JPH03216004A - Directional coupler - Google Patents

Directional coupler

Info

Publication number
JPH03216004A
JPH03216004A JP2013042A JP1304290A JPH03216004A JP H03216004 A JPH03216004 A JP H03216004A JP 2013042 A JP2013042 A JP 2013042A JP 1304290 A JP1304290 A JP 1304290A JP H03216004 A JPH03216004 A JP H03216004A
Authority
JP
Japan
Prior art keywords
contact
conductor
directional coupler
ground
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013042A
Other languages
Japanese (ja)
Inventor
Shusaku Sasaki
佐々木 秀作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2013042A priority Critical patent/JPH03216004A/en
Publication of JPH03216004A publication Critical patent/JPH03216004A/en
Pending legal-status Critical Current

Links

Landscapes

  • Waveguides (AREA)

Abstract

PURPOSE:To evade the effect of case resonance to be occasionally caused based on the grounding condition of substrate at an operating frequency band and at the time of containing a metallic case and to improve the degree of integration of components by providing a contact in contact with the cover of metallic case of a conductor side on one side of a dielectric board. CONSTITUTION:A coupling circuit section 3 realizing the characteristic of the directional coupler is provided on a dielectric circuit board 1, a dielectric board 2 provided with a ground conductor 6 to one side of the circuit section 3 and a throughhole 8 provided to both the boards 1, 2 is provided to connect both the boards 1, 2 to ground in common. Moreover, a contact 7 is provided to the ground conductor 6 to one side of the dielectric board 2 and the contact 7 is brought into contact with a metallic case cover 9. Since the ground condition at an operating frequency band from the metallic case cover is satisfied, the ground impedance of both the boards is made equal and even the effect of the case resonance to be caused at the time of containing the metallic case is evaded to realize the excellent characteristic.

Description

【発明の詳細な説明】 [−産業上の利用汁野] 本発明はマイクロ波集積回路に関し、特に平面回路構成
された方向性結き器に関する,〔従来の技術〕 従来、マイクロ波装置において、高周波信号を検出した
りあるいは分配するために,方向性結合器を使用する場
合がある。
[Detailed Description of the Invention] [-Industrial Applications] The present invention relates to a microwave integrated circuit, and particularly to a directional coupler configured as a planar circuit. [Prior Art] Conventionally, in a microwave device, Directional couplers may be used to detect or distribute high frequency signals.

一般にマイクロ波帯の方向性結合器は、主信号線路と副
信号線路の結合により結合回路を構成し、その結合間距
離で結合度を、又,信号伝搬方向の距離をλg / 4
や3/4λgを選ぶ事により、使用周波数帯域を決定し
ている。近年マイクロ波回路の集積化の観点から、小形
でかつ平面で構成される回路が望まれており、同一基板
内で種々の機能をもった回路を実装することが要求され
る。一般的にはマイクロストリップ線路による構成方法
があるが、この場合、実装の点で集積化にすぐれている
反面、本来の方向性結合器の性能としての方向性が、結
合度30dBに対して数dB(0〜2dB)Lか得られ
ない。又、トリプレート構造″j一なわち2枚の基数を
貼りきせ、結き回路に討して接地導体ではさんだ構造に
する二とにより構成する方法があるか、方向性の性能に
非常にすくれている反面、実装上大きな制約念受けてし
まう。このトリプレート溝造に関し、この欠点解決のた
め、回路パターンを有する基板と、その結合回路部のみ
に片面導体を有した誘電体基板を搭載することにより、
トリプレート構造を実現し、その他の部分に素子を配置
できる構造が考えられる。その場合、回路パターンを有
する基板の結合回路部と、片面導体を有する誘電体基板
に、高周波接地を目的としたスルーホール分設け、これ
により両基板の接地電位が等しくなるように構成してい
る。
Generally, a microwave band directional coupler configures a coupling circuit by coupling a main signal line and a sub-signal line, and the coupling degree is determined by the distance between the couplings, and the distance in the signal propagation direction is λg / 4
The frequency band to be used is determined by selecting λg or 3/4λg. In recent years, from the viewpoint of integrating microwave circuits, circuits that are small and configured on a flat surface are desired, and it is required to mount circuits with various functions on the same substrate. In general, there is a configuration method using microstrip lines, but in this case, although it is superior in terms of integration in terms of implementation, the directivity as the performance of the original directional coupler is dB (0 to 2 dB) L cannot be obtained. Also, is there a method of constructing a tri-plate structure, in other words, by pasting together two bases, connecting them to a connection circuit, and sandwiching them between ground conductors? On the other hand, it is a big constraint when it comes to mounting.In order to solve this drawback of the tri-plate groove structure, we installed a board with a circuit pattern and a dielectric board with a conductor on one side only in the connecting circuit part. By doing so,
A structure that realizes a triplate structure and allows elements to be placed in other parts is conceivable. In that case, a through hole is provided for the purpose of high-frequency grounding in the coupling circuit part of the board with the circuit pattern and in the dielectric board with the single-sided conductor, so that the ground potential of both boards is equalized. .

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の方向性結合器は、動作周波数が高くなる
程、特にマイクロ波周波数領域では、このスルーホール
かりアクタンス素子として効いてくるため、接地が不十
分になり、搭載する側の誘電体基板の片面導体か、回路
パターン側のスルーホールを介してケースに接地される
ため,とうしても両基板の接地インピーダンスが等しく
ならないという欠点がある。また金属ケースに収容する
時に,上記理由により、搭載する側の誘電体基板の片面
導体が十分接地されてないため、ケース共振モードと結
合し易くなり、方向性結合器の特性劣化を招くという欠
点がある。
In the above-mentioned conventional directional coupler, as the operating frequency becomes higher, especially in the microwave frequency range, the through holes become effective as actance elements, resulting in insufficient grounding and damage to the dielectric substrate on the mounting side. Since it is grounded to the case through a single-sided conductor or a through hole on the circuit pattern side, there is a drawback that the grounding impedance of both boards is not equal. Another disadvantage is that when housed in a metal case, due to the above-mentioned reason, the conductor on one side of the dielectric substrate on the mounting side is not sufficiently grounded, which makes it easy to couple with the case resonance mode, leading to deterioration of the characteristics of the directional coupler. There is.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は平面な回路基板の上に平行な2本の線路パター
ンにより形成された結合回路部と、片面に導体を有し且
つ前記結合回路部のみに搭載される誘電体基板と、前記
回路基板及び前記誘電体基板に穿設されてこの二つの基
板を共通に接地するためのスルホールとを有してなる方
向性結合器において、前記誘電体基板の前記片面の導体
側に設けられ金属ケースのカバーと接触する接触子を備
えている。
The present invention provides a coupling circuit section formed by two parallel line patterns on a flat circuit board, a dielectric substrate having a conductor on one side and mounted only on the coupling circuit section, and the circuit board. and a through hole formed in the dielectric substrate for common grounding of the two substrates, the directional coupler having a through hole provided on the conductor side of the one side of the dielectric substrate and of a metal case. It is equipped with a contact that makes contact with the cover.

また本発明の方向性結合器は、前記接触子が前記金属ケ
ースのカバーと少なくとも2箇所で接触する形状をなし
ている。
Moreover, the directional coupler of the present invention has a shape in which the contactor contacts the cover of the metal case at at least two places.

、実施例] 次に、本発明について図面p9照して説明する。,Example] Next, the present invention will be explained with reference to drawing p.

第1図及び第2図は本発明の一実施例の分解斜視図及び
横断面図である。
1 and 2 are an exploded perspective view and a cross-sectional view of an embodiment of the present invention.

本実施例は平面な誘電体回路基板1の上に平行な2本の
線路パターンにより形成された結合回路部3と、片面接
地導体6を有し且つ結合回路部3のみに搭載される誘電
体基板2と、誘電体回路基Wi1及び誘電体基板2に穿
設されてこの両基板を共通接地するためのスルホール8
とを有し、さらに誘電体基板2の片面接地導#.6側に
設けられ金属ゲース10に収納したときに金属ゲースカ
ハ−9と接触する接触子7を備えてなる。
This embodiment has a coupling circuit part 3 formed by two parallel line patterns on a flat dielectric circuit board 1, and a dielectric body having a one-sided ground conductor 6 and mounted only on the coupling circuit part 3. A through hole 8 is formed in the substrate 2, the dielectric circuit board Wi1, and the dielectric substrate 2 for common grounding of both substrates.
Further, one side of the dielectric substrate 2 has a ground conductor #. The contactor 7 is provided on the 6 side and comes into contact with the metal cage 9 when housed in the metal cage 10.

即ち第1図及び第2図に示すように、誘電体回路基板1
上に方向性結合器の特性を実現する結合回路部3か設け
られ、その回路部に片面接地導体6を有した誘電体基板
2を搭載し、両基板に設けられたスルホール8か両基板
の共通接地するよう備えられ、さらに搭載する誘電体基
板2の片面接地導体6に接触子7を備えた構造である。
That is, as shown in FIGS. 1 and 2, a dielectric circuit board 1
A coupling circuit section 3 that realizes the characteristics of a directional coupler is provided on the top, and a dielectric substrate 2 having a one-sided ground conductor 6 is mounted on the circuit section, and a through hole 8 provided on both substrates or a coupling circuit section 3 that realizes the characteristics of a directional coupler is provided. It has a structure in which it is provided for common grounding and further includes a contactor 7 on a one-sided ground conductor 6 of the dielectric substrate 2 to be mounted.

このような本実施例によれば、誘電体基板2の片面導体
側に備えた接触子7が金属ケース力バー9と接触するこ
とにより、金属ゲース力バー側より動作周波数領域での
接地条件を満たすことが可能となるため、両基板の接地
インピーダンスを等しくすることができ、また金属ケー
ス収納時に、生じているケース共振に対してもその影響
を回避するのに効果があり、方向性結合器の良好な特性
を実現できる。
According to this embodiment, the contactor 7 provided on the single-sided conductor side of the dielectric substrate 2 comes into contact with the metal case force bar 9, so that the grounding condition in the operating frequency range can be adjusted from the metal case force bar side. This makes it possible to equalize the grounding impedance of both boards, and is also effective in avoiding the effects of case resonance that occurs when the metal case is stored. Good characteristics can be achieved.

なお本実施例では、接触子7の形状を金属ケース力バー
9と2点で接触する形としているが、これは1点接触よ
りも周波数特性を安定化させるためであり、更に多数箇
所で接触するような形状としても良い。また接触子7と
金属ケース力バー9との接触を確実なものとするために
、接触子7に例えばばね性をもなせるようにしても良い
In this embodiment, the shape of the contact 7 is such that it contacts the metal case force bar 9 at two points, but this is to stabilize the frequency characteristics rather than contacting at one point, and the shape of the contact 7 is such that it contacts the metal case force bar 9 at two points. It may also be shaped like this. Further, in order to ensure the contact between the contact 7 and the metal case force bar 9, the contact 7 may be made to have spring properties, for example.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、マイクロ波集積化に関し
トリプレート楕遣を実現する上で、回路パターンの基板
部のその結谷回路部のみに搭載する誘電体基板の片面導
体側に跡備した接触子の構遺を有することにより、動作
周波数帯での両基板の接地条件及び金属ゲース収納時に
生じることがあるブース共振に対してもその影響の回避
を実現できる特徴かあり、さらには池の高周波部品も、
同一回路基板内の結合回路部以外にも実装可能であり、
部品の集積度を上げることに効果かある。
As explained above, in order to realize the triple-plate ellipse for microwave integration, the present invention provides a circuit pattern on the single-sided conductor side of a dielectric substrate mounted only on the circuit portion of the substrate portion of the circuit pattern. By having the structure of the contactor, it is possible to avoid the effects of the grounding conditions of both boards in the operating frequency band and the booth resonance that may occur when storing the metal gates. High frequency parts as well
It can be mounted in areas other than the combined circuit part on the same circuit board.
It is effective in increasing the degree of integration of parts.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の分解斜視図、第2図は本実
施例の横断面図である。 1・・・誘電体回路基板、2・・・誘電体基板、3・・
・結合回路部、4・・・素子、5・・・接地導体、6・
・・片面接地導体、7・・・接触子、8・・・スルホー
ル、9・・・金属ケース力バー、10・・・金属ケース
FIG. 1 is an exploded perspective view of one embodiment of the present invention, and FIG. 2 is a cross-sectional view of this embodiment. 1... Dielectric circuit board, 2... Dielectric substrate, 3...
・Coupling circuit section, 4...Element, 5...Grounding conductor, 6.
... Single-sided ground conductor, 7... Contact, 8... Through hole, 9... Metal case force bar, 10... Metal case.

Claims (2)

【特許請求の範囲】[Claims] 1.平面な回路基板の上に平行な2本の線路パターンに
より形成された結合回路部と、片面に導体を有し且つ前
記結合回路部のみに搭載される誘電体基板と、前記回路
基板及び前記誘電体基板に穿設されてこの二つの基板を
共通に接地するためのスルホールとを有してなる方向性
結合器において、前記誘電体基板の前記片面の導体側に
設けられ金属ケースのカバーと接触する接触子を備える
ことを特徴とする方向性結合器。
1. a coupling circuit section formed by two parallel line patterns on a flat circuit board; a dielectric substrate having a conductor on one side and mounted only on the coupling circuit section; and the circuit board and the dielectric substrate. In the directional coupler, the through hole is provided on the conductor side of one side of the dielectric substrate and is in contact with the cover of the metal case. A directional coupler characterized by comprising a contactor.
2.前記接触子が前記金属ケースのカバーと少なくとも
2箇所で接触する形状をなしていることを特徴とする請
求項1記載の方向性結合器。
2. 2. The directional coupler according to claim 1, wherein the contact has a shape that makes contact with the cover of the metal case at at least two places.
JP2013042A 1990-01-22 1990-01-22 Directional coupler Pending JPH03216004A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013042A JPH03216004A (en) 1990-01-22 1990-01-22 Directional coupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013042A JPH03216004A (en) 1990-01-22 1990-01-22 Directional coupler

Publications (1)

Publication Number Publication Date
JPH03216004A true JPH03216004A (en) 1991-09-24

Family

ID=11822058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013042A Pending JPH03216004A (en) 1990-01-22 1990-01-22 Directional coupler

Country Status (1)

Country Link
JP (1) JPH03216004A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011055404A (en) * 2009-09-04 2011-03-17 Mitsubishi Electric Corp Directional coupler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011055404A (en) * 2009-09-04 2011-03-17 Mitsubishi Electric Corp Directional coupler

Similar Documents

Publication Publication Date Title
US6266016B1 (en) Microstrip arrangement
EP0848447B1 (en) Transmission circuit using strip line in three dimensions
US7336142B2 (en) High frequency component
TW201640735A (en) Radio frequency connection arrangement
US6661386B1 (en) Through glass RF coupler system
JP2006024618A (en) Wiring board
CA1298629C (en) Wideband stripline to microstrip transition
EP1346432B1 (en) Four port hybrid microstrip circuit of lange type
US11011814B2 (en) Coupling comprising a conductive wire embedded in a post-wall waveguide and extending into a hollow tube waveguide
EP0417590B1 (en) Planar airstripline-stripline magic-tee
US6946927B2 (en) Suspended substrate low loss coupler
JPH08250912A (en) Stripline vertical power supply
EP1798806B1 (en) Apparatus for Converting Transmission Structure
JPH04802A (en) Triplate line type inter-substrate connecting element
JP4381701B2 (en) Connection structure between coaxial connector and multilayer board
JP3008939B1 (en) High frequency circuit board
US4882555A (en) Plural plane waveguide coupler
KR20100005616A (en) Rf transmission line for preventing loss
JPH03216004A (en) Directional coupler
US20010033211A1 (en) Multilayered RF signal transmission circuit and connecting method therein
JPH04115604A (en) microwave circuit
JP2004312217A (en) Waveguide type dielectric filter
JP3723687B2 (en) Connection structure between NRD guide and dielectric waveguide
JPH11308018A (en) Transmission line conversion structure
JP3192252B2 (en) Microwave power distribution circuit