed to this flange part 73.

The embossed portions 72 are continuously provided in 711 rows, and each embossed portion 72 is connected to each other by a flange portion 73 having an opening at the upper end.

The bottom material 71 is formed by vacuum or pressure forming, for example, a sheet plate made of vinyl chloride or polystyrene, while the lid material is made of a laminated sheet made of synthetic resin. Further, a plurality of punch holes 74 are continuously provided in the flange portion 73 adjacent to the embossed portion 72 . This punch hole 74 is
This is for transporting the bottom material 71.

Next, regarding the bottom material manufacturing apparatus for an electronic component carrier (Brief explanation of the drawings) In FIG. 14, forming device 15, cooling device 16, punching device 1
7, feeding section 18, dancer roll 19, inspection unit 20
．． Slitting device 21, punch hole inspection device 30. It is constructed by sequentially arranging a marking device 22, a tension roll 24, and a roll 23.

Among these, the heating device 14 is a one-stage heating device 14a.

It consists of a two-stage heating device 14b and a three-stage heating device 14c, and is configured to heat the sheet plate 51 in three stages. Also, a first stage heating device 14a.

The two-stage heating device 14b and the three-stage heating device 14c have similar configurations, each consisting of a lower heating mold 28 and two upper heating molds.

The molding device 15 also includes a lower molding mold 32 and an upper molding mold 34.
An embossed portion 72 is formed on the sheet plate 51. Further, the punching device 17 includes a punch lower mold 41 and a punch upper mold 45, and is adapted to form a punch hole 74 in the flange portion.

Next, the bottom material marking system according to the present invention will be explained in detail with reference to FIGS. 1 to 4. Here, FIG. 1 is a diagram showing the bottom material mark system, and in FIG. 5, the dancer roll 1
9 is an enlarged view showing the downstream side of FIG.

In FIG. 1, inside the inspection unit 20, there are embossed bottom inspection devices 5 in order from the upstream side in the direction of conveying the bottom material.
3. A flange inspection device 54, an emboss pitch inspection device 55, a position inspection device 60°, and a counter 63 are arranged.

Of these, the embossed bottom inspection device 53 and the flange section inspection device 54 inspect the thickness of the embossed section 72 and the flange section 73, respectively, and both are constructed of trimetrons or the like.

The emboss pitch inspection device 55 is for inspecting the pitch of the embossed portions 72, and includes an upper mold 56 provided above the bottom material 71 and having a protrusion 56a having a shape corresponding to the embossed portions 72, and It consists of a lower pipe 57 provided in the lower pipe 57. To inspect the pitch of the embossed portion 72, the upper die 56 is lowered. And embossed part 7
2, if the pitch of the upper mold 56 is off, the bottom material 7
1 against the lower pipe 57, and the lower pipe 5 due to the pressing force
A defective emboss pitch is detected based on the displacement of 7.

Further, as shown in FIG. 2, the position inspection device 60 inspects the positional relationship between the embossed part 72 and the punched hole 74, and is provided above the bottom material 71 and has a protrusion corresponding to the embossed part 72. 61a and a protrusion 61b having a shape corresponding to the notch hole 74, and a lower tube 62 provided below the bottom member 61. When inspecting the positional relationship between the embossed part 72 and the border hole 74,
The upper mold 61 is lowered. If the positional relationship between the embossed part 72 and the edge hole 74 is misaligned, the upper die 61 presses the bottom material 71 against the lower tube 62, and the displacement of the lower tube 62 due to this pressing force causes A positional defect between the embossed portion 72 and the punched hole 74 is detected.

Further, the counter 63 is configured to hold the embossed portion 72 that is being transferred
The number of shots is counted sequentially using a feed shot method.

Furthermore, near the downstream side of the inspection unit 20, there is a feed roll 25 that transfers the bottom material 71 intermittently, for example, two shots at a time.
is provided.

Next, the punch hole inspection device 30 and the marking device 22 will be described in detail.

As shown in FIGS. 3 and 4, a punch hole inspection device 30
is for inspecting the pitch of the punch holes 74 in the bottom material 71. That is, the snap hole inspection device 30 includes a pin roll 31 provided below the flange portion 73 of the bottom material 71,
A presser roll 35 is provided above the flange part 73 and presses the flange part 73 between it and the pin roll 31.

The outer circumferential surface of the pin roll 31 has a notch edge hole 7 of the bottom material 71.
The pins 32 that are successively arranged within 4 are arranged at a predetermined interval (pitch).
There are multiple locations. Further, the pin roll 31 is configured to rotate around a shaft 33.

On the other hand, the presser roll 35 has a generally H-shaped cross section as shown in FIG. 4, and a space 38 is formed from the outer peripheral surface toward the radial inward direction into which the pin 32 of the pin roll 31 enters.

The presser roll 35 rotates around a shaft 39, and bearings 36 at both ends of the shaft 39 are supported by a moving shaft 37. The moving shaft 37 is vertically movable and is always pressed downward by a spring 40 attached to a stopper 41. Further, a detection section 43 for position detection is attached to the moving shaft 37, and a proximity switch 42 is further provided outside the detection section 43.

In addition, as shown in FIG. 1, the marking device 22 is for crushing a predetermined embossed portion 72, and includes a suppression cylinder 22a provided below the bottom material 71 and a receiver provided above the bottom material 71. It consists of a body 22b. Further, the pressing cylinder 22a is driven and controlled by a cylinder control device 65.

In addition, as shown in FIG. 1, an embossed bottom inspection device 53
, flange inspection device 54, embossed pitch inspection device 5
5. Position inspection device 60. Both of the punch hole inspection device 30 and the punch hole inspection device 30 are electrically connected to the cylinder control device 65. Further, the counter 63 is electrically connected to a cylinder control device 65.

Next, the operation of this embodiment will be explained.

First, the manufacturing process of the bottom material of the electronic component carrier will be explained.

A sheet plate 51 made of vinyl chloride or polystyrene is continuously supplied from the roll 11 and transferred to the heating device 14 through the dancer roll 12 and the preheating roll 13 . The sheet plate 51 is a first-stage heating device 14a and a second-stage heating device It14b of the heating device 14.

Then, they are heated one after another by the three-stage heating device 14c.

The sheet plate 51 that is continuously transferred from the roll 11 is intermittently transferred from the preheating roll 13 to the feeding section 18 and undergoes various treatments. Furthermore, after that, it is intermittently transferred to the feed roll 25 for various inspections, and then continuously transferred to the roll 23 again. It is carried out by 19.

The sheet plate 51 is transferred to a forming device 15, and in this forming device 15, the embossed portion 7 of the bottom material 71 is formed on the sheet plate 51.
2 and guide opening lower 9 (FIG. 6) are molded. This guide opening lower 9 is connected to the sheet plate 5 in the punching device 17.
It is used when positioning 1. In addition, sheet plate 5
The portion other than the embossed portion 72 of No. 1 becomes the flange portion 73 as it is.

Next, the sheet plate 51 is transferred to the cooling device 16 to be cooled, and then transferred to the punch device 17, where the embossed portion 7
A punch hole 74 is continuously formed in the flange portion 73 adjacent to the flange portion 2 .

In this way, the bottom material 71 having multiple rows, for example, four rows of embossed portions 72 and corresponding punch holes 74, as shown in FIG. 6, is formed. Next, this multi-row bottom material 7
1 is transferred from the feeding section 18 to the inspection unit 20 via the dancer roll 19.

In the inspection unit 20, the bottom material 71 is first inspected by the emboss bottom inspection device 53 to see if the bottom of the emboss 72 has a predetermined thickness, and then by the flange inspection device 54 to see if the flange portion 54 has a predetermined thickness. will be examined. These test results are then sent to the cylinder control device 65.

Next, the pitch of the embossed portions 72 of the bottom material 71 is inspected by the embossed pitch inspection device 55. That is, in the emboss pitch inspection device 55, the upper die 56 is lowered and the protrusion 56a is pushed into the emboss portion 72. If the pitch of the embossed portions 72 is off, the upper mold 56 presses the bottom material 71 against the lower receiver 57, and a defect in the emboss pitch is detected by the displacement of the lower receiver 57 due to the pressing force. This test result is then transmitted to the cylinder control device 65.

Subsequently, the bottom material is inspected for the positional relationship between the embossed portion 72 and the punched hole 74 by the position inspection device f60. That is, in the position inspection device 60, the upper mold 61 is lowered to push the protrusions 61a and 61b into the embossed portion 72 and the punch hole 74 peaks, respectively. If the positional relationship between the embossed part 72 and the punched hole 74 is misaligned, the upper mold 61 presses the bottom material 71 against the lower receiver 62, and the embossed part 72 is displaced by the displacement of the lower receiver 62 due to this pressing force. A positional defect between the punch hole 74 and the punch hole 74 is detected. This test result is also sent to the cylinder control device 65.

Subsequently, the bottom material 71 is embossed in the embossed portion 7 by the counter 63.
2 is counted, and when a predetermined number, for example 200, is reached, the result of the count is transmitted to the cylinder control device 65. At the same time, the counter 63 is reset to zero and starts counting again.

In addition, the emboss bottom inspection device 53, the flange portion inspection device 54, and the emboss pitch inspection device v! t55, and if a defect signal from the position inspection device 60 is sent to the cylinder control device 65, and if a defect signal from the punch hole inspection device 30, which will be described later, is sent to the cylinder control device 65, this cylinder control device 65 The pressure cylinder 22a is driven by a signal from the counter 63 as described later, and at the same time the counter 63 is reset to return to zero.

Subsequently, the multi-row bottom material 71 is transferred from the feed roll 25 to the slitting device 21, and the slitting device 21 cuts the flange portion 73 in the transfer direction to divide each row, and then the bottom material 71 is punched with holes. It is moved to the inspection device 30.

When the bottom material 71 is transferred to the punch hole inspection device 30, the bottles 32 of the bottle roll 31 are sequentially inserted into the punch holes 74, and the bottle roll 31 rotates around the shaft 33. In this case, the flange portion 73 of the bottom material 71 is pressed by the outer circumferential surface portion of the bottle roll 31 other than the bins 32 and the outer circumferential surface of the presser roll 35, so that the presser roll 35 also rotates around the shaft 39. Further, since the bins 32 of the bin roll 31 compressed in the bunch holes 74 enter the space 38 west, the bins 32 do not come into contact with the outer peripheral surface of the presser roll 35.

If punch holes 74 are formed in the flange portion 73 at a pitch different from the predetermined pitch, the bins 32 of the bottle roll 31 cannot enter the defective punch holes 74 . Therefore, the bottom material 71
The flange portion 73 of is lifted upward by the bottle 32, and thereby the presser roll 35 is also lifted upward by the flange portion 73 against the suppressing force of the spring 40. In this case, the three shafts, the bearing part 36, and the moving shaft 37 move upward together, and the movement of the moving shaft 37 is detected by a detection device constituted by a proximity switch 42 and a detection part 43. . This test result is then transmitted to the cylinder control device 65.

Subsequently, the bottom material 71 is transferred to the marking device 22,
A predetermined embossed portion 72 of the bottom material 71 is crushed.

The operation of the marking device 22 will be described in detail below.

First, during normal operation, the number of embossed portions 71 on the bottom material 71 is counted by the counter 63 as described above, and when the number reaches, for example, 200, the count result is transmitted to the cylinder control device 65. And the cylinder control device 65
As a result, the pressing cylinder 22a is driven, and a plurality of, for example, 2 to 3, corresponding embossed portions 72 are crushed between the pressing cylinder 22a and the receiver 22b. By marking a predetermined number of 72 embossed portions in this manner, the bottom material 71 can be cut at the marked portions to obtain the bottom material 71 of a predetermined length.

Next, regarding the created bottom material 71, the embossed bottom inspection device 53, the flange inspection device 54, the embossed pitch inspection device 55, the position inspection device 60, or the punch hole inspection device 3
0 etc., if a defective part of the bottom material 71 is detected, these inspection devices 53, 54, 55, 60. and 30, a bottom material failure signal is sent to the cylinder control device 65. In this case, the defect signals from each inspection device 53, 54, 55, 60, and 30 are transmitted with a predetermined delay time corresponding to the distance from the marking device 22. Then, the cylinder control device 65 drives the pressing cylinder 22a, and a plurality of embossed portions 72 near the defective portion are crushed between the pressing cylinder 22a and the receiver 22b. At the same time, a signal from the cylinder control device 65 causes the counter 63 to
is immediately reset to zero, and counting starts again from the subsequent embossed portion 72. Then, as in the case described above, a mark is placed every 200 embossed portions 72, for example.

By marking defective portions of the bottom material 71 in this manner and marking every predetermined number of embossed portions except for the defective portions, it is possible to improve product accuracy.

Next, the four rows of bottom material 71 marked for each predetermined number of embossed portions and defective portions are then rolled onto the roll 2.
It is wound up in 3. In this way, a continuous single row of embossed portions 72, a flange portion 73 that connects the embossed portions 72 to each other, and a single row of punched holes 74 provided in the flange portion 73 in correspondence with the embossed portions 72 are provided. A bottom material 71 is manufactured (FIG. 7).

According to this embodiment, when a defective part occurs in the bottom material 71, the embossed part near the defective part is crushed and marked, and a mark is placed every predetermined number of embossed parts excluding the defective part. , it is possible to obtain a bottom material of a predetermined length with high product precision.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to mark each predetermined number of embossed portions and defective portions of the produced bottom material. Therefore, by subsequently cutting this mark portion, a bottom material of a predetermined length with high product precision can be obtained quickly and reliably.

[Brief explanation of drawings]

Fig. 1 is a schematic system diagram showing one embodiment of the mark system according to the present invention, Fig. 2 is a view of the position inspection device viewed from the downstream side in the direction of transporting the bottom material, and Fig. 3 shows the punch hole inspection device. 4 is a sectional view thereof, FIG. 5 is a schematic diagram showing a bottom material manufacturing apparatus for an electronic component carrier, and FIG. 6 is a plan view showing a multi-row bottom material. , FIG. 7 is a partial perspective view of the electronic component carrier, and FIG. 8 is a sectional view taken along the line ■-■ in FIG. 10... Bottom material manufacturing device, 11... Roll, 12...
Dancer roll, 14... heating device, 15... forming device, 17... punching device, 20... inspection unit,
21... Slit device, 22... Marking device,
23... Roll, 30... Punch hole inspection device, 51.
... Sheet plate, 53 ... Embossed bottom inspection device, 54
...Flange part inspection device, 55... Emboss pitch inspection device, 60... Position inspection device, 63... Counter, 65... Cylinder control device, 71... Bottom material, 7
2... Embossed part, 73... Flange part, 74...
・Punch holes. Applicant's agent Yutsukuda Sato

Claims (3)

[Claims] 1. a counter that sequentially counts the number of embossed portions of the synthetic resin bottom material to be transferred until a predetermined number is reached; an inspection device that inspects whether the bottom material is good or defective; and a predetermined number of embossed portions that are counted by the counter. or when a defect in the bottom material is found by the inspection device, a marking device that marks the corresponding part of the bottom material based on the signal from the counter or the inspection section. Bottom material mark system. 2. 2. The bottom material marking system according to claim 1, wherein the marking device comprises a pressing cylinder that crushes the embossed portion of the corresponding portion of the bottom material. 3. 2. The bottom material marking system according to claim 1, wherein the counter returns to zero when a defect in the bottom material is discovered by the inspection section.