JPH03212937A - Water washing device for wafer - Google Patents
Water washing device for waferInfo
- Publication number
- JPH03212937A JPH03212937A JP937190A JP937190A JPH03212937A JP H03212937 A JPH03212937 A JP H03212937A JP 937190 A JP937190 A JP 937190A JP 937190 A JP937190 A JP 937190A JP H03212937 A JPH03212937 A JP H03212937A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pure water
- washing
- washing device
- closed container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はウェハ水洗装置、特にその洗浄用の純水の溶
存酸素濃度低減に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer washing apparatus, and particularly to a reduction in dissolved oxygen concentration in pure water used for washing.
第２図は従来のウェハ水洗装置の構成を示す模式断面図
である。図において、（１）はウェハ、（２）はウェハ
（１）を入れるウェハキャリアー、（８）はウニ／Ｘキ
ャリア（２）ごと浸漬させる水洗槽、（４）は水洗槽（
８）に張られた純水である。FIG. 2 is a schematic cross-sectional view showing the configuration of a conventional wafer washing apparatus. In the figure, (1) is the wafer, (2) is the wafer carrier into which the wafer (1) is placed, (8) is the washing tank in which the urchin/X carrier (2) is immersed, and (4) is the washing tank (
8) is filled with pure water.
次に動作について説明する。従来のウェハ水洗装置は上
記のように構成され、酸等での処理を終えたウェハ（１
）がウェハキャリアー（２）ごと、純水（４）の張られ
た水洗槽（８）の中に浸漬され水洗でれる。Next, the operation will be explained. A conventional wafer washing apparatus is configured as described above, and is used to wash wafers (1
) is immersed together with the wafer carrier (2) in a washing tank (8) filled with pure water (4) and washed out.
従来のウェハ水洗装置は以上のように構成されていたの
で、純水は大気と接しており、このため純水中の溶存酸
素濃度が高くなってしまい、ウェハがシリコンウェハの
場合、低級のシリコン酸化物がシリコン表面に付着する
等の問題点があった。Conventional wafer washing equipment was configured as described above, and the pure water is in contact with the atmosphere, which increases the dissolved oxygen concentration in the pure water. There were problems such as oxides adhering to the silicon surface.
この発明は上記のような問題点を解消するためになされ
たもので、純水中の溶存酸素濃度を低減式せたウェハ水
洗装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer washing apparatus that can reduce the dissolved oxygen concentration in pure water.
この発明に係るウェハ水洗装置は、純水を張った水洗槽
を真空ポンプに接続された密閉容器内に備えたものであ
る。The wafer washing apparatus according to the present invention includes a washing tank filled with pure water in a closed container connected to a vacuum pump.
この発明におけるウェハ水洗装置の真空ポンプは密閉容
器内を減圧し、これによシ密閉容器内にある純水中の溶
存酸素濃度を低減する。The vacuum pump of the wafer washing apparatus according to the present invention reduces the pressure inside the closed container, thereby reducing the dissolved oxygen concentration in the pure water inside the closed container.
以下、この発明の一実施例を図について説明する。第１
図はウェハ水洗装置の構成を示す模式断面図である。図
において、（１）〜（４）は第２図の従来例に示したも
のと同等であるので説明を省略する。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a schematic cross-sectional view showing the configuration of a wafer washing device. In the figure, (1) to (4) are the same as those shown in the conventional example of FIG. 2, and therefore their explanation will be omitted.
（６）は水洗槽（８）をまるごと収納できる密閉容器、
（６）は真空ポンプ、（γ）は密閉容器（５）と真空ポ
ンプ（６）を接続する真空配管である。(6) is an airtight container that can store the entire washing tank (8);
(6) is a vacuum pump, and (γ) is a vacuum pipe connecting the closed container (5) and the vacuum pump (6).
次に動作について説明する。真空ポンプ（６）が真空配
管（γ）により接続された密閉容器（５）の中の圧力を
減じ、これにより密閉容器（５）内にある純水（４）中
の溶存酸素濃度を低減させる。Next, the operation will be explained. A vacuum pump (6) reduces the pressure in the closed container (5) connected by the vacuum pipe (γ), thereby reducing the dissolved oxygen concentration in the pure water (4) in the closed container (5). .
なお、上記実施例では、ウニ／％ （１）の水洗の方法
としてウェハ（１）をウェハキャリアー（２）ごと純水
（４）を張った水洗槽（８）の中に浸漬する場合につい
て説明したが、例えばウェハ（１）をベルトで移動させ
ながら純水（４）を吹き付ける方法等どんな方法でもよ
く、水洗部分を密閉容器（５）内に備え、この中を減圧
すれば、上記実施例と同様の効果を奏する。In addition, in the above example, the case where the wafer (1) and the wafer carrier (2) are immersed in a washing tank (8) filled with pure water (4) is explained as a method of washing sea urchins/% (1). However, any method may be used, such as spraying pure water (4) while moving the wafer (1) with a belt, or by providing a water washing part in a closed container (5) and reducing the pressure in the container. It has the same effect as.
以上のように、この発明によれば水洗部分を減圧するこ
とにより、純水の溶存酸素濃度を低減でき、例えば低級
酸化膜の生成を抑える等の効果がある。As described above, according to the present invention, by reducing the pressure in the water washing portion, the dissolved oxygen concentration of pure water can be reduced, which has the effect of, for example, suppressing the formation of a lower grade oxide film.
第１図はこの発明に係るウェハ水洗装置の一実施例によ
るウェハ水洗装置の構成を示す模式断面図、第２図は従
来のウェハ水洗装置の構成を示す模式断面図である。
図において、（１）はウェハ、（２）はウェハキャリア
、（８）は水洗槽、（４）は純水、（５）は密閉容器、
（６）は真空ポンプ、（γ）は真空配管である。
なお、図中、同一符号は同一 又は相当部分を示す。FIG. 1 is a schematic sectional view showing the structure of a wafer washing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic sectional view showing the structure of a conventional wafer washing apparatus. In the figure, (1) is a wafer, (2) is a wafer carrier, (8) is a washing tank, (4) is pure water, (5) is a closed container,
(6) is a vacuum pump, and (γ) is a vacuum pipe. In addition, the same symbols in the figures indicate the same or equivalent parts.
Claims (1)
に接続された密閉容器内に備えられていることを特徴と
するウェハ水洗装置。A wafer washing device characterized in that a washing part is provided in a closed container connected to a vacuum pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP937190A JPH03212937A (en) | 1990-01-17 | 1990-01-17 | Water washing device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP937190A JPH03212937A (en) | 1990-01-17 | 1990-01-17 | Water washing device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03212937A true JPH03212937A (en) | 1991-09-18 |
Family
ID=11718613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP937190A Pending JPH03212937A (en) | 1990-01-17 | 1990-01-17 | Water washing device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03212937A (en) |
-
1990
- 1990-01-17 JP JP937190A patent/JPH03212937A/en active Pending
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