JPH0321099A - Electric equipment mounting structure - Google Patents
Electric equipment mounting structureInfo
- Publication number
- JPH0321099A JPH0321099A JP15462489A JP15462489A JPH0321099A JP H0321099 A JPH0321099 A JP H0321099A JP 15462489 A JP15462489 A JP 15462489A JP 15462489 A JP15462489 A JP 15462489A JP H0321099 A JPH0321099 A JP H0321099A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- heat
- transport element
- heat transport
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業十の利川分！ｌ！ｊ；〕
本発明は、高発熱な電子機器を、内部に熱輸送素子が埋
込まれているパネルに、ボルトにより電子機器と熱輸送
素子を結合して取付ける電子機器取トｊり構込に関ずる
，，
〔従来の技術〕
第４図（１），（２）はこの種の電子機器取付け構造の
従来例を示す縦断面図と熱抵抗の等価回路図である。[Detailed description of the invention] [Ten industries! l! [J;] The present invention provides an electronic device installation structure in which a high heat generating electronic device is attached to a panel in which a heat transport element is embedded, and the electronic device and the heat transport element are connected by bolts. Related: [Prior Art] Figures 4 (1) and (2) are a vertical cross-sectional view and an equivalent circuit diagram of thermal resistance showing a conventional example of this type of electronic equipment mounting structure.
表面板２ａとハニカムコア２ｂとからなるパネル２の中
には熱輸送素子３が埋込んであり、高発熱な電子機器１
はポルト４とナット５により熱輸送素子３に結合されて
パネル２の表面板２ａに取イ４けられている。そして電
子機器１で発生した熱は、電子機器１内の熱抵抗、電子
機器１と熱輸送素子３の間の表面板２ａを介した接触熱
抵抗、熱輸送素子３の熱抵抗を経て熱輸送素子３に伝導
され、拡散することにより、電子機器１の温度は下げら
れる。A heat transport element 3 is embedded in a panel 2 consisting of a surface plate 2a and a honeycomb core 2b, and a high heat generation electronic device 1
is connected to the heat transport element 3 by a port 4 and a nut 5, and is mounted on the surface plate 2a of the panel 2. The heat generated in the electronic device 1 is then transported through the thermal resistance inside the electronic device 1, the contact thermal resistance between the electronic device 1 and the heat transport element 3 via the surface plate 2a, and the thermal resistance of the heat transport element 3. By being conducted to the element 3 and diffused, the temperature of the electronic device 1 is lowered.
上述した従来の電了一機器取付け構造は、発熱量か小さ
い電子機器では、電子機器と表面板、表面板と熱輸送素
子の間の接触熱伝達で電子機器の温度を十分下げること
ができたか、電子機器の部品の小型化や高出力化により
発熱量が大きくなると、電子機器と表向板、表面板と熱
輸送素子の間の接触熱抵抗により、電子機器の温度を十
分ト−げることがてきないという欠点があった。The conventional device mounting structure described above is not able to sufficiently lower the temperature of the electronic device through contact heat transfer between the electronic device and the top plate, and between the top plate and the heat transport element, for electronic devices with small heat generation. As the amount of heat generated increases due to the miniaturization and higher output of electronic equipment components, contact thermal resistance between the electronic equipment and the front plate, and between the front plate and the heat transport element makes it necessary to sufficiently raise the temperature of the electronic equipment. The drawback was that it was impossible to do anything.
本発明の目的は、電子機器の部品の小梨化や、高出力化
により発熱量が大きくなっても電子機器の温度を十分下
げられる電子機器取付け構造を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device mounting structure that can sufficiently lower the temperature of the electronic device even if the amount of heat generated increases due to the miniaturization of the components of the electronic device or the increase in output.
〔課題を鮪決するための手段］
木発明の第１の電子機器取付け構造は、電子機器筐体と
熱輸送素子にまたがって、電子機器筐体と熱輸送素子内
にヒートパイブが設けられている。[Means for solving the problem] In the first electronic device mounting structure of the invention, a heat pipe is provided in the electronic device casing and the heat transport element so as to straddle the electronic device casing and the heat transport element.
本発明の第２の電子機器取付け構造は、電子機器筐体と
熱輸送素子にまたがるように、ボルト内にヒートパイプ
が設けられている。In the second electronic device mounting structure of the present invention, a heat pipe is provided within the bolt so as to span the electronic device housing and the heat transport element.
〔作 用〕
電子機器と熱輸送素子をヒートパイプで直接連結するの
で、電子機器と熱輸送素子の間の伝導熱コンダクタンス
が犬き〈なり、高発熱な電子機器の温度を十分下げるこ
とができる。[Function] Since the electronic device and the heat transport element are directly connected through a heat pipe, the conductance between the electronic device and the heat transport element is reduced, and the temperature of the electronic device, which generates a lot of heat, can be sufficiently lowered. .
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は（１），（２）は本発明の第１の実施例の電子
機器取付け構造を示す縦断面図と熱抵抗の等価回路図で
ある。FIGS. 1(1) and 1(2) are a longitudinal sectional view and an equivalent circuit diagram of thermal resistance showing an electronic equipment mounting structure according to a first embodiment of the present invention.
本実施例では、電子機器１の筐体と熱輸送素子３にまた
がって、電子機器１の筐体と熱輸送素子３内にビートパ
イブ６が設けられている。In the present embodiment, a beat pipe 6 is provided within the housing of the electronic device 1 and the heat transport element 3 so as to straddle the housing of the electronic device 1 and the heat transport element 3 .
このように、電子機器１の中で特に発熱量が大きい筐体
部分と熱輸送素子３の間にヒートパイプ６を設け、従来
の接触熱コンタクタンスに加えてヒートバイブ６による
伝導熱コンダクタンスを追加することにより、電子機器
１の温度を十分に下げることができる。In this way, the heat pipe 6 is provided between the casing part of the electronic device 1 that generates a particularly large amount of heat and the heat transport element 3, and in addition to the conventional contact thermal contactance, conductive thermal conductance by the heat vibe 6 is added. By doing so, the temperature of the electronic device 1 can be sufficiently lowered.
第２図は本発明の第２の実施例の電子機器取付け構造を
示す縦断面図と熱抵抗の等価回路図てある。FIG. 2 is a longitudinal sectional view and an equivalent circuit diagram of thermal resistance showing an electronic equipment mounting structure according to a second embodiment of the present invention.
本実施例では、ボルト４とナット５内に軸方向に設けら
れた穴にビートバイプ７が圧入されている。In this embodiment, a beat vip 7 is press-fitted into a hole provided in the bolt 4 and nut 5 in the axial direction.
ボルト４を締め付けることにより、電子機器１とボルト
４およびボルト４と熱輸送素子３の問の接触熱コンダク
タンスが大きくなるが、さらにボルト４内のヒートバイ
プ７により、ボルト４自休が高熱伝導となるため、電子
機器１の発熱がボルト４を介して熱輸送素子３へ伝熱さ
れる。なお、ボルト４内部を減圧し、ウイックと作動流
体を封入してビートパイプ化したボルトを使用すること
もできる。By tightening the bolts 4, the contact thermal conductance between the electronic device 1 and the bolts 4 and between the bolts 4 and the heat transport element 3 increases, but furthermore, due to the heat vip 7 inside the bolts 4, the bolts 4 have high thermal conductivity. Therefore, heat generated by the electronic device 1 is transferred to the heat transport element 3 via the bolt 4. Note that it is also possible to use a bolt that is made into a beat pipe by reducing the pressure inside the bolt 4 and enclosing a wick and a working fluid.
第３図は本発明の第３の実施例の電子機器取付け構造を
示す縦断面図と熱抵抗の等価回路図である。FIG. 3 is a vertical cross-sectional view and an equivalent circuit diagram of thermal resistance showing an electronic equipment mounting structure according to a third embodiment of the present invention.
本実施例では、熱輸送素子１０のボルト穴部分の厚さが
第１図、第２図の熱輸送素子３よりも大きくなっており
、そして熱輸送素子１０のボルト穴にねじがきられて、
ヒートバイブ９が内部に圧人されたボルト８により電子
機器１が熱輸送素子１０に表面板２ａを介して取イ」け
られている。In this embodiment, the thickness of the bolt hole portion of the heat transport element 10 is larger than that of the heat transport element 3 shown in FIGS. 1 and 2, and the bolt hole of the heat transport element 10 is threaded.
The electronic device 1 is attached to the heat transport element 10 via the surface plate 2a by bolts 8 into which the heat vibrator 9 is pressed.
このように、熱輸送素子１０側のボルト穴部分の厚さを
大きくした場合は、ボルト８と熱輸送素子１０間の伝導
熱コンダクタンスをさらに大きくとることができる。In this way, when the thickness of the bolt hole portion on the heat transport element 10 side is increased, the conductive thermal conductance between the bolt 8 and the heat transport element 10 can be further increased.
以上説明したように本発明は、電子機器の発熱を接触熱
コンダクタンスだけでなく、ビートパイプまたはビート
パイプを圧大したボルトをも介して熱輸送素子へ伝熱す
ることにより、取付け面の表面粗さ、平面度、接着剤等
の介在物による接触熱コンダクタンスの低下の影響を受
けずに、電子機器を熱制御することができ、また、電子
機器の発熱に分布があったり、パネルの表面板から離れ
た位置に発熱源がある場合でも、熱輸送素子に対して柔
軟に放熱経路を設定でき、電子機器の温度を十分低下さ
せることができる効果かある。As explained above, the present invention transfers heat from an electronic device to a heat transport element not only through contact thermal conductance but also through a beat pipe or a bolt made of a compressed beat pipe, thereby improving the surface roughness of the mounting surface. It is possible to thermally control electronic equipment without being affected by the reduction in contact thermal conductance caused by inclusions such as flatness and adhesives, and it is also possible to control the heat of electronic equipment without being affected by the reduction in contact thermal conductance due to inclusions such as adhesives. Even if the heat source is located away from the heat transport element, the heat radiation path can be flexibly set for the heat transport element, and the temperature of the electronic device can be sufficiently lowered.
第１図は本発明の第１の実施例の電子機器取付け構造を
示す縦断面図と熱抵抗の等価回路図、第２図は本発明の
第２の実施例の電子機器取付リ構造を示す縦断面図と熱
抵抗のへダ価回路図、第３Ｉヌ１は本発明の第３の電子
機器取付け構造を示す縦断面図と熱抵抗の等価同路図、
第４図は電子機番取付け構造を示す縦断而図と熱抵抗の
等価回路図である。
１・・・電子機器、 ２・・・パネル、２ａ・・・
表面板、 ２ｂ・・・ハニカムコア、３，１０・・
・熱輸送素子、
４，８・・・ボルト、
５・・・ナット、
６，７．９・・・ヒートパイプ。Fig. 1 is a vertical cross-sectional view and an equivalent circuit diagram of thermal resistance showing an electronic device mounting structure according to a first embodiment of the present invention, and Fig. 2 shows an electronic device mounting structure according to a second embodiment of the present invention. A vertical cross-sectional view and a heda value circuit diagram of thermal resistance, No. 3 I No. 1 is a vertical cross-sectional view showing the third electronic device mounting structure of the present invention and an equivalent circuit diagram of thermal resistance,
FIG. 4 is a longitudinal diagram showing the electronic device number mounting structure and an equivalent circuit diagram of thermal resistance. 1...Electronic equipment, 2...Panel, 2a...
Surface plate, 2b...honeycomb core, 3,10...
・Heat transport element, 4, 8... Bolt, 5... Nut, 6, 7.9... Heat pipe.
Claims (2)
ているパネルに、ボルトにより電子機器と熱輸送素子を
結合して取付ける電子機器取付け構造において、 電子機器筐体と熱輸送素子にまたがって、電子機器筐体
と熱輸送素子内にヒートパイプが設けられていることを
特徴とする電子機器取付け構造。1. In an electronic device mounting structure in which a high heat generating electronic device is mounted on a panel with a heat transport element embedded inside, the electronic device and the heat transport element are connected by bolts, and the heat transport element is straddled between the electronic device case and the heat transport element. An electronic device mounting structure characterized in that a heat pipe is provided within an electronic device casing and a heat transport element.
ているパネルに、ボルトにより電子機器と熱輸送素子を
結合して取付ける電子機器取付け構造において、 電子機器筐体と熱輸送素子にまたがるように、前記ボル
ト内にヒートパイプが設けられていることを特徴とする
電子機器取付け構造。2. In an electronic device mounting structure in which a high heat generating electronic device is mounted on a panel with a heat transport element embedded inside, the electronic device and the heat transport element are connected using bolts, and the electronic device straddles the electronic device case and the heat transport element. An electronic device mounting structure characterized in that a heat pipe is provided within the bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15462489A JPH0321099A (en) | 1989-06-19 | 1989-06-19 | Electric equipment mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15462489A JPH0321099A (en) | 1989-06-19 | 1989-06-19 | Electric equipment mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321099A true JPH0321099A (en) | 1991-01-29 |
Family
ID=15588254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15462489A Pending JPH0321099A (en) | 1989-06-19 | 1989-06-19 | Electric equipment mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321099A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967698A (en) * | 1982-10-12 | 1984-04-17 | 三菱電機株式会社 | How to mount the circuit module |
| JPS6349293B2 (en) * | 1976-05-12 | 1988-10-04 | Fuiritsupusu Furuuiranpenfuaburiken Nv |
-
1989
- 1989-06-19 JP JP15462489A patent/JPH0321099A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349293B2 (en) * | 1976-05-12 | 1988-10-04 | Fuiritsupusu Furuuiranpenfuaburiken Nv | |
| JPS5967698A (en) * | 1982-10-12 | 1984-04-17 | 三菱電機株式会社 | How to mount the circuit module |
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