JPH03216501A - Small hole diameter measurement method - Google Patents

Small hole diameter measurement method

Info

Publication number
JPH03216501A
JPH03216501A JP1182190A JP1182190A JPH03216501A JP H03216501 A JPH03216501 A JP H03216501A JP 1182190 A JP1182190 A JP 1182190A JP 1182190 A JP1182190 A JP 1182190A JP H03216501 A JPH03216501 A JP H03216501A
Authority
JP
Japan
Prior art keywords
measured
hole diameter
diameter
hole
capacitance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1182190A
Other languages
Japanese (ja)
Inventor
Minoru Kobari
小針 実
Manda Noda
万朶 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NSK Ltd
Original Assignee
NSK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NSK Ltd filed Critical NSK Ltd
Priority to JP1182190A priority Critical patent/JPH03216501A/en
Publication of JPH03216501A publication Critical patent/JPH03216501A/en
Pending legal-status Critical Current

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明はミニチュア軸受のような小内径を有する部品
の内径寸法の測定方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for measuring the inner diameter dimension of a component having a small inner diameter, such as a miniature bearing.

(従来の技術) 小穴の径寸法を簡易に測定しようとする場合、一般的な
方法としてシリンダーゲージタイプの接触式と、小穴の
表面の工・/ヂ部を光学的に拡大、観察しながら座標を
読み取る顕微鏡タイプの非接触式がある。
(Prior technology) When trying to easily measure the diameter of a small hole, the common methods are to use a cylinder gauge type contact method, and to optically magnify the hole surface and measure the coordinates while observing. There is a microscope type non-contact type that reads the information.

(発明が解決しようとする課題) しかし、シリングーゲージタイプの接触式では、測定子
を小さくすることに限界があり、数1以下の小穴の径を
測定することが困難である。
(Problems to be Solved by the Invention) However, in the syringe-gauge type contact type, there is a limit to how small the measuring tip can be made, and it is difficult to measure the diameter of a small hole of several 1 or less.

また、顕微鏡タイプの非接触式では、穴の表面のエツヂ
部のみが、測定可能で、穴の内部は測定できない。
Furthermore, with a microscope-type non-contact method, only the edge of the surface of the hole can be measured, and the inside of the hole cannot be measured.

この発明は工場においても使用できる簡易な測定操作に
より測定できる小穴の内径寸法測定方法の提供を目的と
する。
The object of the present invention is to provide a method for measuring the inner diameter of a small hole, which can be measured by a simple measuring operation that can be used even in a factory.

(課題を解決する為の手段) 上記の目的を達成するためにこの発明は、導電性の測定
子の外径と被測定穴径面との隙間が均一になるように測
定子を位置させ、前記隙間の大きさによる静電容量を計
測し、予め求めておいた静電容量値と穴径寸法の関係図
より前記計測の静電容量値をもとに穴径寸法を求めるも
のである。
(Means for Solving the Problems) In order to achieve the above object, the present invention positions the conductive gauge head so that the gap between the outer diameter of the conductive gauge head and the diameter surface of the hole to be measured is uniform, The capacitance according to the size of the gap is measured, and the hole diameter size is determined based on the measured capacitance value from a previously determined relationship diagram between the capacitance value and the hole diameter size.

(作用) 披測定穴径に対し、測定子を求心後静電容量を計測し、
この静電容量と穴径寸法の関係図を利用してmff!に
穴径寸法を求められる。
(Function) Measure the capacitance after centripeting the probe with respect to the diameter of the measurement hole,
Using this relationship diagram between capacitance and hole diameter size, mff! The hole diameter dimensions can be found.

(実施例) 次に図を参照しながらこの発明の一実施例について説明
する。
(Example) Next, an example of the present invention will be described with reference to the drawings.

1は絶縁体でXYテーブル2上に載置されている。この
絶縁体1の上に小内径をもった被測定物3が置かれてい
る。4は先端に鋼球の取付けられた測定子で、図示を省
略した支持部材によって支承されている。5は静電容量
計で、導線によりそれぞれ測定子4と被測定物3と結線
されている。
1 is an insulator placed on an XY table 2. An object to be measured 3 having a small inner diameter is placed on this insulator 1. Reference numeral 4 denotes a probe having a steel ball attached to its tip, which is supported by a support member (not shown). Reference numeral 5 denotes a capacitance meter, which is connected to the measuring element 4 and the object to be measured 3 through conducting wires, respectively.

この測定法においては、絶縁体1上の被測定物3と測定
子4との求心を行うが、この実施例ではXYテーブル2
を微小変位させながら被測定物3を移動させ求心する。
In this measurement method, the object to be measured 3 on the insulator 1 and the probe 4 are centered, but in this embodiment, the XY table 2
The object to be measured 3 is moved and centripetalized while slightly displacing the object.

この求心は静電容量計5により静電容量の最小となる位
置を探索する。萌記求心は被測定物3の代りに測定子4
を変位させてもよい。
This centripetal search uses the capacitance meter 5 to search for the position where the capacitance is minimum. Moeki centripetal is measuring point 4 instead of object to be measured 3
may be displaced.

上記のように求心できたら、測定子4の外径と被測定物
3の内径との隙間の大!Ilさによってきまる静電容量
を静電容量計5により計測する。そして各測定子4毎に
、予め穴径寸法と静電容量の関係を求めた図(第2図参
照)により、計測した静電容量値から穴径寸法を求める
ことができる。
If the centering is achieved as described above, the gap between the outer diameter of the probe 4 and the inner diameter of the object to be measured 3 is large! The capacitance determined by the Il is measured by a capacitance meter 5. Then, the hole diameter can be determined from the measured capacitance value using a diagram (see FIG. 2) in which the relationship between the hole diameter and capacitance is determined in advance for each probe 4.

上記のように予め測定子毎に穴径寸法と静電容量値の関
係を求めておく必要はあるが、この測定法では前記求心
作業の完了時の静電容量値が即測定値となる。
Although it is necessary to determine the relationship between the hole diameter dimension and the capacitance value for each probe in advance as described above, in this measurement method, the capacitance value at the time of completion of the centripetal work becomes the immediate measurement value.

(発明の効果) この発明は、静電容量を寸法測定に応用することにより
、非接触で測定力による変形のない内径寸法の測定が可
能となる。
(Effects of the Invention) By applying capacitance to dimension measurement, the present invention enables non-contact measurement of inner diameter dimensions without deformation due to measuring force.

求心作業と同時に計測値が求められるので、比較的能率
的である。
It is relatively efficient because the measured values are obtained at the same time as the centripetal work.

しかも測定子に鋼球を用いることにより、測定子の径を
小さくすることができ、例えば0.5mmから数mmの
小穴の径にも十分対応できる。
Furthermore, by using a steel ball as the measuring element, the diameter of the measuring element can be made small, and the measuring element can sufficiently cope with the diameter of a small hole, for example, from 0.5 mm to several mm.

さらに測定子を内径面に沿って上下動することにより、
内径面の軸方向における任意の位置の測定も可能である
Furthermore, by moving the probe up and down along the inner diameter surface,
Measurement at any position in the axial direction of the inner diameter surface is also possible.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一寅施例を示す説明用図、第2図は
静電容量値と寸法との関係を示す図である。 符号の説明 1は絶縁体、2はXYテーブル、3は被測定物、4は測
定子、5は静電容量計。
FIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG. 2 is a diagram showing the relationship between capacitance value and dimensions. Explanation of the symbols 1 is an insulator, 2 is an XY table, 3 is an object to be measured, 4 is a probe, and 5 is a capacitance meter.

Claims (1)

【特許請求の範囲】[Claims] 小さい穴径寸法測定方法において、電導性の測定子の外
径と被測定穴径面との隙間が均一になるように測定子を
位置させ、前記隙間の大きさによる静電容量を計測し、
予め求めておいた静電容量値と穴径寸法の関係より前記
計測の静電容量値をもとに穴径寸法を求める小穴径寸法
測定方法。
In the small hole diameter measurement method, the measuring element is positioned so that the gap between the outer diameter of the conductive measuring element and the diameter surface of the hole to be measured is uniform, and the capacitance depending on the size of the gap is measured,
A small hole diameter measurement method in which the hole diameter is determined based on the measured capacitance value from the relationship between the capacitance value and the hole diameter determined in advance.
JP1182190A 1990-01-23 1990-01-23 Small hole diameter measurement method Pending JPH03216501A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1182190A JPH03216501A (en) 1990-01-23 1990-01-23 Small hole diameter measurement method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1182190A JPH03216501A (en) 1990-01-23 1990-01-23 Small hole diameter measurement method

Publications (1)

Publication Number Publication Date
JPH03216501A true JPH03216501A (en) 1991-09-24

Family

ID=11788446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1182190A Pending JPH03216501A (en) 1990-01-23 1990-01-23 Small hole diameter measurement method

Country Status (1)

Country Link
JP (1) JPH03216501A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005199390A (en) * 2004-01-16 2005-07-28 Kawasaki Heavy Ind Ltd Cutting device
JP2008309590A (en) * 2007-06-13 2008-12-25 Mitsubishi Electric Corp Nozzle inspection apparatus and nozzle inspection method
WO2010139198A1 (en) * 2009-05-31 2010-12-09 Harbin Institute Of Technology Ultraprecision non-contact three-dimensional probing system based on spherical capacitive plate
US20150056030A1 (en) * 2013-02-26 2015-02-26 The Boeing Company Automated inspection system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005199390A (en) * 2004-01-16 2005-07-28 Kawasaki Heavy Ind Ltd Cutting device
JP2008309590A (en) * 2007-06-13 2008-12-25 Mitsubishi Electric Corp Nozzle inspection apparatus and nozzle inspection method
WO2010139198A1 (en) * 2009-05-31 2010-12-09 Harbin Institute Of Technology Ultraprecision non-contact three-dimensional probing system based on spherical capacitive plate
GB2477893A (en) * 2009-05-31 2011-08-17 Harbin Inst Of Technology Ultraprecision non-contact three-dimensional probing system based on spherical capacitive plate
GB2477893B (en) * 2009-05-31 2016-07-13 Harbin Institute Technology Ultraprecision non-contact three-dimensional probing system based on spherical capacitive surface
US20150056030A1 (en) * 2013-02-26 2015-02-26 The Boeing Company Automated inspection system
US9707656B2 (en) * 2013-02-26 2017-07-18 The Boeing Company Automated inspection system

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