JPH03201534A - Formation of wiring pattern composed of buried metal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of forming a wiring pattern made of embedded metal.

[Conventional technology]

Conventionally, in the manufacturing process of semiconductors such as LSI and thin film devices, when forming a wiring pattern made of embedded metal on an insulating substrate such as glass, for example, a groove or hole for wiring is formed on the surface of the substrate, and the groove or hole is A method of forming a wiring pattern by embedding metal in the substrate using a lift-off method or a constant-speed etch-back method is used.

[Problem to be solved by the invention]

However, since the lift-off method is a method of removing the wiring metal 4 on the substrate 2 in which the groove (or hole) 1 is formed together with the resist 3 as shown in FIGS. 2(a) and 2(b),
There is a problem in that burrs 5 are likely to occur at the edge portions of the wiring pattern. Furthermore, the constant velocity etchback method is shown in Figure 3(a).
As shown in ~(C), this is a method of applying a flattening coating agent 6 to the surface of the wiring metal 4 and etching back.
There is a problem in that it is difficult to find uniform etching conditions for the wiring metal 4 and the planarizing coating 6.

The present invention has been made in view of the above-mentioned circumstances, and its object is to provide a method for forming a wiring pattern made of embedded metal, which can form a wiring pattern made of embedded metal on a substrate.

[Means to solve the problem]

In order to solve the above problems, the present invention forms a metal layer for wiring on a substrate in which grooves or holes are formed, and after flattening the surface of the metal layer by irradiating this metal layer with laser light. ,
The metal layer is etched in the thickness direction.

[For production]

That is, in the present invention, the surface of the wiring metal layer is flattened (reflowed) using a laser beam, and then the metal layer is etched in the thickness direction, so that the wiring metal can be easily filled into the grooves or holes formed in the substrate. It is possible to form a wiring pattern made of embedded metal on the substrate.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1(a) to 1(d).

In FIGS. 1(a) to 1(d), reference numeral 11 is an insulating substrate made of glass or the like, and in order to form a wiring pattern made of embedded metal on this substrate 11, first, as shown in FIG. 1(a), A predetermined pattern of grooves (or holes) 12 is formed on the surface of the substrate 11.

Next, as shown in FIG. 1(b), a wiring metal layer 13 made of aluminum or the like is formed on the substrate 11 by a method such as vapor deposition, and then the surface of this metal layer 13 is irradiated with laser light. When the surface of the metal layer 13 is irradiated with laser light in this manner, the surface portion of the metal layer 13 is melted, and the surface of the metal layer 13 is flattened as shown in FIG. 1(C).

Next, after the metal on the surface portion of the metal layer 13 is solidified, the metal layer 13 is etched in the thickness direction. In this way, metal layer 1
When the metal layer 13 is etched in the thickness direction after the surface of the substrate 3 is planarized, the metal layer 13 on the substrate 11 is removed as shown in FIG.
A wiring pattern consisting of the following is formed.

As described above, in the above embodiment, since the surface of the metal layer 13 is flattened by a laser beam and then the metal layer 13 is etched in the thickness direction, the groove 12 formed in the substrate 11 can be easily filled with metal. Embedded metal 14 on the substrate 11
A wiring pattern consisting of the following can be formed.

Note that the present invention is not limited to the above embodiments,
Various modifications can be made without departing from the spirit of the invention.

〔Effect of the invention〕

As explained above, in the present invention, a metal layer for wiring is formed on a substrate in which grooves or holes are formed, and after flattening the surface of the metal layer by irradiating this metal layer with laser light, The metal layer is etched in the thickness direction. Therefore, the wiring metal can be easily embedded in the groove or hole formed in the substrate, and a wiring pattern made of the embedded metal can be formed on the substrate.

[Brief explanation of drawings]

FIGS. 1(a) to (d) are process diagrams for forming a wiring pattern showing one embodiment of the present invention, FIGS. 2(a) and (b) are explanatory diagrams of the lift-off method, and FIGS. 3(a) to ( C) is an explanatory diagram of the constant velocity etch-back method. DESCRIPTION OF SYMBOLS 11... Substrate, 12... Groove, 13... Metal layer for wiring, 14... Embedded metal. Part 1: Part 3

Claims (1)

[Claims] A metal layer for wiring is formed on a substrate in which grooves or holes are formed, and the metal layer is irradiated with a laser beam to flatten the surface of the metal layer, and then the metal layer is etched in the thickness direction. A method for forming a wiring pattern made of embedded metal, characterized by: