JPH03218061A - Laser trimming device - Google Patents

Abstract

PURPOSE:To make possible a laser trimming at high speed and with high accuracy by a method wherein after a simple function instrumentation is performed, a high-function instrumentation is performed and a function trimming is performed. CONSTITUTION:An electric signal is fed to a circuit board 1 to be trimmed by a probe part 5. A first target is set in a setting reference part 7 and a circuit resister is laser cut by a laser 3 until the output of the circuit 1 to be measured reaches a set reference in a comparison part 8. Then, the electric signal is measured by an instrument 6, the measured value is read in a control part 4, is compared using a software in the interior of the part 4, then, a length to be laser cut is calculated on the basis of a measured result and a laser cut is performed. In such a way, after a single function instrumentation is performed, a high function instrumentation is performed and a function trimming is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a laser trimming device used in the manufacturing process of thick film hybrid ICs.

Prior art In recent years, laser trimming equipment has been developed using thick film hybrid I
As C has become more sophisticated and precise, its trimming precision and γf-freezing properties have declined.

An example of a conventional laser trimming device will be described below with reference to the drawings.

FIGS. 4 and 5 show the operating procedure of a conventional laser trimming device.

In Fig. 4, in the first step, the target value is set in the setting reference part 14, and in the second step, the value of the signal of the circuit under test and the set value are compared by +5L by an electronic circuit, and laser cutting is performed 16 until the target value is reached. conduct. In addition, in Figure 5, the first step is to measure the signal value of the circuit under test, compare it with the target value using software17, and if it does not meet the target value, calculate the length to be cut and perform laser cutting. Do 18.

Problems to be Solved by the Invention However, in the above-mentioned operation, the precision is poor because the trimming is performed toward a single preset target, and the trimming time is shortened when repeated measurements and cuts are made by a certain amount. The problem is that it costs a lot of money.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a laser trimming device for laser trimming a thick film hybrid IC at high speed and with high viscosity.

Means for Solving the Problems In order to achieve the above object, the present invention provides a laser cutting section that continuously laser cuts a circuit board to be trimmed to a first target set in advance in a setting reference section, and a circuit board that has been cut. The laser trimming device is equipped with a measurement section that measures the state of the laser beam, and a controller that calculates the cutting amount based on the measurement results and repeatedly performs laser cutting to trim to the final target value.

Effect of the present invention With the above-described configuration, the first step of trimming is a simple continuous laser cut to perform high-speed cutting, and in the next step, the amount of cut is calculated and the cutting is repeated while comparing the results. This makes it possible to trim with high precision.

Embodiment Hereinafter, a laser trimming apparatus which is an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a main configuration diagram of a laser trimming apparatus as the top embodiment of the present invention, where ◯ indicates a circuit board to be trimmed, which is a workpiece. 2 is an XY table on which the circuit board 1 to be trimmed is placed. 3 is a trimming laser device, and 4 is a control unit that controls the operation of the equipment.

Reference numeral 5 denotes a probe section that supplies electrical signals to the circuit board l to be trimmed. 6 is a measuring instrument for measuring circuit signals.

FIG. 2 is a control configuration diagram for performing function trimming, in which 7 is a setting reference section and 8 is a comparison section. First, after placing the circuit board 1 to be trimmed on the X-Y table 2,
The probe 5 is brought into contact and measured.

FIG. 3 shows the procedure, and as a first step, a first target value, that is, a first target is set in the setting reference section 79. As the second and third steps, the circuit resistance is laser cut using the laser device 3 in the comparing section 8 until the output of the circuit under test reaches the set standard 10, 1! . This procedure is called single-function measurement trimming. Next, as a fourth step, the electrical signal is measured by the measuring device 6, read into the control unit 4, and compared internally using software l2. Next, in the fifth step, the length to be laser cut next is calculated based on the measurement results, and the laser cut is performed 13. This procedure is called high-performance measurement. As described above, according to this embodiment, a control configuration is provided that allows high-function measurement after single-function measurement, and function trimming is performed in that procedure, thereby making it possible to perform laser trimming at high speed and with high precision.

Effects of the Invention The present invention performs continuous laser cutting until the circuit state reaches the first target value set in advance as described above, then measures the circuit state with a measuring section, calculates the cutting amount, and repeats the laser cutting to obtain the final cut. By providing a control function for trimming to a target value, it has become possible to perform function trimming at high speed and with high precision.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a laser trimming device showing one embodiment of the present invention, FIG. 2 is a control block diagram, and FIG.
The figure is a flowchart showing the operating procedure, and FIGS. 4 and 5 are flowcharts showing the operating procedure of a conventional laser trimming device. l...Circuit board to be trimmed 3...Laser device 4...Control unit 6...Measuring instrument

Claims (1)

[Claims] A laser cut section that continuously laser cuts the circuit board to be trimmed to a first target set in advance in a reference section, a measurement section that measures the condition of the cut circuit board, and calculates the amount of cut based on the measurement results. and a control unit that repeatedly performs laser cutting and trims to a final target value.