JPH0320902B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to the structure of a laminated stack of flat semiconductor elements used in a semiconductor rectifier.

[Prior Art] FIGS. 1 and 2 are front and side views showing the structure of a laminated stack of flat semiconductor elements conventionally used in semiconductor rectifiers.

In these figures, a plurality of flat semiconductor elements 1
are stacked with cooling fins 2 disposed at both ends thereof, and one cooling fin 2 at the stacked end.
is pressed by a spring 5 disposed between it and the lower press plate 9 via an insulating spacer 3A and a spring guide 4, and the other cooling fin 2 is pressed against the center part of the upper press plate 8 via an insulating spacer 3B and a steel ball 6. The upper presser plate 8 and the lower presser plate 9 are pressed by the insulating bolt 1.
0, they are connected and fixed at appropriate intervals. Further, an L-shaped metal fitting 12 is fixed to the lower presser plate 9, and a rod 11 passing through the center of the lower presser plate 9 is fixed to the spring guide 4. ball 6
When the insulating spacer 3B is pressed through the insulating spacer 3B, the flat semiconductor element 1 and the cooling fin 2 are pressed together by the reaction force of the spring 5, and the pressing force at this time is measured by the gap 13 between the tip of the rod 11 and the metal fitting 12. It is configured so that it can be detected by

Therefore, in a laminated stack having such a structure, the gap 13 between the tip of the rod 11 and the metal fitting 12 is
By managing this, it is possible to manage the appropriate pressure contact force of the flat semiconductor element 1. For example, when replacing element 1 due to deterioration, spring 5
By loosening the pressure bolt until the reaction force disappears, the element 1 can be replaced, and after replacement, by tightening the pressure bolt 7 until the gap 13 reaches the specified value, the element 1 can be replaced without using a special pressure gauge, etc. The pressure welding state can be the same as before replacing the element.

However, in such a structure, the pressure bolt 7, metal fitting 12, and rod 11 protrude outward from the holding plates 8 and 9, so in a large-capacity semiconductor rectifier that uses a large number of such laminated stacks, the entire device is The drawback was that it became large and uneconomical.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a laminated stack that can reduce the size of the entire semiconductor rectifier device.

[Summary of the invention]

In the present invention, the pressure bolt and the gap measuring section are arranged inside the holding plate.

[Embodiments of the invention]

3 to 5 are views showing an embodiment of the present invention, in which FIG. 3 shows a front view of a laminated stack, FIG. 4 shows a side view thereof, and FIG. 5 shows a plan view of a spring guide. ing.

In FIGS. 3 and 4, the flat semiconductor element 1, the cooling fins 2, and the insulating spacers 3A, 3B are
As in the past, the upper holding plate 8 and the lower holding plate 9 are stacked in a straight line with insulating bolts 10, and the insulating spacers 3A and 3B are connected to the pressure bolt 7 and the spring through the spring guide 4 and the steel ball 6. 5 and is pressed by.

However, the pressure bolt 7 here is screwed into the upper presser plate 8 so that its head is inside the upper presser plate 8, and the head is provided with a conical notch so that the steel ball 6 and the insulating spacer 3B.

On the other hand, as shown in FIGS. 3 and 5, the spring guide 4 is provided with a through hole 14 passing through its center in the axial direction, and a rod fixed to the lower holding plate 9 and protruding inside the plate 9. 11 into this through hole 1
4, and is configured such that the gap 13 between the tip of the rod 11 and the insulating spacer 3A can be measured in a recess 15 formed in the center of the spring guide 4.

Therefore, in such a structure, by rotating the pressure bolt 7, the element 1 and the cooling fin 2 can be brought into pressure contact with each other with an appropriate contact force by the reaction force of the spring 5. The pressure contact force can be detected by measuring the gap 13 between the tip of the rod 11 protruding inside the lower holding plate 9 and the insulating spacer 3A, and the pressure contact force can be detected by applying pressure inside the upper holding plate 8. Adjustment can be made by rotating the head of the pressure bolt 7. In other words, the same functions as conventional ones can be obtained. However, here the pressure bolt 7
Since the gap measuring section corresponding to the deflection measuring section of the spring 5 is arranged inside the upper holding plate 8 and the lower holding plate 9, the maximum dimension in the long axis direction can be reduced.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the maximum dimension of the laminated stack in the long axis direction can be reduced, the space occupied by the semiconductor rectifier can be reduced, and the overall shape of the device can be made smaller. be able to. In addition, even if the spring pressure force varies, the maximum dimension in the long axis direction is determined by the distance between the upper and lower press plates, so variations in spring pressure force should not be taken into account when designing the mounting position. This has the effect of making handling easier during design.

[Brief explanation of the drawing]

1 and 2 are a front view and a side view showing the structure of a conventional laminated stack, FIGS. 3 and 4 are a front view and a side view showing an embodiment of a laminated stack according to the present invention, and FIG. FIG. 2 is a plan view showing the structure of a spring guide. 1... Flat semiconductor element, 2... Cooling fin, 3
A, 3B...Insulating spacer, 4...Spring guide,
5... Spring, 6... Steel ball, 7... Pressure bolt, 8... Upper holding plate, 9... Lower holding plate, 10
...Insulation bolt, 11...rod.

Claims (1)

[Claims] 1 A plurality of flat semiconductor elements are stacked together via a cooling fan, and the stacked bodies are arranged facing each other at a predetermined interval between a pair of presser plates, and a pressure bolt formed on one of the presser plates and the other presser plate. In the laminated stack for a semiconductor rectifier device, the stack includes a measurement unit for press-contacting with a press-contact spring formed in the press-contact spring and measuring the press-contact force based on the amount of deflection of the press-contact spring. The measuring section is disposed on the side that contacts the laminate and is screwed into the presser plate, and the measuring section is disposed between the pressure contact spring and the laminate and is formed in a hole formed on the central axis and on the side surface. A spring guide is provided with a window that allows the inside of a portion of the hole to be visually viewed from a relatively wide field of view, and the spring guide is installed on the side of the laminate of the other presser plate and is inserted through the hole of the spring guide so that the tip of the spring guide is inserted into the hole. 1. A laminated stack for a semiconductor rectifier, characterized by comprising a rod located within a part of the stack.