JPH0320070A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0320070A JPH0320070A JP1155386A JP15538689A JPH0320070A JP H0320070 A JPH0320070 A JP H0320070A JP 1155386 A JP1155386 A JP 1155386A JP 15538689 A JP15538689 A JP 15538689A JP H0320070 A JPH0320070 A JP H0320070A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pellet
- recess
- semiconductor
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は，半導体ペレット及び放熱基板を含む主要部分
を被覆し，外装した半導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor device whose main parts including a semiconductor pellet and a heat dissipation substrate are coated and packaged.
従来の技術
第６図及び第７図は樹脂モールド型半導体装置の一例を
示すもので、９は半導体ペレット１０を固定した放熱基
板である。１１は図示例では３本１組のリードで中夫の
リード１１１Ｌ’ｉ基板９と一体化し，両側のリード１
１ｂ，１１ａの一端をペレット１０の近傍に配置してい
る。１２はペレット１０とリード１１ｂ，１１Ｃとを電
気的に接続した金属細線、１３はペレット１０１ｋ含む
主要部分を樹脂材にて被覆し、外装した樹脂外装部を示
すＯ
発明が解決しようとする課題
第６図及び第７図の半導体装置は、ペレット１０の発生
熱を効率よく放出するために外部の放熱器に取付穴１３
１Ｌ’ｉ利用して固定される。この場合、第６図に示す
ように半導体装置と放熱器１４は取付穴１３１Ｌ’ｉ利
用してネジ１６で固定し、さらに熱抵抗を低下させるた
めに放熱器１４との間にシリコーングリス等を充填して
いる。これによ９半導体ベレッｌ− １ ０ＩＩｉ，放
熱性の良好な放熱器１４に固定されるが、取付作業が煩
雑であるという欠点があった。BACKGROUND ART FIGS. 6 and 7 show an example of a resin molded semiconductor device, in which numeral 9 denotes a heat dissipation substrate on which a semiconductor pellet 10 is fixed. In the illustrated example, 11 is a set of three leads, and is integrated with the lead 111L'i board 9 of the middle man, and the leads 1 on both sides.
One ends of 1b and 11a are arranged near the pellet 10. Reference numeral 12 indicates a thin metal wire electrically connecting the pellet 10 and leads 11b and 11C, and reference numeral 13 indicates a resin exterior part in which the main part including the pellet 101k is covered with a resin material. Problem No. 1 to be solved by the invention The semiconductor device shown in FIGS. 6 and 7 has a mounting hole 13 in an external heat sink in order to efficiently release the heat generated by the pellet 10.
It is fixed using 1L'i. In this case, as shown in FIG. 6, the semiconductor device and the heatsink 14 are fixed with screws 16 using the mounting holes 131L'i, and silicone grease or the like is applied between the semiconductor device and the heatsink 14 to further reduce thermal resistance. It's filling. Although this allows the nine semiconductor bellets l-10IIi to be fixed to the radiator 14 with good heat dissipation, there is a drawback that the installation work is complicated.
そのため，半導体装置と放熱器１４をクリップ等で固定
し，作業性を良好にしたものがある。For this reason, there are some devices in which the semiconductor device and the heat sink 14 are fixed with a clip or the like to improve workability.
本発明は、そのような作業性向上の流れに沿って、半導
体装置の外装形状に工夫を施し，半導体装置と外部放熱
器をよシ確実に固定することを目的とするものである。The present invention aims to improve the exterior shape of a semiconductor device and more reliably fix the semiconductor device and an external heat sink in line with the trend of improving workability.
課題を解決するための手段
本発明は，放熱基板上に載置した半導体ペレットと一端
を半導体ペレットの近傍に配置したリードとを電気的に
接続し、半導体ペレット並びに放熱基板を含む主要部分
を樹脂材にて外装したものにおいて、その外装部に凹部
を形成し、外部放熱器への取付けを確実にさせたもので
ある。Means for Solving the Problems The present invention electrically connects a semiconductor pellet placed on a heat dissipation board to a lead whose one end is placed near the semiconductor pellet, and molds the main parts including the semiconductor pellet and the heat dissipation board using resin. In this case, a concave portion is formed in the exterior part of the external heat sink to ensure secure attachment to an external radiator.
作用
この構成によク、半導体装置を外部放熱器へクリップ等
で固定しようとする場合、半導体装置の外装部に施され
た凹部を利用して外部放熱器へ固定することとなる。Function: According to this configuration, when the semiconductor device is to be fixed to the external heat sink using a clip or the like, the recess formed in the exterior portion of the semiconductor device is used to fix the semiconductor device to the external heat sink.
実施例
第１図は，本発明の一実施例による半導体装置の一部透
視平面図，第２図は側断面図である。第１図及び第２図
にかいて，１は半導体ペレット２を固定した放熱基板で
ある。ａは図示例では３本１組のリードで、中央リード
３ａを基板１と一体化し，両側のリード３ｂ，３０’ｊ
｝リード３ａと平行配列して一端部をペレット２の近傍
に配置している。４はペレット２とリード３ｂ，ａｃと
それぞれ電気的に接続した金属細線、６はペレット２．
リード３の基部、金属細線４を被覆すると共に放熱基板
１の外周面を被覆し、さらに凹部６を施した樹脂外装部
を示す。凹部の形状は、第２図に限定されることなく，
第４図及び第６図でも同様の効果が得られる。Embodiment FIG. 1 is a partially transparent plan view of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a side sectional view. In FIGS. 1 and 2, reference numeral 1 denotes a heat dissipation substrate on which a semiconductor pellet 2 is fixed. In the illustrated example, a is a set of three leads, with the center lead 3a integrated with the substrate 1, and the leads 3b and 30'j on both sides.
}They are arranged in parallel with the lead 3a, and one end is placed near the pellet 2. 4 is a thin metal wire electrically connected to the pellet 2 and the leads 3b and ac, and 6 is the pellet 2.
A resin exterior part is shown that covers the base of the lead 3, the thin metal wire 4, and the outer peripheral surface of the heat dissipation board 1, and is further provided with a recess 6. The shape of the recessed portion is not limited to that shown in FIG.
Similar effects can be obtained in FIGS. 4 and 6.
第３図は，この半導体装置を外部放熱器へ固定した図で
ある。第３図にかいて、半導体装置は外部放熱器Ｔへ凹
部６を利用して，クリップ８で固定されている。FIG. 3 is a diagram of this semiconductor device fixed to an external heat sink. In FIG. 3, the semiconductor device is fixed to an external heat sink T using a recess 6 with a clip 8.
発明の効果
以上のように本発明によれば、半導体装置を外部放熱器
へクリップ等で固定しようとする場合、半導体装置の外
装部に施された凹部を利用することによク、クリップ等
の抜け落ちを防止でき，半導体装置と外部放熱器との確
実な固定が可能になるという効果が得られる。Effects of the Invention As described above, according to the present invention, when a semiconductor device is to be fixed to an external heatsink using a clip or the like, the recess provided in the exterior of the semiconductor device can be used to secure the semiconductor device to an external heatsink. It is possible to prevent the semiconductor device from falling off, and it is possible to securely fix the semiconductor device and the external heat sink.
第１図は本発明の一実施例による一部透視平面図、第２
図は第１図の▲−▲の断面図、第３図は第１図の半導体
装置の取付例を示す側面図、第４図及び第６図は本発明
の変形例を示す側面図、第６図は半導体装置の一例を示
す一部透視平面図，第７図は第６図のＢ−８の断面図、
第８図は第ｅ図の半導体装置の取付例を示す側断面図で
ある。
１．９・・・・・・放熱基板，２．１０・・・・・・半
導体ペレット，３．１１・・・・・・リード，４．１２
・・・・・・金属細線，５，１３・・・・・・樹脂外装
部、６・・・・・・凹部，７．１４・・・・・・外部放
熱器，８・・・・・・クリップ，１５・・・・・・ネジ
。FIG. 1 is a partially transparent plan view according to an embodiment of the present invention, and FIG.
The figure is a sectional view taken along line ▲-▲ in Figure 1, Figure 3 is a side view showing an example of mounting the semiconductor device in Figure 1, Figures 4 and 6 are side views showing modifications of the present invention, 6 is a partially transparent plan view showing an example of a semiconductor device, FIG. 7 is a sectional view taken along line B-8 in FIG. 6,
FIG. 8 is a side sectional view showing an example of how the semiconductor device shown in FIG. e is mounted. 1.9... Heat dissipation board, 2.10... Semiconductor pellet, 3.11... Lead, 4.12
...Metal thin wire, 5, 13...Resin exterior part, 6...Recess, 7.14...External heat sink, 8...・Clip, 15...screw.
Claims (1)
レットの近傍に配置したリードとを金属細線で接続し、
前記半導体ペレット並びに前記放熱基板を含む主要部分
を樹脂材にて外装したものにおいて、その外装部に凹部
を形成し、外部放熱器への取付けを確実にさせたことを
特徴とする半導体装置。A semiconductor pellet placed on a heat dissipation board and a lead with one end placed near the semiconductor pellet are connected with a thin metal wire,
1. A semiconductor device in which the main parts including the semiconductor pellet and the heat dissipation substrate are packaged with a resin material, and a recess is formed in the package to ensure attachment to an external heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155386A JPH0320070A (en) | 1989-06-16 | 1989-06-16 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155386A JPH0320070A (en) | 1989-06-16 | 1989-06-16 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320070A true JPH0320070A (en) | 1991-01-29 |
Family
ID=15604818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1155386A Pending JPH0320070A (en) | 1989-06-16 | 1989-06-16 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320070A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247055B2 (en) * | 1981-01-20 | 1990-10-18 | Japan Radio Co Ltd |
-
1989
- 1989-06-16 JP JP1155386A patent/JPH0320070A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247055B2 (en) * | 1981-01-20 | 1990-10-18 | Japan Radio Co Ltd |
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