JPH03214636A - Printed wiring board - Google Patents

Abstract

PURPOSE:To easily confirm the connection order of a semiconductor to conductor-circuit end parts and to restrain the erroneous confirmation of connections by a method wherein the conductor-circuits end parts of a special shape are arranged and installed at regular intervals around the semiconductor. CONSTITUTION:End parts 5 of conductor circuits 2 of different shapes are arranged and installed at regular intervals. That is to say, the conductor-circuit end parts 5 of a printed wiring board 1 on which circuits have been formed in such a way that the conductor-circuit end parts 5 of the conductor circuits 2 surround a semiconductor 3 are formed in such a way that they are short as compared with other end parts, e.g. for every four circuits; prescribed positions of the semiconductor 3 are connected to the respective conductor-circuit end parts 5 by using gold wires 4. Thereby, the connecting order to the semicon ductor 3 can be confirmed easily, a wiring mistake can be prevented and a mounting yield can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a printed wiring board used to mount a semiconductor.

(Prior art) As a semiconductor chip carrier using a printed wiring board, a pin grid array (P
GA) and plastic leadless chip carriers (PLCC) with external terminals directly arranged on the edge of the printed wiring board.
) is Nikkei Electronics Special Issue Micro Devices, 1
984.6. LL no. A chip-on-port (COB) in which a semiconductor chip is directly mounted on a printed wiring board is also known from Japanese Patent Laid-Open No. 61-349895. In these cases, the semiconductor chip mounted on the printed wiring board and the end of the conductive circuit on the printed wiring board are interconnected in one shell by a wire ring made of ultra-fine gold wire or aluminum wire. .

In recent years, as semiconductor chips have become more sophisticated and highly integrated, the number of I/Os on semiconductor chips has increased, and the number of wire rings has also increased, resulting in an increase in the number of conductor circuit ends on printed wiring boards surrounding semiconductor chips. will also increase. Conventionally, 60-15
In recent years, about 300 pieces of paper have been required, whereas it used to be about 0 pieces, and it is estimated that 400 to 500 pieces will be used in the future. In this way, when the number of conductor circuit ends increases, as shown in a model in FIG. It is difficult to recognize the order of the conductor circuit ends 5, and a problem arises in which the gold wire 4 is wired between the semiconductor chimp 3 and the conductor circuit end 5 in the wrong position.

[Problem to be solved by the invention]

The object of the present invention is to provide a printed wiring board having conductor circuit ends whose order of connection to the semiconductor is easily recognizable.

[Means to solve the problem]

In order to solve the above-mentioned problem, the printed wiring board according to the present invention has a conductor circuit of a printed wiring board connected to a semiconductor, in which the ends of the conductor circuits of different shapes are arranged at every corner for a certain distance. An object of the present invention is to provide a printed wiring board characterized by having a circuit.

〔Example] The present invention will be explained below based on the drawings.

FIG. 1 is an enlarged plan view of an embodiment of the present invention in which a semiconductor is mounted and mounted on a printed wiring board, and FIGS. 2 to 5 are plan views showing other embodiments. It is. In both cases, the number of conductor circuit ends in actual cases is 60.
This is a model with a small number of conductor circuit ends.

In a printed wiring board 1 in which the conductor circuit ends 5 of the conductor circuit 2 surround the semiconductor 3, in FIG. , and are connected to respective conductor circuit ends 5 at predetermined positions of the semiconductor 3 and through gold wires 4 .

In FIG. 2, the tip shape of the conductor circuit end 5 is cut diagonally for every fifth conductor circuit, and in FIG. In FIG. 4, every fourth conductor circuit end 5 has an L-shaped tip, and in FIG. 5, every fourth conductor circuit end has a slightly thicker circuit width. 5. Note that all of the above are examples, and they can be used in combination, and the shapes are not limited to these. Further, the end portions of the conductor circuit having a special shape at regular intervals may be arranged not only one but in a plurality, for example, 10 or 20 in a row.

As described above, since the conductor 3 integral circuit ends are arranged at regular intervals around the semiconductor, it is easy to confirm the connection order of the semiconductor and the conductor circuit ends, and there is no possibility of misidentification of connection. It has a useful effect in blocking and improves the yield of mounted products, and its effect is recognized in products with 60 or more conductor circuit ends, and is especially noticeable in products with 150 or more conductor circuit ends. .

Next, we will discuss the materials used. The printed wiring board 1 is made of an insulating material obtained by curing a prepreg resin obtained by impregnating a base material with a resin and drying it. The resin for this insulating material is preferably one that has excellent heat resistance and moisture resistance, and has high resin purity, particularly low ionic impurities. Specifically, resins such as epoxy resin, polyimide resin, unsaturated polyester resin, fluorocarbon resin, phenol resin, and PPO resin are suitable, and as base materials for insulating materials, paper cloth, organic synthetic fiber, glass fiber, glass nonwoven fabric, etc. It can be appropriately selected and used depending on the purpose. In particular, inorganic materials such as glass fiber and glass nonwoven fabric are preferable because of their excellent heat resistance and moisture resistance.

4 The conductor circuit 2 and the conductor circuit end portion 5 disposed on the printed wiring board 1 can be appropriately selected from copper, brass, aluminum, iron, stainless steel, etc. and used. Among them, copper is particularly preferred because of its excellent conductivity.

Next, the conductor circuit and the ends of the conductor circuit can be formed by using various commonly used circuit forming methods such as an additive method and a subtractive method.

(Effects of the Invention) As described above, in the printed wiring board of the present invention, in the conductor circuit of the printed wiring board connected to the semiconductor, the printed wiring board has conductor circuit ends of different shapes arranged at regular intervals. This makes it possible to easily recognize the order of connections with semiconductors, prevent wiring mistakes, and improve packaging yield.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of the present invention; Figures 2 to 5 are plan views of other embodiments. FIG. 6 shows a plan view of a conventional example. ・・・Printed wiring board ・Conductor circuit ···semiconductor ...gold wire ...Conductor circuit end

Claims (1)

[Claims] (1) A printed wiring board characterized in that a conductor circuit of the printed wiring board connected to a semiconductor has conductor circuit ends of different shapes arranged at regular intervals.