JPH03211796A - Radiator structure - Google Patents
Radiator structureInfo
- Publication number
- JPH03211796A JPH03211796A JP623090A JP623090A JPH03211796A JP H03211796 A JPH03211796 A JP H03211796A JP 623090 A JP623090 A JP 623090A JP 623090 A JP623090 A JP 623090A JP H03211796 A JPH03211796 A JP H03211796A
- Authority
- JP
- Japan
- Prior art keywords
- air
- opening
- heat
- radiation
- sound pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、共鳴箱を備えた音響機器の放熱構造に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat dissipation structure for an audio device equipped with a resonance box.
従来の装置は、実公昭63−185293号公報に記載
のように、電動の冷却ファンを使用し筐体内部の暖めら
れた空気を外部に排出するようになっていた。Conventional devices, as described in Japanese Utility Model Publication No. 63-185293, use an electric cooling fan to exhaust warm air inside the housing to the outside.
上記従来技術は、コスト、静粛性の点について配慮され
ておらず消費電力が増える、製品原価が高くなる、モー
タの駆動音、ファンの風切り音等の騒音が出るといった
問題があった。The above-mentioned conventional technology does not take into account cost and quietness, and has problems such as increased power consumption, increased product cost, and noise such as motor drive noise and fan wind noise.
本発明の目的は、直接電力を利用せず低コストで静粛性
に優れた放熱構造を提供することにある。An object of the present invention is to provide a heat dissipation structure that does not directly use electric power, is low cost, and has excellent quietness.
上記目的を達成するために1本発明は共鳴箱の前面に設
けた開口部の前方に放熱ファン等の放熱部品を設置し、
さらに、その前方の筐体にスリット状の通気孔を設けた
ことを特徴とする。In order to achieve the above object, one aspect of the present invention is to install a heat dissipation component such as a heat dissipation fan in front of an opening provided on the front surface of a resonance box,
Furthermore, it is characterized by providing a slit-shaped ventilation hole in the front casing.
共鳴箱内部のスピーカが駆動させられることにより音圧
が発生し、それが共鳴箱内部の空気を共振させ音声の出
力レベルに比例して共鳴箱の開口部より空気を吹き出さ
せる。それにより、開口部より吹き出した空気が放熱部
品によって暖められた空気を筐体の通気孔から筐体外部
に排出する。When the speaker inside the resonance box is driven, sound pressure is generated, which causes the air inside the resonance box to resonate, causing air to be blown out from the opening of the resonance box in proportion to the output level of the sound. Thereby, the air blown out from the opening is heated by the heat dissipation component and is discharged to the outside of the housing from the ventilation hole of the housing.
以下、本発明の実施例を第1図、第2図により説明する
。Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.
第1図は本発明の一実施例の斜視図である。ラジカセ等
の筐体7の内部に設置された共鳴箱1の内部の空気を仕
切り板1aが共鳴室1c、密閉室1dに分割しており共
鳴室ICは共鳴管1eにより密閉室1dの前面の右下隅
に設けた開口部1bに通じている。又、スピーカ3が振
動面を共鳴室に向け、仕切り板1aに固定されている。FIG. 1 is a perspective view of an embodiment of the present invention. A partition plate 1a divides the air inside a resonance box 1 installed inside a housing 7 of a radio cassette player or the like into a resonance chamber 1c and a sealed chamber 1d. It communicates with an opening 1b provided in the lower right corner. Further, the speaker 3 is fixed to the partition plate 1a with its vibration surface facing the resonance chamber.
開口部1bの全面には基板6に固定部材5によって固定
された放熱部品2が数枚の板状に形成した放熱面を開口
部1bに垂直になるように設置されている。A heat dissipating component 2 fixed to a substrate 6 by a fixing member 5 is installed on the entire surface of the opening 1b so that its heat dissipating surface formed in the shape of several plates is perpendicular to the opening 1b.
又放熱部品2の下面には基板5に電気的に接続された発
熱素子4が発熱面を密着させる様に固定されている。放
熱部品2に向かいあう筐体7の壁面にはスリット状の通
気孔7aが設けられている。Further, a heating element 4 electrically connected to a substrate 5 is fixed to the lower surface of the heat dissipating component 2 so that the heating surface is brought into close contact with the heating element 4. A slit-shaped ventilation hole 7a is provided on the wall surface of the casing 7 facing the heat dissipation component 2.
以下、本実施例の動作の説明をする。スピーカ;3が駆
動させられることにより、音圧が発生しそれが共鳴室1
d及び共鳴’fJ 1 c=にある空気を共振させ、音
声の出力レベルに比例して開口部1eより空気を吹き出
させる。又、放熱部品2の板状に形成された放熱面間に
ある空気は発熱素子4から放熱部品2に伝わった熱によ
り暖められている。The operation of this embodiment will be explained below. When the speaker 3 is driven, sound pressure is generated and it is transmitted to the resonance chamber 1.
d and resonance 'fJ 1 c=, and the air is blown out from the opening 1e in proportion to the audio output level. Further, the air between the plate-shaped heat radiating surfaces of the heat radiating component 2 is warmed by the heat transmitted from the heating element 4 to the heat radiating component 2.
これにより開口部1bから排出された空気が放熱部品2
によって暖められた空気を移動させ通気孔7aより筐体
7の外部に強制的に排出する。As a result, the air discharged from the opening 1b is transferred to the heat dissipating component 2.
The heated air is moved and forcibly discharged to the outside of the casing 7 through the ventilation hole 7a.
本実施例によれば、低コストで静粛性に優れた強制放熱
を行なう事ができる。According to this embodiment, forced heat radiation can be performed at low cost and with excellent quietness.
第2図は本発明の他の実施例の斜視図である。FIG. 2 is a perspective view of another embodiment of the invention.
第1図と異なる点は放熱部品8の形状であり第1図の実
施例では数枚の板状の放熱面を設けていたのに対し第2
図の実施例では筒状の放熱面としている。このため、開
口部1bより発生した音声は放熱部品8の筒の中を通っ
て外部に出るので筐体7の内部にはこもらず音響効果の
減少を抑えることができる。The difference from FIG. 1 is the shape of the heat dissipation component 8. The embodiment shown in FIG. 1 had several plate-shaped heat dissipation surfaces, whereas the second embodiment
In the illustrated embodiment, a cylindrical heat radiation surface is used. Therefore, the sound generated from the opening 1b passes through the tube of the heat dissipation component 8 and exits to the outside, so that it is not trapped inside the housing 7, and a reduction in the acoustic effect can be suppressed.
本発明は、以上説明したように構成されているので以下
のような効果を奏する。Since the present invention is configured as described above, it produces the following effects.
すなわち、放熱に直接電力を利用しないので、消費電力
を増やす必要がない。また、電動の冷却ファンを使用し
ないので部品代がかからず、モータの駆動音、冷却ファ
ンの風切り音等の騒音が発生しない。また、共鳴箱から
吹き出される風圧を利用し、放熱を行なうため自然放熱
より効率の良い放熱が可能となる。That is, since electric power is not directly used for heat radiation, there is no need to increase power consumption. Furthermore, since no electric cooling fan is used, there are no parts costs, and no noise such as motor drive noise or cooling fan wind noise is generated. In addition, since heat is radiated using the wind pressure blown from the resonance box, it is possible to radiate heat more efficiently than natural heat radiation.
第1図は本発明の一実施例の斜視図、第2図は本発明の
他の実施例の斜視図である。
1・・・共鳴箱、1a・・・仕切り板、lb・・・開口
部、1c・・・共鳴室、1d・・・密閉室、le・・・
共鳴管、2・・・・放熱部品、3・・・スピーカ、4・
・・発熱素子、5・・・固定部材、6・・・基板、7・
・・筐体、7a・・・通気孔、8・・放熱部品。FIG. 1 is a perspective view of one embodiment of the invention, and FIG. 2 is a perspective view of another embodiment of the invention. 1... Resonance box, 1a... Partition plate, lb... Opening, 1c... Resonance chamber, 1d... Closed chamber, le...
Resonance tube, 2... Heat dissipation component, 3... Speaker, 4...
...Heating element, 5...Fixing member, 6...Substrate, 7.
...Housing, 7a...Vent hole, 8...Heat dissipation parts.
Claims (2)
口部と、前記開口部の前方に設置された放熱部品と、そ
の前方の筺体壁面に設けた通気孔とから成る放熱構造に
おいて、 前記共鳴箱の内部のスピーカの音圧に共鳴し前記開口部
より吹き出される空気を用いて前記放熱部品から発生す
る熱を前記通気孔より前記筐体の外部に放散させること
を特徴とする放熱構造。1. A heat dissipation structure consisting of a resonance box inside a housing, an opening provided on the front surface of the resonance box, a heat dissipation component installed in front of the opening, and a ventilation hole provided on the wall surface of the housing in front of the heat dissipation component, Heat radiation characterized in that heat generated from the heat radiation component is radiated to the outside of the housing through the ventilation hole using air that resonates with the sound pressure of a speaker inside the resonance box and is blown out from the opening. structure.
請求項1に記載の放熱構造。2. The heat dissipation structure according to claim 1, wherein the heat generating component has a cylindrical shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623090A JPH03211796A (en) | 1990-01-17 | 1990-01-17 | Radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623090A JPH03211796A (en) | 1990-01-17 | 1990-01-17 | Radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03211796A true JPH03211796A (en) | 1991-09-17 |
Family
ID=11632716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP623090A Pending JPH03211796A (en) | 1990-01-17 | 1990-01-17 | Radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03211796A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2322500A (en) * | 1997-02-19 | 1998-08-26 | Motorola Gmbh | Heat dissipator using acoustically generated airflow |
| US5956228A (en) * | 1997-09-22 | 1999-09-21 | National Railroad Passenger Corporation | Electrical equipment case |
| EP0873595A4 (en) * | 1995-01-23 | 2005-02-02 | Jbl Inc | Loudspeaker thermal management structure |
| WO2007107921A3 (en) * | 2006-03-21 | 2007-12-13 | Koninkl Philips Electronics Nv | Cooling device and electronic device comprising such a cooling device |
| US7349207B2 (en) * | 2005-09-08 | 2008-03-25 | Brookstone Purchasing, Inc. | Heat dissipating audio systems and methods thereof |
| KR100881341B1 (en) * | 2006-12-20 | 2009-02-02 | 삼성테크윈 주식회사 | Heat dissipation structure of electronic equipment |
| WO2018125632A1 (en) * | 2016-12-30 | 2018-07-05 | Google Llc | Design for compact home assistant with combined acoustic waveguide and heat sink |
| US11368770B2 (en) * | 2019-07-22 | 2022-06-21 | AAC Technologies Pte. Ltd. | Speaker box device and mobile terminal using same |
| US11375302B2 (en) * | 2019-07-22 | 2022-06-28 | AAC Technologies Pte. Ltd. | Speaker device and mobile terminal provided with speaker device |
| US11375301B2 (en) * | 2019-07-22 | 2022-06-28 | AAC Technologies Pte. Ltd. | Speaker box device and mobile terminal using same |
| US11886654B2 (en) | 2019-07-24 | 2024-01-30 | Google Llc | Compact home assistant device |
-
1990
- 1990-01-17 JP JP623090A patent/JPH03211796A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0873595A4 (en) * | 1995-01-23 | 2005-02-02 | Jbl Inc | Loudspeaker thermal management structure |
| GB2322500A (en) * | 1997-02-19 | 1998-08-26 | Motorola Gmbh | Heat dissipator using acoustically generated airflow |
| US5956228A (en) * | 1997-09-22 | 1999-09-21 | National Railroad Passenger Corporation | Electrical equipment case |
| US6115237A (en) * | 1997-09-22 | 2000-09-05 | National Railroad Passenger Corporation | Electrical equipment case |
| US7349207B2 (en) * | 2005-09-08 | 2008-03-25 | Brookstone Purchasing, Inc. | Heat dissipating audio systems and methods thereof |
| WO2007107921A3 (en) * | 2006-03-21 | 2007-12-13 | Koninkl Philips Electronics Nv | Cooling device and electronic device comprising such a cooling device |
| KR100881341B1 (en) * | 2006-12-20 | 2009-02-02 | 삼성테크윈 주식회사 | Heat dissipation structure of electronic equipment |
| KR20190072620A (en) * | 2016-12-30 | 2019-06-25 | 구글 엘엘씨 | Designed for compact home assistant with combined acoustic waveguide and heat sink |
| WO2018125632A1 (en) * | 2016-12-30 | 2018-07-05 | Google Llc | Design for compact home assistant with combined acoustic waveguide and heat sink |
| GB2559476B (en) * | 2016-12-30 | 2020-09-16 | Google Llc | Design for compact home assistant with combined acoustic waveguide and heat sink |
| KR20200145869A (en) * | 2016-12-30 | 2020-12-30 | 구글 엘엘씨 | Design for compact home assistant with combined acoustic waveguide and heat sink |
| US11011168B2 (en) | 2016-12-30 | 2021-05-18 | Google Llc | Compact speaker device |
| KR20210057227A (en) * | 2016-12-30 | 2021-05-20 | 구글 엘엘씨 | Design for compact home assistant with combined acoustic waveguide and heat sink |
| US11942088B2 (en) | 2016-12-30 | 2024-03-26 | Google Llc | Compact speaker device |
| US11368770B2 (en) * | 2019-07-22 | 2022-06-21 | AAC Technologies Pte. Ltd. | Speaker box device and mobile terminal using same |
| US11375302B2 (en) * | 2019-07-22 | 2022-06-28 | AAC Technologies Pte. Ltd. | Speaker device and mobile terminal provided with speaker device |
| US11375301B2 (en) * | 2019-07-22 | 2022-06-28 | AAC Technologies Pte. Ltd. | Speaker box device and mobile terminal using same |
| US11886654B2 (en) | 2019-07-24 | 2024-01-30 | Google Llc | Compact home assistant device |
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