JPH03211867A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH03211867A JPH03211867A JP746490A JP746490A JPH03211867A JP H03211867 A JPH03211867 A JP H03211867A JP 746490 A JP746490 A JP 746490A JP 746490 A JP746490 A JP 746490A JP H03211867 A JPH03211867 A JP H03211867A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead frame
- resin
- support leads
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 230000000994 depressogenic effect Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract description 2
- 238000001721 transfer moulding Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、樹脂封止される半導体装置に用Ｉ１１られる
リードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead frame used in a resin-sealed semiconductor device.
従来の技術
従来、樹脂封止される半導体装置に用いるリードフレー
ムの半導体素子積載部サポートリードは第３図に示すよ
うに半導体素子積載部の４隅を４本のサポートリードで
支持していた。このサポートリードはプレス加工により
湾曲され、ディプレス部４を形成していた。2. Description of the Related Art Conventionally, support leads for a semiconductor element mounting portion of a lead frame used in a resin-sealed semiconductor device have supported the four corners of the semiconductor element mounting portion with four support leads as shown in FIG. This support lead was bent by pressing to form a depressed portion 4.
発明が解決しようとする課題
半導体装置用リードフレームにディプレスを設ける目的
は、半導体素子部上下の樹脂厚を均一にすることにより
、パッケージクラックやワイヤータッチを防止すること
にある。しかし、半導体素子積載部の微細化と多ビン化
が進展するにつれて半導体素子積載部サポートリードの
幅が細くなり、ディプレス部強度が低下する。また、半
導体素子積載部サポートリードは半導体素子積載部の４
隅を４点で支えているため、ディプレス部の強度が弱い
と樹脂封止時に半導体素子積載部が傾き、樹脂封止後に
半導体素子積載部が浮き上がりワイヤータッチやパッケ
ージクラックが発生するという課題があった。Problems to be Solved by the Invention The purpose of providing a depression in a lead frame for a semiconductor device is to prevent package cracks and wire touches by making the resin thickness uniform above and below the semiconductor element portion. However, as the semiconductor element mounting part becomes smaller and the number of bins increases, the width of the semiconductor element mounting part support lead becomes narrower, and the strength of the depressed part decreases. In addition, the semiconductor element loading part support lead is the 4th part of the semiconductor element loading part.
Since the corners are supported by four points, if the strength of the depression part is weak, the semiconductor element mounting part will tilt during resin sealing, and the semiconductor element mounting part will rise after resin sealing, causing wire touch and package cracks. there were.
本発明はこのような課題を解決するもので、樹脂封止時
に樹脂の流れによるサポートリードのディプレス部の変
形を防止する、強度の強いリードフレームを提供するこ
とを目的とするものである。The present invention solves these problems, and aims to provide a strong lead frame that prevents deformation of depressed portions of support leads due to resin flow during resin sealing.
課題を解決するための手段
この課題を解決するために本発明は、ディプレスを設け
ようとする半導体素子積載部サポートリードが枝分かれ
していることにより半導体素子積載部を４点以上の多点
で支持することができると共にディプレス部の強度を大
きくしたものである。Means for Solving the Problems In order to solve this problem, the present invention provides support leads for the semiconductor device mounting portion where depressions are to be provided, so that the semiconductor device mounting portion is provided with multiple points of four or more. It can be supported and the strength of the depressed portion is increased.
作用
この構成により、樹脂封止時に樹脂流入圧力が加わって
も半導体素子積載部が傾かないよう、ディプレス強度を
確保することができ、パッケージクラックやワイヤータ
ッチを防止することができる。Function: With this configuration, it is possible to ensure depression strength so that the semiconductor element mounting portion does not tilt even when resin inflow pressure is applied during resin sealing, and it is possible to prevent package cracks and wire touches.
実施例
第１図に本発明の一実施例によるリードフレームの構成
を示す。Embodiment FIG. 1 shows the structure of a lead frame according to an embodiment of the present invention.
第１図において、半導体素子積載部１は半導体素子積載
部サポートリード２により支持されている。３はインナ
ーリードである。In FIG. 1, a semiconductor element mounting section 1 is supported by semiconductor element mounting section support leads 2. As shown in FIG. 3 is the inner lead.
半導体素子積載部サポートリード２は第２図に示すよう
な８点支持の構成で、エツチングあるいはパンチングに
より作られた半導体装置用リードフレームに機械的プレ
スによりディプレスが設けられる。このディプレスは半
導体素子積載部サポートリードの８点を同形状に成型し
て形成される。このようにして８点で支持された半導体
素子積載部に半導体素子を載置しボンディングした後ト
ランスファー成型により樹脂封止される。The semiconductor element mounting portion support lead 2 has an eight-point support structure as shown in FIG. 2, and a depression is provided by mechanical pressing on a lead frame for a semiconductor device made by etching or punching. This depression is formed by molding eight points of the support leads of the semiconductor element mounting portion into the same shape. After the semiconductor element is placed on the semiconductor element mounting portion supported at eight points and bonded in this way, it is sealed with resin by transfer molding.
発明の効果
以上の実施例の説明からも明らかなように、本発明によ
れば４本の半導体素子積載部サポートリードをそれぞれ
分岐させることにより、樹脂封止時に起る半導体素子積
載部の傾きやパッケージクラック、ワイヤータッチを防
止することができるという効果が得られる。Effects of the Invention As is clear from the description of the embodiments above, according to the present invention, by branching each of the four semiconductor element mounting part support leads, the tilting of the semiconductor element mounting part that occurs during resin sealing can be avoided. This has the effect of preventing package cracks and wire touches.
第１図は本発明の一実施例による半導体装置用リードフ
レームの平面図、第２図は上記リードフレームの要部拡
大斜視図、第３図は従来の半導体装置用リードフレーム
の平面図である。
１・・・・・・半導体素子積載部、２・・・・・・半導
体素子積載部サポートリード、３・・・・・・インナー
リード、４・・・・・・ディプレス部。
第３図FIG. 1 is a plan view of a lead frame for a semiconductor device according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of main parts of the lead frame, and FIG. 3 is a plan view of a conventional lead frame for a semiconductor device. . 1... Semiconductor element loading section, 2... Semiconductor element loading section support lead, 3... Inner lead, 4... Depressed section. Figure 3
Claims (1)
が枝分かれしていることを特徴とした半導体装置用リー
ドフレーム。A lead frame for semiconductor devices characterized by branching depressed parts of the leads that support the semiconductor element mounting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007464A JP2584084B2 (en) | 1990-01-17 | 1990-01-17 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007464A JP2584084B2 (en) | 1990-01-17 | 1990-01-17 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03211867A true JPH03211867A (en) | 1991-09-17 |
| JP2584084B2 JP2584084B2 (en) | 1997-02-19 |
Family
ID=11666536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007464A Expired - Fee Related JP2584084B2 (en) | 1990-01-17 | 1990-01-17 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2584084B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650360U (en) * | 1992-03-12 | 1994-07-08 | 株式会社三井ハイテック | Lead frame for semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624143U (en) * | 1985-06-25 | 1987-01-12 | ||
| JPS62135445U (en) * | 1986-02-19 | 1987-08-26 | ||
| JPS6379652U (en) * | 1986-11-13 | 1988-05-26 |
-
1990
- 1990-01-17 JP JP2007464A patent/JP2584084B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624143U (en) * | 1985-06-25 | 1987-01-12 | ||
| JPS62135445U (en) * | 1986-02-19 | 1987-08-26 | ||
| JPS6379652U (en) * | 1986-11-13 | 1988-05-26 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650360U (en) * | 1992-03-12 | 1994-07-08 | 株式会社三井ハイテック | Lead frame for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2584084B2 (en) | 1997-02-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |