JPH03218041A - Mounting method of semiconductor element - Google Patents

Abstract

PURPOSE:To realize precise alignment and mounting by electrically connecting bump electrodes, and relatively moving a semiconductor element and a board while monitoring electric continuity between corresponding electrode terminals on the mounting board surface. CONSTITUTION:At least a pair of bump electrodes 2 of a semiconductor element 1 is electrically connected by using a metal wire 3. It is monitor with an ammeter 7 checking whether electric continuity between at least a pair of electrode terminals 5 on a mounting board 4 is obtained. The element 1 and the board 4 are relatively moved while the monitoring is continued. Even if deformation like cutout exists, the bump electrodes of the semiconductor element are precisely aligned for the electrode terminals of the mounting board and mounting is enabled by the electric continuity detection based on the above monitoring.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor device in which bump electrodes protruding from the surface of a semiconductor device such as an IC chip are directly connected to electrode terminals on a mounting board (face-down bonding). The present invention relates to a method for mounting a product on a mounting board.

[Conventional technology]

When mounting a semiconductor element on a mounting board by directly connecting bump electrodes formed on the semiconductor element to electrode terminals on the mounting board, conventionally, the electrode terminals on the mounting board were connected using a TV camera or an image processing device. The bump electrodes on the semiconductor element were aligned and mounted at this position.

[Problem to be solved by the invention]

However, since the bump electrodes and electrode terminals are aligned while facing each other, it is not possible to actually observe the alignment. Instead, the outer shape of the semiconductor element is observed from the back side of the semiconductor element, and from this outer shape the bump electrodes are aligned. They were trying to guess the location. For this reason, if there is a deformation such as a chip in the outer shape of the semiconductor element, accurate alignment is difficult.

Therefore, in view of the above-mentioned circumstances, the present invention makes it possible to precisely align the bump electrodes on the semiconductor element with the electrode terminals on the mounting board and mount it even if the semiconductor element is deformed such as chipping. Our mission is to propose possible mounting methods for semiconductor devices.

[Means to solve the problem]

In order to achieve the above object, in the semiconductor device mounting method according to the present invention, at least one pair of bump electrodes on the semiconductor device are electrically connected to each other, and corresponding bump electrodes are formed on the surface of the mounting substrate. While monitoring whether or not the formed at least one pair of electrode terminals are electrically connected to each other, the bump electrodes are brought into contact with the surface of the mounting board and the semiconductor element is moved relative to the mounting board to ensure electrical continuity. The semiconductor element is positioned on the mounting board at a position where the electrode terminals being monitored are electrically connected to each other, and the semiconductor element is mounted on the mounting board.

[Effect]

By doing this, when the semiconductor element is aligned with the mounting board and the bump electrodes on the semiconductor element come into contact with the correspondingly formed electrode terminals, this contact causes an electrical connection between the electrode terminals. Detected as continuity.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 schematically shows how bump electrodes on a semiconductor element are aligned relative to electrode terminals on a mounting board according to the present invention. As shown in the figure, a plurality of protruding bump electrodes 2 are formed on the surface of the semiconductor element 1. At least one pair of bump electrodes 2 are electrically connected to each other by metal wiring 3 formed on the surface of semiconductor element 1. On the other hand, electrode terminals 5 are formed on the surface of the mounting substrate 4 on which the semiconductor element 1 is mounted, corresponding to the bump electrodes 2 on the semiconductor element 1.

As described above, the pair of electrode terminals 5 formed corresponding to the bump electrodes 2 that are electrically connected to each other are brought into contact with each other by contacting the electrode terminals 5 and the bump electrodes 2. Detecting means for detecting whether or not there is electrical continuity between the two is connected. As this detection means, in the illustrated embodiment, a DC power source 6 and an ammeter 7 are connected in series between the electrode terminals 5.

Next, a case will be described in which the bump electrodes 2 are directly connected to the electrode terminals 5 and the semiconductor element 1 is mounted on the mounting board 4. In the mounting method according to the present invention, first, the bump electrodes 2 of the semiconductor element 1 are brought into contact with the surface of the mounting board 4 on which the electrode terminals 5 are formed. Then, the semiconductor element 1 is slid relative to the mounting board 4 while monitoring whether or not the electrode terminals 5 are electrically connected to each other by the above-mentioned detection means. When a pair of bump electrodes 2 electrically connected to each other come into contact with a pair of electrode terminals 5 to which a detection means is connected, conduction is established between the electrode terminals 5 or through the bump electrodes 2 and the metal wiring 3. . These bump electrodes 2 and electrode terminals 5 are formed in correspondence with each other, so when the electrode terminals 5 are electrically connected to each other, all the bump electrodes 2 on the semiconductor element 1 are formed in correspondence with each other. This means that the electrode terminals 5 on the mounting board 4 are aligned with each other. Therefore, as shown in FIG. 2, when the semiconductor element 1 is aligned with the mounting board 4 and the conduction between the electrode terminals 5 is detected by the detection means, the sliding of the semiconductor element 1 with respect to the mounting board 4 is detected. The movement is stopped, and the semiconductor element 1 is positioned with respect to the mounting board 4 at that position. Thereafter, the mounting board 4 is heated, and the preliminary solder applied on the electrode terminals 5 is reflowed, so that the bump electrodes 2 on the semiconductor element 1 are directly connected to the electrode terminals 5 on the mounting board 4, and the semiconductor element 1 is mounted on the mounting board 4.

Note that the smaller the sizes of the bump electrodes 2 and the electrode terminals 5 formed corresponding to the bump electrodes 2 that are connected to each other, the more the alignment accuracy improves. Furthermore, by providing a plurality of pairs of bump electrodes 2 that are electrically connected to each other and separating these pairs from each other, conduction between the electrode terminals 5 formed corresponding to these pairs can be established as described above. By detecting in this manner, alignment accuracy is further improved.

The size of the bump electrodes 2 that are connected to each other is 10 μm in diameter.
, the diameter of the electrode terminal 5 correspondingly formed on the substrate is 10
μm, and the alignment accuracy when the present invention is applied is compared with the alignment accuracy using a conventional alignment device, as shown in the table below.

〔Effect of the invention〕

As explained above, according to the present invention, by detecting conduction between electrode terminals formed on a mounting board,
It is possible to check the alignment status between the bump electrodes on the semiconductor element and the electrode terminals on the mounting board, and even if the semiconductor element is deformed such as chipping, the bump electrodes on the semiconductor element can be aligned with the electrode terminals on the mounting board. It can be mounted with high precision alignment.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a semiconductor element and a mounting board that are relatively aligned according to the present invention, and FIG. 2 is a diagram showing the semiconductor element and a mounting board after the alignment is completed. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Bump electrode, 3... Metal wiring, 4... Mounting board, 5... Electrode terminal, 6...
・DC power supply, 7... ammeter.

Claims (1)

[Scope of Claims] A method for mounting the semiconductor element on the mounting substrate by directly connecting bump electrodes protruding from the surface of the semiconductor element to electrode terminals on the mounting substrate, the method comprising: at least one pair of bump electrodes on the semiconductor element; electrically connecting the bump electrodes to each other, and determining whether at least one pair of electrode terminals formed on the surface of the mounting board corresponding to the bump electrodes electrically connected to each other are electrically connected to each other. While monitoring, the semiconductor element is moved relative to the mounting board by bringing the bump electrode into contact with the surface of the mounting board, and at a position where the electrode terminals whose continuity is being monitored are mutually electrically connected. A method for mounting a semiconductor element, comprising: positioning the semiconductor element with respect to the mounting substrate; and mounting the semiconductor element on the mounting substrate.