JPH03215869A - Base body cleaning method - Google Patents
Base body cleaning methodInfo
- Publication number
- JPH03215869A JPH03215869A JP1117190A JP1117190A JPH03215869A JP H03215869 A JPH03215869 A JP H03215869A JP 1117190 A JP1117190 A JP 1117190A JP 1117190 A JP1117190 A JP 1117190A JP H03215869 A JPH03215869 A JP H03215869A
- Authority
- JP
- Japan
- Prior art keywords
- brush
- base body
- cleaning
- substrate
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Photoreceptors In Electrophotography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(a)産業上の利用分野
この発明は、塗布されるべき基体の塗工前の基体洗浄方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a method for cleaning a substrate before coating the substrate to be coated.
(b)従来の技術
何らかの基体に塗液を塗布する場合に、塗工前に前記基
体を洗浄する。これは、液をはじくなどの塗工不良の原
因となる油分、ダスト等を落とすために行われる。一般
に、洗浄方法には、超音波洗浄、ジェソト洗浄、蒸気洗
浄等があり、油分、ダスト等を完璧に除去していた。(b) Prior Art When a coating liquid is applied to a certain substrate, the substrate is cleaned before coating. This is done to remove oil, dust, etc. that cause coating defects such as liquid repellency. Generally, cleaning methods include ultrasonic cleaning, jesotho cleaning, steam cleaning, etc., and oil, dust, etc. are completely removed.
例えば、惑光体の基体の場合には、まず超音波洗浄をし
たのち冷却し、蒸気洗浄を行い乾燥して、次の塗布工程
へと送られていく。For example, in the case of a photoreceptor substrate, it is first subjected to ultrasonic cleaning, then cooled, steam cleaned, dried, and sent to the next coating process.
(C)発明が解決しようとする課題
しかしながら、上述の方法によると、油分、ダストなど
は完全に洗浄できるにもかかわらず、液をはじく等の不
具合が発生することがあった。特に鏡面加工を施された
加工面等の表面自由エネルギー(ぬれ性)の小さいもの
に多く、従来の洗浄方法では、いかに完全に洗浄したと
しても、表面自由エネルギーを向上させることはできな
いという問題があった。(C) Problems to be Solved by the Invention However, according to the above-mentioned method, although oil, dust, etc. can be completely cleaned, problems such as liquid repellency may occur. This is especially true for surfaces with low surface free energy (wettability), such as mirror-finished surfaces, and conventional cleaning methods have the problem of not being able to improve surface free energy, no matter how thoroughly they are cleaned. there were.
そこでこの発明の目的は、洗浄と同時に表面自由エネル
ギーを向上させる基体洗浄方法を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a substrate cleaning method that improves surface free energy at the same time as cleaning.
(d)課題を解決するための手段
この発明の基体洗浄方法では、塗布されるべき基体の塗
布面を、塗工前にブラシ等の傷形成手段で摺擦し、前記
塗布面全体に塗布面の表面粗さより微小な傷を均一に付
けることを特徴とする。(d) Means for Solving the Problems In the substrate cleaning method of the present invention, the coating surface of the substrate to be coated is rubbed with a scratch forming means such as a brush before coating, and the entire coating surface is coated. It is characterized by uniformly creating scratches that are smaller than the surface roughness of .
tel作用
この発明に係る基体洗浄方法では、塗布されるべき基体
の塗工前の洗浄においてブラシ等の傷形成手段により洗
浄と同時に前記基体の塗工面全体を摺擦して、前記基体
の塗工面全体に前記塗工面の表面粗さより微小な傷を均
一につける。これにより前記塗工面には微小な凹凸が全
面に形成され、その凹凸は表面粗さより小さいので基体
の完成品の機能への影響を及ぼすことな《、表面自由エ
ネルギーが大きくなり、塗工不良の発生を防止する。tel action In the method for cleaning a substrate according to the present invention, in cleaning the substrate to be coated before coating, the entire coated surface of the substrate is rubbed at the same time with a scratch forming means such as a brush, thereby cleaning the coated surface of the substrate. Scratches smaller than the surface roughness of the coated surface are uniformly made over the entire surface. As a result, minute irregularities are formed all over the coated surface, and since the irregularities are smaller than the surface roughness, they do not affect the functionality of the finished product of the substrate. Prevent occurrence.
(fl実施例
第3図は、本発明の実施例で基体洗浄方法の工程図であ
る。本実施例では感光体の基体にブラシにより傷を形成
する場合を説明する。前記基体の材質はアルミニウム合
金で、表面粗さは0,2μmRmaxである。(fl Example) FIG. 3 is a process diagram of a substrate cleaning method according to an example of the present invention. In this example, a case will be explained in which scratches are formed on the substrate of a photoreceptor using a brush. The material of the substrate is aluminum. It is made of an alloy and has a surface roughness of 0.2 μmRmax.
まず回転ブラシと基体を接触させた状態で同一方向に回
転し、洗浄溶剤によりブラシ洗浄する。First, the rotating brush and the substrate are rotated in the same direction while in contact with each other, and the brush is cleaned using a cleaning solvent.
次に60°の温浴を施したのぢ冷浴し、藤気洗浄をして
乾燥する。これらの工程の条件は次のようである。Next, take a 60° hot bath, then a cold bath, wash with Fuji air, and dry. The conditions for these steps are as follows.
ブラシ洗浄 洗浄液−1.1.1トリクロロエタンブラ
シ回転数−90〜l O O r p m基体回転数−
20〜6 0 r p rn温浴 洗浄?&−1
.1.1. 1− +J クa ロエタ:/温度−60
度
浸漬時間−30秒
冷浴 洗浄液−1.1.1. }リクロロエタン
浸漬時間−30秒
蒸気洗浄 洗浄液−1.11. I−リクロ口エタン
および乾燥 時間−30秒
第1図は、前記基体のブラシ傷を付けたあとの塗工面の
拡大図である。アルミニウム合金製の基体の表面粗さは
通常0.05〜0.2μmRmaxであり、溝の深さも
表面粗さに応じてそれぞれ0.05〜0.2 μmであ
る。図中深い溝10はドラム切削によるもので表面粗さ
は通常0.05〜0.2μmRrnaXに含まれるもの
で、微小なa11がブラシ傷であり0.05〜0.2μ
mより浅く付けられている。Brush cleaning Cleaning liquid - 1.1.1 Trichloroethane Brush rotation speed - 90 ~ l O O rpm Substrate rotation speed -
20~60 r p rn hot bath cleaning? &-1
.. 1.1. 1- +J Ku Roeta: / Temperature -60
Immersion time - 30 seconds Cold bath Cleaning solution - 1.1.1. }Lichloroethane immersion time - 30 seconds steam cleaning Cleaning liquid - 1.11. I-Licroethane and drying time - 30 seconds FIG. 1 is an enlarged view of the coated surface of the substrate after being scratched with a brush. The surface roughness of the aluminum alloy substrate is usually 0.05 to 0.2 μm Rmax, and the depth of the groove is also 0.05 to 0.2 μm, depending on the surface roughness. The deep grooves 10 in the figure are caused by drum cutting, and the surface roughness is usually 0.05 to 0.2 μm, which is included in RrnaX, and the minute a11 is a brush scratch, which is 0.05 to 0.2 μm.
It is attached shallower than m.
第2図は、同洗浄方法のブラシ洗浄の説明図である。基
体1と回転ブラシ2は接触させた状態で、各々の回転軸
1aと2aを平行にして、同方向に回転させる。このと
きシャワーノズル4より洗浄溶剤3を噴出させる。こう
して洗浄溶剤で洗浄すると同時に回転ブラシ2が基休1
の表面を摺擦し、全面に均一な漱小なブラシ傷を形成す
る。FIG. 2 is an explanatory diagram of brush cleaning in the same cleaning method. The base body 1 and the rotating brush 2 are rotated in the same direction with their rotating shafts 1a and 2a parallel to each other while in contact with each other. At this time, the cleaning solvent 3 is spouted from the shower nozzle 4. In this way, at the same time as cleaning with the cleaning solvent, the rotating brush 2 is removed from the base 1.
Rub the surface to form small, uniform scratches on the entire surface.
回転ブラシ2は樹脂(ナイロン)製でありブラシ毛の直
径は1龍以下が良好であり、0.1mm以下が好ましい
。しかし、あまり細くなりすぎると、ブラシの弾性が弱
くなり回転速度を速くする必要がある。The rotating brush 2 is made of resin (nylon), and the diameter of the bristles is preferably 1 mm or less, preferably 0.1 mm or less. However, if the brush becomes too thin, the elasticity of the brush becomes weak and the rotation speed needs to be increased.
以上のように洗浄したブラシ傷を有する基体と、既に述
べた従来の超音波洗浄一冷浴一蒸気洗浄および乾燥の方
法で洗浄したブラシ傷のない基体とを、ぬれ性指示薬(
和光純薬製)により表面自由エネルギーを比較すると、
本発明の方法によるブラシ傷を有ずる基体ては38dy
ne/cmで、従来方法によるブラシ傷のない基体では
34dyne/cmであり、ブラシ傷を有する方が表面
自由エネルギーが大きくなったことが判明した。The substrate with brush scratches that was cleaned as described above and the substrate without brush scratches that had been cleaned by the conventional method of ultrasonic cleaning, cold bath, steam cleaning and drying described above were washed with a wettability indicator (
Comparing the surface free energy using Wako Pure Chemical Industries),
The substrate with brush scratches by the method of the present invention is 38dy
It was found that the surface free energy was 34 dyne/cm for the substrate without brush scratches obtained by the conventional method, and that the surface free energy was larger for the substrate with brush scratches.
また、上述の2種類の基体の表面に、ジブロムアンスア
ンスロン2重量部、ブチラール樹脂(エスレックBM2
、セキスイ科学) 2重量部、シクロヘキサノン230
重量部より構成される塗液を塗布して、乾燥膜厚0.5
μmの塗膜を形成した。In addition, 2 parts by weight of dibrom anthron and butyral resin (S-LEC BM2
, Sekisui Science) 2 parts by weight, cyclohexanone 230
Apply a coating liquid consisting of parts by weight to achieve a dry film thickness of 0.5
A coating film of μm was formed.
塗液のはじき等の欠陥のない塗工良品率は、ブラシ傷の
ない基体では70%、ブラシ傷を有する基体で95%と
、良品率は大きく向上した。The rate of good coatings without defects such as repelling of the coating liquid was 70% for the substrates without brush scratches, and 95% for the substrates with brush scratches, which was a significant improvement.
さらに、本発明の方法によるブラシ傷を有する基体の前
記塗布膜表面に、ヒドラゾン系電荷輸送剤(亜南香斜株
式会社製、商品名rABPFLJ)を1重量部、ポリカ
ーボネイト樹脂(帝人化成株式会社製、パンライトL−
1250) 1重量部をジクロルエタン8重量部に溶
解して調整した塗液を塗布し、乾燥膜w.15μmとな
るように塗布し70Lで1時間乾燥して電荷輸送層を形
成したのち、電子写真感光体を作成した。そして、前記
電子写真感光体を画像形成装置(シャープ株式会社SF
8100)に適用して画像形成を行い、画像の評価を行
った結果、ブラシ傷が画像に現れることな《良質の画像
を得ることができた。これにより、基体表面に、表面粗
さより微小の傷が均−・に付いていることにより画像に
悪影響を及ぼさないことが判明した。Furthermore, 1 part by weight of a hydrazone-based charge transport agent (trade name: rABPFLJ, manufactured by Anan Kosha Co., Ltd.) and a polycarbonate resin (manufactured by Teijin Kasei Co., Ltd.) were applied to the surface of the coating film of the substrate having brush scratches obtained by the method of the present invention. , Panlight L-
1250) A coating solution prepared by dissolving 1 part by weight in 8 parts by weight of dichloroethane was applied, and a dry film w. After coating to a thickness of 15 μm and drying at 70 L for 1 hour to form a charge transport layer, an electrophotographic photoreceptor was prepared. Then, the electrophotographic photoreceptor was attached to an image forming apparatus (Sharp Corporation SF
8100) to form an image and evaluate the image.As a result, it was possible to obtain a high-quality image with no brush scratches appearing on the image. As a result, it was found that fine scratches, which were smaller than the surface roughness, were evenly formed on the surface of the substrate and did not adversely affect the image.
なお、回転ブラシと基体の回転方向は同一方向、逆方向
のいずれてもよいが、同一方向の方がより均一で微小な
傷を付けることができる。Note that the rotating direction of the rotating brush and the base body may be the same direction or opposite directions, but it is possible to make more uniform and minute scratches by rotating the rotating brush in the same direction.
本実施例では傷形成手段を回転ブラシとしたが、均一で
微小な傷を付けることができればどのような手段でも差
し支えない。また、本発明は感光体の基体の塗工に限ら
れるものではない。In this embodiment, a rotating brush is used as the scratch forming means, but any means may be used as long as it can create uniform and minute scratches. Further, the present invention is not limited to coating the substrate of a photoreceptor.
(gl発明の効果
以上のように、この発明によれば、塗布されるべき基体
を塗工前に、ブラシ等の傷形成手段で前記基体の塗工面
全面を摺擦し、均一で微小な傷を付ける。この傷により
前記塗工面には微小な凹凸が全面に形成され、表面自由
エネルギーが大きくなる。従って、液はじき等の塗工不
良の発生を防止することができる。(Effects of the Invention As described above, according to the present invention, before coating the substrate to be coated, a scratch forming means such as a brush is used to rub the entire surface of the substrate to be coated, thereby creating uniform and minute scratches. Due to these scratches, minute irregularities are formed all over the coated surface, increasing the surface free energy. Therefore, the occurrence of coating defects such as liquid repellency can be prevented.
第1図は、この発明の実施例である基体洗浄方法により
ブラシ傷のついた基体の塗工面の拡大図である。第2図
は、同基体洗浄方法のブラシ洗浄の説明図である。第3
図は、同基体洗浄方法の工程図である。
1一基体、
2〜回転ブラシ(本実施例の傷形成手段)、11−ブラ
シ傷C本実施例の微小傷)。FIG. 1 is an enlarged view of the coated surface of a substrate with brush scratches caused by a substrate cleaning method according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of brush cleaning in the same substrate cleaning method. Third
The figure is a process diagram of the same substrate cleaning method. 1-Base, 2-Rotating brush (flaw forming means of this example), 11-Brush scratches (C minute scratches of this example).
Claims (1)
等の傷形成手段で摺擦し、前記塗布面全体に塗布面の表
面粗さより微小な傷を均一に付けることを特徴とする基
体洗浄方法。(1) The coating surface of the substrate to be coated is rubbed with a scratch-forming means such as a brush before coating, and scratches smaller than the surface roughness of the coating surface are uniformly created over the entire coating surface. Substrate cleaning method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1117190A JPH03215869A (en) | 1990-01-20 | 1990-01-20 | Base body cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1117190A JPH03215869A (en) | 1990-01-20 | 1990-01-20 | Base body cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03215869A true JPH03215869A (en) | 1991-09-20 |
Family
ID=11770607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1117190A Pending JPH03215869A (en) | 1990-01-20 | 1990-01-20 | Base body cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03215869A (en) |
-
1990
- 1990-01-20 JP JP1117190A patent/JPH03215869A/en active Pending
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