JPH03215699A - Electrodeposition coated member and production thereof - Google Patents

Electrodeposition coated member and production thereof

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Publication number
JPH03215699A
JPH03215699A JP1102990A JP1102990A JPH03215699A JP H03215699 A JPH03215699 A JP H03215699A JP 1102990 A JP1102990 A JP 1102990A JP 1102990 A JP1102990 A JP 1102990A JP H03215699 A JPH03215699 A JP H03215699A
Authority
JP
Japan
Prior art keywords
film
copper
electrodeposition
electrodeposition coated
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1102990A
Other languages
Japanese (ja)
Other versions
JP2608339B2 (en
Inventor
Susumu Sumikura
角倉 進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011029A priority Critical patent/JP2608339B2/en
Publication of JPH03215699A publication Critical patent/JPH03215699A/en
Application granted granted Critical
Publication of JP2608339B2 publication Critical patent/JP2608339B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To produce the above electrodeposition coated member having excellent corrosion resistance by successively forming a chemically colored film and an electrodeposition coated film on a nonmetallic base material having a thin film of copper on a surface and curing the electrodeposition coated film at a low temp. CONSTITUTION:The nonmetallic base material 1 is subjected to etching and catalytic treatment and thereafter, the thin film 2 of copper plating of about 1 to 10mu thickness is formed by electroless plating on this substrate. After the chemically colored film 3 of a thin oxide film is formed on the thin film 2 of the copper plating by a copper oxide method, etc., using an alkali, the electrodeposition coated film 4 of an acrylic, melamine system, etc., of low-temp. curing resins on the chemically colored film 3 and is subjected to a curing treatment for about 20 to 180 min. at about 90 to 100 deg.C. The electrodeposition coated film 4 is formed with a good adhesive property on the non-metallic base material 1 in this way and the electrodeposition coated member useful for optical apparatus, such as cameras, is obtd.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、カメラ等光学機器や、事務機、音響製品、家
庭電化製品あるいは計器類などに用いられる粗性表面形
成に適する電着塗料および電着塗装部材に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides an electrodeposition coating material and a coating material suitable for forming rough surfaces used in optical equipment such as cameras, office machines, audio products, home appliances, instruments, etc. This invention relates to electrodeposition coated members.

〔従来の技術〕[Conventional technology]

従来、電着塗装部材を形成する方法としては、基材表面
にリン酸亜鉛部材あるいは銅上にニッケルめっきを施し
たのちクロム酸塩によるクロメート処理またはクロムめ
っきを施し塗膜形成していた。
Conventionally, the method of forming an electrodeposition coated member was to apply nickel plating on a zinc phosphate member or copper on the surface of the base material, and then perform chromate treatment with chromate or chromium plating to form a coating film.

また、吹付塗装としては特殊処理としてカブリング処理
等で構成されている。
Additionally, spray painting includes a special treatment such as fogging treatment.

しかしながら、従来の方法には、次のような欠点があっ
た。基板上は塗膜形成は銅表面に直接塗装すると、銅自
身の耐食性が著しく悪く品質上大きな問題である。次に
ニッケルめっき表面の塗装は耐食性は解決するものの付
着性が極度に悪く、やはり品質に問題である。さらには
付着性を向上するためにクロム酸塩を用いた化学的処理
または電解によるクロメート処理、あるいはクロムめっ
き等は工程が増加をするとともに、作業環境の悪化さら
には公害等の問題があり量産的ではない。
However, the conventional method has the following drawbacks. When forming a coating film on a substrate, if it is applied directly to the copper surface, the corrosion resistance of the copper itself is extremely poor, which poses a major quality problem. Next, although painting the nickel-plated surface solves the problem of corrosion resistance, it has extremely poor adhesion, which is still a quality problem. Furthermore, chemical treatment using chromate or electrolytic chromate treatment to improve adhesion, or chromium plating, etc., increases the number of steps, worsens the working environment, and poses problems such as pollution, making mass production difficult. isn't it.

また吹付塗装においては、ニッケルめっき被膜上に塗膜
形成しているが特殊処理としてシランカプリング剤処理
あるいは特別仕様の限られた高価な塗料を用いて形成し
ているためやはり工程の複雑性による高度の技術を要す
るとともにコスト高の問題があり量産的ではない。
In addition, in spray painting, a coating film is formed on the nickel plating film, but it is formed using a special treatment such as a silane coupling agent treatment or an expensive paint with limited special specifications, so the complexity of the process also increases the It requires a lot of technology and is expensive, so it cannot be mass-produced.

一方、近年電着塗装膜の硬化方法も特公昭59−347
99号公報に記載されている高温硬化型から低温硬化型
へ移行されつつある。これは、外装用として基材がプラ
スチック化され、さらには表面改質のニーズが高まり高
級志向への展開が必要となってきたからである。こうし
たことから低温硬化と共に表面改質を目的とした電着塗
装法がいくつか提案されているが、いずれも塗膜特性が
高温硬化型に較べ基材への密着性が低《品質の低下で製
品への汎用性に欠け限定されたものとなる。
On the other hand, in recent years, the curing method for electrodeposited coatings has also been changed to
A transition is being made from the high temperature curing type described in Japanese Patent No. 99 to the low temperature curing type. This is because the base material for exterior use has become plastic, and the need for surface modification has increased, making it necessary to develop products for high-end products. For this reason, several electrodeposition coating methods have been proposed for the purpose of surface modification as well as low-temperature curing, but all of them have coating film characteristics that are lower in adhesion to the substrate than high-temperature curing types. The product lacks versatility and is limited.

〔発明が解決しよ・うとしている問題点〕本発明は上記
問題点に鑑みなされたものであり、耐食性に優れた電着
塗装部材及びその製造方法を提供することを目的とする
ものである。また本発明は低温硬化法で電着塗装膜を硬
化させた場合も基材と前記電着塗装被膜との密着性が良
好な電着塗装部材及びその製造方法を提供することを他
の目的とするものである。
[Problems to be solved by the invention] The present invention has been made in view of the above problems, and its purpose is to provide an electrodeposition coated member with excellent corrosion resistance and a method for manufacturing the same. . Another object of the present invention is to provide an electrocoated member and a method for producing the same, which exhibits good adhesion between the base material and the electrocoated film even when the electrocoated film is cured by a low-temperature curing method. It is something to do.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の電着塗装部材は、金属基材又は七埠表面に銅薄
膜を有する非金属基材及び化学着色膜を有し、該化学着
色膜上に電着塗装被膜を有することを特徴とするもので
ある。
The electrodeposition coated member of the present invention is characterized by having a metal base material or a non-metal base material having a copper thin film on the surface thereof, a chemically colored film, and an electrodeposition coated film on the chemically colored film. It is something.

また本発明の電着塗装部材の製造方法は、金属基材又は
銅薄膜を÷存表面に有する非金属基材上に化学着色膜を
形成し、次いで該化学着色膜上に電着塗装被膜を形成し
た後、該電着塗装被膜を低温硬化させることを特徴とす
るものである。
Further, the method for manufacturing an electrodeposition coated member of the present invention involves forming a chemically colored film on a metal base material or a nonmetallic base material having a copper thin film on its surface, and then applying an electrodeposition coated film on the chemically colored film. After being formed, the electrodeposited coating is cured at a low temperature.

即ち本発明によれば基材上の銅薄膜を形成し該銅薄膜上
に化学着色層を形成した後、電着塗装膜を形成すること
により、銅自身の耐食性の向上及び電着塗装被膜の基材
への付着性が向上したものであり、OA機器、家電製品
等、電磁波シールド体策されたプラめっきへの外装塗装
への適用が有効である。
That is, according to the present invention, a copper thin film is formed on a substrate, a chemically colored layer is formed on the copper thin film, and then an electrodeposition coating film is formed, thereby improving the corrosion resistance of the copper itself and improving the corrosion resistance of the electrodeposition coating film. It has improved adhesion to base materials, and is effective for application to exterior painting of plastic plating that is designed to shield electromagnetic waves, such as OA equipment and home appliances.

本発明による電着塗装部材の構成は、第1図に示す。The structure of the electrocoated member according to the present invention is shown in FIG.

第1図に於で非金属部材に銅めっきを施し、さらに化学
着色被膜を形成し、その後、電着塗装膜を形成したとき
の態様の断面図である。非金属部材としてはABS樹脂
を無電解銅めっき、あるいは電解めっきが施され、次い
で、化学着色被膜を形成し電着塗装膜を形成するもので
あるが、この化学着色被膜の形成方法としては、酸化銅
法、炭酸銅法、硫化銅法、水酸化銅アンモニア法あるい
は亜酸化銅法等があるが、本発明によって、付着性、耐
食性を満足する方法としてはアルカリによる酸化銅法が
最も効果があり、また、銅上に直接電着塗装膜を形成す
ると、銅が電着塗料中に溶解し蓄積され塗膜物性に影響
があるが、酸化被膜上の電着塗装膜形成は銅イオンの存
在は認められない。次に化学着色の処理条件としては、
薄い酸化被膜の形成で目的を達成することができる。電
着塗装に関しては、アニオン系あるいはカチオン系が適
用できる。
FIG. 2 is a cross-sectional view of an embodiment in which the nonmetallic member in FIG. 1 is plated with copper, further a chemically colored film is formed, and then an electrodeposition coating film is formed. As a non-metallic member, ABS resin is subjected to electroless copper plating or electrolytic plating, and then a chemically colored film is formed to form an electrodeposition coating film.The method for forming this chemically colored film is as follows: There are copper oxide methods, copper carbonate methods, copper sulfide methods, cupric ammonia hydroxide methods, cuprous oxide methods, etc., but according to the present invention, as a method that satisfies adhesion and corrosion resistance, the copper oxide method using alkali is the most effective method. Also, when an electrodeposition coating film is formed directly on copper, copper dissolves and accumulates in the electrodeposition paint, which affects the physical properties of the coating, but formation of an electrodeposition coating film on an oxide film is due to the presence of copper ions. It is not allowed. Next, the processing conditions for chemical coloring are as follows:
This goal can be achieved by forming a thin oxide film. Regarding electrodeposition coating, anionic or cationic coatings can be applied.

次に、硬化温度はプラスチック部材の関係で90〜10
0℃のオーブンで20〜180分間が望ましい。
Next, the curing temperature is 90 to 10 degrees depending on the plastic material.
It is desirable to bake in an oven at 0°C for 20 to 180 minutes.

第2図は金属上基材に化学着・色被膜を形成し電着塗膜
を形成したときの態様の断面図である。このときも、化
学着色法はアルカリによる酸化銅が最も−効果があった
FIG. 2 is a cross-sectional view of an embodiment in which a chemically deposited/colored film is formed on a metal base material and an electrodeposition coating film is formed. In this case as well, copper oxide using alkali was the most effective chemical coloring method.

このように電着塗装部材は金属基材に酸化被膜を形成す
ることによって電着塗膜との付着性、耐食性が著し《向
上し、商品価値を高める効果がある。特に本発明は電着
塗装膜を低温で硬化させる場合に有効である。
In this way, by forming an oxide film on the metal base material of the electrodeposition coated member, the adhesion with the electrodeposition coating film and the corrosion resistance are significantly improved, which has the effect of increasing the commercial value. Particularly, the present invention is effective in curing electrodeposition coating films at low temperatures.

本発明の代表的な構成・とじては、基材はABS材また
は金属材でABS材では一般に知られているプラスチッ
ク上のめっき法で、エッチングし触媒処理後無電解めっ
きを1−10μmを施す。次に銅部材又はアルカリによ
る酸化銅(厚みとしてlμm以下)を形成し、後に一般
に知られているめっき部材を低温硬化樹脂アクリル・メ
ラミン、系、アクリル系、エポキシ系、ウレタン系、ア
ルキツド系等で電着塗装被膜を形成する。該被膜には必
要に応じてセラミック粒子を分散することで塗膜強度の
向上が図れる。塗料としての樹脂濃度は7〜l5wt%
が好ましく(着色のために顔料として1〜3wt%を添
加する)電解条件としては20〜25℃、pH8.5〜
9で50〜170vが望ましい。
In a typical configuration of the present invention, the base material is an ABS material or a metal material, and the ABS material is etched and treated with a catalyst, followed by electroless plating to a thickness of 1 to 10 μm using a commonly known plastic plating method. . Next, copper oxide (thickness of 1 μm or less) is formed using a copper member or alkali, and later the plated member is coated with a generally known low-temperature curing resin such as acrylic/melamine, acrylic, epoxy, urethane, or alkyd resin. Forms an electrodeposition coating. The strength of the coating can be improved by dispersing ceramic particles in the coating as necessary. Resin concentration as paint is 7-15wt%
is preferable (1 to 3 wt% is added as a pigment for coloring).The electrolytic conditions are 20 to 25°C, pH 8.5 to
9 and 50-170v is desirable.

次いて硬化温度としては90〜100℃のオーブンで2
0〜180分間硬化し完成する。この供試片はJISK
5400に準拠し、付着性、耐塩水性試験によって評価
した。その結果は表−11表−2に示す。
Next, the curing temperature is 22 in an oven at 90 to 100℃.
It is cured for 0 to 180 minutes to complete. This specimen is JISK
5400, and was evaluated by adhesion and salt water resistance tests. The results are shown in Table 11 and Table 2.

以上本発明は酸化被膜形成によって、電着塗装の付着性
、あるいは耐食性に関して、問題点を解決するとともに
外装への適用を可能とし、Niめっきの廃止等によるコ
スト面においても大きく寄与する。
As described above, the present invention solves problems regarding adhesion or corrosion resistance of electrodeposition coatings by forming an oxide film, and also enables application to exteriors, and greatly contributes to cost reduction by abolishing Ni plating.

以下、本発明を実施例に従ってより具体的に説明するが
本発明に係る実施例のみ限定されるものではない。
Hereinafter, the present invention will be explained in more detail according to Examples, but the present invention is not limited to the Examples.

〔実施例〕〔Example〕

実施例I ABS (電気化学工業社製)基板を用いてCr03H
2S04−H20系エッチング液で1分間処理し水洗後
、センシタイザー液として塩化第1スズ30g/I2、
塩酸20mf/I!を用いて室温2分間処理し水洗し、
次いで、アクチベータ液として、塩化パラジウム0.3
g/ A ,塩酸3ml/Iを用いて室温、2分間処理
し導通化した。その後、無電解銅めっき液(奥野製薬工
業社製)pH13.0浴温70℃にて30分間めっきを
施し2μmの厚さを得た。次いで、水酸化ナトリウム5
%、過硫酸カリウム1%の水溶液で70℃、1分間処理
し化学着色膜である銅の酸化被膜を形成した。そして、
アクリル・メラミン系樹脂(商品名:ハニブライトC−
IL,ハニー化成社製)100重量部に対して平均粒径
1μmのアルミナ表面に無電解ニッケルめっき2μmを
施したものをlO重量部をポールミルで30時間分散し
た後、脱塩水にて15重量部に稀釈し着色のためにカー
ボンブラック2.0重量部添加し塗液を用いて浴温25
℃、PH8〜9の条件で、被塗装物を陽極とし、対極と
して0.5tステンレス板を用い印加電圧150V,3
分間電着した。電着後に水洗し、97℃±1℃のオーブ
ンにて60分間硬化し完成した。この形成された電着塗
膜の付着性(JISK5400碁盤目試験に準拠)、耐
食性(JISK5400塩水噴霧試験に準拠)について
、銅上の電着塗膜、ニッケル上の電着塗膜と比較した結
果、(表−1及び2)で示す通り、付着性は100/1
00、耐食性は片側フクレ幅として1 m m以下で非
常に効果が認められた。
Example I Cr03H using ABS (manufactured by Denki Kagaku Kogyo Co., Ltd.) substrate
After treatment with 2S04-H20 type etching solution for 1 minute and washing with water, 30 g of stannous chloride/I2 as sensitizer solution,
Hydrochloric acid 20mf/I! Treat for 2 minutes at room temperature using
Then, as an activator liquid, palladium chloride 0.3
g/A, and treated with 3 ml/I of hydrochloric acid at room temperature for 2 minutes to conductivity. Thereafter, plating was performed for 30 minutes at an electroless copper plating solution (manufactured by Okuno Pharmaceutical Co., Ltd.) with a pH of 13.0 and a bath temperature of 70°C to obtain a thickness of 2 μm. Then sodium hydroxide 5
% and potassium persulfate for 1 minute at 70° C. to form a chemically colored copper oxide film. and,
Acrylic/melamine resin (product name: Honeybright C-
After dispersing 100 parts by weight of alumina with an average particle size of 1 μm and electroless nickel plating of 2 μm on the surface of alumina (IL, manufactured by Honey Kasei Co., Ltd.) in a Pall mill for 30 hours, 15 parts by weight was added to demineralized water. Add 2.0 parts by weight of carbon black for coloring, and use the coating solution at a bath temperature of 25%.
℃ and pH 8 to 9, using the object to be coated as an anode and a 0.5t stainless steel plate as a counter electrode, apply a voltage of 150 V, 3
It was electrodeposited for a minute. After electrodeposition, it was washed with water and cured in an oven at 97°C±1°C for 60 minutes to complete the process. The adhesion (according to JISK5400 grid test) and corrosion resistance (according to JISK5400 salt spray test) of the formed electrocoated coating were compared with those of the electrocoated coating on copper and the electrocoated coating on nickel. As shown in (Tables 1 and 2), the adhesion is 100/1.
00, corrosion resistance was very effective when the width of one side blistering was 1 mm or less.

実施例2 ABS (電気化学工業社製)基板を用いてCr03H
2SO4−H20系エッチング液で1分間処理し、水洗
後センシタイザー液として塩化第1スズ30g/I!、
塩酸20mi!/I!を用いて室温、2分間処理し水洗
し、次いでアクテベータ液として、塩化パラシウム0.
3g/ I!、塩酸3rrl/j!を用いて室温、2分
間処理し、導通化した。その後、無電解銅めっき液(奥
野製薬工業社製)、pH13.0浴温70℃にて、30
分間めっきを施し2μmの厚さを得た。次いで水酸化ナ
トリウム5%、過硫酸カリウム1%の水溶液で70℃、
1分間処理し酸化被膜を形成を完成した。そして、アク
リル・メラミン系樹脂(商品名:ハニブライ}C−IL
,ハニー化成社製) 100重量部に対して平均粒径1
μmのアルミナを10重量部をボールミルで30時間分
散した後、脱塩水にて15重量部に稀釈し着色のために
カーボンプラック2.0重量部添加し塗液を用いて浴温
25℃、pH8〜9の条件で、被塗装物を陽極とし、対
極として0.5tステンレス板を用い印加電圧150V
,3分間電着した。電着後に水洗し、97°C±1℃の
オーブンにて60分間硬化し完成した。この形成された
電着塗膜の付着性(JIS.K5400碁盤目試験に準
拠)、耐食性(JIS.K5400塩水噴霧試験に準拠
)について、銅上の電着塗膜、ニッケル上の電着塗膜と
比較した結果、実施例−1と同様の結果が得られ、非常
に効果があることが認められた。
Example 2 Cr03H using ABS (manufactured by Denki Kagaku Kogyo Co., Ltd.) substrate
Treated with 2SO4-H20 etching solution for 1 minute, washed with water, and then treated with 30g/I of stannous chloride as a sensitizer solution! ,
Hydrochloric acid 20mi! /I! was treated for 2 minutes at room temperature, washed with water, and then treated with 0.0% palladium chloride as an activator solution.
3g/I! , hydrochloric acid 3rrl/j! was used for 2 minutes at room temperature to make it conductive. After that, electroless copper plating solution (manufactured by Okuno Pharmaceutical Co., Ltd.), pH 13.0, bath temperature 70°C, 30
Plating was performed for minutes to obtain a thickness of 2 μm. Then, at 70°C with an aqueous solution of 5% sodium hydroxide and 1% potassium persulfate,
After processing for 1 minute, the formation of an oxide film was completed. And acrylic/melamine resin (product name: Honeybly) C-IL
(manufactured by Honey Kasei Co., Ltd.) Average particle size 1 per 100 parts by weight
After dispersing 10 parts by weight of μm alumina in a ball mill for 30 hours, it was diluted to 15 parts by weight with demineralized water, and 2.0 parts by weight of carbon plaque was added for coloring. Under the conditions of ~9, the object to be coated was used as an anode, a 0.5t stainless steel plate was used as a counter electrode, and an applied voltage of 150V was applied.
, electrodeposited for 3 minutes. After electrodeposition, it was washed with water and cured in an oven at 97°C±1°C for 60 minutes to complete the process. The adhesion (according to JIS.K5400 grid test) and corrosion resistance (according to JIS.K5400 salt spray test) of the formed electrocoated coating were evaluated for the electrocoated coating on copper and the electrocoated coating on nickel. As a result of comparison, results similar to those of Example-1 were obtained, and it was recognized that the results were very effective.

実施例3 ABS (電気化学工業社製)基板を用いてCr03H
2SO4−H20系エッチング液で1分間処理し、水洗
後センシタイザー液として塩化第1スズ30g/It、
塩酸20mj7/I!を用いて室温、2分間処理し水洗
し、次いでアクテベータ液として、塩化パラジウム0.
3g/ I!、塩酸3ml/I!を用いて室温、2分間
処理し、導通化した。その後、無電解銅めっき液(奥野
製薬工業社製)、pH13.0、浴温70℃にて、30
分間めっきを施し2μmの厚さを得た。
Example 3 Cr03H using ABS (manufactured by Denki Kagaku Kogyo Co., Ltd.) substrate
After treatment with 2SO4-H20 based etching solution for 1 minute and washing with water, 30g/It of stannous chloride was added as a sensitizer solution.
Hydrochloric acid 20mj7/I! was treated for 2 minutes at room temperature, washed with water, and then treated with 0.0% palladium chloride as an activator solution.
3g/I! , hydrochloric acid 3ml/I! was used for 2 minutes at room temperature to make it conductive. After that, electroless copper plating solution (manufactured by Okuno Pharmaceutical Co., Ltd.), pH 13.0, bath temperature 70°C, 30
Plating was performed for minutes to obtain a thickness of 2 μm.

次いで水酸化ナトリウム5%、過硫酸カリウム1%の水
溶液で70℃、1分間処理し酸化被膜の形成を完了した
。そして、アクリル・メラミン系樹脂(商品名:ハニブ
ライトC−IL,ハニー化成社製)100重量部を、脱
塩水にて15重量部に稀釈し着色のためにカーボンブラ
ック2.0重量部添加し塗液を用いて浴温25℃,pH
8〜9の条件で、被塗装物を陽極とし、対極として0.
5tステンレス板を用い印加電圧150V,3分間電着
した。電着後に水洗し、97℃±1℃のオーブンにて6
0分間硬化し完成した。
Next, it was treated with an aqueous solution of 5% sodium hydroxide and 1% potassium persulfate at 70° C. for 1 minute to complete the formation of an oxide film. Then, 100 parts by weight of acrylic/melamine resin (trade name: Honeybrite C-IL, manufactured by Honey Kasei Co., Ltd.) was diluted to 15 parts by weight with demineralized water, and 2.0 parts by weight of carbon black was added for coloring. Using a bath temperature of 25℃, pH
Under conditions 8 to 9, the object to be coated was used as the anode and the counter electrode was used as the 0.
Electrodeposition was performed using a 5t stainless steel plate at an applied voltage of 150V for 3 minutes. After electrodeposition, wash with water and place in an oven at 97℃±1℃ for 6 days.
It was cured for 0 minutes and completed.

この形成された電着塗膜の付着性(JIS.K5400
碁盤目試験に準拠)、耐食性01S.K5400塩水噴
霧試験に準拠)について、銅上の電着塗膜、ニツケル上
の電着塗膜と比較した結果、実施例lと同様の結果が得
られ、非常に効果があることが認められた。
Adhesion of the formed electrodeposited coating (JIS.K5400
Corrosion resistance 01S. As a result of comparing the electrodeposited coating on copper and the electrocoated coating on nickel (according to K5400 salt spray test), the same results as in Example 1 were obtained, and it was recognized that it was very effective. .

実施例4 黄銅板(100X50X0.7)を用いて、溶剤脱脂、
電解脱脂等のめっき前処理を行なった。次いで、水酸化
ナトリウム5%、過硫酸カリウム1%の水溶液を用いて
、70℃1分間処理し、銅の酸化皮膜を形成し完成した
。そしてアクリル・メラミン系樹脂(商品名:エレコー
ト、シミズ社製)100重量部に対して平均粒径lμm
のアルミナ表面に無電解ニッケルめっき2μmを施した
ものをlO重量部をボールミルで30時間分散した後、
脱塩水にて15重量部に希釈し着色のためにカーボンブ
ラック2.0重量部添加し塗液を用いて浴温25℃、p
H8〜9の条件で、被塗装物を陽極とし、対極として0
.5tステンレス板を用い印加電圧150V,3分間電
着した。電着後に水洗し、97℃±1℃のオーブンにて
60分間硬化し完成した。この形成された電着塗膜の付
着性(JIS.K5400碁盤目試験に準拠)、耐食性
(JIS.K5400塩水噴霧試験に準拠)について、
銅上の電着塗膜、ニッケル上の電着塗膜と比較した結果
、(表−1)に示す通り付着性は100/100,耐食
性は片側フクレ幅として1 m m以下で、非常に効果
が求められた。
Example 4 Using a brass plate (100 x 50 x 0.7), solvent degreasing,
Plating pretreatment such as electrolytic degreasing was performed. Next, using an aqueous solution of 5% sodium hydroxide and 1% potassium persulfate, treatment was performed at 70°C for 1 minute to form a copper oxide film. The average particle size is 1 μm per 100 parts by weight of acrylic/melamine resin (trade name: Elecoat, manufactured by Shimizu Co., Ltd.)
After dispersing the alumina surface with 2 μm of electroless nickel plating in a ball mill with 10 parts by weight for 30 hours,
Dilute to 15 parts by weight with demineralized water, add 2.0 parts by weight of carbon black for coloring, and use a coating solution at a bath temperature of 25°C, p.
Under the conditions of H8-9, the object to be coated is the anode and the counter electrode is 0.
.. Electrodeposition was performed using a 5t stainless steel plate at an applied voltage of 150V for 3 minutes. After electrodeposition, it was washed with water and cured in an oven at 97°C±1°C for 60 minutes to complete the process. Regarding the adhesion (based on JIS.K5400 grid test) and corrosion resistance (based on JIS.K5400 salt spray test) of the formed electrodeposition coating film,
As shown in Table 1, the adhesion was 100/100, and the corrosion resistance was 1 mm or less in terms of blistering width on one side, making it very effective. was required.

表−1 付着性の評価結果 表−2 耐食性の評価結果 〔発明の効果〕 以上説明したように、本発明は金属部材または被金属部
材に銅めっきを施した後、化学着色膜を形成し、この表
面に電着塗装することで塗膜物性の向上、工程の短縮に
よる経済効果にも、太き《寄与できる電着塗装部材を提
供するものである。
Table 1 Adhesion evaluation results Table 2 Corrosion resistance evaluation results [Effects of the invention] As explained above, the present invention provides copper plating on a metal member or a member to be metallized, and then forms a chemically colored film. By applying electrodeposition coating to this surface, we provide an electrodeposition coated member that can significantly contribute to the improvement of the physical properties of the coating film and the economic effect of shortening the process.

更に本発明によれば電着塗装膜の硬化を低温で行なった
場合にも基材への密着性が非常に優れた電着塗装部材を
得ることができる。
Further, according to the present invention, even when the electrodeposition coating film is cured at a low temperature, it is possible to obtain an electrodeposition coating member having extremely excellent adhesion to a substrate.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、非金属基材を銅めっきし、酸化被膜形成した
後、電着塗膜を形成したー態様の断面図である。 第2図は、金属基材を化学着色被膜形成した後、電着塗
膜を形成したー態様の断面図である。 l・・・非金属基材 2・・・めっき部材 3・・・化学着色被膜 4・・・電着塗膜部材 5・・・金属基材 都)1!;イ[S≧;) 室−2−図
FIG. 1 is a cross-sectional view of an embodiment in which a nonmetallic base material is copper plated, an oxide film is formed, and then an electrodeposition coating is formed. FIG. 2 is a cross-sectional view of an embodiment in which a chemically colored coating was formed on a metal substrate and then an electrodeposition coating was formed. l...Non-metal base material 2...Plating member 3...Chemical color coating 4...Electrodeposition coating member 5...Metal base material) 1! ;B [S≧;) Room-2-Figure

Claims (4)

【特許請求の範囲】[Claims] (1)金属基材又は表面に銅薄膜を有する非金属基材及
び化学着色膜を有し、該化学着色膜上に電着塗装被膜を
有することを特徴とする電着塗装部材。
(1) An electrocoated member comprising a metal substrate or a nonmetallic substrate having a copper thin film on its surface, a chemically colored film, and an electrodeposited coating on the chemically colored film.
(2)該銅薄膜が銅めっき被膜である請求項1の電着塗
装部材。
(2) The electrocoated member according to claim 1, wherein the copper thin film is a copper plating film.
(3)該化学着色膜が銅の酸化膜である請求項1の電着
塗装部材。
(3) The electrocoated member according to claim 1, wherein the chemically colored film is a copper oxide film.
(4)金属基材又は銅薄膜を表面に有する非金属基材上
に化学着色膜を形成し、次いで該化学着色膜上に電着塗
装被膜を形成した後、該電着塗装被膜を低温硬化させる
ことを特徴とする電着塗装部材の製造方法。
(4) Forming a chemically colored film on a metal base material or a nonmetallic base material having a thin copper film on the surface, then forming an electrodeposition coating on the chemically colored film, and then curing the electrodeposition coating at a low temperature. 1. A method for manufacturing an electrodeposition coated member, the method comprising:
JP2011029A 1990-01-20 1990-01-20 Electrodeposition coating member and manufacturing method thereof Expired - Lifetime JP2608339B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011029A JP2608339B2 (en) 1990-01-20 1990-01-20 Electrodeposition coating member and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011029A JP2608339B2 (en) 1990-01-20 1990-01-20 Electrodeposition coating member and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH03215699A true JPH03215699A (en) 1991-09-20
JP2608339B2 JP2608339B2 (en) 1997-05-07

Family

ID=11766663

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2608339B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175741A (en) * 1974-12-27 1976-06-30 Uemura Kogyo Kk KINZOKUSOZAINIHEIKATSUNA DENCHAKUTOMAKUO KEISEISASERUHOHO
JPS58193394A (en) * 1982-04-30 1983-11-11 Hokusei Alum Kk Formation of coating film
JPS6384191A (en) * 1986-09-29 1988-04-14 宇部興産株式会社 Manufacturing method of through-hole printed wiring board
JPH02121388A (en) * 1988-10-29 1990-05-09 Ibiden Co Ltd Formation of electrodeposition resist film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175741A (en) * 1974-12-27 1976-06-30 Uemura Kogyo Kk KINZOKUSOZAINIHEIKATSUNA DENCHAKUTOMAKUO KEISEISASERUHOHO
JPS58193394A (en) * 1982-04-30 1983-11-11 Hokusei Alum Kk Formation of coating film
JPS6384191A (en) * 1986-09-29 1988-04-14 宇部興産株式会社 Manufacturing method of through-hole printed wiring board
JPH02121388A (en) * 1988-10-29 1990-05-09 Ibiden Co Ltd Formation of electrodeposition resist film

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