JPH03219038A - Plate material for electrical conducting parts of electronic and electrical equipment - Google Patents

Abstract

PURPOSE:To obtain an Al alloy plate for electrical conducting parts of electronic and electrical equipments excellent in cyclic bendability, bonding properties and corrosion resistance and having high strength by cladding both faces of an Al alloy having high strength as a core material with soft Al alloy sheets excellent in corrosion resistance. CONSTITUTION:As a core material, an Al alloy having a compsn. contg., by weight, 0.5 to 5.0% Cu and 0.2 to 2.0% Mg or furthermore contg. one or >=2 kinds among <1.0% Mn, <0.3% Cr, <0.3% V and <5.7% Ni or an Al alloy sheet contg. 2.0 to 7.0% Zn and 1.0 to 3.5% Mg or furthermore contg. one or >=2 kinds among <2.5% Cu, <1.0% Mn, <0.3% Cr, <0.3% Zr, <0.3% V and <5.7% Ni and having >=40kgf/mm<2> tensile strength is used. Then, both faces of the above are clad with Al alloy sheets contg. one or two kinds of 0.5 to 5.0% Mg and 0.1 to 1.5% Mn and having more softness and more excellent corrosion resistance compared to those of the core material, into >=8mum thickness pre face, by which an Al alloy clad plate as a plate material for electrical conducting parts of electronic and electrical equipment can be manufactured.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a plate material for conductive parts of electronic and electrical equipment used in lead frames of semiconductors and ICs, or conductive parts such as connectors and switches, and which has high strength and good repeated bendability. The present invention relates to an inexpensive plate material for electrically conductive parts of electronic and electrical equipment, which also has good electrical conductivity, thermal conductivity (heat dissipation), corrosion resistance, and bonding properties.

Conventional Technology Electronics 9 Typical conductive parts used in electrical equipment include individual semiconductors such as transistors and 1. C, L.S.
There is a lead frame used for I.SCR. This lead frame is typically made into an IC through the following process.
and incorporated into semiconductors.

That is, first, a plate material made of a conductive material as a lead frame material with a thickness of 0.1 to 0.5 is prepared, and the plate material is press punched or etched to form the desired lead frame shape (however, the outer leads are mutually connected). Then, a semiconductor element (Si chip) made of high purity 81 or the like is bonded to a predetermined location of the lead frame.

This bonding is called die bonding, and is performed by pressure bonding using a conductive resin such as Ag paste, or by attaching Au, A plating layer consisting of a single layer or a multilayer of two or more of Ag, Ni, etc. is formed in advance, and the material is heat-diffusion-pressed through this plating layer to utilize the eutectic reaction of Au-3i or the like. There are methods of bonding a lead frame and a semiconductor element using a method such as a method of bonding a lead frame and a semiconductor element, and a method of bonding a lead frame and a semiconductor element using a Pb-3n solder or the like. Thereafter, the A/electrode of the semiconductor element (Si chip) die-bonded to a predetermined location of the lead frame on the substrate and the conductor terminal (inner lead) of the lead frame are connected with an Au wire or an Al wire. This connection is called wire bonding. Subsequently, the semiconductor element, the wiring section, and the portion of the lead frame to which the semiconductor element is attached are sealed with resin, ceramic, or the like to protect them, and finally, the interconnected portions of the outer leads of the lead frame are cut off.

The plate material for the lead frame used through the following two processes must have good press workability or etching property, and good bondability in wire bonding, and also have good bondability. It has good heat dissipation (thermal conductivity) and electrical conductivity, and also has mechanical strength and excellent repeated bending resistance that will not cause damage due to bending or repeated bending when transporting semiconductor devices or incorporating them into electronic equipment. , it is also required to have corrosion resistance.

Conventionally, such lead frame plate materials include Fe-
42 alloy which is 42%Ni alloy or Fe17%C
Kovar, which is an o-29% Ni alloy, as well as phosphor bronze (CA 501), which is a Cu-based alloy, and C11Fe-Zn.
-P (CA 194) alloy, Cu-FeCo-3n
-P (CA 195) alloy etc. are used.

Problems to be Solved by the Invention Both Kovar and 42 alloys, which are conventionally used as plate materials for lead frames, are expensive because they contain large amounts of expensive Ni, and they have poor thermal conductivity and corrosion resistance. There was an inferior problem. Further, Cu-based alloys have poor repeatability and are also problematic in terms of cost. Therefore, there is a strong desire to develop and put into practical use a material that satisfies the various characteristics required for these parts and is inexpensive and can be used as a conductive plate material for conductive parts of electronic and electrical equipment such as lead frame materials.

Aluminum alloy is generally known as an inexpensive conductive material, and lead frame plate materials using aluminum alloy have already been proposed in JP-A-62-96638 and JP-A-62-96644. has been done.

Although these aluminum alloys have relatively good electrical conductivity and heat dissipation, their strength is lower than that of conventional lead frame plate materials such as 42 alloy and phosphor bronze, and their repeated bendability is insufficient. Therefore, it is desired to develop an aluminum alloy-based plate material that has higher strength and excellent repeated bending properties.

This invention was made against the background of the following two circumstances.
It is an object of the present invention to provide a plate material for electrically conductive parts of electronic and electrical equipment made of an inexpensive aluminum-based alloy that has particularly excellent repeated bendability, high mechanical strength, and other properties such as bonding properties and corrosion resistance. This is the purpose.

Means for Solving the Problems The present inventors have developed an aluminum-based alloy that has the characteristics necessary as a plate material used in electrically conductive parts of electronic and electrical equipment such as lead frames as described above, in particular, excellent repeated bendability and high strength. As a result of various experiments and studies in order to find a plate material that satisfies good corrosion resistance and excellent bonding properties,
The above objective is achieved by applying a composite plate that uses Al-Mg-based, Al-Mn-based, or Al-Mg-Mn-based aluminum alloy as the surface layer material and a high-strength aluminum alloy as the core material. They discovered that it is possible to do this and came up with this invention.

Specifically, the plate material for electrically conductive parts of electronic and electrical equipment according to the invention of claim 1 has an aluminum alloy having a tensile strength of 40 kgf/- or more as a core material, and Mg on both sides of the core material.
11.5-5.0% and Mn0. It is characterized in that a surface layer material made of an aluminum alloy containing one or two of l-1.5% is bonded to a thickness of IILLI11 or more per side.

Further, the plate material for electrically conductive parts of electronic and electrical equipment according to the invention of claim 2 is as follows:
The aluminum alloy of the core material in the material of the invention of claim 1 is a 1-Cu-Mg alloy, that is, Cu 0.5
~5.0wt%, Mg 0.2~2.9w1%, and the remainder consists of Al and inevitable impurities.

Furthermore, in the plate material for electrically conductive parts of electronic and electrical equipment according to the invention of claim 3, the aluminum alloy of the core material according to the invention of claim 2 is
In addition to Cu and Mg, MnQwf% or less, Croi
It is characterized by containing one or more of the following: vl% or less, Zroivl% or less, V 0.3v1% or less, and Ni 5.7w+% or less.

Furthermore, in the plate material for electrically conductive parts of electronic and electrical equipment according to the invention of claim 4, the aluminum alloy of the core material in the material of the invention of claim 1 is an AJ-Zn-Mg alloy, that is, Zn2.
0~? , Ow1%, M g 1. O-3,5w1%
, with the remainder consisting of l/ and unavoidable impurities.

Further, the plate material for electrically conductive parts of electronic and electrical equipment according to the invention of claim 5 is as follows:
In the invention of claim 4, the aluminum alloy of the core material is Z
In addition to n, Mg, Cu2.5 wI% or less, M n
1.0wt% or less, CroJvl% or less, Zr0.
3v1% or less, V 0.3v1% or less, N i 5,
It is characterized by containing one or more of 7v1% or less.

Function The plate material for electrically conductive parts of electronic and electrical equipment of the present invention is made of a composite aluminum alloy plate, and basically contains Al-Mg type, Al-Mn type, or Al-Mg type as the surface layer material.
- By using a relatively soft Mn-based aluminum alloy, good repeated bending properties, excellent bonding properties, and corrosion resistance are ensured, and by using a high-strength aluminum alloy as the core material, strength is ensured. The function, thickness, etc. of each of these villages will be further explained below.

Generally, plate materials for electrically conductive parts of electronic and electrical equipment, such as plate materials for lead frames, are required to have a tensile strength of 35 kgr/- or more, and even higher tensile strength is required when higher reliability is required. Therefore, in this invention as well, the composite plate as a whole is required to have a tensile strength of 35 kgr/- or more.

The strength σ of the composite plate is given by the following equation, where the strength σf1 of the surface layer material is the ratio of the thickness of the surface layer f1 to the total thickness f1, and the strength σC of the core material.

σ=f・σf+σc (1f) Therefore, the thickness of the surface layer material is the total strength σ required as a plate material for electrically conductive parts of electronic and electrical equipment, the strength σc1 of the aluminum alloy plate used for the core material, and the aluminum alloy used for the surface layer material. The thickness ratio is designed from the strength σf of the plate.

On the other hand, for plate materials for lead frames, bonding (wire bonding) with gold wire or aluminum wire is often performed by ultrasonic vibration bonding, but with ultrasonic vibration bonding, materials with low hardness are easily bonded, resulting in defects. It has been found through experiments by the present inventors that the ratio decreases. Therefore, the present inventors have already proposed in Japanese Patent Application No. 63-3 that the bonding performance in ultrasonic vibration bonding can be improved by using a soft pure Al-based material with an Al purity of 99.0% or more as the surface layer material.
Although proposed in No. 22925, in this invention,
Al-Mg type, AlMn type, or Al-Mg type material that is softer than the core material to improve bonding properties and has higher strength than pure Al type material to correspond to high strength.
-Mn-based aluminum alloy is used as the surface layer material.

Note that when bonding is performed using ultrasonic vibration in this way, the relatively soft surface layer that is involved in improving bonding properties has a thickness of 5μ.
m or more is sufficient, therefore Al-Mg system, A
Sufficiently excellent bonding properties can be obtained by providing the surface layer material made of l-Mn-based or Al-Mg-Mn-based aluminum alloy with a thickness of 8 μm or more.

Also, Al-Mg system, AA'-Mn system, or Al-M
g-Mn-based aluminum alloys have excellent corrosion resistance,
Therefore, by bonding surface layer materials made of aluminum alloys based on these alloys on both sides, excellent corrosion resistance can be obtained as a plate material for electrically conductive parts of electronic and electrical equipment.

Here, when the thickness of the surface layer material is 8 μm or more, sufficient corrosion resistance can be exhibited.

Furthermore, as a surface layer material, A1Mg type, which is softer than the core material,
Good repeat bendability can be obtained by using l-Mn-based or Al-MgMn-based aluminum alloy. This is because the surface layer is softer and more ductile than the core material, which suppresses the occurrence of surface cracks during bending. Regarding such repeated bendability, sufficiently good characteristics can be ensured when the thickness of the surface layer material is 8 μm or more.

On the other hand, as for the thickness distribution of the surface layer material, it is sufficient to have a maximum of 10% on one side, as described below, and in this case, the minimum strength σf of the surface layer material is
is 15 kgf/-, the ratio f of the thickness of the surface layer to the total thickness is 20%, and the strength σ of the entire composite board is 35
In order to ensure kgr/m4 or more, the strength of the core material σ. As is clear from the above formula, 40kgf
/- or more.

Here, as already mentioned, the thickness of the surface material per side is 8
By forming the film with a thickness of μm or more, good bonding properties, corrosion resistance, and repeated bending properties can be obtained.
As described above, if the absolute thickness is 8 μs or more per side, even if the thickness distribution ratio (one side) of the surface layer material exceeds 10%, the effects of improving repeat bendability, bonding performance, and corrosion resistance will not increase much beyond that. Not only that, if the thickness distribution ratio of the surface layer material exceeds 10% on one side, the thickness distribution ratio of the core material will decrease. The strength of the core material must be further increased, and as a result, the ductility of the core material itself tends to decrease. Therefore, it is preferable that the thickness distribution of the surface layer material be 20% or less in total.

As mentioned above, it is sufficient to use a core material of 40 kgF/- or more, but in order to obtain such high strength with an inexpensive aluminum alloy, the aluminum alloy for the core material should be Al, which is a heat-treated aluminum alloy. It is desirable to use a -Cu-Mg alloy or an Al-ZnMg alloy. The invention according to claim 2.3 uses an Al-Cu-Mg alloy as the core material, and the invention according to claim 4.5 uses an Al-Zn-Mg alloy as the core material.

Here, the A/-Cu-Mg alloy is one that contains 0.5% (by weight, the same applies hereinafter) or more of Cu as an essential alloy component;
Contains 5.0% or less, and 0.2% or more of Mg, 20%
The reasons for limiting the content of Cu and Mg in the Al-Cu-Mg alloy used for such a core material will be explained below.

Cu: Cu is an element that contributes to improving strength, but when Cu is 0.5
If it is less than 5.%, the effect of improving strength cannot be sufficiently obtained.
If it is contained in an amount exceeding 0%, rolling properties will decrease and rolling will become difficult. Therefore, Cu was set within the range of 0.5 to 50%.

Mg/Mg is an element that forms precipitates when coexisting with Cu and contributes to improving strength, and is important for providing the necessary strength to the core material of composite materials used in parts such as lead frames. However, if the content is less than 0.2%, a sufficient strength improvement effect cannot be obtained, and on the other hand, if the content exceeds 2.0%, there is no significant improvement in strength, and moreover, the rolling properties are extremely reduced. Therefore, Mg was set within the range of 0.2 to 2.0%.

On the other hand, A/-Zn-Mg alloy contains Zn as an essential component.
Contains 2.0% or more and 70% or less, and 1.0% Mg
Above, the content is 3.5% or less. Zn and M in Al-ZnMg alloys used for such core materials.
The reason for limiting the g content will be explained below.

Zn: Zn is an element that coexists with Mg to form precipitates and contributes to improving strength, and is important for providing the necessary strength to the core material of composite materials used in parts such as lead frames. . If the Zn content is less than 2.0%, a sufficient strength improvement effect cannot be obtained, and on the other hand, if the Zn content exceeds 7.0%, there is no significant strength improvement. Therefore, Zn is 2.0 to 7.0
It was set within the range of %.

Mg: Mg is an element that forms precipitates when coexisting with Zn and contributes to improving strength, and is important for providing the necessary strength to the core material of composite materials used in parts such as lead frames. If the Mg content is less than 1.0%, sufficient strength-improving effects cannot be obtained, and on the other hand, if the Mg content exceeds 3596, there is no significant improvement in strength, but only the rolling properties are reduced. Therefore, Mg was set within the range of 1.0 to 3.5%.

In the case of this Al-Zn-Mg alloy, 2.5% or less of Cu may be contained in order to further improve the strength. If Cu exceeds 2.5%, casting cracks will occur and manufacturing will be difficult, so when adding Cu, the amount of Cu added should be
2.5% or less.

The aluminum-based alloy used as the core material of the electrically conductive component plate material for electronic and electrical equipment of this invention is basically the above-mentioned Al
-Cu-Mg alloy or AlZn-Mg alloy can ensure the necessary mechanical properties for parts such as lead frames, but in order to further improve heat resistance (softening resistance),
The above AtCu-Mg alloy or A I-Z n
-Mn 1.0% or less, Cr
0.3% or less, Zr03% or less, VO, 3% or less, Ni
One or more of these may be added in an amount of 5.7% or less. The reason for limiting the amount of these elements added is as follows.

Mn: Mn is an effective element for refining recrystallized grains during solution treatment and further improving strength and heat resistance (softening resistance). Even if the content exceeds f1%, the effects of improving strength and heat resistance will be saturated, and the quenching sensitivity during solution treatment will increase, making manufacturing difficult. Therefore, the amount of Mn added was 1.096 or less.

Cr: C is also an effective element for refining recrystallized grains during solution treatment and further improving strength and heat resistance.
Even if the content exceeds 3%, the effects of improving strength and heat resistance are saturated, and large compounds are likely to be formed during casting. Therefore, the amount of C" added was set to 0.3% or less.

Zr: Zr also makes recrystallized grains finer, improves strength, and improves heat resistance.
Zr is an effective element for two reasons, but even if it is contained in an amount exceeding 3%, the effects of improving strength and heat resistance will be saturated, and it will also be easier to form huge compounds during casting, so the amount of Zr added is 0. .3% or less.

■= ■Also improves recrystallized grain size, improves strength, and heat resistance.
However, even if it is contained in an amount exceeding 0.3%, the effects of improving strength and heat resistance will be saturated, and giant compounds will be likely to be formed during casting, so the addition amount of (2) should be 0.
It was set to 3% or less.

Ni: Ni is also an effective element for refining recrystallized grains, improving strength, and improving heat resistance, but even if it is contained in a large amount exceeding 5.7%, the effects of improving strength and heat resistance are saturated; Furthermore, since giant compounds are likely to be formed during casting, the amount of Ni added was set at 5.7% or less.

Note that the core material is A I - Cu - M g type or AtZ
Unavoidable dull materials in n-Mg alloys include Fe,
Usually, Si is contained, but the amount of Fe in these
If the amount of Si increases, the size of crystallized substances will increase and the repeated bendability will decrease, so Fe should be about 0.50% or less, S
It is desirable for i to be approximately 0.30% or less, more preferably for Fe to be 0.30% or less, and for Si to be 0.15% or less.

In addition, in the production of aluminum alloy ingots, generally Ti1 or Ti and B are often added to refine the ingot crystal grains, but in the case of the aluminum alloy used as the core material of the plate material of this invention, Ti1 or Ti
Even if B and B are added, there is no particular problem as a material for electrically conductive parts of electronic and electrical equipment such as lead frame materials. However, the amount of addition is as follows: Ti: 0.296 or less, B: 0. N9
6 or less is desirable.

In addition, when casting A1 alloys containing Mg such as Al-Cu-Mg or Al-ZnMg-based alloys,
Be may be added as necessary for the purpose of preventing oxidation of the molten metal or improving rollability, but in the case of the aluminum alloy of the core material of the plate material of this invention, Re may be added to about 50 ppm or less as necessary. Can be added.

On the other hand, as the aluminum alloy for the surface layer material, Mg 0
．． 5-5. Of1%, M n 0. I~I, 5w1
Aluminum alloy containing any one or two of %, i.e. Al-Mg alloy, Al-Mn alloy,
Alternatively, an Al or -Mg-Mn alloy is used.

Here, Mg and Mn are both elements that contribute to strength improvement, and in the case of Mg addition, if Mg@ is less than 0.5w1%, the contribution to strength improvement is small, and in the case of Mn addition, the Mn amount is 0.1w1%. If it is less than that, there is little contribution to the strength direction -1-.

On the other hand, if the Mg content exceeds 5.0 wt%, cladding with the core material becomes difficult and the repeatability of bending decreases. Moreover, if M n It exceeds 1.5wt96, not only the effect of improving strength is saturated, but also the repeated bendability decreases.

Therefore, the Mg amount is 0.5-5.9w1%, and the Mn amount is 0.
．． It was set within the range of 1 to 1.5w1%. In addition, when both Mg and Mn are included, Mgl is 0.5 to 5. As long as it is within the Ov1% range, there is no problem even if Mnt is less than 0wt%, and Mnt
If the n amount is within the range of 0.1 to 1.5v1%, there is no problem even if the Mg amount is less than 0.5wt96.

The above Mg in the aluminum alloy of the surface layer material.

In addition to Mn, basically Al and other unavoidable impurities may be used, but CrLGO5 to 0.25196 may be added as necessary to improve strength and repeat bendability. Characteristics such as gender are not particularly impaired. In addition, unavoidable impurities include Fe, Si, and Cu.

Contains Zn, etc., but F e 0.5Qv1% or less, S
i0.30W1% or less, Cu 0.30v1% or less, Z
If n is 0.30W1% or less, there will be no particular adverse effect on bonding properties or repeated bending properties. moreover,
As already mentioned regarding the core material, when casting Mg-containing aluminum alloys, a small amount of Be is sometimes added for the purpose of preventing oxidation of the molten metal and improving rollability, but the surface material used in this invention In the case of an Mg-containing aluminum alloy, Be may be added in an amount of 50p or less if necessary. Furthermore, for the aluminum alloy of the surface layer material, as with the core material, 0.2% or less T1 is added to refine the ingot crystal grains, or 0.2% or less T1 and 0.04% or less B You may also add.

Next, a preferred method of manufacturing the plate material for electrically conductive parts of electronic and electrical equipment of the present invention will be described.

In manufacturing the plate material for electrically conductive parts of electronic and electrical equipment of the present invention, basically, a rolled plate of a composite material made of the above-mentioned core material and the above-mentioned surface layer material bonded to both sides is heated to 440 to 530°C.
Solution treatment is performed at a cooling rate of ℃/sec or higher, and the processing rate of the subsequent cold working is set to 0 to 50% to obtain a plate material with a final thickness having a surface layer material with a thickness of 8 μm or more per side. It is desirable to further perform a final heat treatment at 100 to 220° C. to the plate material having the final thickness.

A more specific manufacturing method will be explained below.

The core material and the surface material may be joined by a general method, and is not particularly limited, but cladding may normally be performed by hot rolling, warm rolling, or cold rolling. The clad composite material is further rolled as necessary to form a rolled plate intermediate, and then subjected to solution treatment and quenching.

This solution treatment and quenching is a necessary step to increase strength. After solution treatment and quenching in this way,
A rolled plate having a predetermined product thickness is obtained at a cold working rate of θ to 5096. In other words, whether cold working is not performed or even if cold working is performed, 5
The processing rate should be small, below 0%. In general, the plate thickness O
Product board thickness varies by 1 to 1.2 degrees.

Here, as conditions for the solution treatment and quenching of the composite rolled plate intermediate, the solution temperature and the cooling rate during quenching are important. In other words, solution treatment-quenching is
In order to give age hardenability to the aluminum alloy of the core material, elements such as MgCu and Zn of the core material alloy are dissolved in solid solution in advance, and the solution treatment temperature is A7! -C
In both u-Mg system and Al-Zn-Mg system
It is necessary to set the temperature within the range of 440 to 530°C. If the solution treatment temperature is less than 440° C., the subsequent age hardenability and work hardenability will deteriorate, making it impossible to obtain sufficient strength.

On the other hand, if the solution treatment temperature exceeds 530°C, eutectic melting will occur, which is undesirable. For AlCu-Mg alloy, the temperature is 4!10~530℃, and for Al-ZnMg alloy, it is 4.
40-500°C is preferred. Further, the holding time at the solution treatment temperature varies depending on the plate 1'F, but if the plate thickness is 1 mm or less, holding for 40 minutes or less is sufficient. Cooling (quenching) after holding at the solution treatment temperature is performed at a cooling rate of 1°C/see or higher.

If the cooling rate is less than 1°C/sec, age hardening will be low and work hardening will also be low, making it impossible to obtain sufficient strength, so it is necessary to set the cooling rate to 1°C/see or higher. Note that when performing this solution treatment on a coil-shaped composite rolled plate intermediate, a continuous annealing furnace is normally used, but in the case of continuous annealing, the cooling rate is 1°C even if the holding time is short. / or more, the subsequent age hardenability and work hardenability will not be significantly impaired.

After solution treatment and quenching, it may be used as a product sheet as is, but if necessary, cold rolling or leveling may be applied to increase the strength or correct distortion during quenching. Can be processed. however,
Excessive cold working will reduce bendability, so the cold working ratio after solution treatment and quenching must be within the range of 0 to 50%.

Regarding the strength of the final rolled plate, the tensile strength is 35kgf in order to obtain performance equivalent to or higher than that of conventional 42 alloy or Cu-based alloy plate materials for electrically conductive parts of electronic and electrical equipment such as lead frames.
/- or more, repeated bending 3 times] 2 is required, but in the case of an aluminum-based alloy composite plate made by the above method,
It is possible to sufficiently satisfy the values for both strength and repeated bending property, and also to obtain sufficient corrosion resistance and bonding properties.

In order to further improve the repeat bendability, it is preferable to perform final annealing at 100 to 220° C. after the final plate thickness is achieved with a cold working rate of 0 to 50%, such as in a double series. If the final annealing temperature is less than 100°C, the improvement in ductility is small, and the repeat bendability is not improved much. If the final annealing temperature is over 220°C, the ductility and repeat bendability are improved, but the strength is decreased. Moreover, depending on the temperature, over-aging may occur and the repeated bendability may deteriorate. Therefore, the final annealing must be performed within the range of 100 to 220°C.

Examples Alloys NQI to Na9 having the compositions shown in Table 1 were clad in various combinations by hot rolling as shown in the composite material codes aw in Table 3, and the plate thickness was 3 m (7) W composite. A hot rolled sheet was obtained. The surface material was clad with the same thickness on both sides of the core material. 3? j (A hot rolled composite plate is subjected to -second cold rolling to obtain a rolled plate intermediate with a thickness of 0.30 to 0.75+s, and then subjected to solution treatment and quenching, and then cold worked ( Some parts were not cold worked), and then some were subjected to final annealing, resulting in a composite rolled plate with a thickness of 0.3θ.Detailed manufacturing conditions after hot rolling are shown in Table 2. show.

Table 3 shows the results of examining the tensile strength, repeated bending properties, bonding properties, and corrosion resistance of each composite rolled plate obtained. Table 3 also shows the thickness of the surface layer material (one side).

Here, the tensile test was conducted after being left at room temperature for 7 times after solution treatment. In addition, when there was a final annealing, the final annealing was performed after being left at room temperature for 7 days after the solution treatment, and the tensile test was performed.

Moreover, the repeated bendability was evaluated by the number of times of 906 bends.

However, bending from 08° to 90° was counted as one time, and bending from 90° to 08° was also counted as one time. It is practically sufficient if the number of times of repeated bending is three or more times.

Furthermore, bonding properties were evaluated by bonding to an aluminum surface without silver plating at 200° C. using a thermocompression bonding method combined with ultrasonic waves using a commercially available bonder, and the bonding strength was evaluated. That is, bonding strength of 8 g or more was rated as ○, bonding strength of 5 g or more and less than 8 g was rated as Δ, and bonding strength of less than 5 g was rated as ×.

Corrosion resistance was also evaluated by conducting a salt spray test.

ADVANTAGEOUS EFFECTS OF THE INVENTION The plate material for electrically conductive parts of electronic and electrical equipment of the present invention has high strength and excellent repeat bendability, as well as good corrosion resistance and bonding properties. Therefore, these characteristics are required for ICS′l! It is ideal as a lead frame material for conductors and a plate material for electrically conductive parts of electronic and electrical equipment such as switches and connectors. In particular, if the plate material of the present invention is used as a lead frame when wire bonding is performed using Al wire in a lead frame, there is no need to apply gold plating, silver plating, etc. to the semiconductor element mounting part and the wire connection part, and the wire can be bonded as is. Bonding is now possible for semiconductor devices! There is also the benefit of being able to make Kokichi, which further lowers the cost of 2-zo.

Claims (5)

[Claims] (1) An aluminum alloy plate with a tensile strength of 40 kgf/mm^2 or more is used as a core material, and both sides of the core material are coated with Mg
An electronic device characterized by having a surface layer material made of an aluminum alloy containing one or two of 0.5 to 5.0 wt% Mn and 0.1 to 1.5 wt% Mn bonded to a thickness of 8 μm or more per side. Board material for equipment conductive parts. (2) The aluminum alloy of the core material is Cu0.5-5
．． 2. The plate material for electrically conductive parts of electronic and electrical equipment according to claim 1, which contains 0 wt% of Mg and 0.2 to 2.0 wt% of Mg, with the remainder consisting of Al and unavoidable impurities. (3) The aluminum alloy of the core material is Cu0.5-5
．． 0 wt%, Mg 0.2 to 2.0 wt%, and further contains Mn 1.0 wt% or less, Cr 0.3 wt% or less, Zr
0.3wt% or less, V0.3wt% or less, Ni5.7w
2. The plate material for electrically conductive parts of electronic and electrical equipment according to claim 1, which contains one or more of t% or less, with the remainder consisting of Al and unavoidable impurities. (4) The aluminum alloy of the core material is Zn2.0-7
．． 2. The plate material for electrically conductive parts of electronic and electrical equipment according to claim 1, which contains 0 wt% and 1.0 to 3.5 wt% of Mg, with the remainder consisting of Al and unavoidable impurities. (5) The aluminum alloy of the core material has Zn2.0 to 7
．． 0wt%, Mg1.0 to 3.5wt%, and further contains Cu2.5wt% or less, Mn1.0wt% or less, Cr
0.3wt% or less, Zr0.3wt% or less, V0.3w
t% or less, one or two of Ni5.7wt% or less
2. The plate material for electrically conductive parts of electronic and electrical equipment according to claim 1, wherein the plate material contains Al or more and the remainder consists of Al and unavoidable impurities.