JPH03216607A - Manufacturing method of photoelectric conversion module - Google Patents
Manufacturing method of photoelectric conversion moduleInfo
- Publication number
- JPH03216607A JPH03216607A JP1212690A JP1212690A JPH03216607A JP H03216607 A JPH03216607 A JP H03216607A JP 1212690 A JP1212690 A JP 1212690A JP 1212690 A JP1212690 A JP 1212690A JP H03216607 A JPH03216607 A JP H03216607A
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- mold
- electromagnetic wave
- conversion device
- conversion module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 22
- 230000008878 coupling Effects 0.000 claims abstract description 11
- 238000010168 coupling process Methods 0.000 claims abstract description 11
- 238000005859 coupling reaction Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 20
- 239000013307 optical fiber Substances 0.000 claims description 14
- 230000006378 damage Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000002788 crimping Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、光送受信に用いられる光電変換モジュール
に関し、より詳細には、光ファイバのプラグを嵌脱し、
光電変換デバイスが組込まれた光電変換モジュールの製
造方法に関する．〔従来の技術〕
光ファイバのプラグを嵌脱し、光電変換デバイスが組込
まれた光電変換モジュールとしては、従来、種々のもの
が提案され、実施されている．例え′ば、リードフレー
ム上にマウントされた光電変換素子のＩＣチップが゛透
明モールド体によりモールドされ、更に光不透過モール
ド体により被覆されている光送受信コネクタレセプタク
ルを備える光伝送装置（特公昭６２−５９４７８号公報
）、変換素子が透明モールド体で被覆され、更に光不透
過モールド体で外形が形成され、その透明または不透過
モールド体に電磁波シールド部材が設けられている光電
変換モジュール〈特公昭６２−４４８２８号公報）があ
る．
これらの光電変換モジュールは、コネクタ本体′の結合
部に樹脂を用いこの樹脂の弾性を利用して容易に嵌合し
かつ離脱するプッシュプル形式簡易接続型である．一方
、送受信する光変換デバイスに於いては、高速化・高感
度化に加えて光電変換素子と波形成形回路と増幅回路と
その他種々の電子回路とを集積化し、外部からの電磁ノ
イズの影響を受け易くなってきているために、少なくと
も光変換デバイス部分を電磁波シールド材でシールドす
ることが必須になってきている．
上述の電磁波シールド構造を有する光電変換モジュール
を製造する方法としては、従来、溶融した金属または導
電性を有する溶融樹脂を、金型に注入し固化してコネク
タ本体を成形し、これに光電変換デバイスを挿入する方
法や、樹脂成形したコネクタ本体の外側にシールド材で
被覆する方法、シールド材を光変換デバイスと樹脂製コ
ネクタ本体との間に介在させて得る方法、更にシールド
部材で被覆された光変換デバイスを金型内に挿入して位
置決めし、この金型に溶融樹脂を注入し固化する方法な
どがある．
〔発明が解決しようとする課題〕
しかしながら、従来の光電変換モジュールの製造方法の
うち、コネクタ本体外側をシールド材で覆う方法では、
プラグとのコネクタ結合部が開口状態になってしまい十
分なシールド効果を得ることができず、また、コネクタ
本体と光変換デバイスとの間にシールド材を挿入する方
法では、コネクタ本体，光変換デバイスおよびシールド
材の間に位置ズレが生じ易く，また正確な位置決めが難
しく、各部品に厳しい寸法精度が必要となってしまう．
更に、シールド部材と光変換デバイスとを金型内に挿入
して位置決めし溶融樹脂を注入する方法では、金型で光
電変換デバイスを扶持するので、型締め圧が直接に光電
変換デバイスにかかるために金型に厳格な寸法精度が要
求され、また注入される高温の溶融樹脂による熱損傷を
光電変換デノくイスが受け易くなる．
この発明は上述の背景に基づきなされたものであり、そ
の目的とするところは、光電変換デノくイスを十分にシ
ールドでき、精度のよい位置決めが容易でありかつ各部
材間のズレを防止でき、しかも光電変換デバイスへの挟
圧によるダメージ及び熱による損傷をなくすことができ
る光電変換モジュールの製造方法を提供することである
．〔課題を解決するための手段〕
上記の課題は、この発明により解決される．すなわち、
この発明による光電変換モジュールの製造方法は、
光ファイバに光送信または／および光受信する、透明樹
脂で被覆された光電変換デバイスと、光ファイバのプラ
グを嵌脱する光コネクタ結合部を前部に有し、光ファイ
バの光軸と対向するように底部より光電変換デバイスを
嵌着するコネクタ本体と、
光電変換用の窓を前側面に有し、光電変換デバイスを底
部より収納する電磁波シールドケースと、を有する光電
変換モジュールの製造方法であって、次の工程を含むも
のである．
（Ａ）光電変換モジュール外形を形成する金型を準備す
る工程．
（Ｂ）この金型内に挿入した電磁波シールドケースを、
金型内部に突設したシールドケース保持部に冠置し、光
コネクタ結合部用金型部分から突設された固定用ビンで
シールドケースを扶持して固定する固定．
（Ｃ）金型内に溶融樹脂を注入して固化し、所定位置に
電磁波シールドケースが配置されたコネクタ本体を形成
する工程．
（Ｄ）得られたコネクタ本体の電磁波シールドケース内
に底面開口部より光電変換デバイスを挿嵌し、その開口
部で固定する工程．
〔作 用〕
上記の構成を有する本願発明による光電変換モジュール
の製造方法は、次のように機能・作用する．
まず、光電変換デバイス、電磁波シールドケースおよび
、金型などを準備する．
この電磁波シールドケース内には、光電変換デバイスを
収納する開空間、すなわち孔が形成されている．他方、
金型内にその内部側に突設したシールドケース保持部が
形成されている．電磁波シールドケースを挿入して、金
型内部に突設したシールドケース保持部に冠置する．こ
の冠置により金型内で、電磁波シールドケースが一応に
固定され、位置決めされる．更に、光コネクタ結合部用
金型部分から突設された固定用ピンで電磁波シールドケ
ースを扶持することにより、正確にかつ確実に固定され
る．このように位置決め固定された金型内に溶融樹脂を
注入すると、キャビティに溶融樹脂が充填する．この樹
脂を固化させると、所定位置に電磁波シールドケースが
正確に配置・固定されたコネクタ本体が形成される．
得られたコネクタ本体の電磁波シールドケース内に底面
開口部より光電変換デバイスを挿入すると、この電磁波
シールドケースに光電変換デバイスが嵌合し、このケー
ス前側面の光電変換用の窓に光電変換素子が対応する．
次いで、そのコネクタ本体の開口部で光電変換デバイス
を接着剤などで固定して、所定の光電変換モジュールを
得る．
得られた光電変換モジュールは、光ファイバに光送信ま
たは／および光受信する、透明樹脂で被覆された光電変
換デバイスと、光ファイバのプラグを嵌脱する光コネク
タ結合部を前部に有し、光ファイバの光軸と対向するよ
うに底部より光電変換デバイスを嵌着するコネクタ本体
と、光電変換用の窓を前側面に有し、光電変換デバイス
を底部より収納する電磁波シールドケースと、を有する
ものである．
透明樹脂で被覆された光電変換素子は、冥質的に、光フ
ァイバと結合する窓を除いて、電磁波シードケースで覆
われているので、外部への電磁波ノイズ、および外部か
らの電磁波ノイズを防止する．
〔実施例〕
この発明の光電変換モジュールを、以下に詳説する実施
例により具体的に説明するが、この発明の範囲は、この
発明の主旨に反しないかぎり、この実施例に限定される
ものではない．
第１図に、この発明による光電変換モジュールの製造方
法による金型例の断面図を示し、第２図に、この実施例
により得られたコネクタ本体の断面図を示し、第３図に
実施例により得られた光電変換モジュールの断面図を示
し、第４図にこの先電変換モジュールの使用態様を示す
．
この発明による製造方法は、まず、光電変換デバイス１
０、電磁波シールドケース２０および、金型３０など材
料や部材を準備する．
この実施例のおける電磁波シールドケース２０には、金
属板の所定の形状に切断しプレス成形して得られた金属
製ケースであり、光電変換デバイスを収納する開空間が
形成され、また、光電変換デバイスの光電変換素子用の
窓が前側面に形成されている．更に、このケース２０の
前底部には、シールドライン接統半田用ピン２１が設け
られている．
この発明の製造方法に用いられる金型３０ａ、ｂ，ｃお
よびｄには、底部形成用金型部分３０ａからその内部側
に突設したシールドケース保持部３４が形成され、更に
、光コネクタ結合部用金型部分３０ｂから突設した固定
用ピン３１が設けられ、また、裏部形成用金型３０ｄか
ら突設した固定用ピン３２が設けられている．
この発明においてビ電磁波シールドケース２０を金型３
０内に挿入して、金型内部に突設したシールドケース保
持部３４に冠置する．
この冠置により金型内で、電磁波シールドケース２０を
一応に固定し、所定位置に位置決めする．更に、光コネ
クタ結合部用金型部分３０ｂから突設された固定用ピン
３１で電磁波シールドケース２０を挟持することにより
，正確に固定し、また、裏部形成用金型部分３０ｄから
突設された固定用ピン３２で裏から電磁波シールドケー
ス２０を挟持することにより、シールドケースを確実に
固定する．
このようにシールドケースを位置決め固定した金型内に
溶融樹脂を注入すると、キャビテイ内部３３に溶融樹脂
が充填する．この樹脂を固化させると、所定位置に電磁
波シールドケース２０が正確に配置・固定されたコネク
タ本体４５を形成する．得られたコネクタ本体４５を第
２図に示す．なお、このコネクタ本体には、少なくとも
機械的強度を有する材料を用い、コネクタプラグとの摩
擦面となる部分４０は少なくとも滑りのよい樹脂を用い
ることが望ましい．
このコネクタ本体４５の電磁波シールドケース２０内に
底面開口部より光電変換デバイス１０を挿入すると、こ
の電磁波シールドケースに光電変換デバイス１ｏが嵌合
し、このケース前側面の光電変換用の窓２４に光電変換
素子が対応する．次いで、そのコネクタ本体の下開口部
で光電変換デバイス１０を接着剤２５で固定して、所望
の光電変換モジュール１を得る．
この実施例の光電変換モジュール１は、基本的に、光フ
ァイバに光送信または／および光受信し透明樹脂２６で
被覆された光！変換デバイス１０と、光ファイバのプラ
グを嵌脱する光コネクタ結合部４０を前部に有し、光フ
ァイバの光軸と対向するように底部より光電変換デバイ
ス１０を嵌着するコネクタ本体４５と、光電変換用の窓
２４を前側面に有し、光電変換デバイスを底部より収納
する電磁波シールドケース２ｏと、を有する．組み立て
られな光電変換モジュール１は、第４図に示すように、
コネクタ結合部４０で光ファイバ５２のプラグ５３と抜
き差し可能に嵌脱される．〔発明の効果〕
上記の構成を有するこの発明により、下記の効果を奏す
る．
（１） 請求項第１項記載の本発明の光電変換モジュー
ルの製造方法では、樹脂成形時に光電変換デバイスが金
型内に挿入されていないので、成形時の熱や圧力がこの
光電変換デバイスに挟圧によるダメージ及び熱による損
傷を、すなわち悪影響を与える恐れがなく、光電変換性
能の良好な光電変換モジュールを得ることができる．
（２） 請求項第１項記載の製造方法では、一部の窓な
どを除いて、光電変換素子やその周辺集積回路を電磁波
シールドケースで覆うことができるので、光電変換デバ
イスを十分にシールドでき、信顆性の高い光電変換モジ
ュールを得ることができる．
（３） 請求項第１項記載の態様の光電変換モジュール
の製造方法では、電磁波シードでケースをビンと保持部
で固定扶持するので、ケースや充電変換デバイスを精度
よく位置決めし、かつ各部材間のズレを防止でき、信頼
性の高い充電変換モジュールを得ることができる．
（４） 請求項第２項記載の！Ｅ！様の光電変換モジュ
ールの製造方法では、電磁波シードでケースを両サイド
からと内部から固定扶持するので、さらに、ケースや光
電変換デバイスを確実にかつ正確に位置決めし固定する
ことができ、光電変換を高信顆性で行なうことができる
．[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a photoelectric conversion module used for optical transmission and reception, and more specifically, relates to a photoelectric conversion module used for optical transmission and reception.
This article relates to a method for manufacturing a photoelectric conversion module incorporating a photoelectric conversion device. [Prior Art] Various types of photoelectric conversion modules in which optical fiber plugs are inserted and removed and photoelectric conversion devices are incorporated have been proposed and implemented in the past. For example, an optical transmission device (Japanese Patent Publication No. 62, -59478 Publication), a photoelectric conversion module in which a conversion element is covered with a transparent mold body, the outer shape is further formed with a light-impermeable mold body, and an electromagnetic wave shielding member is provided on the transparent or non-transparent mold body. 62-44828). These photoelectric conversion modules are push-pull type easy-to-connect types that use resin for the connecting portion of the connector body and utilize the elasticity of the resin to easily fit and disconnect. On the other hand, in optical conversion devices for transmitting and receiving, in addition to increasing speed and sensitivity, we are integrating photoelectric conversion elements, waveform shaping circuits, amplifier circuits, and various other electronic circuits to reduce the influence of external electromagnetic noise. Because of this, it has become essential to shield at least the optical conversion device part with an electromagnetic wave shielding material. Conventionally, the method for manufacturing a photoelectric conversion module having the above-mentioned electromagnetic wave shielding structure is to inject molten metal or conductive molten resin into a mold and solidify it to form a connector body, and then insert a photoelectric conversion device into this. A method of inserting a shielding material onto the outside of a resin-molded connector body, a method of interposing a shielding material between an optical conversion device and a resin connector body, and a method of inserting a shielding material into the resin-molded connector body. Methods include inserting and positioning a conversion device into a mold, then injecting molten resin into the mold and solidifying it. [Problems to be Solved by the Invention] However, among the conventional methods of manufacturing photoelectric conversion modules, the method of covering the outside of the connector body with a shielding material,
The connecting part of the connector with the plug becomes open, making it impossible to obtain a sufficient shielding effect.In addition, with the method of inserting a shielding material between the connector body and the optical conversion device, the connector body and the optical conversion device Misalignment easily occurs between the shielding material and the shielding material, and accurate positioning is difficult, requiring strict dimensional accuracy for each part. Furthermore, in the method of inserting and positioning the shield member and the photoconversion device into the mold and injecting the molten resin, the mold supports the photoelectric conversion device, so mold clamping pressure is applied directly to the photoelectric conversion device. Strict dimensional accuracy is required for the mold, and the photoelectric conversion device is susceptible to thermal damage from the high-temperature molten resin that is injected. This invention was made based on the above-mentioned background, and its purpose is to sufficiently shield a photoelectric conversion denomous chair, facilitate accurate positioning, and prevent misalignment between each member. Moreover, it is an object of the present invention to provide a method for manufacturing a photoelectric conversion module that can eliminate damage to photoelectric conversion devices due to pinching pressure and damage due to heat. [Means for Solving the Problems] The above problems are solved by the present invention. That is,
A method of manufacturing a photoelectric conversion module according to the present invention includes a photoelectric conversion device coated with a transparent resin that transmits light to and/or receives light from an optical fiber, and an optical connector coupling portion for fitting and removing an optical fiber plug in the front part. a connector body into which a photoelectric conversion device is fitted from the bottom so as to face the optical axis of the optical fiber; and an electromagnetic shielding case which has a window for photoelectric conversion on the front side and accommodates the photoelectric conversion device from the bottom. A method for manufacturing a photoelectric conversion module having the following steps. (A) Step of preparing a mold for forming the outer shape of the photoelectric conversion module. (B) The electromagnetic shielding case inserted into this mold,
A fixing method in which the shield case is placed on the shield case holder protruding inside the mold, and the shield case is supported and fixed by a fixing pin protruding from the mold part for the optical connector coupling part. (C) Step of injecting molten resin into the mold and solidifying it to form a connector body with an electromagnetic shielding case placed in a predetermined position. (D) A step of inserting the photoelectric conversion device into the electromagnetic wave shielding case of the obtained connector body from the bottom opening and fixing it with the opening. [Function] The method for manufacturing a photoelectric conversion module according to the present invention having the above configuration functions and functions as follows. First, prepare the photoelectric conversion device, electromagnetic shielding case, mold, etc. This electromagnetic shielding case has an open space, or a hole, in which the photoelectric conversion device is housed. On the other hand,
A shield case holding part is formed inside the mold that protrudes from the inside. Insert the electromagnetic shielding case and place it on the shielding case holder protruding inside the mold. This crown position temporarily fixes and positions the electromagnetic shielding case within the mold. Furthermore, by supporting the electromagnetic shielding case with fixing pins protruding from the mold part for the optical connector coupling part, it is fixed accurately and reliably. When molten resin is injected into the mold that is positioned and fixed in this way, the molten resin fills the cavity. When this resin hardens, a connector body is formed in which the electromagnetic shielding case is precisely placed and fixed in place. When a photoelectric conversion device is inserted into the electromagnetic wave shielding case of the obtained connector body from the bottom opening, the photoelectric conversion device is fitted into this electromagnetic wave shielding case, and the photoelectric conversion element is inserted into the photoelectric conversion window on the front side of the case. handle. Next, a photoelectric conversion device is fixed in the opening of the connector body with an adhesive or the like to obtain a desired photoelectric conversion module. The obtained photoelectric conversion module has a photoelectric conversion device coated with a transparent resin that transmits light to and/or receives light through an optical fiber, and an optical connector coupling part that connects and disconnects an optical fiber plug in the front part, It has a connector body into which a photoelectric conversion device is fitted from the bottom so as to face the optical axis of the optical fiber, and an electromagnetic wave shielding case which has a window for photoelectric conversion on the front side and houses the photoelectric conversion device from the bottom. It is something. The photoelectric conversion element coated with transparent resin is subtly covered with an electromagnetic wave seed case, except for the window that connects to the optical fiber, so it prevents electromagnetic wave noise to the outside and electromagnetic wave noise from the outside. do. [Example] The photoelectric conversion module of the present invention will be specifically explained with reference to Examples detailed below, but the scope of the present invention is not limited to these Examples unless it goes against the gist of the invention. do not have. FIG. 1 shows a sectional view of an example of a mold according to the method for manufacturing a photoelectric conversion module according to the present invention, FIG. 2 shows a sectional view of a connector body obtained by this example, and FIG. A cross-sectional view of the photoelectric conversion module obtained by the method is shown, and FIG. 4 shows how the photoelectric conversion module is used. The manufacturing method according to the present invention first includes a photoelectric conversion device 1.
0. Prepare materials and components such as the electromagnetic shielding case 20 and the mold 30. The electromagnetic wave shielding case 20 in this embodiment is a metal case obtained by cutting a metal plate into a predetermined shape and press-molding it, and has an open space for storing a photoelectric conversion device. A window for the device's photoelectric conversion element is formed on the front side. Furthermore, a shield line connection soldering pin 21 is provided at the front bottom of the case 20. The molds 30a, b, c, and d used in the manufacturing method of the present invention are formed with a shield case holding portion 34 that protrudes from the bottom forming mold portion 30a toward the inside thereof, and further includes an optical connector coupling portion. A fixing pin 31 is provided protruding from the mold portion 30b, and a fixing pin 32 is provided protruding from the back forming mold 30d. In this invention, the electromagnetic wave shielding case 20 is placed in the mold 3.
0 and place it on the shield case holding part 34 protruding inside the mold. This crown placement temporarily fixes the electromagnetic shielding case 20 within the mold and positions it at a predetermined position. Furthermore, by holding the electromagnetic wave shielding case 20 with the fixing pins 31 protruding from the mold part 30b for the optical connector coupling part, the electromagnetic wave shielding case 20 can be accurately fixed. By holding the electromagnetic shielding case 20 from the back with the fixing pins 32, the shielding case is securely fixed. When molten resin is injected into the mold with the shield case positioned and fixed in this manner, the inside of the cavity 33 is filled with the molten resin. When this resin is solidified, a connector body 45 is formed in which the electromagnetic shielding case 20 is accurately placed and fixed at a predetermined position. The resulting connector body 45 is shown in Figure 2. It is preferable that the connector body is made of a material having at least mechanical strength, and that the portion 40 that forms a friction surface with the connector plug is made of at least a slippery resin. When the photoelectric conversion device 10 is inserted into the electromagnetic wave shielding case 20 of this connector body 45 from the bottom opening, the photoelectric conversion device 1o is fitted into this electromagnetic wave shielding case, and the photoelectric conversion device 1o is inserted into the photoelectric conversion window 24 on the front side of the case. The conversion element corresponds. Next, the photoelectric conversion device 10 is fixed at the lower opening of the connector body with an adhesive 25 to obtain the desired photoelectric conversion module 1. The photoelectric conversion module 1 of this embodiment basically transmits and/or receives light through an optical fiber and coats the light with a transparent resin 26. A connector main body 45 that has a conversion device 10 and an optical connector coupling part 40 for fitting and removing an optical fiber plug in the front part, and that the photoelectric conversion device 10 is fitted from the bottom so as to face the optical axis of the optical fiber; It has an electromagnetic wave shielding case 2o which has a window 24 for photoelectric conversion on the front side and houses a photoelectric conversion device from the bottom. The unassembled photoelectric conversion module 1 is as shown in FIG.
The connector coupling portion 40 is removably connected to the plug 53 of the optical fiber 52. [Effects of the Invention] This invention having the above configuration provides the following effects. (1) In the method for manufacturing a photoelectric conversion module of the present invention as set forth in claim 1, since the photoelectric conversion device is not inserted into the mold during resin molding, the heat and pressure during molding are not applied to the photoelectric conversion device. It is possible to obtain a photoelectric conversion module with good photoelectric conversion performance without the risk of damage caused by clamping pressure or damage caused by heat, that is, any adverse effects. (2) In the manufacturing method described in claim 1, the photoelectric conversion element and its peripheral integrated circuit can be covered with the electromagnetic wave shielding case, except for some windows, so the photoelectric conversion device cannot be sufficiently shielded. , it is possible to obtain a photoelectric conversion module with high reliability. (3) In the method for manufacturing a photoelectric conversion module according to the aspect described in claim 1, since the case is fixedly supported by the bottle and the holding part using electromagnetic wave seeds, the case and the charging conversion device can be positioned accurately and the distance between each member can be fixed. It is possible to prevent misalignment and obtain a highly reliable charging conversion module. (4) As stated in claim 2! E! In the manufacturing method of photoelectric conversion module, the electromagnetic wave seeds are used to securely support the case from both sides and from inside, so the case and the photoelectric conversion device can be positioned and fixed securely and accurately, making it possible to perform photoelectric conversion. It can be performed with high confidence.
第１図は、この発明による光電変換モジュールの製造方
法による金型例の断面図、第２図は、この実施例により
得られたコネクタ本体の断面図、第３図は、実施鍔によ
り得られた光電変換モジュールの断面図、第４図は，こ
の光電変換モジュールの使用態様を示す斜視図である．FIG. 1 is a cross-sectional view of a mold example obtained by the method for manufacturing a photoelectric conversion module according to the present invention, FIG. 2 is a cross-sectional view of a connector body obtained by this example, and FIG. FIG. 4 is a sectional view of the photoelectric conversion module shown in FIG. 4, and is a perspective view showing how this photoelectric conversion module is used.
Claims (1)
れた光電変換デバイスと、 光ファイバのプラグを嵌脱する光コネクタ結合部を前部
に有し、光ファイバの光軸と対向するように底部より該
光電変換デバイスを嵌着するコネクタ本体と、 光電変換用の窓を前側面に有し、該光電変換デバイスを
底部より収納する電磁波シールドケースと、を有する光
電変換モジュールの製造方法であつて、光電変換モジュ
ール外形を形成する金型を準備し、該金型内に挿入した
電磁波シールドケースを、金型内部に突設したシールド
ケース保持部に冠置し、光コネクタ結合部用金型部分か
ら突設された固定用ピンで前面からシールドケースを挟
持して固定し、 金型内に溶融樹脂を注入して固化し、所定位置に電磁波
シールドケースが配置されたコネクタ本体を形成し、 得られたコネクタ本体の電磁波シールドケース内に底面
開口部より光電変換デバイスを挿嵌し、該開口部で固定
することを含むことを特徴とする光電変換モジュールの
製造法。 ２、裏部形成用金型部分から突設した固定用ピンで裏面
からシールドケースを挟持する、請求項１記載の光電変
換モジュールの製造法。[Scope of Claims] 1. A photoelectric conversion device that transmits/receives light to an optical fiber and is coated with a transparent resin, and an optical connector coupling part for connecting and disconnecting an optical fiber plug in the front part; a connector body into which the photoelectric conversion device is fitted from the bottom so as to face the optical axis of the connector; and an electromagnetic wave shielding case having a window for photoelectric conversion on the front side and housing the photoelectric conversion device from the bottom. The method for manufacturing a photoelectric conversion module includes preparing a mold for forming the outer shape of the photoelectric conversion module, and placing an electromagnetic wave shielding case inserted into the mold on a shielding case holding part protruding inside the mold. , the shield case is clamped and fixed from the front with fixing pins protruding from the mold part for the optical connector coupling part, molten resin is injected into the mold and solidified, and the electromagnetic shielding case is placed in the specified position. manufacturing a photoelectric conversion module, comprising: forming a connector body, inserting a photoelectric conversion device into an electromagnetic wave shielding case of the obtained connector body from a bottom opening, and fixing it at the opening; Law. 2. The method for manufacturing a photoelectric conversion module according to claim 1, wherein the shield case is held from the back side by fixing pins protruding from the back side forming mold part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1212690A JPH03216607A (en) | 1990-01-22 | 1990-01-22 | Manufacturing method of photoelectric conversion module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1212690A JPH03216607A (en) | 1990-01-22 | 1990-01-22 | Manufacturing method of photoelectric conversion module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03216607A true JPH03216607A (en) | 1991-09-24 |
Family
ID=11796846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1212690A Pending JPH03216607A (en) | 1990-01-22 | 1990-01-22 | Manufacturing method of photoelectric conversion module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03216607A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1248128A3 (en) * | 2001-04-03 | 2004-06-02 | Autonetworks Technologies, Ltd. | Optical connector, optical element holding structure, and structure of a mount section of an optical connector |
| JP2005275407A (en) * | 2004-03-24 | 2005-10-06 | Agilent Technol Inc | Integrated interference molded fiber optic transceiver electromagnetic interference shield |
| JP2009016486A (en) * | 2007-07-03 | 2009-01-22 | Hitachi Information & Communication Engineering Ltd | Optical communication equipment |
| JP2010214766A (en) * | 2009-03-17 | 2010-09-30 | Sumitomo Wiring Syst Ltd | Waterproof connector component manufacturing apparatus |
| JP2012530626A (en) * | 2009-06-30 | 2012-12-06 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Method for manufacturing an electronic component |
| JP2014142576A (en) * | 2012-12-27 | 2014-08-07 | Kel Corp | Optical connector device |
| KR20230141979A (en) * | 2022-03-30 | 2023-10-11 | 티에스테크놀로지 주식회사 | Core insert unit |
-
1990
- 1990-01-22 JP JP1212690A patent/JPH03216607A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1248128A3 (en) * | 2001-04-03 | 2004-06-02 | Autonetworks Technologies, Ltd. | Optical connector, optical element holding structure, and structure of a mount section of an optical connector |
| US6860643B2 (en) | 2001-04-03 | 2005-03-01 | Autonetworks Technologies, Limited | Optical connector with a surface mounted shield |
| EP1524538A1 (en) * | 2001-04-03 | 2005-04-20 | Autonetworks Technologies, Ltd. | Optical connector, optical element holding structure, and structure of a mount section of an optical connector |
| US6939054B2 (en) | 2001-04-03 | 2005-09-06 | Autonetworks Technologies, Ltd. | Holding structures for optical elements of an optical connector |
| JP2005275407A (en) * | 2004-03-24 | 2005-10-06 | Agilent Technol Inc | Integrated interference molded fiber optic transceiver electromagnetic interference shield |
| JP2009016486A (en) * | 2007-07-03 | 2009-01-22 | Hitachi Information & Communication Engineering Ltd | Optical communication equipment |
| JP2010214766A (en) * | 2009-03-17 | 2010-09-30 | Sumitomo Wiring Syst Ltd | Waterproof connector component manufacturing apparatus |
| JP2012530626A (en) * | 2009-06-30 | 2012-12-06 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Method for manufacturing an electronic component |
| US8916079B2 (en) | 2009-06-30 | 2014-12-23 | Robert Bosch Gmbh | Method for producing an electronic component |
| JP2014142576A (en) * | 2012-12-27 | 2014-08-07 | Kel Corp | Optical connector device |
| KR20230141979A (en) * | 2022-03-30 | 2023-10-11 | 티에스테크놀로지 주식회사 | Core insert unit |
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