JPH03214756A - Chip removing jig - Google Patents

Abstract

PURPOSE:To avoid the pushed flaws and the defective electrical characteristics of a chip created in post-processes by a method wherein suction holes are provided near the contact part of a collet where the collet is brought into contact with the circumference of the chip. CONSTITUTION:A number of suction holes 8 which are linked with an exhaust hole 6 through a shut valve 9 are arranged radially near and outside the contact part 7 of a collet 2a where the collet 2a is brought into contact with the circumference of a chip 1. In order to remove the chip 1 from an adhesive sheet 4 with this chip removing jig, when the collet 2a is made to approach the chip 1, the shut valve 9 is opened and wastes adhering to the surface of the chip 1 are drawn off. When the collet 1 is brought into contact with the chip 1, the shut valve 9 is closed and the chip 1 is attracted by the collet 2a. With this constitution, the pushed flaws and the defective electrical characteristics of the chip can be avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a jig used during the manufacturing process of semiconductor devices, and in particular, to a jig used in the manufacturing process of semiconductor devices, and in particular, to a jig used for forming a large number of integrated circuit regions on a wafer, and for forming a chip containing the regions. This invention relates to a chip peeling jig used to peel off the chips one by one from the adhesive sheet after the wafer has been divided into chips and is stuck to the adhesive sheet.

[Conventional technology]

Traditionally, this type of jig has been used to separate wafers into chips, which is the first step in the assembly process for semiconductor devices.
It is used in the process of mounting a chip on a lead frame, that is, the chip mounting process. For this reason, various measures have been taken to prevent fine dust and the like from adhering to the chip.

FIG. 3 is a perspective view for explaining an example of a conventional chip peeling jig. As shown in the figure, this chip peeling jig includes a flat cap 5 to which an adhesive sheet 4 to which a chip 1, which is a divided semiconductor piece, is attached is attached by pulling;
A collet 2 having an exhaust gas 66 and a recess similar to the outer contour of the chip 1 at the center facing the flat cap 5.
Although not shown in the drawings, it is composed of an ejector rod that pushes from the back side of the flat cap and presses the chip against the collet 2.

When peeling off the chip 1 from the adhesive sheet 4 using this chip peeling jig, first push up the chip 1 pasted on the adhesive sheet 4 using the ejector rod, and then insert the chip 1 into the collet 2.
1 and make contact with the contact portion 7. Next, the collet 2 is evacuated from the exhaust 66, and the chips are attracted to the collets 1 and 2. Next, raise the collet and peel chip 1 from adhesive sheets 1 and 4. After this, although not shown in the drawing,
The collet 2 moves and is transferred to the island of the lead frame placed on the stage of the mounting device. In this way, a large number of chips attached to the adhesive sheet 4 were peeled off one by one and transferred to the lead frame.

[Problem to be solved by the invention]

However, with conventional chip stripping jigs, silicone debris generated during cutting adheres to the contact surface 7 of the collet 2, and this debris falls off while the jig is being operated, leaving behind the remaining chips affixed to the adhesive sheet. There are problems in that the debris that is placed on the chip and adheres to the chip may cause scratches in subsequent processes or cause defects in electrical characteristics.

The present invention solves this problem, and makes it possible to
It is an object of the present invention to provide a chip peeling jig that does not cause defects in electrical characteristics.

[Means to solve the problem]

The chip peeling jig of the present invention has an exhaust hole for peeling off the chips by vacuum adsorption force from a wafer that is divided into a large number of chips and attached to an adhesive sheet, and a depression having a similar external shape to the chip. In the chip stripping jig having a collet, the collet is characterized in that a plurality of suction holes are provided in the collet near the outside of the contact portion with the chip and arranged along the outer contour of the chip.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a partial sectional view of a collet of a chip stripping jig showing one embodiment of the present invention. As shown in the figure, this chip stripping jig includes an exhaust valve 6 and a shirt valve 9 near the outside of the contact portion 7 that contacts the periphery of the chip 1 of the collet 2a.
This is because a large number of suction holes are arranged radially and communicate through the holes.

When the chip 1 is peeled off from the adhesive sheet 4 using this chip peeling jig, when the collet 2a approaches the chip 1, the shirt valve 9 is opened and the surface of the chip 1 is removed from the suction hole 8. Suction and remove attached debris. Then, when the collet 2a comes into contact with the chip 1, the shirt bolt 9 snaps, and the chip 1 is attracted to the collet 2a.

FIG. 2 is a partial cross-sectional view of a collet of a chip stripper according to another embodiment of the present invention. As shown in the figure, this chip stripping jig is provided with a flexible exhaust pipe 10 that connects to a hole that communicates with a suction pipe 68 formed side by side on the outside of the contact area with the peripheral edge of the chip 1. A vacuum bomb (not shown) was provided independently.

This chip stripping jig has an independent vacuum bomb and a sequence control device that controls this jig, so that even after the chip 1 has been sucked into the collet 2b and the chip 5 is attached, the effect of sucking the chips from the suction hole 8 is maintained. Since it can last longer, it is better than the chip removal jig of the above-mentioned embodiment.
This has the advantage of preventing debris from falling.

〔Effect of the invention〕

As explained above, the present invention provides a suction hole near the contact portion of the collet 1 that contacts the periphery of the chip to suck in debris adhering to the chip, thereby preventing the generation of push scraps on the chip in the subsequent process. Moreover, it is possible to obtain a chip stripping jig that does not cause defects in electrical characteristics.

[Brief explanation of drawings]

FIG. 1 is a partial cross-sectional view of a collet of a chip stripping jig showing one embodiment of the present invention, FIG. 2 is a partial cross-sectional view of a collet of a chip stripping jig showing another embodiment of the present invention, and FIG. FIG. 2 is a perspective view for explaining an example of a conventional chip peeling jig. 1... Chip, 2, 2a, 2b... Collet, 3.
...One missing number, 4...Adhesive sheet, 5...Flat cap, 6 6...Exhaust hole, 7...Contact part, 8...Suction hole, 9...Shut valve, 10 ···Exhaust pipe.

Claims (1)

[Claims] In a chip peeling jig having an exhaust hole for peeling off the chips by vacuum adsorption force from a wafer which is divided into a large number of chips and attached to an adhesive sheet, and a collet having a recess having a similar external shape to the chip. . A chip stripping jig, characterized in that the collet is provided with a plurality of suction holes arranged along the outer contour of the chip near the outside of the contact portion with the chip.