JPH03217093A - Method and apparatus for mounting ic component - Google Patents

Abstract

PURPOSE:To efficiently mount an IC component on a circuit board with high reliability by cutting separately the component formed integrally with a carrier film, mounting it directly on the board, and bonding its leads to the electrode of the board by laser heating as it is. CONSTITUTION:A carrier film 1 is held between a punch 14 and a mounting nozzle 15, the punch 14 is driven upward as by an arrow B from this state, and an IC component 2 is separately cut while holding it at the nozzle 15. Thereafter, the nozzle 15 is raised as by arrow C, driven toward a board 3 as by an arrow E, positioned at a position directly above the IC mounting position, the nozzle 15 is moved down as by an arrow, the component 2 is mounted on the board 3, and pressurized to be fixed as it is. Then, a laser light is emitted to the leads 11 of the components 2 through the opening 19 of the nozzle 15 to thermally melt a solder on the electrode formed on the board 3, and at the lead 11 sequentially connected to the electrode.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an IC component mounting method and apparatus for mounting an IC component integrally formed on a carrier film onto a circuit board.

2. Description of the Related Art Conventionally, when an IC component is mounted on a circuit board, the leads 51 protruding from the null body 50a of the IC component 50 may be bent or broken, as shown in FIG. In order to prevent this, the IC component 50 is positioned and held in a tray, and this tray is supplied to a component mounting device, and the IC component 50 in the tray is moved to a mounting head 52 as shown in FIG.
It was held at a predetermined position on the circuit board 53.

At this time, an adhesive 54 for temporary fixing was applied in advance to the IC component mounting position on the circuit board 53, and cream solder 56 was applied to the electrode 55 to which the lead was to be connected.

After mounting the IC components, the circuit board 53 is inserted into a reflow oven to melt the cream solder 56 and perform solder bonding.

In addition, in recent years, in order to streamline the manufacturing process of IC parts,
After mounting the IC chip on the carrier film with the inner leads and outer leads formed and bonding the bumps of the IC chip and the inner leads, the IC chip and inner leads are sealed with resin while being held by the carrier film, and the main body is sealed. A manufacturing method has been proposed in which the IC component is separated from the carrier film by cutting at the tip of the outer lead, but IC components manufactured in this way are also attached to the circuit board as described above. It was implemented.

Problems to be Solved by the Invention However, the above-mentioned mounting method requires a large number of steps from mounting the IC component on the circuit board to soldering the leads to the electrodes, which is inefficient and makes it difficult to assemble the IC component. There is a possibility that the leads may be bent or broken when being accommodated in the tray, conveying the tray, or being taken out from the tray, and there is a possibility that a bonding failure may occur.

3 In view of the above-mentioned conventional problems, it is an object of the present invention to provide an IC component mounting method and apparatus for efficiently mounting an IC component on a circuit board using an IC component integrally formed on a carrier film.

Means for Solving the Problems In the IC mounting method of the present invention, an IC component integrally formed on a carrier film is cut and separated from the carrier film while being held by a mounting head, and the IC component is connected to a circuit by the mounting head. It is characterized in that it is attached to a board and fixed by pressing as it is, and in that state it is heated with laser light to join the leads of the IC component to the electrodes of the circuit board.

Further, the IC mounting apparatus of the present invention includes a cutting means for separating and cutting IC components from a carrier film integrally formed with the IC components, a mounting head capable of holding an RC component, and a circuit board on which the IC components are mounted. A positioning means, a position for holding an IC component to be cut by a cutting means, and an IC on a circuit board.
The present invention is characterized by comprising a moving means for moving the mounting head to and from the mounting position of the component, and a laser beam irradiation means for joining the leads of the IC component at the mounting position and the electrodes of the circuit board 4.

Operation According to the mounting method 6 of the present invention, an IC component integrally formed on a carrier film is cut and separated and directly mounted on a circuit board, and the leads are directly joined to electrodes of the circuit board by laser heating. Therefore, IC components can be efficiently mounted on a circuit board in a series of steps. In addition, when the IC parts are cut and separated from the carrier film, they are held by the mounting head, mounted on the circuit board as they are, and are further pressed and fixed in the mounted state for laser bonding.
Highly reliable bonding is achieved without deformation of the leads or misalignment after mounting the IC components.

Further, according to the mounting apparatus of the present invention, the above-mentioned mounting method can be carried out by a single apparatus having a configuration similar to a commonly used component mounting apparatus.

Embodiment Below, an IC component mounting apparatus according to an embodiment of the present invention is shown in FIGS.
This will be explained with reference to FIG.

In FIG. 2, a board conveying means 5 for conveying a printed circuit board (hereinafter referred to as a board) 3 and positioning it at a predetermined position is provided on the front part of the upper surface of the main body 4, and a carrier film 1 is provided on the rear part.
Cutting means 6 for separating and cutting the IC components 2 from each other are provided. A mounting head 7 capable of holding the IC component 2 is placed between the cutting means 6 and the substrate conveying means 5.
An XY robot 8 is disposed to move the substrate 2 between the substrate 2 and an arbitrary position on the substrate 2. Furthermore, a supply means 9 is disposed at the rear of the main body 4 for supplying the carrier film 1 on which the IC component 2 is integrally formed to the cutting means 6.

As shown in FIG. 3, the carrier film 1 is integrally formed with six mucosa JC parts 2 at appropriate intervals in its longitudinal direction, and feed holes 1o are formed on both sides. An inner lead and an outer lead are formed in advance on the carrier film 1. An IC chip is mounted on the carrier film, the hump and the inner lead are joined, and the carrier film 1, the IC chip, and the inner lead are integrally molded with resin. By sealing, a blank body 2a of the IC component 2 is formed, and leads (outer leads) protrude in all directions from the wooden body 2a.
11 is formed. Note that the carrier film 1 is notched at the lead 11 portion.

As shown in FIG. 4, the cutting means 6 includes a guide member 12 that guides and supports the supplied carrier film l, a die 13 for punching the film fixedly disposed above the guide member 12, and a die formed on the guide member 12. The punch 14 is arranged to be movable up and down along the raised and lowered guide hole 12a, and punches out the carrier film l between it and the mold 13. Further, the IC component holding portion of the mounting head 7 is composed of a suction nozzle 15 formed with a suction hole 16 at the axial center position and biased to protrude by a spring 17, and the lower end of the suction nozzle 15 The portion 15a is formed to have the same planar shape as the punch 14, and has a recess 18 into which the main body 2a of the IC component 2 is fitted.
It is configured to cut between the metal mold 13 and the mold 13 by the rising 7- of the metal mold 4. Further, as shown in FIG. 5, an opening 19 is formed in a portion of the four circumferential portions of the tip portion 15a of the suction nozzle 15 that faces the lead 11 portion of the IC component 2. As shown in FIG. Furthermore, the plane dimensions of the die 13, the punch 14, and the tip 15a of the suction nozzle 15 are as shown in FIG. It is set to disconnect with the remaining state,
A narrow frame 2 in which the tip of the lead 11 is made of a carrier film.
They are reinforced while connected to each other at 0.

Next, the overall configuration of the mounting head will be explained with reference to FIG.

The movable part 8a of the X-Y robot 8 is provided with an elevating body 21 that is driven up and down by an elevating motor 22 and a feed screw mechanism 23. A mounting shaft 25 extends downward from this elevating body 21, and its lower end A suction nozzle 15 is attached to the holder so as to be able to move up and down and is biased downward by a kappa 17. The mounting shaft 25 is attached to the elevating body 21 so as to be rotatable about its axis, and is configured to be positionable at any rotational position by a rotational positioning motor 24. In addition, a suction passage 26 is formed in the mounting shaft 25 and communicates with the suction hole 16 of the suction nozzle l5, and a swivel joint 27 is provided at the upper part of the mounting shaft 25.
It is connected to a suction source (not shown) via.

Further, a bracket 28 is fixed to the movable portion 8a, and is provided with a through-cylindrical portion 29 through which the mounting shaft 25 concentrically passes. A pulley IJ3 is rotatably attached to the through cylinder portion 29 via a bearing 30.
1 is attached, and a rotary frame 32 is fixed to this pulley 31. The pulley 31 is configured to be rotatably driven by a rotation motor 33 fixed to the bracket 28 via a drive pulley 34 and a toothed belt 35. In the rotating frame 32,
A moving body 37 is attached to be capable of linear movement via a slide bearing 36, and a moving motor 38 is fixed to the rotating frame 32.
It is configured to be able to be driven by a rack and pinion mechanism 39. The moving body 37 has a mounting shaft 2 in a direction perpendicular to the moving direction.
A pair of spacing adjusting bodies 40a, 40b that can move toward and away from each other around the axis of the suction nozzle 15 are attached to the spacing adjusting bodies 40a, 40b. The lead 11 of the IC component 2 is held on the board 3 and mounted on the board 3
A laser beam irradiation means 41 is attached to irradiate the laser beam. The spacing adjusters 40a and 40b are space adjusters that rotatably drive the feed screw mechanism 43 and the feed screw shaft 42, which are provided with feed screw shafts 42 formed with opposite threads on the left and right sides about the axial center position of the mounting shaft 25. They are driven synchronously by a moder 44. Further, a suction means 45 is disposed near the laser beam irradiation means 41 for sucking and discharging flux smoke generated during joining by irradiating the laser beam.

Next, the mounting operation of IC components will be explained.

When the carrier film 1 is supplied to the cutting means 6 by the supply means 9 and the portion corresponding to the IC component is positioned on the punch 14, the punch 14 rises to a position close to the lower surface of the mold 13 and stops. At the same time, the mounting head 7 is positioned directly above the cutting means 6, the elevating body 2l is driven downward by the elevating motor 22, the mounting shaft 25 descends as shown by arrow A in FIG. 4, and the suction nozzle 15 stops at a position where it has retracted by a predetermined amount against the biasing force of the spring 17. At this time, the carrier film l is supported between the punch 14 and the mounting nozzle I5. From this state, the punch 14 is driven upward as shown by arrow B in FIG. 4, and as shown in FIG.
The carrier film 1 is cut between the punch 14 and the mold 13, and the IC part crystal 2 in the state shown in FIG. 6 is separated and cut while being held by the suction nozzle 15. Thereafter, the lifting motor 22 is driven in the opposite direction, and the lifting body 21
, the suction nozzle 15 is connected via the mounting shaft 25 as shown by arrow C in FIG.
The punch 14 moves upward as shown by arrow D, and then descends as shown by arrow D toward the next cutting operation.

Next, the mounting head 7 is moved and driven by the XY robot 8 toward the substrate 3 as shown by arrow E, and is positioned directly above the IC component mounting position.

Next, the elevating body 21 is driven downward by the elevating motor 22, and the suction nozzle 15 is lowered via the mounting shaft 25 as shown by arrow F in FIG. Once installed, the suction nozzle 15 descends to a position where it has retracted by a predetermined amount against the urging force of the spring 17 and stops, so that the Ic component 2 is pressurized at the installed position by the urging force of the spring 17. Fixed. Incidentally, the mounting posture of the IC component 2 is adjusted by rotating the mounting shaft 25 by the rotary positioning moke 24 for eight circumferences.

Next, while irradiating the leads 11 of the IC component 2 with a laser beam from the laser beam irradiation means 41 through the opening 19 of the suction nozzle 15, the movable body 37 is moved to scan along two mutually parallel sides of the IC component 2. , the solder on the electrodes formed on the substrate 3 corresponding to each lead 11 is heated and melted, and the leads 11 and the electrodes are successively joined. 1 of this moving body 37
The two parallel sides of the IC component 2 are joined at once by the two movements, and then the rotary frame 32 is moved by the rotary frame motor 33.
After rotating by 90 degrees, each 12 lead 11 on two adjacent sides is also bonded to each electrode of the substrate 3 by scanning with the movable body 37 while irradiating the laser beam with the laser beam irradiation means 41. Ru. thus,
All the leads 11 of the IC components 2 are bonded, and the mounting of the IC components 2 on the predetermined positions of the substrate 3 is completed, and the following operations are repeated to sequentially mount the IC components 2.

Effects of the Invention According to the IC component mounting method of the present invention, an IC component integrally formed on a carrier film is cut and separated and directly mounted on a circuit board, and the leads are directly attached to the electrodes of the circuit board by laser heating. Since the IC components on the carrier film can be mounted on the circuit board in a series of steps, the IC components are held by the mounting head when they are cut and separated from the carrier film, and are mounted on the circuit board as they are. Furthermore, since the leads are laser-bonded by pressing and fixing them while they are still attached, there is no possibility of deformation of the leads during transport of the IC parts, misalignment during temporary fixing of the IC parts with adhesive, or subsequent transport into the glue flow furnace. Therefore, it is possible to mount IC components on a circuit board efficiently and with high reliability.

Moreover, according to the mounting apparatus of the present invention, a relatively simple unit mounting apparatus is provided with a cutting device for separating and cutting IC components from a carrier film instead of a component supply section in a technically established and well-known component mounting apparatus. The above-mentioned mounting method can be implemented using the above-mentioned device.

[Brief explanation of drawings]

FIG. 1 is a vertical cross-sectional view showing the process of mounting an IC component in an embodiment of the present invention, FIG. 2 is a perspective view showing the overall schematic configuration of the IC component mounting apparatus, and FIG. 3 is a diagram showing the process of mounting an IC component. A perspective view of the carrier film, FIG. 4 is a longitudinal sectional view of the process of separating and cutting IC components from the carrier film, FIG. 5 is a perspective view of the nozzle tip of the mounting head, and FIG. FIG. 7 is a vertical sectional view of the mounting head, FIG. 8 is a front view showing the conventional mounting process of the IC component, and FIG. 9 is a perspective view of the IC component. Carrier film IC component board Board transportation means Cutting means mounting Hesode X-Y robot 1 lead.

Claims (2)

[Claims] (1) The IC component integrally formed on the carrier film is cut and separated from the carrier film while being held by the mounting head, and the IC component is mounted on the circuit board by the mounting head and fixed by pressing as it is, in that state. An IC component mounting method characterized by joining leads of an IC component to electrodes of a circuit board by heating with a laser beam. (2) A cutting means for separating and cutting IC components from a carrier film integrally formed with the IC components, a mounting head capable of holding the IC components, a means for positioning a circuit board on which the IC components are mounted, and a cutting means. a moving means for moving a mounting head between a position for holding an IC component to be cut by cutting and a mounting position for the IC component on a circuit board; and a laser for joining the lead of the IC component at the mounting position and the electrode of the circuit board. An IC component mounting apparatus comprising: a light irradiation means.