JPH03205841A - Assembling apparatus for probe card - Google Patents

Abstract

PURPOSE:To obtain an assembly in which a length from a ring of a measuring stylus to a bonding pad is made substantially constant even in the case of two semiconductor chips disposed at obliquely deviated positions by disposing an arrow feather state and a sector state of specific shapes at specific positions. CONSTITUTION:Arrow feather states 11, 12 having parallel linear parts spaced at a predetermined distance (d) in directions of extension lines 3, 4 of two diagonal lines parallel to the sides of rectangular shapes 1, 2 existing on a region interposed between the lines 3, 4 when diagonal lines passing no vertex P1 of a shared use are written at the shapes 1, 2 with the vertex P1 as the center of a point symmetry, are disposed, and sector states 13-16 having bent and linear parts so determined as to be spaced substantially at the distance (d) from the sides included in the angular range regions formed of the lines 3, 4 and an extension line 5 of the other diagonal line passing the vertex P1, are disposed in the angular range regions.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a probe card assembly device.

[Conventional technology]

When manufacturing semiconductor devices, especially ICs, a large number of semiconductor chips are formed on a semiconductor wafer at the same time, and the chips are divided into individual chips and then housed in a predetermined package. The electrical characteristics of each chip are measured at the semiconductor wafer stage before being divided into chips. This measurement involves contacting multiple rows of measurement needles (probe needles) attached to a probe cart to the rows of electrode pads (bonding pads) on the surface of the semiconductor chip, and transmitting test signals to the semiconductor chip through these multiple probe needles. This is done by connecting to a measuring device that receives a response signal from the semiconductor chip and measures the electrical characteristics. In this case, for example,
As shown in Publication No. 5, a plurality of probe needles are arranged side by side at a predetermined pitch, and are fixed and supported by a holding part called a ring, which is generally made of epoxy resin and shaped like a frame. ing. In this case, in order to perform accurate measurements by making the measurement conditions the same for each bonding pad of the semiconductor chip, it is necessary to It is desirable that the contact resistance of the measuring needle to the throat be the same for all. For this purpose, it is necessary that all measuring needles from the ring to the bonding pad have the same length. Therefore, 1
The shape of the ring of the probe card for measuring each semiconductor chip is, for example, a concentric ring shape centered on the center position of the semiconductor chip.

[Problem to be solved by the invention]

By the way, in order to increase the throughput of measurements performed with a wafer prober, it is possible to simultaneously test two semiconductor chips at diagonally shifted positions of a plurality of semiconductor chips arranged in a matrix on a semiconductor wafer. has already been implemented. In this case as well, in order to ensure that the contact resistance of all measuring needles to each bonding pad is the same, it is desirable to make all the measuring needles the same length from the ring to the bonding pad. The shape of the ring on the probe card is a problem. In view of the above points, the present invention seeks to provide an assembly that can make the length from the ring of the measuring needle to the bonding pad almost constant even for the diagonal semiconductor chip as described above. It is something to do.

[Means to solve the problem]

The apparatus for assembling a probe card according to the present invention is as follows: When considering two quadrilaterals with one common vertex as the center of point symmetry, and drawing a diagonal line that does not pass through the vertex of the center of point symmetry in each of these quadrilaterals, , in the area sandwiched between the extensions of the two diagonals, is parallel to each side of the quadrilateral that exists in this area, and in the direction of the extension of the diagonals with respect to each side. A barb-shaped part having parallel straight parts separated by a predetermined distance d is arranged, and in an area outside the extension line of the two diagonal lines, the other part passes through the extension line and the vertex that is the center of the point symmetry. In each corner range area formed by the extension line of the diagonal line of It is characterized by being arranged.

[Effect]

If the probe card assembly apparatus according to the present invention as described above is applied to the ring of the probe card, the length of the measuring needle from the ring to the bonding butt of the two diagonal semiconductor chips of the semiconductor wafer can be , becomes almost constant and accurate measurements can be made.

【Example】

Hereinafter, an embodiment of the probe card assembly apparatus according to the present invention will be described with reference to the drawings, taking as an example a case in which a ring of a probe card is constructed. The ring 10 of the probe card in this example has a thickness of, for example, about 1 mm, and supports and fixes a plurality of rows of probe needles (not shown) made of, for example, tungsten, with each tip positioned, using, for example, epoxy resin. It was designed to do so. Usually, a large number of semiconductor chips are regularly arranged in a matrix on a semiconductor wafer. As shown in FIG. 1, the ring 10 has a contour that allows the length of the probe needles from the ring 10 to be approximately constant with respect to the bonding pads of two semiconductor chips located diagonally on the wafer. Shape. In other words, the ring 10 is constructed by considering two quadrilaterals 1 and 2 having a point symmetry center at one vertex P1 corresponding to two diagonal semiconductor chips on the wafer/\, and forming the respective quadrilaterals 1 and 2. When we draw a diagonal line that does not pass through the center vertex P of the point symmetry above, the extension line 3 of these two diagonals,
In the area sandwiched by 4, an arrow-like part 1 is parallel to each side IA, 2A of the above-mentioned quadrilaterals 1, 2 existing in this area, and has a straight portion having the same length as these sides 1Δ2A.
1, and similarly, each side ID existing in this area,
It has an arrow-like part 12 which is parallel to 2D and has a straight part having the same length as these sides ID and 2D. In this case, the distance in the direction of the extension line 3.4 from the sides IA, 2A and ID, 2D to the fletched portion 11.12 is defined as d. Further, extension lines 3 and 4 of the above two diagonal lines of the link 10
In the area outside of the above extension line 3 or 4,
Extension line 5 of the diagonal line passing through the vertex P which is the center of the above point symmetry
In each corner range area formed by, each side IB, IC and 2B, 2 included in each corner range area.
A fan-shaped portion 1314, 1 having a curved portion with a radius of curvature such that the distance from the center 0, 02 of the quadrilateral 1.2 from C when viewed in the normal direction is approximately the distance d.
5.16 is placed. Probe needles are attached from the fletched portions 1]l, 12 of this ring 10 in parallel to the extension line 3.4 of the diagonal line. Further, the sector-shaped portions 13, 14, 15
, 1.6, probe needles are attached in the direction toward the center 01 or 02. Therefore, the length from the ring 10 to the bonding pad, which is the tip of the probe needle, is approximately constant. The ring 10 having the above shape is manufactured as follows. That is, the ring base portion 20 is a jig for manufacturing a ring.
is made of SUS, for example, and as shown in Figure 2A,
A fletching-like member 2 having a contour shape corresponding to the shape of the ring 10
1. , 22 and fan-shaped members 23, 24, 25, and 26 are combined. In this case, the upper surfaces of these fletching members 2], 22 and the fan-shaped members 23 to 26 are
As shown in Figure B, the ring base portion 20 is tapered so that its height gradually decreases toward the center. In the tapered upper surface of the ring base portion 20, the inner circumferential portion having the same shape as the ring 10 is
Step portion 2 that is lower than other portions by, for example, about 0.2 mm
7 and 28. The fletching members 21, 22 are members molded, for example, from SUS, and as shown in FIGS. 3A, B, and C, the straight portions 31, 22 have a length equal to the length of one side of the semiconductor chip and are orthogonal to each other. 32, and these straight portions 31. ,32
A step portion 27 is formed whose height gradually decreases toward the ring 10 and further becomes lower by one step at the position where the ring 10 is formed. It also has a tapped hole 33 for attachment to an assembly ring, which will be described later. Moreover, the fan-shaped members 23 to 26 are designed as follows. That is, first of all, in FIG. 1, taking side 1B as an example, one point in the center and points near both ends of this side IB are taken as representative points, and from these three points, from the ring 10 Three points separated by an equal distance dtE in the direction in which the probe needle is actually led out are determined, and the three determined points are used as sample points. Then, find the radius of the arc that includes these three sample points. This arc is then drawn as 34 in FIG. Assuming that the arc 34 and the center O are the same, the fan-shaped portion 13~]6
An arc 35 up to the stepped portion 28 and an arc 36 forming the outer periphery of the fan-shaped member are drawn. Also, ring 1 from the center of quadrilateral], 2
An arc 37 whose radius is smaller than the arc 34 by the length of 0.
, and line segments 38 and 39 passing through the center O of this circular arc 37 and perpendicular to each other are drawn. Then, find the intersections P2 to P5 between these line segments 38 and 39 and the circular arc 37, and find the intersections P2 to P5.
The fan shape surrounded by thick lines in the figure, which occupies a range of 45 degrees from line segments 38 and 39, is 41.42
, 43.44 find. By cutting out only the sector-shaped parts 41-44, the upper surface shapes of the sector-shaped members 23-26 can be obtained. Therefore, for example, SUS
The target fan-shaped member 23 is shaped as described above, and the fan-shaped members 41 to 44 shown in bold lines in FIG. 4 are cut out.
~26 is obtained. The fan-shaped members 23 to 26 have screw holes 45 and 46 for attachment to assembly links, which will be described later. In manufacturing the ring 10, for example, SUS
The ring base 20 is mounted on the assembly ring 50 as shown in FIGS. ,
The screw holes 40 and 41 of the fan-shaped members 23 to 26 are connected to the screw hole 5.
It is arranged so as to match the positions of 2 and 5.3, and is attached with screws. Next, in the central space of the assembly ring 50 and the ring base 20, a ring die having a shape corresponding to the contours of the two diagonal semiconductor chips and slightly larger than the contours of the two diagonal semiconductor chips is installed. (not shown), and probe needles made of, for example, tungsten are arranged on this ring die. In this case, the position of the tip of the probe needle is regulated by a member called a temptate, and the template is correctly positioned in the rotational direction by the position regulating screw inserted from the insertion hole 54 of the position regulating screw of the assembly ring 50. It is determined. In this assembled state, the step portions 27 and 2
For example, epoxy resin is applied to the portion 8, and a ring member (not shown) made of an insulating material such as ceramic is placed thereon. Then, when this ring member is peeled off from the ring base 20, on the ring member,
A probe needle is supported and fixed by a ring 1o having a contour as shown in FIG. In the above example, in FIG. 1, the contour of the ring 10 with respect to the outer sides IB, IC, 2B, and 2C of the diagonal extensions 3 and 4 of the quadrilateral 1.2 is a curved line having a predetermined radius of curvature. However, this portion may simply have a contour as shown in the following example. That is, the shape of the ring 60 in this example is as shown in FIG. The side IB. IC, 2B,
The outline of the ring 10 for each side IB. I
C. The parts facing 2B and 2C are these sides IB and IC
, 2B, 2C by a distance d, and the remaining portions are a 174 arcuate contour 64 with a radius d centered at the apex position of each of the quadrilaterals 1 and 2, and 1
78 arcuate contour portion 65. 8A, which has the same outline as the ring 60.
The ring molded part 80 as shown in FIGS.
The ring 60 of this example can be manufactured by setting the fitted ring in the assembly ring and following the same process as described above. The ring base portion 70 in this example is designed based on the ring shape for one semiconductor chip, as shown in FIG.
Four sides 7A, 7B, 7 of quadrilateral 7 corresponding to a semiconductor chip
The parts facing C and 7D are straight line contours 72, 73, 74
．． 75, and the remaining parts are 1/4 arcs 76, 77, 78, 79 centered on each node of the quadrilateral 7. A donut-shaped member made of SUS, for example, is cut along the cutting line 91.92.
Cut it into two members 70A and 70B, and then cut these two members and two fletching members 7 to connect them.
It can be easily configured with 0C. Similarly, the ring molding part 80 is made of a donut-shaped member as shown in FIG.
It can be easily constituted by four members: these two members 80A and 80B, and a feather-like member 80C for connecting them. In the above example, the ring base parts 20, 70 and the ring mold part 80 are constructed from a plurality of members, but they may be constructed as an integral body having the above-mentioned outline. Furthermore, it goes without saying that the present invention is applicable to not only square semiconductor chips but also rectangular semiconductor chips.

【Effect of the invention】

As described above, according to the present invention, it is possible to obtain an assembly having a contour spaced from each side of two diagonally adjacent quadrilaterals by a substantially constant distance. Therefore, if this invention is applied to a ring for supporting and fixing the probe needles of a probe card for simultaneously measuring two diagonally adjacent semiconductor chips, the length of the probe needles from the ring to the bonding pad of the semiconductor chip can be reduced. Since the contact resistance of the probe needle to the bonding pad can be made almost the same for all probe needles, accurate measurement is possible. Further, by applying the present invention to a jig for manufacturing links, it is possible to easily manufacture a probe card equipped with a ring capable of performing accurate measurements as described above.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the contour shape of an embodiment of the present invention, FIG. 2A is a top view of an example of a ring base part when manufacturing a ring of a probe card according to the present invention, and FIG. 2B is a The sectional view taken along the line A-A, FIGS. 3 and 4 are diagrams for explaining examples of some constituent members of the link heirth portion, and FIG. 5A is a top view of an example of the assembly ring. , 5th
Figure B is a sectional view thereof, Figure 6 is a diagram showing the contour shape of another example of the present invention, Figure 7A is a top view of the ring base part of another example, and Figure 7B is its f3 -B sectional view, Figure 8A
is a top view of an example of the link molding part, and FIG. 8B is its C.
-C line sectional view, FIG. 9 is a diagram for explaining the members constituting the ring base part of the example in FIG. 7, and FIG. 10 is a diagram for explaining the members constituting the link or mold part. be. 1, 2; quadrilateral 3, 4; diagonal extension line that does not pass through point P1 5; term point P
1; the rings 1.1, 12 of the probe card; the fletched portions 13-16; the sector portions 20, 70; the ring base portions 21, 22. Flap-shaped members 23 to 26; fan-shaped member 80; ring molding part

Claims (1)

[Claims] If we consider two quadrilaterals with one common vertex as the center of point symmetry, and if we draw a diagonal in each of these quadrilaterals that does not pass through the vertex of the center of point symmetry, then the two quadrilaterals In the area sandwiched by extensions of the diagonals of In the area outside the extension line of the two diagonals, the extension line and the extension line of the other diagonal line passing through the apex that is the center of the point symmetry are arranged. In each of the corner range regions formed, a fan-shaped portion having a curved line and/or a straight line portion is arranged so as to be approximately the distance d apart from each side included in each corner range region. Assembling equipment for probe cards.