JPH03218698A - Device for holding semiconductor chip by suction - Google Patents

Abstract

PURPOSE:To enable a semiconductor chip to be surely bonded to a board even if the upside of the board is inclined by a method wherein a nozzle shaft and a die collet interlinked to the lower end of the nozzle shaft are provided, where the collet is linked to the nozzle shaft through a universal joint. CONSTITUTION:A ring body 22 is connected to a lower plate 23 with a machine screw 26, a die collet 3 is coupled with the lower plate 23 by a machine screw 32, and an outer peripheral surface 21a of an upper plate 21 is formed into a circular curved surface. Therefore, these components swing slightly in the direction of an arrow N around the upper plate 21 as a rotation axis elastically deforming an O-ring 25. By this setup, when the upside of a board 35 is inclined, the die collet 3 is made to descend to press micro-bumps 34 against the board 35, whereby the die collet 3 is made to swing in the direction of the arrow N by its force of descent, so that a semiconductor chip can be bonded to the board 35 making all the micro-bumps 34 conform to the upside of the board 35.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a semiconductor chip suction device, in which a die collet is swingably connected to a nozzle shaft in order to cope with the slope of the upper surface of a substrate to which a semiconductor chip is bonded. This is what I did.

(Prior Art) FIG. 4 shows how a semiconductor tinop 101 is bonded to a substrate 102 using a conventional die collet 100. 103 is a nozzle shaft. The semiconductor chip 101 is a flip chip, and a large number of micro bumps 104 with a size of about 7μ are protruded from the bottom surface of the semiconductor chip 101.
The bonding is done by matching the electrode part of the.

(Problems to be Solved by the Invention) There are various substrates 102 such as ceramic substrates and glass substrates, but the upper surface thereof is not necessarily a perfectly horizontal plane and may be inclined as shown by the chain line. be. This inclination is generally not so large, and therefore, in the case of a normal flip chip having a bump with a size of, for example, about 80 μm, this inclination can be sufficiently absorbed and bonded to the substrate 102. However, in the case of the flip chisel board 101 having the small micro bumps 104 as described above, this inclination cannot be absorbed, and all the micro bumps 104 are connected to the substrate 102.
There has been a problem in that bonding cannot be performed after landing on the substrate1.Therefore, an object of the present invention is to provide a means for reliably bonding a semiconductor chip, such as a Frithop chip, having microbumps, which requires horizontal precision on the top surface of the substrate, to a substrate. shall be.

(Means for Solving the Problems) For this purpose, the present invention provides a semiconductor chip suction device that includes a nozzle shaft and a die collet connected to the lower end of the nozzle shaft.
It is swingably connected to the nozzle shaft via a universal joint.

(Function) In the above configuration, the die collet that has attracted the semiconductor chip lands the semiconductor chip on the substrate and performs bonding. However, if the top surface of the substrate is inclined, there is a universal joint between the nozzle shaft and the die collet. Since the die collet is interposed therebetween, the die collet swings, and the lower surface of the semiconductor chip is aligned with the upper surface of the substrate, thereby making it possible to reliably bond the semiconductor chip.

(Example) Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a semiconductor chip suction device, FIG. 2 is a sectional view, and FIG. 3 is an exploded view. Reference numeral 1 denotes a pipe-shaped nozzle shaft, and a die collet 3 is swingably connected to the lower end of the nozzle shaft through a universal joint 2.

As shown in FIG. 3, the universal joint 2 includes a disc-shaped upper plate 2.
1, a ring body 22 into which the upper plate 2l is fitted, a disc-shaped lower plate 23, a small ring body 24 and an elastic O-ring 25 which are fitted between the upper plate 21 and the lower plate 23. It is made.

26 is a screw that connects the upper plate 2I and the lower plate 23, 27, 28
．． Reference numerals 29 indicate screw holes formed in the outer peripheral edge of the upper plate 2l, the inner peripheral edge of the ring body 22, and the lower plate 23, respectively.

A disk-shaped protrusion 30 is integrally provided on the upper surface of the upper plate 21 . 3l is a screw, and this screw 3l is attached to the protrusion 30.
The upper plate 2l is assembled to the nozzle shaft I by screwing into the nozzle shaft I.

Further, as shown in FIG. 2, the head 26 of the screw 26
A prevents the upper plate 21 and the ring body 22 from being separated by pressing the upper surfaces of the upper plate 21 and the ring body 22 from above. Further, the outer circumferential surface 21a of the upper plate 2l is a circularly curved surface, and the inner circumferential surface of the ring body 22 is in line contact with this outer circumferential surface 21a. Also, the O-ring 25 is connected to the small ring body 24.
It is fitted inside the ring body 22, and its upper surface is in elastic contact with the lower surface of the upper plate 2l. 32 is a screw that connects the die collet 3 and the lower plate 23.

In FIG. 2, the upper plate 2l is fixed to the nozzle shaft l with screws 31, and there is also a ring body 22, a lower plate 23 connected to this ring body 22 with screws 26, and a screw 32 attached to this lower plate 23. Since the outer circumferential surface 21a of the upper plate 21 is a circularly curved surface, the die collet 3 connected with can move. In FIG. 2, 33 is a flip chip; 34 is a flip chip;
35 is the microbump, and 35 is the substrate.

This suction device has the above-described configuration, and the die collet 3 that has suctioned the flip chip 33 lands the micro bumps 34 of the flip chip 33 on the upper surface of the substrate 35 for bonding. As shown by the chain line in FIG. 2, when the upper surface of the substrate 35 is inclined, the die collet 3
When the microbumps 34 are pressed against the substrate 35 by descending, the guicolet 3 swings in the direction of arrow N due to the downward force, and all the microbumps 34 can be bonded along the upper surface of the substrate 35.

(Effects of the Invention) As explained above, the present invention includes a nozzle shaft and a die collet connected to the lower end of the nozzle shaft, and the die collet is connected to the nozzle shaft via a universal joint. As a result, since the collet is swingable, a semiconductor chip such as a Frithop chip having microbumps can be reliably bonded to the substrate even if the upper surface of the substrate is inclined.

1 is a perspective view of a suction device, FIG. 2 is a sectional view, FIG. 3 is an exploded perspective view, and FIG. 4 is a sectional view of a conventional suction device.

■・・・Nozzle shaft 2...Universal joint part 3...Dai colette

Claims (1)

[Claims] It is equipped with a nozzle shaft and a die collet connected to the lower end of the nozzle shaft.
A semiconductor chip suction device characterized in that a collet is made swingable by being connected to a nozzle shaft via a universal joint.