JPH0321962Y2 - - Google Patents
Info
- Publication number
- JPH0321962Y2 JPH0321962Y2 JP1982132897U JP13289782U JPH0321962Y2 JP H0321962 Y2 JPH0321962 Y2 JP H0321962Y2 JP 1982132897 U JP1982132897 U JP 1982132897U JP 13289782 U JP13289782 U JP 13289782U JP H0321962 Y2 JPH0321962 Y2 JP H0321962Y2
- Authority
- JP
- Japan
- Prior art keywords
- head body
- recess
- head
- thermal print
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electronic Switches (AREA)
Description
【考案の詳細な説明】 本考案はサーマルプリントヘツドに関する。[Detailed explanation of the idea] The present invention relates to a thermal print head.
サーマルプリントヘツドは使用時に発熱を伴う
ので、通常、アルミニウム板等の放熱板に取り付
けられた状態で用いられる。 Since thermal print heads generate heat during use, they are usually used while being attached to a heat sink such as an aluminum plate.
第1図は従来のサーマルプリントヘツドが放熱
板に取り付けられた状態を示す説明図であり、同
図イはその斜視図、同図ロは部分断面図である。
第1図において、1はサーマルプリントヘツドの
ヘツド本体であり、このヘツド本体1は矩形状の
セラミツク基板上に図示しない発熱体及びその配
線等が印刷形成され、その表面は外部接続端子部
を除き保護膜で覆われている。2は例えば表面処
理されたアルミニウム板よりなる放熱板であり、
この放熱板2に前記ヘツド本体1が例えばエポキ
シ系の接着剤3によつて貼着固定される。 FIG. 1 is an explanatory diagram showing a state in which a conventional thermal print head is attached to a heat dissipation plate, and FIG. 1A is a perspective view thereof, and FIG. 1B is a partial sectional view.
In Fig. 1, reference numeral 1 denotes a head body of a thermal print head, and this head body 1 has a heating element (not shown) and its wiring formed on a rectangular ceramic substrate by printing, and its surface is covered with the exception of external connection terminals. covered with a protective film. 2 is a heat sink made of, for example, a surface-treated aluminum plate;
The head body 1 is adhered and fixed to the heat radiation plate 2 with, for example, an epoxy adhesive 3.
しかしながら、従来の放熱板にあつては、前述
したヘツド本体1の貼着の際に、余剰の接着剤が
はみ出して、第1図ロに示す如くヘツド本体1の
側辺に盛り上り部3′を生じる。この接着剤の盛
り上り部3′はヘツド本体1の表面(特に発熱体)
と図示しない感熱紙との良好な密着を妨げ、印字
不良を招来させる。そのため、このような盛り上
り部3′は除去しなければならないので、従来の
放熱板はサーマルプリンタの製造を煩雑にすると
いう欠点を有している。 However, in the case of the conventional heat sink, when the head body 1 is attached as described above, excess adhesive is squeezed out and a raised portion 3' is formed on the side of the head body 1 as shown in FIG. 1B. occurs. The raised part 3' of this adhesive is the surface of the head body 1 (especially the heating element).
This prevents good adhesion between the paper and the thermal paper (not shown), resulting in poor printing. Therefore, since such raised portion 3' must be removed, the conventional heat sink has the disadvantage of complicating the manufacture of the thermal printer.
また、従来の放熱板2は、ヘツド本体1を取り
付けるための位置決め手段がないので、ヘツド本
体1の位置決めが困難であり、そのためヘツド本
体1の取り付け位置にバラツキが生じ易いという
欠点をも有している。 Furthermore, the conventional heat sink 2 has the disadvantage that it is difficult to position the head body 1 because it does not have a positioning means for attaching the head body 1, and therefore the attachment position of the head body 1 is likely to vary. ing.
本考案は上記欠点を排除するためになされたも
ので、ヘツド本体を貼着する際に、余剰の接着剤
がはみ出すことのないサーマルプリントヘツドを
提供することを目的としている。 The present invention has been devised to eliminate the above-mentioned drawbacks, and its object is to provide a thermal print head in which excess adhesive does not ooze out when the head body is attached.
また、本考案の他の目的はヘツド本体を貼着す
るときの位置決めを容易、迅速かつ正確に行いう
るサーマルプリントヘツドを提供することにあ
る。 Another object of the present invention is to provide a thermal print head that allows easy, quick, and accurate positioning of the head body when it is attached.
そして、そのために本考案に係るサーマルプリ
ントヘツドは、放熱板の表面長手方向にヘツド本
体の巾より大きい巾で、且つ、ヘツド本体の厚み
よりも浅い深さの凹部を形成し、該凹部の底面両
側に、該両側の面と平行に延設された断面U字状
の細溝を形成し、前記凹部の底面に接着剤を介し
て前記ヘツド本体を貼着してなることを特徴とし
ている。 To this end, the thermal print head according to the present invention has a recess formed in the longitudinal direction of the surface of the heat dissipation plate with a width larger than the width of the head main body and a depth shallower than the thickness of the head main body, and the bottom surface of the recess The device is characterized in that a thin groove with a U-shaped cross section is formed on both sides and extends parallel to the surfaces on both sides, and the head main body is adhered to the bottom surface of the recess via an adhesive.
以下、本考案の実施例を図面をもとに説明す
る。第2図は本実施例のサーマルプリントヘツド
の説明図であり、同図イは斜視図、同図ロはその
部分断面図である。 Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is an explanatory view of the thermal print head of this embodiment, in which A is a perspective view and B is a partial sectional view thereof.
第2図に於て、1はヘツド本体で、第1図の従
来例に示すヘツド本体と変らない。4は放熱板
で、例えば表面処理が施されたアルミニウム板よ
りなつている。5は前記放熱板4の表面にその長
さ方向に設けられた凹部で、この凹部は前記ヘツ
ド本体1の巾よりも若干大きい巾で、ヘツド本体
1の厚さより浅い深さに形成されると共に、この
凹部5の底面両側には該両側の面に平行に延設さ
れた断面U字状の細溝6が設けられている。そし
て、ヘツド本体1は前記放熱板4に設けられた凹
部5の底面に接着剤3を介して貼着されている。 In FIG. 2, reference numeral 1 denotes a head body, which is the same as the head body shown in the conventional example of FIG. Reference numeral 4 denotes a heat sink, which is made of, for example, a surface-treated aluminum plate. Reference numeral 5 denotes a recess provided on the surface of the heat dissipation plate 4 in its length direction, and this recess is formed to have a width slightly larger than the width of the head main body 1 and a depth shallower than the thickness of the head main body 1. A narrow groove 6 having a U-shaped cross section is provided on both sides of the bottom surface of the recess 5 and extending parallel to both surfaces. The head body 1 is adhered to the bottom surface of a recess 5 provided in the heat sink 4 with an adhesive 3 interposed therebetween.
次に、本実施例の作用について説明する。ヘツ
ド本体1は放熱板4の凹部5に嵌合されて迅速か
つ正確に位置決めされ、凹部5の底面に接着剤3
で貼着される。そして、余剰の接着剤3は細溝6
に流れ込んで細溝6内に溜まる。細溝6を例えば
ヘツド本体1の長さよりも長く形成しておけば、
余剰の接着剤3が極めて多い場合であつても充分
この細溝6内に収納される。 Next, the operation of this embodiment will be explained. The head body 1 is fitted into the recess 5 of the heat sink 4 and positioned quickly and accurately, and an adhesive 3 is applied to the bottom of the recess 5.
It is pasted with. Then, the excess adhesive 3 is removed from the narrow groove 6.
and accumulates in the narrow groove 6. For example, if the narrow groove 6 is formed longer than the length of the head body 1,
Even if there is an extremely large amount of excess adhesive 3, it can be sufficiently accommodated within this narrow groove 6.
従つて、本考案のサーマルプリントヘツドにお
いては、余剰の接着剤がはみ出してヘツド本体の
側辺に接着剤の盛り上り部を生じることはない。
また、ヘツド本体を放熱板の凹部に嵌合すること
によりヘツド本体の位置決めが行われるので、ヘ
ツド本体の位置決めを迅速かつ正確に行うことが
できる。 Therefore, in the thermal print head of the present invention, excess adhesive does not protrude and create adhesive bulges on the sides of the head body.
Further, since the head body is positioned by fitting the head body into the recess of the heat sink, the head body can be positioned quickly and accurately.
第1図は従来のサーマルプリントヘツドが放熱
板に取り付けられた状態を示す説明図であり、同
図イはその斜視図、同図ロは部分断面図である。
第2図は本実施例のサーマルプリントヘツドの説
明図であり、同図イは斜視図、同図ロはその部分
断面図である。
1……ヘツド本体、3……接着剤、4……放熱
板、5……凹部、6……細溝。
FIG. 1 is an explanatory diagram showing a state in which a conventional thermal print head is attached to a heat dissipation plate, and FIG. 1A is a perspective view thereof, and FIG. 1B is a partial sectional view.
FIG. 2 is an explanatory view of the thermal print head of this embodiment, in which A is a perspective view and B is a partial sectional view thereof. 1... Head main body, 3... Adhesive, 4... Heat sink, 5... Recess, 6... Thin groove.
Claims (1)
れた凹部であつて、該凹部は、その巾が該凹部の
底面に貼着されるヘツド本体の巾より若干大き
く、且つ、その深さは前記ヘツド本体の厚さより
浅く、更に該凹部の巾方向の底面両側に該両側の
面と平行に延設された断面U字状の細溝が設けら
れてなり、該凹部の底面に接着剤により前記ヘツ
ド本体を貼着してなることを特徴とするサーマル
プリントヘツド。 A recess provided on the surface of the heat dissipation plate along its length, the width of the recess being slightly larger than the width of the head body attached to the bottom of the recess, and the depth of the recess being is shallower than the thickness of the head body, and is further provided on both sides of the bottom surface in the width direction of the recessed portion with a U-shaped cross section extending parallel to both surfaces, and an adhesive is applied to the bottom surface of the recessed portion. A thermal print head, characterized in that the head body is attached to the head body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13289782U JPS5938052U (en) | 1982-08-31 | 1982-08-31 | Thermal print head heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13289782U JPS5938052U (en) | 1982-08-31 | 1982-08-31 | Thermal print head heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5938052U JPS5938052U (en) | 1984-03-10 |
| JPH0321962Y2 true JPH0321962Y2 (en) | 1991-05-14 |
Family
ID=30299966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13289782U Granted JPS5938052U (en) | 1982-08-31 | 1982-08-31 | Thermal print head heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938052U (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0539891Y2 (en) * | 1985-02-21 | 1993-10-08 | ||
| JPH0611794Y2 (en) * | 1985-02-21 | 1994-03-30 | ロ−ム株式会社 | Thermal print head |
| JPS63221055A (en) * | 1987-03-10 | 1988-09-14 | Rohm Co Ltd | Line type thermal head |
| JPH0611545B2 (en) * | 1987-04-09 | 1994-02-16 | ロ−ム株式会社 | Thermal print head |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4318738Y1 (en) * | 1964-03-25 | 1968-08-03 | ||
| JPS557830B2 (en) * | 1973-12-29 | 1980-02-28 | ||
| JPS5180287U (en) * | 1974-12-20 | 1976-06-25 | ||
| JPS5199534A (en) * | 1975-02-27 | 1976-09-02 | Matsushita Electric Industrial Co Ltd | |
| JPS5851831B2 (en) * | 1976-08-18 | 1983-11-18 | 松下電器産業株式会社 | Thermal head device |
| JPS55159139U (en) * | 1979-05-01 | 1980-11-15 | ||
| JPS5724272A (en) * | 1980-07-18 | 1982-02-08 | Ricoh Co Ltd | Thermal head |
-
1982
- 1982-08-31 JP JP13289782U patent/JPS5938052U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5938052U (en) | 1984-03-10 |
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