JPH03217099A - Coating and inspecting method for adhesive - Google Patents
Coating and inspecting method for adhesiveInfo
- Publication number
- JPH03217099A JPH03217099A JP2012954A JP1295490A JPH03217099A JP H03217099 A JPH03217099 A JP H03217099A JP 2012954 A JP2012954 A JP 2012954A JP 1295490 A JP1295490 A JP 1295490A JP H03217099 A JPH03217099 A JP H03217099A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- coating
- window
- application
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は装着された電子部品を仮固定するための接着剤
を回路基板に塗布する場合等に利用される接着剤塗布検
査方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an adhesive application inspection method used when applying an adhesive to a circuit board for temporarily fixing mounted electronic components.
従来の技術
電子部品を回路基板に実装する過程で、電子部品を回路
基板上に装着するのに先立って、電子部品を半田等で本
固定するまでの間仮固定するための接着剤を回路基板に
塗布する工程がある。Conventional TechnologyIn the process of mounting electronic components on a circuit board, prior to mounting the electronic components on the circuit board, an adhesive is applied to the circuit board to temporarily fix the electronic components until they are permanently fixed with solder, etc. There is a process of applying it.
通常この接着剤の塗布においては、接着剤を収容した塗
布ノズルの上部空間に高圧気体を導入して接着剤を吐出
するように構成した接着剤塗布装置が用いられ、所定位
置に位置決めした回路基板上に塗布ノズルから所定量の
接着剤を吐出させて塗布している。Normally, when applying this adhesive, an adhesive applicator is used, which is configured to introduce high-pressure gas into the upper space of the application nozzle containing the adhesive and discharge the adhesive. A predetermined amount of adhesive is applied onto the surface by discharging it from a coating nozzle.
ところで、この接着剤の塗布が適正に行われずに糸引き
を注した場合や位置ずれして塗布された場合には、接着
剤が回路基板の電極部上に付着して接合不良を生じてし
まう等の問題を生じることになる。By the way, if this adhesive is not applied properly and stringy or misaligned, the adhesive will adhere to the electrodes of the circuit board, resulting in poor bonding. This will cause problems such as:
そこで、従来は接着剤塗布位置を順次テレビカメラで撮
像してモニターテレビに表示し、糸引きや位置ずれがあ
るか否かを作業者が目視によって検査を行っていた。Therefore, in the past, images of the adhesive application positions were sequentially taken with a television camera and displayed on a monitor television, and an operator visually inspected the adhesive application positions to see if there was any stringiness or positional deviation.
発明が解決しようとする課題
ところが、上記のように目視にて検査を行っていたので
は時間がかかって能率が極めて悪いという問題があった
。又、そのために頻繁に検査を行うことはできず、その
一方で糸引きは外気や塗布ノズル内の接着剤の温度変化
、ノズル先端の汚れ、残留接着剤等の様々な要因で発生
するため、接着剤塗布の信顛性を向上するのが困難であ
るという問題があった。However, the problem that the invention aims to solve is that the visual inspection as described above takes time and is extremely inefficient. In addition, frequent inspections are not possible, and on the other hand, stringiness can occur due to various factors such as outside air, temperature changes in the adhesive inside the application nozzle, dirt on the tip of the nozzle, and residual adhesive. There is a problem in that it is difficult to improve the reliability of adhesive application.
尚、接着剤塗布位置の認識画像を画像処理して接着剤の
塗布状態を検査することも考えられるが、画像データの
処理によって塗布された接着剤の面積を演算することは
比較的容易であるが、その形状が適正か糸引きしている
かを認識するのは極めて困難である。Although it is possible to inspect the adhesive application state by image processing the recognized image of the adhesive application position, it is relatively easy to calculate the area of the applied adhesive by processing the image data. However, it is extremely difficult to recognize whether the shape is appropriate or stringy.
本発明は上記従来の問題点に鑑み、塗布された接着剤の
問題となる糸引きや位置ずれを自動的に検査して信頼性
の高い接着剤塗布を実現できる接着剤塗布検査方法を提
供することを目的とする。In view of the above-mentioned conventional problems, the present invention provides an adhesive application inspection method that can realize highly reliable adhesive application by automatically inspecting the applied adhesive for problems such as stringiness and misalignment. The purpose is to
課題を解決するための手段
本発明は、上記目的を達成するため、基板上の接着剤塗
布位置に塗布ノズルにて接着剤を塗布し、所定位置にウ
ィンドウを有する画像認識手段にて塗布位置を認識し、
塗布された接着剤の形状がウィンドウからはみ出してい
るか否かによって塗布3
状態の良否を判定することを特徴とする。Means for Solving the Problems In order to achieve the above object, the present invention applies adhesive to an adhesive application position on a substrate using a coating nozzle, and detects the application position using an image recognition means having a window at a predetermined position. Recognized,
The present invention is characterized in that the quality of the applied adhesive is judged based on whether or not the shape of the applied adhesive protrudes from the window.
作用
本発明の上記構成によれば、塗布された接着剤の形状に
糸引きがあったり、塗布位置がずれたりしてウィンドウ
からはみ出すと、簡単な画像データ処理にてそれを自動
的に検出することができ、このウィンドウの設定を後工
程の接合等において問題となる糸引きや位置ずれを検出
できるように設定することによって信頼性の高い接着剤
塗布が可能となる。According to the above-described structure of the present invention, if the applied adhesive has stringiness or the application position is shifted and protrudes from the window, this is automatically detected by simple image data processing. By setting this window in such a way that it is possible to detect stringing and positional deviations that may cause problems during bonding in subsequent processes, highly reliable adhesive application is possible.
実施例
以下、本発明の一実施例を第1図、第2図を参照しなが
ら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.
まず、第2図により接着剤塗布装置の概略構成を説明す
ると、X方向とY方向の任意の位置に位置決め可能なX
−Yテーブル1が配設され、このX−Yテーブル1上の
所定位置に回路基板2を固定するように構成されている
。x−Yテーブル1の上方には、昇障可能な塗布ノズル
3と、塗布された接着剤の形状を画像認識するだめのテ
レビカ4
メラ4とをX方向に並べて設置した塗布ヘッド5が配設
されている。この塗布ヘッド5はこれら塗布ノズル3と
テレビカメラ4の配置方向、即ちX方向に移動可能に構
成されている。First, the schematic configuration of the adhesive applicator will be explained with reference to FIG. 2.
A -Y table 1 is provided, and a circuit board 2 is fixed at a predetermined position on this XY table 1. Above the X-Y table 1, there is disposed a coating head 5 in which a dispensing nozzle 3 that can be elevated and a television camera 4 for image recognition of the shape of the applied adhesive are arranged side by side in the X direction. has been done. The coating head 5 is configured to be movable in the direction in which the coating nozzles 3 and the television camera 4 are arranged, that is, in the X direction.
次に、回路基板2に対する接着剤の塗布工程を説明する
。Next, the process of applying adhesive to the circuit board 2 will be explained.
回路基板2が適宜搬送手段にてX−Yテーブル1上に搬
入されて所定位置に固定された後、X−Yテーブル1が
動作して接着剤塗布位置が塗布ノズル3の直下位置に位
置するように回路基板2が位置決めされる。回路基板2
が位置決めされると、塗布ノズル3が回路基板2の近傍
まで下降してその先端から接着剤が所定量吐出され、吐
出後塗布ノズル3が上昇することによって回路基板2上
に所定量の接着剤が塗布される。After the circuit board 2 is carried onto the X-Y table 1 by an appropriate conveyance means and fixed at a predetermined position, the X-Y table 1 is operated to position the adhesive application position directly below the application nozzle 3. The circuit board 2 is positioned as follows. circuit board 2
When the coating nozzle 3 is positioned, the coating nozzle 3 descends to the vicinity of the circuit board 2 and a predetermined amount of adhesive is discharged from its tip, and after discharging, the coating nozzle 3 rises to deposit a predetermined amount of adhesive onto the circuit board 2. is applied.
次に、塗布ヘッド5がX方向に移動し、テレビカメラ4
が塗布位置の直上に位置し、第1図に示すように、塗布
された接着剤7の形状が認識される。テレビカメラ4か
らの画像信号が入力される画像処理手段(図示せず)に
は、接着剤がその範囲をはみ出すと後工程に影響を与え
る領域を囲むようにウィンドウ6が設けられている。又
、これら塗布された接着剤7及びウインドウ6の画像は
必要に応じて図示しないモニターテレビにも表示される
。画像処理手段においては、塗布された接着剤7の画像
の外郭線が抽出され、ウインドウ6の外郭線と交差する
か否かの判定が行われる。Next, the coating head 5 moves in the X direction, and the television camera 4
is located directly above the application position, and as shown in FIG. 1, the shape of the applied adhesive 7 can be recognized. An image processing means (not shown) to which an image signal from the television camera 4 is input is provided with a window 6 so as to surround an area where if the adhesive exceeds the area, it will affect subsequent processes. Further, images of the applied adhesive 7 and the window 6 are also displayed on a monitor television (not shown) as necessary. In the image processing means, the outline of the image of the applied adhesive 7 is extracted, and it is determined whether it intersects with the outline of the window 6 or not.
すなわち、第1図(a)に示すように塗布された接着剤
7がウィンドウ6からはみ出していない時には適正な塗
布状態と判定される。一方、第1図(b)に示すように
塗布された接着剤7に糸引きが生してウィンドウ6から
はみ出している場合には外郭線同士が交差するのでこれ
によって糸引きが検出される。又、第1図(C)に示す
ように塗布位置がずれている場合にも同様に検出される
。That is, when the applied adhesive 7 does not protrude from the window 6 as shown in FIG. 1(a), it is determined that the applied state is proper. On the other hand, if the applied adhesive 7 is stringy and protrudes from the window 6 as shown in FIG. 1(b), the outline lines intersect with each other, so that the stringing is detected. Further, as shown in FIG. 1(C), even if the coating position is shifted, it is detected in the same way.
このようにして、塗布された接着剤7の形状をウィンド
ウ6を用いて検査し、その検査結果に基づいて以降の塗
布条件が調整される。In this way, the shape of the applied adhesive 7 is inspected using the window 6, and subsequent coating conditions are adjusted based on the inspection results.
この接着剤の塗布と検査は、各回路基板2に設けられた
テスト塗布領域に対してテスト塗布を行う時に行っても
よく、本塗布工程においてすべての塗布位置ムこ対して
、或いは一定の塗布回数毎に行ってもよい。This adhesive application and inspection may be performed when test application is performed on the test application area provided on each circuit board 2. In the main application process, the adhesive application and inspection may be performed on all application positions or on a fixed application area. You may do it every number of times.
上記実施例では、X−Yテーブル1上に単一の回路基板
2を位置決め固定し、X方向に移動可能な塗布ヘッド5
にX方向に塗布ノズル3とテレヒカメラ4を並設し、各
塗布毎に、又は各回路基板毎に、又は所定の塗布回数毎
に塗布ヘッド5を移動させてテレビカメラ4にて塗布さ
れた接着剤7の形状を検査するように構成したが、塗布
箇所の全数検査を行う場合には、生産性が低《なる。In the above embodiment, a single circuit board 2 is positioned and fixed on an X-Y table 1, and a coating head 5 movable in the X direction
A coating nozzle 3 and a television camera 4 are arranged side by side in the X direction, and the coating head 5 is moved for each coating, each circuit board, or a predetermined number of coatings, and the adhesive is coated with the television camera 4. Although the configuration is such that the shape of the agent 7 is inspected, the productivity will be low if all coating locations are inspected.
そこで、全数検査を行う場合には、第3図に示すように
、複数の回路基板2をそれぞれ所定位置に位置決め固定
できるX−Yテーブル11を設け、各回路基板2、2上
の対応した位置の上方に塗布ノズル3とテレビカメラ4
をそれぞれ固定して配設し、一方の回路基板2に対して
塗布ノズル3にて接着剤を塗布すると同時に、他方の回
路基板2上に塗布された接着剤の形状をテレビカメラ4
にて認識してその検査を行うように構成するとよい。Therefore, when performing a 100% inspection, as shown in FIG. Above the coating nozzle 3 and TV camera 4
are respectively fixed and arranged, and at the same time, the adhesive is applied to one circuit board 2 with the application nozzle 3, and at the same time, the shape of the adhesive applied on the other circuit board 2 is observed with the television camera 4.
It is preferable to configure the system so that it is recognized and inspected.
7
このようにすると、接着剤の塗布とその全数検査を生産
性良く行うことができる。7 In this way, adhesive application and 100% inspection can be performed with high productivity.
さらに、接着剤の塗布装置と、テレビカメラとウィンド
ウを有する画像処理手段を設けた検査装置とを別に設け
て、検査結果を塗布装置にフィードハックするようにし
てもよい。Furthermore, an adhesive application device and an inspection device provided with an image processing means having a television camera and a window may be provided separately, and the inspection results may be fed back to the application device.
発明の効果
本発明によれば、塗布された接着剤の形状がウィンドウ
からはみ出すと、簡単な画像データ処理にてそれを自動
的に検出することができ、ウィンドウを適当に設定する
ことによって後工程において問題となるような糸引きや
位置ずれを確実にかつ自動的に検出することができ、不
良塗布の目視検査が不要になるとともに検査洩れによる
不良塗布の発生も防止され、信顛性の高い接着剤塗布が
可能となる。Effects of the Invention According to the present invention, if the shape of the applied adhesive protrudes from the window, it can be automatically detected by simple image data processing, and by setting the window appropriately, it can be detected in the subsequent process. It is possible to reliably and automatically detect stringing and positional misalignment, which can cause problems in the process, eliminating the need for visual inspection of defective coatings and preventing the occurrence of defective coatings due to omissions in inspections, resulting in highly reliable coatings. Adhesive application becomes possible.
第1図及び第2図は本発明の一実施例を示し、第1図(
a)、(b)、(C)は塗布された接着剤とウィンドウ
の位置関係の説明図、第2図は接着剤塗布装置8
の概略構成を示す正面図、第3図は本発明の他の実施例
における接着剤塗布装置の概略構成を示す正面図である
。
回路基板
塗布ノズル
テレビカメラ
ウインドウ
塗布された接着剤。1 and 2 show an embodiment of the present invention, and FIG. 1 (
a), (b), and (C) are explanatory diagrams of the positional relationship between the applied adhesive and the window, FIG. 2 is a front view showing the schematic configuration of the adhesive coating device 8, and FIG. FIG. 2 is a front view showing a schematic configuration of an adhesive coating device in an embodiment of the present invention. Circuit board application nozzle TV camera window applied adhesive.
Claims (1)
布し、所定位置にウィンドウを有する画像認識手段にて
塗布位置を認識し、塗布された接着剤の形状がウィンド
ウからはみ出しているか否かによって塗布状態の良否を
判定することを特徴とする接着剤塗布検査方法。Adhesive is applied to the adhesive application position on the substrate using a coating nozzle, and the application position is recognized by an image recognition means having a window at a predetermined position, and whether the shape of the applied adhesive protrudes from the window or not is determined. An adhesive application inspection method characterized by determining whether the application state is good or bad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012954A JP2807019B2 (en) | 1990-01-22 | 1990-01-22 | Adhesive application inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012954A JP2807019B2 (en) | 1990-01-22 | 1990-01-22 | Adhesive application inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03217099A true JPH03217099A (en) | 1991-09-24 |
| JP2807019B2 JP2807019B2 (en) | 1998-09-30 |
Family
ID=11819668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012954A Expired - Fee Related JP2807019B2 (en) | 1990-01-22 | 1990-01-22 | Adhesive application inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2807019B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315796A (en) * | 1992-05-12 | 1993-11-26 | Sanyo Electric Co Ltd | Parts assembling method |
| JPH0623308A (en) * | 1992-07-10 | 1994-02-01 | Sanyo Electric Co Ltd | Coating device |
| JPH07147480A (en) * | 1993-11-24 | 1995-06-06 | Hitachi Ltd | Adhesive coating method, its apparatus, and component mounting method |
| JP2002190670A (en) * | 2000-12-22 | 2002-07-05 | Yamaha Motor Co Ltd | Composite device in component mounting system |
| KR101015593B1 (en) * | 2008-10-23 | 2011-02-17 | 세크론 주식회사 | Adhesive inspection method |
| JP2019047067A (en) * | 2017-09-06 | 2019-03-22 | ヤマハ発動機株式会社 | Substrate work apparatus |
-
1990
- 1990-01-22 JP JP2012954A patent/JP2807019B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315796A (en) * | 1992-05-12 | 1993-11-26 | Sanyo Electric Co Ltd | Parts assembling method |
| JPH0623308A (en) * | 1992-07-10 | 1994-02-01 | Sanyo Electric Co Ltd | Coating device |
| JPH07147480A (en) * | 1993-11-24 | 1995-06-06 | Hitachi Ltd | Adhesive coating method, its apparatus, and component mounting method |
| JP2002190670A (en) * | 2000-12-22 | 2002-07-05 | Yamaha Motor Co Ltd | Composite device in component mounting system |
| KR101015593B1 (en) * | 2008-10-23 | 2011-02-17 | 세크론 주식회사 | Adhesive inspection method |
| JP2019047067A (en) * | 2017-09-06 | 2019-03-22 | ヤマハ発動機株式会社 | Substrate work apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2807019B2 (en) | 1998-09-30 |
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