JPH03216923A - Electronic circuit board - Google Patents

Abstract

PURPOSE:To improve the degree of freedom in lay-out of an electric conducting pattern by laminating a switch section comprising the electric conducting pattern over other electric conducting pattern via an insulation pattern. CONSTITUTION:On a base film 2 an electric conducting pattern 3d is formed under a switch section 2, with electric conducting patterns 3c for a switch in a manner facing to each other via the pattern 3d. An insulation layer 15 is laminated over the pattern 3d so as not to cover the pattern 3c. A carbon contact point 17 is laminated with a small gap 16 over the pattern 3c for the switch. With this constitution, the carbon contact point 17 is laminated over the insulation layer 15 formed on the pattern 3c, and the freedom of lay-out of the electric conducting pattern on the base is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic circuit board used for keyboards and the like.

[Prior Art] In recent years, flexible electronic circuit boards have been housed inside keyboards, etc., and these electronic circuit boards include conductive patterns for electrical continuity and connections between multiple conductive patterns. Alternatively, a switch section for shutting off and an insulating pattern for electrical insulation are formed.

The conductive patterns, switch parts, etc. formed on the electronic circuit board are wired in a complex manner in a very narrow area in order to provide high functionality in response to the many switches included in the keyboard. Ru.

Therefore, it is necessary to make the conductive patterns on the substrate cross each other, and in such a case, wiring is performed by making the conductive patterns cross each other via an insulating pattern.

Further, the switch section is provided at a position corresponding to each switch of the keyboard, and turns the conductive pattern on and off depending on when the switch is pressed or released.

As shown in the plan view of FIG. 5(a), carbon contacts P2 are laminated on a pair of conductive patterns P1 with a slight gap between them, and above them As shown in the P-p cross-sectional view of FIG. 5(b),
A switch P4 having a carbon ring P3 at the bottom and biased upward by a spring or the like is disposed.

Therefore, when switch P4 is pushed downward (in the direction of arrow O), carbon ring P3 contacts both carbon contacts P2,
This establishes electrical continuity between both conductive patterns P1.

[Problems to be Solved by the Invention] However, with the above-mentioned electronic circuit board, there were problems such as the inability to greatly increase the density in which conductive patterns are arranged and the inability to form an electronic circuit board compactly. In order to ensure conduction when the switch is pressed, other conductive patterns are formed in the switch part, which has a more complex configuration than other parts, in addition to the pair of conductive patterns for the switch. Therefore, the positions where the conductive patterns can be placed are limited, and optimal wiring of the conductive patterns cannot necessarily be achieved.

For example, it is necessary to form a large number of conductive patterns by bypassing the many switch parts formed on the electronic circuit board, which causes the problem of unnecessarily increasing the board area and the problem that the switch part There was a problem that comrades could not be placed in close proximity.

In addition, this increases the restrictions on the shape of the electronic circuit board, reducing the degree of freedom in positioning connectors to other boards and holes for coupling with other parts. An object of the invention is to solve the above problems and provide an electronic circuit board on which conductive patterns can be suitably arranged.

[Means for Solving the Problems] The electronic circuit board of the present invention has a conductive pattern and an insulating pattern formed on a base, and a plurality of conductive patterns among the conductive patterns are arranged close to each other. The gist of the present invention is an electronic circuit board having a switch part formed thereon, wherein the switch part made of the conductive pattern is laminated on top of another conductive pattern via the insulating pattern. do.

Here, various types of base films can be used as the base serving as the electronic circuit board, and for example, polyethylene terephthalate (PET) is suitable.

Further, as the conductive pattern, for example, carbon used for switch parts, silver or copper used for other conductive parts, etc. can be used, and as the insulating pattern, ultraviolet curable resin etc. can be used. can be used.

[Function] In the electronic circuit board of the present invention, a conductive pattern and an insulating pattern are formed on the base, and a plurality of the conductive patterns among the conductive patterns are arranged in close proximity to each other in a switch section to provide conductive patterns. Turns on/off conduction between sexual patterns.

Then, by laminating another conductive pattern under the conductive pattern of the switch part with an insulating pattern interposed therebetween, the other conductive pattern is allowed to pass through the switch part while being insulated from the switch part. It becomes possible to form the This improves the degree of freedom in arranging the conductive pattern.

[Example 1] Hereinafter, a base film (base) for an electronic circuit board, which is a preferred example of the present invention, will be described based on FIGS. 1 to 4.

As shown in FIG. 2, the base film 2 of the electronic circuit board 1 of this embodiment is made of polyethylene terephthalate (PET).
It is a flexible film made of On this base film 2, a number of conductive patterns 3 made of silver are arranged in close contact with each other, and at the parts where these conductive patterns 3 intersect with each other (insulating intersecting parts 4 are formed). In addition, the switch of the base film 2 (Fig. 1(b)
') A switch section 6 is formed at each position corresponding to 5.

As shown in the plan view of FIG. 3(a) and the A-A cross-sectional view of FIG. 3(b), the insulating intersection portion 4 intersects different conductive patterns 3a and 3b in an insulated state. .

The formation of this insulating cross section 4 is performed in the following procedure.

First, one conductive pattern 3a is placed on the base film 2.
and a pair of conductive patterns 3b are formed with the conductive pattern 3a sandwiched therebetween. Next, an insulating layer (resist) 10 is laminated with an ultraviolet curable resin so as to straddle the conductive pattern 3a and reach the other pair of conductive patterns 3b.

In this case, the insulating layer 0 is not formed on the upper portions 1 of the ends of the pair of conductive patterns 3b. Thereafter, a carbon jumper 2, which is another conductive pattern connecting both conductive patterns 3b, is laminated on the inside of this insulating layer]0.

As a result, conduction is established between the pair of conductive patterns 3b, and insulation from the other conductive patterns 3a is maintained, so that both conductive patterns 3a and 3b can intersect in an insulated state.

Further, as shown in the plan view of FIG. 1(a) and the BB cross-sectional view of FIG. 1(b), the switch unit 6, which is the main part of this embodiment, is turned on and off electrically. A conductive pattern 3c for a switch is provided, and another conductive pattern 3d is provided below the switch section 6.

The formation of the switch portion 6 is performed by the following procedure as shown in FIG. First, place the switch section 6 on the base film 2.
10 μm thick conductive pattern 3d placed under the
and a conductive pattern 3c for a switch, which faces each other with the conductive pattern 3d in between. Therefore, the conductive pattern 3d extending in the vertical direction of the figure and the conductive pattern 3C for the switch do not intersect.

Next, an insulating layer 15 made of ultraviolet curable resin and having a thickness of 12 μm is laminated on top of the conductive pattern 3d so as not to cover the conductive pattern 3c for the switch.

Furthermore, on top of this insulating layer 15 and the conductive pattern 3c for the switch, with a slight interval ]6, another conductive pattern made of a pair of carbon with a thickness of 10 μm is placed.
m carbon contacts 17 are laminated and formed.

With this, the carbon contact 1 is connected to the conductive pattern 3.
It will be laminated on top of the insulating layer 15 formed on d.

Therefore, when the switch (FIG. 1(b)) 5 disposed at the top of the switch section 6 is pressed, the carbon ring 18 formed at the bottom of the switch 5 comes into contact with both carbon contacts 7. Therefore, conduction is established between the conductive patterns 3c, and the switch 5 is turned on.

Such a configuration provides the following effects.

That is, in the electronic circuit board of this embodiment, another conductive pattern 3d is formed below the switch section 6 with an insulating layer 15 interposed therebetween. Therefore, since the conductive pattern 3 can be arranged closely on the base film 2, the electronic circuit board 1 can be formed compactly, and the degree of freedom in arranging the conductive pattern 3 can be increased.

In other words, since it is not necessary to form the conductive pattern 3 by removing the switch part 6, there is an advantage that the switch parts 6 can be arranged close to each other, and there is also less restriction on the shape of the electronic circuit board 1, and other This has the remarkable effect of increasing the degree of freedom in the position of the connector section on the board and the position of holes for coupling with other parts.

Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments in any way, and it goes without saying that it can be implemented in various forms without departing from the gist of the present invention.

For example, it goes without saying that the present invention can be applied to hard substrates in addition to the flexible base film 2, and various materials other than those mentioned above can be used for the conductive pattern 3 and the insulating layer 10.15.

[Effects of the Invention] As detailed above, in the electronic circuit board of the present invention, the switch portion made of a conductive pattern is laminated on top of another conductive pattern via an insulating pattern.
Increased freedom to form conductive patterns on the base,
A more highly functional electronic circuit board can be formed. In addition, there is an additional advantage that the electronic circuit board can be made more compact.

[Brief explanation of drawings]

FIG. 1(a) is a plan view showing the switch section of the embodiment of the present invention, FIG. 1(b) is a sectional view taken along line B-8, FIG. 2 is a plan view showing the base film, and FIG. ) is a plan view showing the insulation intersection, FIG. 3(b) is a sectional view taken along the line A-A, FIG. 4 is an explanatory diagram showing the manufacturing procedure of the switch section, and FIG. The plan view shown in FIG. 5(b) is that P-
It is a P sectional view. 1...Base film 3, 3a, 3b, 3c, 3d--...Conductive pattern 10
．． 15... Insulating layer 12... Carbon jumper] 7... Carbon contact

Claims (1)

[Claims] 1. An electronic circuit board in which a conductive pattern and an insulating pattern are formed on a base, and a switch part is formed by arranging a plurality of conductive patterns among the conductive patterns in close proximity, and the electronic circuit board is made of the conductive pattern. An electronic circuit board characterized in that a switch section is laminated on top of another conductive pattern via the insulating pattern.