JPH03214791A - Electronics - Google Patents

Abstract

PURPOSE:To improve the mounting density of components by a method wherein the components are mounted in such a way that the surface, on which the terminals of an electric component are soldered, of a substrate is different from the surface, on which the chip components are soldered, of the substrate. CONSTITUTION:Holes 4 for inserting terminals 3 of an electric component 2 are provided in a substrate 1 and copper foils 5 for soldering the terminals 3 of the component 2 are respectively provided on the peripheries of the individual holes 4 on the side of the substrate surface identical with that in the direction of insertion of the component 2. Chip components 6 are installed on the substrate 1 from the opposite direction to the direction of insertion of the component 2. Copper foils 7 for soldering the components 6 are provided. The terminals 3 of the component 2 are inserted in the holes 4, which are provided so as to correspond to the terminals 3 of the component 2, of the substrate 1 and the parts of the foils 5 are fixed to the terminals 3 of the component 2 with solders 8. Similarly, the components 6 are also fixed to the foils 7 with solders 8. Accordingly, the surface, on which the terminals 3 of the component 2 are soldered, of the substrate results in being different from the surface, on which the chip components 6 are soldered, of the substrate 1. Thereby, the mounting density of the components can be improved.

Description

[Detailed description of the invention] Industrial applications The present invention is. This relates to electronic devices such as tuners.

Conventional technology The structure of a conventional electronic device is that a hole is provided in a board, and around the hole, steel foil for soldering (1) (2) is provided on either side of the board, and the copper foil is placed around the hole. Insert the terminal of the electrical component into the hole of the board from the side opposite to the side with Steel foil for soldering chip components was provided on the opposite side of the electrical component from the direction in which the terminals were inserted, and the chip components were mounted on the copper foil and fixed by soldering. This will be explained below based on the drawings.

Conventional examples are shown in FIGS. 5 to 7.

A board 9 has a hole 12 into which a terminal 11 of an electric component 10 is inserted. Further, a chip component 13 is mounted on the board 9 from a direction opposite to the direction in which the electrical component 10 is inserted. FIG. 6 is a view of the substrate 9 from direction B in FIG.
A steel foil 14 for soldering the terminal 11 of the electrical component 10 and a copper foil 15 for soldering the chip component 13 are provided around the terminal 2 . The terminal 11 of the electrical component 10 is inserted into the hole 12 of the board 9 provided to correspond to the terminal 11 of the electrical component 10, and the terminal 11 is inserted into the copper foil 14.1 of the board 9.
The copper foil 14 and the terminal 11 of the electrical component 10 are fixed to each other by solder 16 . Similarly, the chip component 13 is also fixed to the copper foil 15 by solder 16.

Problems to be Solved by the Invention In this conventional method, the copper foil surface to which the terminals of electrical components are soldered and the copper foil surface to which chip components are soldered are the same surface, and the soldering of the terminals of electrical components It is necessary to provide an appropriate gap (the part without copper foil) K between the copper foil part for attachment and the copper foil part for soldering chip components, which reduces the packaging density of the components and also reduces the soldering of the chip components. Each had the disadvantage that the terminals of the electrical components protruded from the mounting surface, making it easy for solder shorts to occur between the terminals of the electrical components and the chip components during soldering.

The present invention is intended to solve the above problems, and aims to improve the packaging density of components and at the same time prevent solder shorts between terminals of electrical components and chip components.

Means for Solving the Problem In order to solve this problem, the present invention provides a soldering copper plate on one side of a board having a hole into which a terminal of an electrical component is inserted, so as to be located around the hole. A foil is provided, a terminal of an electrical component is inserted into the hole of the board from the same side as the surface with the steel foil, and the terminal of the electrical component is fixed to the steel foil of the board by soldering. Furthermore, in this case, the terminals of the electrical components are not protruded from the surface of the board.

Since the surface to which the terminals of the working electrical components are soldered is different from the surface to which the chip components are soldered, it is possible to improve the mounting density of components, and the terminals of the electrical components do not protrude from the soldering surface of the chip components. With this structure, it is possible to prevent a solder short between the terminal of the electrical component and the chip component during soldering.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 to 4.

Reference numeral 1 in FIG. 1 is a board, which has a hole 4 into which a terminal 3 of an electric component 2 is inserted. A copper foil 5 for soldering the terminals 3 of the electrical component 2 is provided around the hole 4 on the same side as the direction in which the electrical component 2 is inserted. Furthermore, a chip component 6 is mounted on the board 1 from a direction opposite to the direction in which the electrical component 2 is inserted. FIG. 2 is a view of the board 1 viewed from the direction A in FIG. 1. Steel foil 7 for soldering chip components 6 is provided. Hole 4 of substrate 1 provided to correspond to terminal 3 of electrical component 2
The terminal 3 of the electrical component 2 is inserted into the terminal 3 of the electrical component 2, and the steel foil 5 portion and the terminal 3 of the electrical component 2 are fixed with solder 8. Similarly, the chip component 6 is also fixed to the copper ffl7 by solder 8.

As a result, the surface to which the terminals of the electrical component are soldered and the surface to which the chip component is soldered are different from each other, so that the packaging density of the components can be improved. Furthermore, as shown in FIG. 4, if the terminal 3' of the electrical component 2' is made not to protrude beyond the surface of the board 1 on which the chip component 6 is mounted, the terminal 3' of the electrical component 2' and the chip component 6 can be connected to each other during soldering. This has the effect of preventing solder shorts between the two.

Effect of the Invention 5 As described above, according to the present invention, since the surface to which the terminals of the electrical component are soldered and the surface to which the chip component is soldered are different from each other, the packaging density of the components can be improved, and as a result, the mounting density of the components can be improved. As a result, it is possible to downsize electronic devices such as tuners, and by preventing the terminals of electrical components from protruding from the surface to which the chip components are soldered, it is possible to prevent solder shorts between the terminals of the electrical components and the chip components during soldering. This has the effect of stabilizing quality.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of one embodiment of the present invention, and FIG.
FIG. 3 is a sectional view of the same embodiment, and FIG. 4 is a sectional view of another embodiment of the present invention. 1... Board, 2... Electrical parts, 3...
...terminal, 4...hole, 5...copper foil for soldering terminals of electrical components, 6...chip component, 7...・Copper foil for soldering chip parts,
8...Solder. 6

Claims (2)

[Claims] (1) Copper foil for soldering is provided on one side of a board that has a hole for inserting the terminal of an electrical component so as to be located around the hole, and the same side as the side with the copper foil is provided. An electronic device in which a terminal of an electrical component is inserted into a hole in the board, and the terminal of the electrical component is fixed to the copper foil of the board by soldering. (2) The electronic device according to claim 1, wherein the terminals of the electrical components are prevented from protruding from the surface of the board.