JPH03215953A - Method and device for inner lead bonding - Google Patents

Abstract

PURPOSE:To prevent a defective unit from occurring, to decrease a bonding operation in manhours, and to improve a semiconductor device in productivity by a method wherein a control means possessed of functions which are able to select a prescribed bonding tool out of bonding tools and to set bonding conditions for each of the selected bonding tools is provided. CONSTITUTION:Bonding tools 25a and 25b are provided, and a control means 11A possessed of a function which is able to select a prescribed bonding tool out of the bonding tools 25a and 25b and to set bonding conditions for each of the selected bonding tools is provided. Therefore, works of several types can be mounting on a tape 12 in continuous form corresponding to the bonding conditions of the type of the work without rewinding or replacing the tape 12. By this setup, a defective unit can be prevented from occurring, a bonding operation can be lessened in manhour, and a product can be improved in productivity.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention is directed to, for example, T A B (Tape Auto
The present invention relates to an inner lead bonding device and an inner lead bonding method for mounting an IC chip on a cine film-like TAB tube using a mated bonding technique.

(Prior art) Generally, T A B (Tape Automated
There is an inner lead bonding device (hereinafter referred to as an ILB device) that connects an IC chip to an inner lead using a bonding technique as shown in FIG.

That is, this ILB device 1 uses a carrier tape (hereinafter referred to as tape) as a long tape in the form of a cinefilm.
2 is run on the device, and the circuit patterns 3 formed on the tape 2 and arranged intermittently are temporarily stopped at the bonding position.

Then, the ILB device 1 uses the pick-and-place unit 4 to pick up one IC chip from among the IC chips 6 formed on the wafer 5 and supplies it to the bonder stage 7, and then performs bonding with the circuit pattern 3. The IC chips supplied to the stage 7 are aligned so as to face each other.

Further, the ILB device 1 lowers the heated bonding tool 8, and uses the bonding tool 8 to heat and press the IC chip and the inner leads 9 to connect them. Then, the ILB device 1 attaches one IC chip to each circuit pattern 3 and repeats these bonding operations to sequentially mount the IC chips 6 of the wafer 5 on one tape 2. .

Furthermore, recently, with the diversification of TAB components, it has become necessary to mount, for example, two to three types of IC chips on one circuit pattern 3.

The above-mentioned conventional device 1 is capable of mounting multiple types of IC chips on one circuit pattern 3 in this way.
When using IC chips, one type of IC chip is mounted on one reel, then the tape is rewound onto the reel, the tape is run again, and after the tool is replaced, another type of IC chip is mounted. Various types of IC chips were mounted. By repeating the rewinding and running of the tape in this manner, a plurality of IC chips and a plurality of types of IC chips are attached to one circuit pattern or one tape.

(Problem to be Solved by the Invention) By the way, as mentioned above, by rewinding the tape for each type of IC chip to be mounted and running the tape on the device many times, it is possible to In some cases, the inner lead that was not connected could be bent. In addition, defective products may be produced due to the bending of the inner lead, resulting in a decrease in yield.

Furthermore, it takes a lot of effort and man-hours to reapply the tape, replace the bonding tool with a bonding tool appropriate for the type of IC chip, and change the parameters of the bonding conditions, such as heating temperature, heating time, and pressing force. , productivity could be low.

An object of the present invention is to provide an inner lead bonding device and an inner lead bonding method that can prevent the occurrence of defective products and reduce the number of man-hours, and are excellent in productivity.

[Structure of the Invention] (Means and Effects for Solving the Problems) In order to achieve the above object, the present invention provides a bonding tool that heats an inner lead that is formed on a long tape and constitutes a circuit pattern, and a workpiece. In an inner lead bonding device that connects by applying pressure, a plurality of bonding tools are provided, and at least a function to select a predetermined bonding tool from the plurality of bonding tools, and a bonding condition can be set for each selected bonding tool. A control means having the following functions is provided.

5 In addition, in an inner lead bonding method in which an inner lead formed on a long tape and constituting a circuit pattern and a work are connected by applying pressure while heating with a bonding crane, a predetermined bonding tool is selected from a plurality of bonding tools provided. The method included a step of selecting, and a step of driving the selected predetermined bonding tool based on predetermined bonding conditions.

By doing so, the present invention allows multiple types of workpieces to be mounted on a single long tape under bonding conditions appropriate to each type of workpiece without having to unwind or rehang the long tape. In addition to preventing the occurrence of defective products, it also reduced man-hours and improved productivity.

(Example) An embodiment of the present invention will be described below with reference to FIG.

FIG. 1 shows the main part of one embodiment of the present invention.
1 is T A B (Tape Automated
An inner lead bonding device (hereinafter referred to as ILB device) 12 connects an IC chip to an inner lead using bonding technology, and 12 is a carrier tape (hereinafter referred to as a long tape) running on this ILB device 11. , tape).

The tape 12 is formed into a cine film and has an IL
A supply rill (not shown) mounted on the B device 11
The rollers are pulled out from the rollers and run intermittently, for example, while being guided by guide rollers 13, 13, etc. After the tape 12 passes a predetermined position on the ILB device 11, it is wound up and stored by a take-up reel (not shown).

Further, the tape 12 has two types of circuit patterns 14a and 14b arranged alternately along the longitudinal direction and mounting different types of IC chips. and,
The tape 12 has inner leads 15a115b set to be connected to the corresponding IC chips on the circuit buttons 14a and 14b.

Then, the tape 12 has each circuit pattern 14a114b.
The circuit pattern 14a, 14b is intermittently run with the tape facing downward, and when stopped, each circuit pattern 14a, 14b is positioned inside the bonding hole 17 of a plate-shaped tape guide 16 displaceably provided in the device 11, for example. .

Further, reference numeral 16 in FIG. 1 is an IC chip supply section, and this IC chip supply section 16 is provided with two wafer stages 17a and 17b and one pick-and-place unit 18. wafer stage 17a,
On the upper surface of the wafer 17b, wafers 19a and 19b of different types that are automatically transferred, for example, from a wafer magazine (not shown) are placed and fixed.

The pick and place unit 18 has both wafers 1.
From 9a and 19b, the IC chip 20a as a workpiece
... 20b... is picked up and transported. In other words, the pick and place unit 18 is
A circuit pattern 14a from two types of IC chips 20a...20b... stopped at the bonding position 21 and located in the bonding hole 23 of the tape guide 22.
(or 14b).

After picking up one IC chip at its tip, the pick-and-place unit 18 rotates and displaces, for example, in the horizontal direction, so that the picked-up IC chip can be displaced from the wafer stage 17a (or 17b). A bonding stage 24 is provided.

Furthermore, the ILB device 11 includes two
Two bonding tools 25a and 25b are provided. The bonding tools 25a, 25b are attached to the tip of the support body 26, and are attached to the slide body 26a.
, 25b, and can be moved up and down.

Furthermore, the bonding tools 25a and 25b are movable in the horizontal direction together with the support body 26.

Both of the bonding tools 25a and 125b are pushed from above by one pressure mechanism section 26A (described later), and are each independently driven to move up and down.

9 Further, the bonding tools 25a and 25b are heated, for example, at their tips to raise the temperature. The temperature of each bonding tool 25a, 25b is set to a value suitable for inner lead bonding of each of the two types of IC chips 20a, 20b by a command from the control means 11A. Then, each bonding tool 25a, 25b is driven downward by selecting a side corresponding to the type of IC chip supplied to the bonding stage 24, so that the corresponding inner lead and the IC chip are brought into pressure contact and thermocompression bonded. It has become.

Further, the bonding tools 25a, 25b and the bonding stage 24 can be moved horizontally separately, for example, so that they are stopped at the bonding position and aligned based on a circuit pattern whose position is roughly fixed in advance. It has become. The bonding tool 25a125b and the bonding stage 24 are aligned with respect to the circuit patterns 14a and 14b by 1
This is now done every time one IC chip is mounted10.

Further, the IC chip 20a supplied on the bonding stage 24 and the inner leads of the circuit pattern corresponding to the IC chip are aligned by moving the IC chip 20a onto the bonding stage 24 using two positioning claws 24A, 24A.
After positioning and adjusting the posture, the IC chip 20a
The position of the inner lead 15a and the inner lead 15a are recognized separately, and the position of the IC chip 2 relative to the inner lead 15a is recognized separately.
This is done by correcting the relative position of 0a.

Here, the positioning claws 24A, 24A are rectangular plate-shaped objects disposed at substantially right angles to each other, and move back and forth in orthogonal directions to position, fix, and release the IC chip 20a on the bonding stage 24. It has become.

Further, the tape guide 22 is made movable, and the bonding hole 23 is connected to the circuit pattern 14a (or 14b).
It may also be possible to align with.

On the other hand, the pressure mechanism section 26A raises and lowers the bonding tools 25a and 25b alternately and periodically in accordance with the supply of each IC chip 24a and 24b to the bonding stage 24 based on a command from the control means 1111A. . Further, the pressure mechanism section 26 lowers each bonding tool 25a, 25b, and lowers each bonding tool 25a, 25b.
The tips of a and 25b are brought into contact with each inner lead of the circuit pattern exposed through the bonding hole 23 of the tape guide 22. The pressure mechanism section 26 applies pressure and load to the inner leads and the IC chip.
The driving time and driving force can be set arbitrarily. The pressurizing mechanism section 26 then moves the bonding tools 25a and 25b to two types of IC chips 20a and 2.
The heating time, pressing force, etc. are optimized for each bonding of 0b. Further, the heating time, the pressing force, etc. of the pressing mechanism 26 are determined by instructions from the control section means 11A.

That is, such ILB devices 11 and 12 In the ILB method performed by this ILB device 11, since two bonding tools 25a and 25b and a pressure mechanism section 26 that drives them are provided, the tape winding is For example, multiple types of IC chips can be mounted on one tape without having to put it back or rehang it. Therefore, the inner lead is not bent, the generation of defective products can be prevented, and the yield can be improved.

Furthermore, bonding condition parameters such as heating temperature, heating time, and pressure are set for each bonding tool depending on the type of IC chip, so it is easy to change bonding conditions when switching types. It is possible to mount a plurality of types of IC chips.

These things can significantly reduce the number of man-hours and improve productivity.

Also, as shown in FIG. 2, when two IC chips 28 and 29 of the same type or different types are attached to one circuit pattern 27, or as shown in FIG. When taking out a plurality of chips 28 and 29, there is no need to rewind or rehang the tape 12.

In this embodiment, the IC chips 20a and 20b are supplied from two wafers 19a and 9b, but the present invention is not limited to this. For example, as shown in FIG. The IC chips 20a and 20b may be supplied from the tray stage 32 to the bonding stage 24 in the form of packages stored in a plurality of trays 30, 30, 31, and 31.

In this case, each tray 30, 30, 31, 3] is placed on a tray stage, as separated by a dashed line (■) in the figure, into a tray group 33 divided according to the type of IC chip 20a120b. It is conceivable to arrange them in groups of 34.

Further, the parameters of the bonding conditions may be set to be different for each bonding tool 25a, 24b, or both bonding tools 25a, 24b may be set differently.
may be set equally.

14 Furthermore, in this embodiment, two positioning claws 24A, 24
The bonding stage 24 of the IC chip 20a is
For example, as shown in FIG. 8, a locking notch 24B having a shape corresponding to the shape of the IC chip 20a is provided at the tip of one positioning claw 24A, and this positioning The IC chip 20a may be positioned by moving the claw 24A diagonally relative to the IC chip 20a as shown by arrow V in FIG. 8 and locking the claw 24A.

Further, in this embodiment, two bonding tools are arranged parallel to each other, but the present invention is not limited to this. For example, as shown in FIG. 5, four bonding tools 25a to 25d are arranged. The bonding tools 25a to 25d may be arranged substantially concentrically downward on a rotating body 35 rotatably provided at the tip of the support 26.

In this case, it is conceivable to rotate the rotating body 35 to select a predetermined bonding tool, and to push the selected bonding tool 15 downward by the pressurizing mechanism section 26A.

Further, as shown in FIG. 6, similarly four bonding tools 25a to 25d may be provided to protrude radially from a rotatable head portion 36.

Then, while moving the head portion 36 up and down together with the slide portion 26a provided at the tip of the support body 26,
Rotate the head section 36 to select a predetermined bonding tool, and attach the selected bonding tool to the head section 36.
It may also be made to sink into the ground.

Furthermore, as shown in FIG.
It is also possible to heat the bonding tool 25d to a certain temperature in advance with the preheater 37, select and take out the necessary bonding tool 25a from the preheater 37, and attach it to the slide part 26a at the tip of the support part 26. It will be done.

In this case, a predetermined bonding tool 25a is held by a holder 38 provided at the tip of the slide portion 26a.
can be retained. The 16 bonding tools 25a to 25d can be replaced depending on the type of IC chip. Here, 39 in FIG. 7 indicates a heater on the side of the preheater 37, and 40 indicates a heater on the side of the slide portion 26a.

[Effects of the Invention] As explained above, the present invention provides an inner lead bonding apparatus that connects an inner lead formed on a long tape and forming a circuit pattern to a work by applying pressure while heating it with a bonding tool. A plurality of bonding tools are provided, and a control means having at least a function of selecting a predetermined bonding tool from the plurality of bonding tools and a function of setting bonding conditions for each selected bonding tool is provided.

In addition, in an inner lead bonding method in which an inner lead formed on a long tape constituting a circuit pattern and a work are connected by applying pressure while heating with a bonding crane, a predetermined bonding tool is selected from a plurality of bonding tools. and a step of driving the selected predetermined bonding tool based on predetermined bonding conditions.

Therefore, the present invention allows multiple types of workpieces to be mounted on a single long tape under bonding conditions suitable for each type of workpiece without having to rewind or rehang the long tape. This has the effect of not only preventing the occurrence of problems but also reducing man-hours and improving productivity.

[Brief explanation of drawings]

Figures 1 to 3 show one embodiment of the present invention.
The figure is a perspective view showing the main part, FIGS. 2 and 3 are front views showing the implementation example, FIGS. 4 to 7 are perspective views schematically showing each modification, and FIG. 8 is the same modification. A plan view schematically shown in 5,
FIG. 9 is a perspective view showing a conventional example. 11...Inner lead bonding equipment, 11 people...
- Control means, 12...carrier tape (long tape)
14a, 14b... Circuit pattern, 15a, 1518 b... Inner lead, 2 0 a1 20b... IC chip (work) 2 5 a, 25b... Bonding crane, 26A... Pressure mechanism section .

Claims (2)

[Claims] (1) In an inner lead bonding device that connects an inner lead that is formed on a long tape and constitutes a circuit pattern to a workpiece by applying pressure while heating it with a bonding tool, a plurality of the above bonding tools are provided, and at least a plurality of these bonding tools are provided. An inner lead bonding apparatus comprising: a control means having a function of selecting a predetermined bonding tool from among the bonding tools, and a function of setting bonding conditions for each selected bonding tool. (2) In an inner lead bonding method in which an inner lead formed on a long tape and forming a circuit pattern and a work are connected by applying pressure while heating with a bonding tool, a predetermined bonding tool is selected from a plurality of bonding tools provided above. An inner lead bonding method comprising the steps of: selecting a predetermined bonding tool; and driving the selected predetermined bonding tool based on predetermined bonding conditions.