JPH03217224A - Leak mechanism of vacuum vessel - Google Patents

Abstract

PURPOSE:To eliminate undersirable generation of turbulent flow, swirling-up flow, etc., by providing a gas flow control means to the gas introduction opening part of the gas introduction passage through which gas is introduced into a vacuum vessel and furnishing a gas flow passage and a flow velocity reduction means to the gas flow control means. CONSTITUTION:In the leak mechanism of a vacuum vessel 10 to introduce gas into the vessel 10 to break the vacuum in the vessel 10, the gas flow control means 22 is provided at the gas introduction opening part connected with the vessel 10 in the gas introduction passage 12 through which gas is introduced into the vessel 10. In the gas flow control means 22, the flow velocity reduction means consisting of bent parts 34, 36, 38, 40 is provided in the gas flow passage 24, and each enlarged sectional area part 42, 44, 46 is respectively disposed in the bent parts 36, 38, 40. As a result, undesirable turbulent flow or swirling-up flow is not generated, and resticking of contaminants to contents is prevented when vacuum is broken.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vacuum container used for storing wafers in a semiconductor manufacturing facility.
The present invention relates to a leakage mechanism of a vacuum container that introduces gas into the vacuum container in order to break the vacuum container.

[Prior Art] Conventionally, in order to break the vacuum in a vacuum container, a slow leak valve is installed in a pipe that introduces gas into the vacuum container, and the valve is operated to release air or non-liquid. This was done by slowly introducing active gas.

[Problems to be Solved by the Invention] However, such conventional methods were insufficient to prevent contamination. In other words, contamination of the contents such as wafers stored in the vacuum container must be prevented as much as possible, but with conventional technology, the gas flow introduced into the vacuum container is not sufficiently controlled. Alternatively, turbulence occurs when an inert gas is introduced. This turbulence causes contaminants within the container to fly up and re-adhere to the contents. Further, there is a problem in that contaminants that have adhered to the inner wall of the vacuum container are peeled off when air or inert gas is introduced and re-adhered to the contents.

When the contents are wafers, for example, if the re-deposition of contaminants as described above occurs, the yield of semiconductor chips, which are final products, will deteriorate, leading to an increase in manufacturing costs.

The present invention was proposed in view of the problems of the prior art described above, and aims to provide a leakage mechanism for a vacuum container that prevents contaminants from re-adhering to the contents when the vacuum is broken. There is.

[Means for Solving the Problems] The vacuum container leak mechanism of the present invention introduces gas into the vacuum container to break the vacuum inside the vacuum container. A gas flow control means is provided at an inlet portion where the gas introduction flow path connects with the vacuum container, and the gas flow control means includes a flow path through which the gas flows and a flow rate reduction means provided inside the flow path. I'm here.

In carrying out the present invention, if the gas introduced into the vacuum container is air, a fine-mesh filter is provided on the air inlet side of the gas introduction channel to prevent contamination by particles from the outside. It is preferable to do so.

Furthermore, it is also possible to provide an automatic connection mechanism such as a quick coupling on the upstream side of the gas flow control means to make the vacuum container movable.

Further, as the flow rate reducing means, a bent portion or an enlarged diameter portion formed in a gas flow path within the gas flow control means, a porous body installed in the flow path, etc. are preferable.

[Function] According to the present invention having the configuration described above, when clean air or inert gas (N2, Ar, etc.) is introduced into the vacuum container to break the vacuum, The airflow is subjected to diameter expansion, collision, flow path resistance, etc. by the flow velocity reduction means provided inside the gas flow control means, and the airflow is controlled to a low velocity, thereby preventing unnecessary turbulence from occurring. As a result, contaminants inside the container may fly up and re-adhere to the contents, or contaminants that have adhered to the inner wall of the vacuum container may peel off and re-adhere to the contents when air or inert gas is introduced. This will prevent you from doing so.

Therefore, when the contents stored in the vacuum container are wafers, the yield of the final product, the semiconductor chip, is improved and the cost is reduced.

[Example] Hereinafter, an example of the present invention will be described with reference to the attached drawings.

In FIG. 1, reference numeral 10 indicates a vacuum container, and a gas introduction channel 12 is connected to the vacuum container.

In this gas introduction channel l2, an air introduction channel 16 and an inert gas introduction channel 18 merge at a merging portion 14. An air filter 20 is provided at the end of the air introduction channel 16. On the other hand, the end of the inert gas introduction channel 18 is connected to a storage section (not shown) of clean inert gas such as N2 or Ar.

Note that the end of the inert gas introduction channel 18 may be connected to a clean air source (not shown).

At the point where the vacuum container 10 and the gas introduction channel 12 are connected, there is a gas flow control means 22 whose details are shown in FIGS. 2 and 3.
is provided. In addition, in FIG. 1, the symbols 23, 2
6 and 28 are open/close valves, 30 is a leak valve, and 32 is a vacuum pump system.

In FIGS. 2 and 3, the gas flow control means 22 connected to the gas introduction flow path 12 is composed of a flow path 24 through which gas flows, and the flow path 24 has bent portions 34 and 36 as flow velocity reducing means. , 38, and 40. Further, each of the bent portions 36, 38, and 40 is used as a boundary, and the pipe diameter on the downstream side of the flow path 24 is larger than that on the upstream side. In other words,
Refracting Portions Each of the refracting portions 36, 38, 40 constitutes an enlarged diameter portion 42, 44, 46, respectively. The flow path 24 forms a flow path as shown by a dotted line 24t.

In the embodiments of FIGS. 1, 2, and 3, the vacuum vessel 1
When using air to break the zero vacuum, it is sufficient to open the valve 26, close the valve 28, open the valve 23, and set the leak valve 30 to a predetermined opening degree. The introduced air is purified by the air filter 20 and passes through the gas introduction channel 12 .

On the other hand, when using a purified inert gas such as Ar or N2, the valve 26 is closed and the valve 28 is opened. In this case, a filter is not required since the gas introduced is already purified.

The gas that has passed through the gas introduction channel 12 is transferred to the gas flow control means 2.
2 into the vacuum vessel 10.

Here, the gas is indicated by the arrow 1 in FIGS. 2 and 3. is introduced into the gas flow control means 22 as indicated by the arrow OU.
The bent portions 34, 36, 38 of the flow path 24 within the gas flow control means 22 are guided into the vacuum vessel 10 as shown at T.
, 40 and the enlarged-diameter portions 42, 44, and 46, the flow is very slow when it reaches the vacuum vessel 10. Therefore, no turbulent flow is generated within the vacuum container 10, and no contaminants are thrown up or peeled off from the inner wall of the vacuum container 10. Therefore, contaminants are prevented from recontaminating the contents (wafers, etc.) of the vacuum container 10.

FIG. 4 shows another embodiment of the gas flow control means 22, in which a porous body 50 is provided in the flow path 24 as a flow rate reducing means. This porous body 50 further decelerates the gas passing through the flow path 24.

In the embodiment shown in FIG. 5, the vacuum container 60 is made detachable and movable, and quick couplings 62, 64 are installed as an automatic connection mechanism immediately upstream of the gas flow control means 22 and the vacuum pump system 32. are provided for each. When moving the vacuum container 60, it is sufficient to separate the quick couplings 62 and 64, respectively.

[Effect of the invention] The effects of the present invention are listed below.

(1) Clean air or inert gas (N2, Ar, etc.) introduced into the vacuum container to break the vacuum is expanded, collided, and blocked by the flow velocity reduction means provided inside the gas flow control means. The airflow is controlled by the resistance and does not cause unnecessary turbulence or winding up.

(2) Contaminants are prevented from re-adhering to the contents when air or inert gas is introduced into the container.

(3) Contents (wafers) stored in the vacuum container
The yield of final products (for example, semiconductor chips) manufactured from these materials is improved and costs are reduced.

(4) The vacuum container can be detached and moved.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing an embodiment of the present invention, FIG. 2 is a front sectional view of the gas flow control means used in the embodiment of FIG. 1, and FIG. 3 is a view taken along the X arrow in FIG. FIG. 4 is a front sectional view showing another embodiment of the gas flow control means, and FIG. 5 is a block diagram showing another embodiment of the present invention. 10... Vacuum container 12... Gas introduction channel 2
2... Gas flow control means 24... Channel of gas flow control means 34, 36, 38, 40... Bent portion 42
, 44, 46... Expanded diameter portion 50... Porous body 6
2, 64... Automatic connection mechanism Fig. 1 Fig. 2 Fig. 6

Claims (1)

[Claims] In a vacuum container leak mechanism that introduces gas into the vacuum container in order to break the vacuum inside the vacuum container, a gas introduction channel that introduces gas into the vacuum container has a gas flow at an inlet portion that connects with the vacuum container. 1. A leak mechanism for a vacuum container, comprising a control means, the gas flow control means including a flow path through which gas flows and a flow rate reduction means provided inside the flow path.