JPH03220701A - Manufacture of resistor array - Google Patents

Abstract

PURPOSE:To perform opposing and touching arrangement of prober needles easily and securely and to enable high-precision trimming processing, by using in common one electrode pattern between both resistor patterns arranged adjoining against the resistor patterns for trimming processing, and by separating after that. CONSTITUTION:Groups of electrode patterns are provided at specified intervals on the surface of an insulating board 1, and groups of resistor patterns spreading over each pair of electrode patterns 2, 2', 2', 2'' adjoining each other and comprising the groups of electrode patterns are provided being separated from each other on the board surface. Trimming processing is performed with required probers 4 opposed and touched, using in common the electrode patterns 2, 2, 2', 2'' spreading over a plurality of those resistor patterns. After that, the electrode patterns 2, 2', 2', 2'' used in common are separated and insulated electrically for each resistor pattern 31, 32. This makes it possible to perform specified opposing and touching, positioning operation easily too, without the necessity of considering special construction or shapes etc., of the prober needles. Besides resistance adjustment by the trimming processing can be accomplished precisely and smoothly.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to an improved method of manufacturing resistor arrays.

(Prior Art) With the increasing density and integration of wiring circuits, not only active elements such as semiconductor elements, but also resistor arrays as passive elements are being developed. That is, as shown in plan in FIG. 4, an insulating substrate, such as an alumina substrate, is used as a support plate, and a pair of electrode patterns 2a, 2b and the electrode patterns 2a, 2b are formed on the main surface thereof.
It is known that resistor patterns 3 are formed across and electrically connected to each other.

The above-mentioned resistor array is generally manufactured as follows. That is, electrode patterns 2a are formed at predetermined intervals on the main surface of an alumina substrate 1 serving as a support plate by, for example, thick film printing.

First, an electrode pattern group consisting of 2b pairs is formed. Next, the resistive pattern 3 is formed by the thick film printing method in such a manner that it straddles the paired electrode patterns 2a and 2b of the formed electrode pattern group and is electrically connected to each other.

Thereafter, each of the formed resistor patterns 3 (resistance pattern group) is subjected to a required trimming process. That is, as shown in plan in FIG.
The so-called 4-terminal measurement method (2 terminals are connected to a constant current source to flow a constant current to resistance pattern 3, and the other 2 terminals are used to measure the voltage drop across resistance pattern 3). The required trimming process is performed sequentially while taking measurements using a voltmeter (a voltmeter is connected to the In this way, a resistor array is obtained by performing a trimming process on the three groups of resistor patterns formed above and adjusting each to a predetermined resistance value.

(Problems to be Solved by the Invention) However, the above method for manufacturing a resistor array has the following practical disadvantages. In other words, if this main resistor array is made smaller or more highly integrated, it will inevitably be necessary to make the electrode patterns 2a and 2b smaller, but this will require a smaller thickness (diameter) of the prober needle 4. There is a limit due to balance.

Further, if the distance between the prober needles 4 that are in contact with the electrode patterns 2a and 2b is set narrowly, alignment becomes difficult and operations become complicated, making it unsuitable for mass production.

The present invention has been made in response to the above-mentioned circumstances, and an object of the present invention is to provide a manufacturing method that allows a desired resistor array to be obtained without requiring complicated operations.

[Structure of the Invention] (Means for Solving the Problems) The present invention includes a step of forming a group of electrode patterns at a predetermined interval on an insulating substrate surface, and a step of forming a group of electrode patterns formed as described above at a predetermined interval. a step of forming a group of resistor patterns spaced apart from each other on the substrate surface spanning a pair of adjacent electrode patterns, and a shape in which the electrode pattern spanning the plurality of formed resistor patterns is shared. The present invention is characterized by comprising a step of performing a trimming process by bringing the required probers into contact with each other, and a step of electrically insulating and separating the shared electrode pattern for each resistor pattern after the trimming process. In other words, the main point of the manufacturing method according to the present invention is to share one electrode pattern between the antibody patterns on both sheets for the trimming process with respect to the resistor patterns disposed adjacent to each other, and then to separate the electrode patterns.

(Function) According to the present invention, in the trimming process for each resistor pattern constituting the resistor array, one electrode pattern between adjacent resistor patterns is shared.

In other words, during the trimming process, two adjacent resistor pattern electrodes are integrated and have a relatively wide area, so the prober needles can be placed in contact with each other easily and reliably. High precision trimming can be performed.

(Example) The following figures 1 to 3 schematically show embodiments of the present invention.
The present invention will be described in detail with reference to the drawings.

First, an insulating substrate such as an alumina substrate 1 is prepared as a support plate, and electrode patterns 2.
2'2'2'... A group of electrode patterns consisting of pairs is formed. Next, electrode patterns 2, 2', 2', 2', and 2', which pair each other of the formed electrode pattern groups are formed.
. . . Each resistor pattern 31'+32
... is formed (Figure 1).

In addition, the above electrode pattern 2.2'2'2'...
- Step of forming electrode pattern groups consisting of pairs and each resistor pattern 3. , 32... in the forming stage, each time or after thick film printing of both patterns, performing a baking treatment at a predetermined temperature, respectively.
This is the same as in the conventional manufacturing method.

After forming the above-mentioned required electrode pattern groups and resistor pattern groups, as shown in plan in FIG. The prober needles 4 are brought into contact with each other in a desired state, and necessary trimming processing is sequentially performed while measuring by a so-called four-terminal measurement method. For example, for the resistor pattern 31, two prober needles 4 are placed in contact with the electrode patterns 2, 2', and for the resistor pattern 32, two proper needles 4 are placed in each of the electrode patterns 2', 2'. Each resistor pattern 3. is sequentially trimmed in a facing manner. , 32... are adjusted as required.

After adjusting the resistance of each resistor pattern 31, 32... as described above, the resistor patterns 31, 32...
The electrode patterns 2'2', which are shared by the electrode patterns 2', 2', and so on, are separated into two parts by, for example, irradiation and scanning with a laser beam. In other words, as shown in plan in Figure 3,
an electrode pattern 2' shared during the trimming process;
2'... for each resistor pattern 3. , 32 . . . by separating and insulating the resistors 5 into electrodes corresponding to the resistor arrays.

In the above, an example was shown in which the so-called thick film printing method was used to manufacture the resistor array, but each electrode pattern 2 could be formed by other means, such as a combination of thin film formation by vapor deposition and etching or laser beam cutting. ′, 2″・
...and each resistor pattern 3. , 32... may be formed. Further, the insulating substrate used as the support plate is not limited to the alumina substrate, and may be, for example, an aluminum nitride substrate or a metal core insulating substrate.

[Effects of the Invention] As can be seen from the above description, according to the method for manufacturing a resistor array according to the present invention, in the trimming process step for each resistor pattern, one electrode of mutually adjacent resistor patterns is integrated. . That is, even when the intended resistor array is small, one electrode of adjacent resistor patterns is shared (common) with each other, and has a relatively large area in plan view. Therefore, predetermined abutting and positioning can be easily performed without the need to consider a special structure or shape of the prober needle, and resistance adjustment by trimming can also be achieved accurately and smoothly. Thus, the method of the present invention can be said to be a means suitable for manufacturing resistor arrays that require miniaturization.

[Brief explanation of drawings]

1, 2 and 3 are plan views schematically showing an embodiment of the method for manufacturing a resistor array according to the present invention in order of steps, and FIGS. 4 and 5 are conventional methods for manufacturing a resistor array. FIG. 3 is a plan view schematically showing an example of the embodiment in the order of steps. 1... Insulating substrate (alumina substrate, etc.) 2.2
'2'... Electrode pattern 31.32...
...Resistor pattern 4...Prober needle

Claims (1)

[Claims] A step of forming electrode pattern groups at predetermined intervals on an insulating substrate surface; a step of forming a group of resistor patterns so as to be separated from each other; and a step of performing a trimming process by bringing the required prober needles into contact with each other so that the plurality of resistor patterns thus formed share the straddling electrode pattern. A method for manufacturing a resistor array, comprising the steps of: electrically insulating and separating the shared electrode pattern for each resistor pattern after the trimming process.