JPH03219966A - thermal print head - Google Patents

thermal print head

Info

Publication number
JPH03219966A
JPH03219966A JP1529990A JP1529990A JPH03219966A JP H03219966 A JPH03219966 A JP H03219966A JP 1529990 A JP1529990 A JP 1529990A JP 1529990 A JP1529990 A JP 1529990A JP H03219966 A JPH03219966 A JP H03219966A
Authority
JP
Japan
Prior art keywords
print head
thermal print
fpc
head
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1529990A
Other languages
Japanese (ja)
Inventor
Hideaki Sonehara
秀明 曽根原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP1529990A priority Critical patent/JPH03219966A/en
Publication of JPH03219966A publication Critical patent/JPH03219966A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Electronic Switches (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 ［産業上の利用分野１ 本発明は、サーマルプリンタや、ファクシミリに用いる
サーマルプリントヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a thermal print head used in a thermal printer or facsimile.

［従来の技術］ 従来のサーマルプリントヘッドの構造は、第４図に示す
ように、フレキシブル回路基板は、折り込まれずに使わ
れていた。[Prior Art] In the structure of a conventional thermal print head, as shown in FIG. 4, a flexible circuit board is used without being folded.

［発明が解決しようとする課題］ しかしながら、第４図の様な構造のヘッドでは、ヘッド
サイズは、フレキシブル回路基板（以下、ＦＰＣと称す
。）のサイズに規制されてしまい、特に回路パターンが
複雑になるとＦＰＣＯサイズが大きくなりヘッドを小型
化するには、ＦＰＣ上に形成される回路パターンを厚く
したり、３層ＦＰＣ等特殊な物を使用しなくてはならず
ヘットコストのアップにつながっていた。[Problems to be Solved by the Invention] However, in a head with a structure as shown in FIG. As a result, the FPCO size increases, and in order to miniaturize the head, it is necessary to thicken the circuit pattern formed on the FPC or use special materials such as 3-layer FPC, which leads to an increase in head cost. Ta.

［ｉ１題を解決するための手段１ 上記問題点を解決するために本発明のサーマルプリント
ヘッドは、従来のＦＰＣで、面積の大きくなった分を保
護カバーの内側に折り込んだ事を特徴とする。[Means for solving problem i1 1 In order to solve the above problems, the thermal print head of the present invention is characterized in that the larger area of the conventional FPC is folded inside the protective cover. .

［実施例１ 第１図は、本発明のサーマルプリントヘッドの断面図で
ある。[Example 1] FIG. 1 is a sectional view of a thermal print head of the present invention.

第１図に於て、　　サーマルプリントヘッドチップ２に
ＦＰＣＩが保護カバー４側に折り込まれ、保護カバー４
により圧接されている。In Figure 1, the FPCI is folded into the thermal print head chip 2 toward the protective cover 4 side, and the protective cover 4
are pressed together.

ここで、サーマルプリントヘッドチップ２とＦＰＣｌと
の接続方式には、直に半田付けする方式や、保護カバー
４でシリコンゴム等の柔軟性のある材料７を介して圧接
する方式が考えられる。Here, the method of connecting the thermal print head chip 2 and the FPCl may be a method of direct soldering or a method of pressure contact with the protective cover 4 through a flexible material 7 such as silicone rubber.

ここで、熱膨張係数等の違いなどを考慮すると圧接する
方式の方が長期信頼性には優れている。Here, when considering differences in thermal expansion coefficients, etc., the pressure welding method is superior in long-term reliability.

また、第２図は、ＦＰＣ１の上面図で、９はサーマルプ
リントヘッドチップとの接続領域で、８はＦＰＣの折り
込みラインである。このＦＰＣは、素材がポリエステル
や、ポリイミド等の柔軟性のある材料を使用する必要が
ある。Further, FIG. 2 is a top view of the FPC 1, where 9 is a connection area with a thermal print head chip, and 8 is a folding line of the FPC. This FPC requires the use of a flexible material such as polyester or polyimide.

本発明では、パターン引き回し上、特に重要なサーマル
ヘッドの電源ライン幅の確保に主眼を置いて試作を行っ
た。In the present invention, trial production was carried out with a focus on ensuring the width of the power supply line of the thermal head, which is particularly important for pattern routing.

サーマルプリントヘッドは、特に主走査方向にヘッドサ
イズが大きくなると電源ラインの抵抗値が大きくなり、
多数ドツト同時印字すると電流容量が足りなくなり印字
濃度が薄くなってしまう。For thermal print heads, as the head size increases, especially in the main scanning direction, the resistance value of the power supply line increases.
When multiple dots are printed simultaneously, the current capacity becomes insufficient and the print density becomes thin.

その為、電源ラインは極力太く設計するのがセオリーで
ある。Therefore, the theory is to design the power line as thick as possible.

第２図に於いて所望のヘッドサイズより決定されるＦＰ
ＣＯ幅より大きくなる領域１１に電源ライン１０を形成
した。これによれば、電源ライン１０は、他の信号ライ
ンが多少複雑になっても所望の電源ライン幅は確保され
る。FP determined from the desired head size in Figure 2
A power supply line 10 was formed in a region 11 that was larger than the CO width. According to this, the desired power supply line width can be secured for the power supply line 10 even if other signal lines become somewhat complicated.

又、第３図に本発明の実施例を示した。Further, FIG. 3 shows an embodiment of the present invention.

第３図に於いて１２は、貫通孔である。この貫通孔は、
ＦＰＣを折り曲げ易くする目的と、サーマルプリントヘ
ッドチップとの接続前分を見易くし、接続精度の向上を
目的として形成した物である。In FIG. 3, 12 is a through hole. This through hole is
It was formed to make the FPC easier to bend, to make it easier to see the part before connection to the thermal print head chip, and to improve connection accuracy.

この貫通孔は、ＦＰＣ製造時に・ポリエステルや、ポリ
イミド等の素材に銅箔等の導体を張り付ける前にプレス
により打ち抜いても良いし、又、ＦＰＣとして製造した
後、最後にプレスなどで打ち抜いても良い。These through-holes can be punched out using a press during FPC manufacturing, before attaching a conductor such as copper foil to a material such as polyester or polyimide, or they can be punched out using a press at the end after manufacturing the FPC. Also good.

（比較例） 下表は、本発明によるヘッドと、他の方式とのコスト比
較をしたものである。(Comparative Example) The table below shows a cost comparison between the head according to the present invention and other systems.

比較例 〔発明の効果〕 以上説明してきたように、ＦＰＣの一部を保護カバーの
内側に折り込む事により、主走査方向にヘッドサイズが
大きくなっても、ヘッドの幅をコストを余りアップさせ
る事なく狭くできる。Comparative Example [Effects of the Invention] As explained above, by folding a part of the FPC inside the protective cover, even if the head size increases in the main scanning direction, the width of the head can be increased without increasing the cost. It can be made narrower without any problem.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明のサーマルプリントヘッドの断面を示
す図。 第２図は、本発明のサーマルプリントヘッドのＦＰＣの
上面構造を示す図。 第３図（ａ）、　（ｂ）は、本発明の実施例を示す図。 第４図は、従来のサーマルプリントヘッドの構造を示す
図。 （本発明ＦＰＣコストを１としたときの比率）１　・　
・　・　ＦＰＣ ２・・・サーマルプリントへッドチツ ４・・・保護カバー ５・・・とめネジ ・固定板 ・ゴム ・折り込みライン ・接続領域 ・電源ライン ・折り込み領域 ・貫通孔 以上 出願人セイコーエプソン株式会社 代理人弁理土鈴木喜三部（化１名） ＬＱ） （ｂ） 第３因 第１図 第２図 第４図FIG. 1 is a diagram showing a cross section of a thermal print head of the present invention. FIG. 2 is a diagram showing the top structure of the FPC of the thermal print head of the present invention. FIGS. 3(a) and 3(b) are diagrams showing an embodiment of the present invention. FIG. 4 is a diagram showing the structure of a conventional thermal print head. (Ratio when the FPC cost of the present invention is set to 1) 1 ・
・ ・ FPC 2... Thermal print head 4... Protective cover 5... Set screw, fixing plate, rubber, folding line, connection area, power line, folding area, through hole and above Applicant: Seiko Epson Corporation Representative Patent Attorney Kizobe Tsuzuki (1 person) LQ) (b) Third cause Figure 1 Figure 2 Figure 4

Claims (1)

【特許請求の範囲】[Claims] 　発熱素子、電極、ドライバーＩＣ等を耐熱性絶縁基板
上に構成してなるサーマルプリントヘッドチップと、プ
リンター本体からの電気信号を前記サーマルプリントヘ
ッドチップに供給するフレキシブル回路基板が電気的に
接続されている構造を有し、前記接続前を保護するカバ
ーと前記サーマルプリントヘッドチップとフレキシブル
回路基板を固定する固定板により構成されてなるサーマ
ルプリントヘッドにおいて、前記フレキシブル回路基板
の一部は、保護カバーの内側に折り込まれている事を特
徴とするサーマルプリントヘッド。A thermal print head chip comprising a heating element, an electrode, a driver IC, etc. on a heat-resistant insulating substrate is electrically connected to a flexible circuit board that supplies electrical signals from the printer main body to the thermal print head chip. In the thermal print head, the thermal print head has a structure that includes a cover that protects the front of the connection, and a fixing plate that fixes the thermal print head chip and the flexible circuit board. Thermal print head is characterized by being folded inside.
JP1529990A 1990-01-25 1990-01-25 thermal print head Pending JPH03219966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1529990A JPH03219966A (en) 1990-01-25 1990-01-25 thermal print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1529990A JPH03219966A (en) 1990-01-25 1990-01-25 thermal print head

Publications (1)

Publication Number Publication Date
JPH03219966A true JPH03219966A (en) 1991-09-27

Family

ID=11884943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1529990A Pending JPH03219966A (en) 1990-01-25 1990-01-25 thermal print head

Country Status (1)

Country Link
JP (1) JPH03219966A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365762B2 (en) * 2002-03-21 2008-04-29 Aps Engineering Thermal printing head comprising a printable tape guiding member, in the form of a protection cover for a flexible control printed circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365762B2 (en) * 2002-03-21 2008-04-29 Aps Engineering Thermal printing head comprising a printable tape guiding member, in the form of a protection cover for a flexible control printed circuit

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