JPH0321348A - Thermostatic apparatus - Google Patents

Abstract

PURPOSE:To enhance heat exchange efficiency, airtightness and reliability by arranging an electromagnetic heating means or a far infrared heating means heating a treatment solution through piping to the predetermined part of the piping and heating said solution from the outside of the piping in a non-contact state. CONSTITUTION:A treatment solution is led out of the reaction tank 1 filled with the treatment solution by piping 2 and further returned to the reaction tank 1. The heat exchange with the treatment solution is performed by the heat exchange port 4 arranged to a part of the piping 2 to control the treatment solution to predetermined temp. The heat exchange part 4 is constituted of the electromagnetic or far infrared heating means arranged to the outside of the piping 2. As a result, heat exchange efficiency is enhanced and a structure is simple and airtightness is high and, further, reliability becomes high.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a constant temperature device, and particularly to the structure of a heat exchange section of a constant temperature device used for controlling the temperature of corrosive chemicals and the like.

[Conventional technology]

When a strongly corrosive chemical solution is used for general industrial purposes, the reaction rate changes significantly depending on the temperature of the solution, so careful attention must always be paid to controlling the solution temperature.

Therefore, various temperature control devices such as thermostats have been developed to control the liquid temperature.

Such a temperature control device usually has the following characteristics, as shown in FIG.
The treatment liquid is circulated by a pump 103 from a reaction tank 101 filled with the treatment liquid through a pipe 102, heat exchanged in a heat exchange section 104, and the temperature is controlled and impurities are removed through a filter 105. It is arranged to return the liquid to the reaction tank.

Since a highly corrosive chemical is used as the processing liquid, fluororesin, which is a corrosion-resistant material, is used for the piping, and various materials are used in the heat exchange section to make it resistant to the chemical. Efforts have been made.

As an example of the conventional heat exchange section is shown in FIG. 4, heat exchange plates 201 and 202 are made of high-purity alumina that is free from impurity contamination with chemical solutions, and side parts are made of chemical-resistant resin such as fluororesin. They are arranged facing each other with a wall 203 interposed therebetween to form a heat exchange chamber 204, and in this heat exchange section, the temperature of, for example, a semiconductor processing chemical solution led out from a processing container through a pipe or the like is controlled. is being proposed.

In this apparatus, the surfaces of heat exchange plates 201 and 202 are coated with fluororesin to prevent reaction with semiconductor processing chemicals, and are configured to be cooled or heated, respectively, by thermo modules 205 and 206.

The heat radiation sides of the thermo-modules 205 and 206 are brought into contact with heat radiation blocks 209 and 210, respectively, which are cooled by cooling water introduced through cooling pipes 207 and 208.

When the semiconductor processing chemical is introduced into the heat exchange chamber through the first pipe 211, it is cooled in the heat exchange chamber 4 and then returned to the processing container via the second pipe 212.

Although this device can effectively control the temperature of the semiconductor processing chemical without the heat exchange plate coming into contact with the processing chemical and causing a reaction, the heat exchange efficiency is insufficient.
There was a problem that it took time to control.

Furthermore, since conventional devices use fluororesin for some of the structural members, there is a limit to the operating temperature range due to thermal expansion and contraction.

Therefore, in order to increase the heat exchange efficiency, the present inventor provided multiple flow channels inside the heat exchange block and airtightly connected the piping and the heat exchange block so that the semiconductor processing chemical solution flowed into the flow channels. We are proposing a heat exchanger that can be connected to

According to this heat exchanger, the contact area between the heat exchange block and the processing chemical increases as the processing chemical flows through the plurality of channels arranged inside the heat exchange block, thereby improving heat exchange efficiency.

However, with this structure, the flow efficiency of the processing chemical is not very good, and the difference in thermal expansion coefficient between the heat exchange block and the piping may cause liquid leakage or corrosive gas leakage at the sealing part. there were.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a heat exchanger that has high heat exchange efficiency, simple structure, high airtightness, and high reliability.

[Means for solving problems]

Therefore, in the present invention, electromagnetic heating means or far-infrared heating means for heating the processing liquid via the piping is provided at a predetermined portion of the piping, and heating is performed from the outside of the piping without contact.

[Effect]

According to the above structure, heating can be performed from the outside of the pipe without contact, so there is no need to connect the heat exchange part to the pipe, and since there is no joint with the pipe, it is possible to heat the pipe from the outside without contact. Even in this case, there is no leakage due to differences in thermal expansion coefficients.

Furthermore, since the heat exchange part and the processing liquid do not come into contact with each other and can be attached to the outside of the piping, manufacturing is also extremely easy.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing a constant temperature apparatus according to an embodiment of the present invention, and FIG. 2 is an enlarged view of its heat exchange section.

As shown in FIG. 1, this constant temperature device circulates the processing liquid from a reaction tank 1 filled with the processing liquid through a pipe 2 made of fluororesin using a pump 3, and has an electromagnetic wave heating device installed outside the pipe. 41 is arranged, and the outside thereof is further covered with a container 4.
Heat exchange is performed in a heat exchange section 4 covered with a heat exchanger 2, and the treated liquid, which has undergone temperature control and impurity removal, is returned to the reaction tank via a filter 5.

As shown in the enlarged view in FIG.
The electromagnetic wave heating means 41 is disposed on the outside of the piping, and since the piping has no joints, it is easy to shape the blue distribution, and the airtightness is extremely high. Furthermore, since there are no joints, there is no leakage of liquid due to differences in thermal expansion coefficients.

In this heat exchange section, heat exchange is performed over the entire piping area within the container, so the heat exchange area with the processing chemical is large, and the heat exchange efficiency is extremely high.

In addition, in the embodiment, the heat exchange section is constructed of electromagnetic wave heating means, but it may be constructed of far-infrared heating means.

Furthermore, the material of the piping is not limited to fluororesin, but any material may be used as long as it is not contaminated with impurities and has high heat resistance and pressure resistance against chemical-resistant chemicals.

〔Effect of the invention〕

As explained above, according to the constant temperature device of the present invention,
Electromagnetic heating means or far-infrared heating means that heat the processing liquid through the piping are installed in designated areas, and heating is performed from the outside of the piping without contact. There is no need for a connection, and constant temperature control can be performed instantly, making it possible to improve reliability.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a constant temperature device according to an embodiment of the present invention, FIG. 2 is an enlarged view of a heat exchange section, and FIG. 3 is a diagram showing a conventional constant temperature device.
FIG. 4 is a diagram showing a conventional heat exchanger. 101... Reaction tank, 102... Piping, 103...
Bomb, 104... Heat exchange section, 105... Filter, 201, 202... Heat exchange plate, 203... Side wall, 204... Heat exchange chamber, 205, 206... Thermo Module, 207.208...Cooling pipe, 20
9,210... Heat dissipation block, 211... Lth piping, 212... Second piping, 1... Reaction tank, 2...
・Piping, 3...Pump, 4...Heat exchange section, 5...
Filter, 41... Electromagnetic wave heating means, 42... Container. Figure 1 Section 3 41 Figure 2 Figure 4

Claims (1)

[Scope of Claims] A reaction tank filled with a processing liquid, a pipe for leading out the processing liquid from the reaction tank and returning it to the reaction tank, and a pipe installed in a part of the pipe to perform heat exchange with the processing liquid, A constant temperature device including a heat exchange section for controlling a liquid to a predetermined temperature, wherein the heat exchange section is an electromagnetic heating means or a far infrared heating means disposed outside the piping. .