JPH03218647A - Manufacture of semiconductor integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a manufacturing technology for semiconductor integrated circuit devices, and in particular to a technology for manufacturing semiconductor integrated circuit devices.
The present invention relates to a technique that is effective when applied to a method of manufacturing a semiconductor integrated circuit device using the nding method.

[Conventional technology]

Regarding the TAB method in which the tips of conductor leads repeatedly formed on a tape carrier and bumps formed on a semiconductor chip are overlapped and gang bonded, for example, published by Kinsha Marcom Inn 9-t'yyatl,
rsemicon NEWS 1989.3, TA
"Technological Trends and Future Prospects of B" are described on pages 43 to 48.

In this method, a tape carrier with semiconductor chips bonded thereto is wound onto a storage reel after the semiconductor chips are sealed with a potting resin.

At this time, the tape carrier is wound up while being sandwiched between the flexible tapes in order to separate the sealing resin.

Convex portions are provided on both sides of the substrate tape at both ends in the width direction to prevent the potting resin from coming into contact with the substrate tape when the tape carrier is sandwiched between the substrate tapes.

[Problem to be solved by the invention]

However, the present inventor has discovered that the above-mentioned conventional technique in which convex portions are provided at both ends of the spacer tape in the width direction has the following problems.

That is, for example, as the area of a semiconductor chip increases and the width of a tape carrier increases, the center of the spacer tape in the width direction tends to be distorted when the tape carrier is wound up after potting processing, and as shown in FIG. There was a problem in that the center portion in the width direction came into contact with the potting resin 51, resulting in noticeable poor appearance and poor sealing.

The present invention has been made with attention to the above-mentioned problems, and its purpose is to provide a technology that can prevent defects in the sealing resin caused by distortion of the spacer tape in the manufacturing process of semiconductor integrated circuit devices using the TAB method. It is about providing.

Another object of the present invention is to provide a technique that can improve the yield of semiconductor integrated circuit devices using the TAB method.

Still another object of the present invention is to provide a technique that allows a tape carrier to be wound up without being sandwiched between spacer tapes in a manufacturing process of a semiconductor integrated circuit device using the TAB method.

The above and other objects and novel features of the present invention will become apparent from the description of the specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the invention recited in claim 1 provides a method for sealing both sides of the tape carrier at the stage where the semiconductor chip bonded via the bump to the tip of the conductor lead formed on the tape carrier is sealed with the sealing resin. A method for manufacturing a semiconductor integrated circuit device, in which a spacing member protruding in a direction perpendicular to the surface of the tape carrier is provided near the outer periphery of the resin, and the sealing resin and the spacer tape are separated when the tape carrier is wound up. It is.

According to the third aspect of the invention, when the semiconductor chip bonded to the tip of the conductor lead formed on the tape carrier via the bump is sealed with the sealing resin, the outer periphery of the sealing resin is removed on one side of the tape carrier. Providing a spacing member protruding in a direction perpendicular to the surface of the tape carrier in the vicinity;
The present invention provides a method for manufacturing a semiconductor integrated circuit device in which sealing resins in overlapping tape carriers are separated from each other when the tape carriers are wound up.

Effect C] According to the above-mentioned invention as claimed in claim 1, when the tape carrier is wound up after the sealing process, the distortion in the center of the spacer tape in the width direction is suppressed by the spacing member, so that the spacer tape and the sealing resin are This makes it possible to prevent contact between

According to the invention described in claim 3, when the tape carrier is wound up after the sealing process, the sealing resins in the overlapping tape carriers are separated by the spacing member, so that the tape carrier is not sandwiched between the spacer tapes. It becomes possible to wind it up.

[Example 1] Eleventh! 1 is a cross-sectional view of a tape carrier and a substrate table during the manufacturing process of a semiconductor integrated circuit device using the TAB method, which is an embodiment of the present invention, FIG. 2 is a plan view of this tape carrier, and FIG. 3 is a semiconductor integrated circuit device using the TAB method. FIG. 4 is a perspective view of a tape carrier, a spacing member, and a vacuum suction nozzle for explaining the manufacturing process of the circuit device; FIG. 4 is a schematic perspective view showing the vacuum suction nozzle shown in FIG. 3;

A tape carrier used in the manufacturing process of a semiconductor integrated circuit device using the TAB method according to the first embodiment will be explained with reference to FIGS. 1 and 2.

1 and 2 show the tape carrier 1 after the potting process. The tape carrier 1 is made of polyimide, for example. A plurality of subrocket holes 2 are bored at regular intervals near the side edge of the tape carrier 1.

A semiconductor chip 4 sealed with a botting resin (sealing resin) 3 is disposed in the center of the tape carrier 1 and is bonded to the tips of leads 6 via CCB bumps 5 formed on its main surface. ing.

The lead 6 is made of copper (Cu).

At the tip of the lead 6 exposed from the potting resin 3,
A test pad 6a that is brought into contact with a probe (not shown) for testing the conduction state between the lead 6 and the semiconductor chip 4
is formed.

The tape carrier 1 is wound up between spacer tapes 7.7, as shown in FIG. The spacer tape 7 is made of, for example, polyester mixed with carbon. Carbon is mixed in order to prevent electrostatic damage to elements, wiring, etc. formed on the semiconductor chip 4. Convex portions 7a are formed at both ends of the spacer tape 7 in the width direction.

In the first embodiment, after the botting process, spacing members 8 are provided near the outer periphery of the potting resin 3 on both sides of the tape carrier 1. The spacing member 8 is, for example, 3 to
It is a cubic member of about 5 mm x 3 to 5 fflII1, and is adhered onto the tape carrier 1 with an adhesive, for example. The spacing member 8 is made of, for example, polyester mixed with carbon. Carbon is a semiconductor chip 4
It is mixed to prevent electrostatic damage to elements, wiring, etc. formed in the process. The spacing member 8 separates the tape carrier 1 during winding of the tape carrier 1 after the potting process.
It acts to suppress the distortion of the center portion of the smoothing tape 7 sandwiching the smoothing tape 7 and to prevent contact between the smoothing tape 7 and the potting resin 3. In addition, in FIG. 2, the spacing member 8 is shown with diagonal lines to make the drawing easier to see.

Next, a method for manufacturing a semiconductor integrated circuit device using the TAB method according to the first embodiment will be explained with reference to FIGS. 3 and 4.

As shown in FIG. 3, after the semiconductor chips 4 (see FIG. 1) bonded to the ends of the leads 6 on the tape carrier 1 are sealed with the potting resin 3, they are aligned and housed in the jig 9. Among the plurality of spacing members 8, for example, four spacing members 8 are suctioned at once by the vacuum suction nozzle 10. The vacuum suction nozzle 10 has a structure that allows the length in the direction indicated by the arrow in FIG. 4 to be changed. This is so that the placement position of the spacing member 8 can be changed depending on the width of the tape carrier 1, the size of the semiconductor chip 4, etc.

Next, the vacuum suction nozzle 10 is moved toward the tape carrier 1 by a drive system (not shown). During this movement, although not shown, an adhesive is applied to the bottom surface of the spacing member 8.

Next, the vacuum suction nozzle 10 is moved to the spacing member 8 on the tape carrier 1 based on information such as the shape and size of the potting resin 3 that has been detected in advance and the position information of the lead 6 etc. on the tape carrier 1. Place it on the position to be glued.

Then, while the spacing member 8 is being sucked, the vacuum suction nozzle 10 is
is moved downward, and the spacing member 8 is adhered to the vicinity of the outer periphery of the potting resin 3 on the tape carrier 1. Although not shown, the spacing member 8 is also adhered to the back side of the tape carrier 1 in the same manner.

Thereafter, the tape carrier 1 is wound onto a storage reel (not shown) while being sandwiched between spacer tapes 7 (see FIG. 1). At this time, distortion of the center portion of the spacer tape 70 in the width direction is suppressed by the spacing member 8, and contact between the spacer tape 7 and the botting resin 3 is prevented.

As described above, according to the first embodiment, even if the width of the tape carrier 1 increases, the distortion in the widthwise center of the spacer tape 7 is suppressed by the spacing member 8 when the tape carrier 1 is wound up after the potting process. , subesa tape 7
It becomes possible to prevent contact between the potting resin 3 and the potting resin 3. Therefore, it is possible to prevent defects in the potting resin 3 due to distortion of the spacer tape 7 during the manufacturing process of a semiconductor integrated circuit device using the TAB method.
It becomes possible to improve the yield of semiconductor integrated circuit devices using the TAB method.

[Embodiment 2] FIG. 5 is a sectional view of a tape carrier during the manufacturing process of a semiconductor integrated circuit device using the TAB method, which is another embodiment of the present invention.

In the second embodiment, as shown in FIG. 5, at the stage where the semiconductor chip 4 on the tape carrier 1 is sealed with the potting resin 3, near the outer periphery of the potting resin 3,
A spacing member 8 is provided to separate the potting resins 3 and 3 of the overlapping tape carriers 1 from each other when the tape carriers 1 are wound up.

The spacing member 8 is glued to one side of the tape carrier 1 with an adhesive. The height of the spacing member 8 is set so that when the tape carrier 1 is wound up, the potting resins 3.3 on the overlapping tape carriers 1.1 do not come into contact with each other.

According to the second embodiment, when the tape carrier 1 is wound up after the potting process, the tape carriers 1 overlap each other.
Since the potting resin 3.3 in is separated by the spacing member 8, it is possible to wind up the tape carrier 1 without providing a spacer tape.

The invention made by the present inventor has been specifically explained based on Examples above, but the present invention is not limited to Examples 1 and 2, and can be modified in various ways without departing from the gist thereof. Needless to say.

For example, in the first embodiment, the case where the spacing member is cubic is explained, but this is not limited to this and various changes are possible. For example, as in the spacing member 8 shown in FIG. But it's okay. Alternatively, it may be spherical, like the spacing member 8 shown in FIG. Alternatively, it may be in the form of a frame, as shown by the diagonally shaded spacer member 8 in FIG.

Further, in the first and second embodiments, the case where the spacing member is made of polyester mixed with carbon has been described, but the present invention is not limited to this and various modifications can be made.

Further, in Example 1.2, the case where the tape carrier is made of polyimide has been described, but the tape carrier is not limited to this and various modifications can be made. For example, polyethylene or the like may be used.

〔Effect of the invention〕

Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

(1). That is, at the stage where a semiconductor chip bonded to the tip of a conductor lead formed on a tape carrier via a bump is sealed with a sealing resin, the tape carrier is placed near the outer periphery of the sealing resin on both sides of the tape carrier. According to the invention according to claim 1, wherein a spacing member is provided that projects in a direction perpendicular to the plane of the tape carrier, and the sealing resin and the spacer tape are separated from each other when the tape carrier is wound. When removing the spacer tape, the distortion at the center in the width direction of the spacer tape is suppressed by the spacing member, making it possible to prevent contact between the spacer tape and the sealing resin. Therefore, it is possible to prevent defects in the sealing resin due to distortion of the spacer tape in the manufacturing process of semiconductor integrated circuit devices using the TAB method.
According to this method, it is possible to improve the yield of semiconductor integrated circuit devices.

C). Further, at the stage where the semiconductor chip bonded to the tip of the conductor lead formed on the tape carrier via the pump is sealed with the sealing resin, the tape carrier is placed near the outside of the sealing resin on one side of the tape carrier. According to the invention according to claim 3, wherein a spacing member is provided that projects in a direction perpendicular to the plane of the tape carrier, and a spacing member is provided that separates the sealing resins in the overlapping tape carriers from each other when the tape carrier is wound up. When winding up the tape carrier, the sealing resins of the overlapping tape carriers are separated by the spacing member, making it possible to wind up the tape carrier without being sandwiched between spacer tapes.

[Brief Description of the Drawings] Fig. 1 is a sectional view of a tape carrier and a spacer tape during the manufacturing process of a semiconductor integrated circuit device using the TAB method, which is an embodiment of the present invention, and Fig. 2 is a plan view of this tape carrier. , FIG. 3 is a perspective view of a tape carrier, a spacing member, and a vacuum suction nozzle for explaining the manufacturing process of a semiconductor integrated circuit device using the TAB method, FIG. 4 is a schematic perspective view showing the vacuum suction nozzle shown in FIG. 3, FIG. 5 is a sectional view of a tape carrier during the manufacturing process of a semiconductor integrated circuit device according to another embodiment of the present invention, and FIGS. 6 and 7 are a cross-sectional view of a semiconductor integrated circuit device according to another embodiment of the present invention. A sectional view of a tape carrier and a spacer tape during the manufacturing process, FIG. 8 is a plan view of the tape carrier during the manufacturing process of a semiconductor integrated circuit device according to another embodiment of the present invention, and FIG. 9 shows a conventional tape carrier and a spacer tape. FIG. 3 is a cross-sectional view of a spacer tape. 1...Tape carrier, 2...Subrocket hole, 3
... Potting resin (sealing resin), 4 ... Semiconductor chip, 5 ... CCB bump, 6 ... Lead, 6a ... Test pad, 7 ... Spacer tape, 7a ... Convex Part, 8... Spacing member, 9... Jig, 10... Vacuum suction nozzle, 50... Spacer tape, 51... Potting resin.

Claims (1)

[Scope of Claims] 1. At the stage where the semiconductor chip bonded to the tip of the conductor lead formed on the tape carrier via the bump is sealed with the sealing resin, the outer periphery of the sealing resin is removed on both sides of the tape carrier. A method for manufacturing a semiconductor integrated circuit device, characterized in that a spacing member protruding in a direction perpendicular to the surface of the tape carrier is provided in the vicinity, and the sealing resin and the spacer tape are separated from each other when the tape carrier is wound up. 2. The method of manufacturing a semiconductor integrated circuit device according to claim 1, wherein the spacing member has a frame shape. 3. At the stage where the semiconductor chip bonded to the tip of the conductor lead formed on the tape carrier via the bump is sealed with the sealing resin, the tape carrier is placed near the outer periphery of the sealing resin on one side of the tape carrier. A method of manufacturing a semiconductor integrated circuit device, comprising: providing a spacing member projecting in a direction perpendicular to the plane of the tape carrier, and separating the sealing resins of the overlapping tape carriers from each other when the tape carriers are wound up.