JPH03220738A - Manufacturing equipment for resin-encapsulated semiconductor devices - Google Patents

Abstract

PURPOSE:To control the position of a die pad by installing a die pad position control means, which controls the position of the die pad, located below the die pad and inside a mold. CONSTITUTION:An attempt is made to install a die pad 2 on which a semicon ductor element 1 to be resin-sealed is placed, a lead frame 5 obtained by electri cally connecting the semiconductor element 1 and a lead by wire bonding by way of a gold wire 3, and an upper mold 6. A further attempt is made to install a lower mold 4 installed in conformity with the upper mold 6 and designed to place the die pad 2 and the lead frame 5 thereon and die pad position control means 10 and 11, which are located below the die pad 2 within the lower mold 4 and designed to control the position of the die pad as well. This construction makes it possible to control the position of the die pad and embody stable manufacturing of the die pad whose thickness is 1.27mm and below.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Technology] The present invention relates to an apparatus for manufacturing a resin-sealed semiconductor device.

[Prior Art] FIG. 3 is a sectional view showing a conventional resin-sealed semiconductor device. In the figure, (1) is a semiconductor element, (2) is a die pad on which this semiconductor element (1) is placed, (3) is a gold wire connecting the semiconductor element (1) and a lead (not shown), (
4) is the lower mold on which the die pad (2) is placed, and (5) is the lead obtained by electrically connecting the semiconductor element (1) and the lead via the gold wire (3) by wire bonding. frame, (6) is an upper mold provided corresponding to the lower mold (4), (7) is a gate provided in this upper mold (6) and serves as a passage for injecting molding resin, which will be described later; (8) is this mold resin, and (9) is a cavity as a mold for the mold resin (8) formed between the upper mold (6) and lower mold (4) after they are clamped at a constant pressure. be.

A conventional manufacturing apparatus for a resin-sealed semiconductor device is configured as described above, and includes a die pad (2) on which a semiconductor element (1) is placed, and a gold wire (3) that connects the semiconductor element (1) and leads.
The lead frame (5), which has been electrically connected and has undergone wire bonding, is placed on the lower mold (4). next,
The lower mold (4) and upper mold (6) are clamped under constant pressure. As a result, a cavity (9) that serves as a mold for the mold resin (8) and a gate (7) that serves as a passage for injecting the mold resin (8) into the cavity (9) are formed. Here, the thickness of the cavity (9) is also designed to be 1.27 mm or less so that the overall thickness of the resin-sealed semiconductor device after assembly is 1.27 mm or less. Next, mold resin (8) that has been melted and has a low viscosity
is injected into the cavity (9) through the gate (7). This mold resin (8) is injected in upper and lower parts around the semiconductor element (1) and die pad (2), and is finally injected when the cavity (9) is completely filled with the mold resin (8). is completed.

[Problems to be Solved by the Invention] In the conventional resin-encapsulated semiconductor device manufacturing apparatus as described above, the flow behavior of the mold resin (8) within the cavity (9) depends on the thickness of the flow path. The smaller the thickness, the more difficult it becomes for the mold resin (8) to flow. Now, the displacement of die pad (2) is 0.1m before injection of mold resin (8).
m, the cavity thickness is 1.0 mm, the semiconductor element thickness is 0.4 mm+, and the die pad thickness is 0.10 mm, then the channel thickness ratio of the upper and lower cavities (9) is 2, and the cavity thickness is 2. 6 mm, the semiconductor element thickness is 0.4 mm, and the type plate thickness is 0.2 mm, the channel thickness ratio is 2. Therefore, the smaller the cavity thickness, the more susceptible it is to die pad fluctuations before molding, and the mold resin (8)
The injection balance is easily disrupted. If the injection balance is disrupted in this way, voids may occur or die pads (2
) itself was subject to large displacement due to the flow pressure of the mold resin (8).

This invention was made to solve these problems, and provides an apparatus that can control the die pad position and stably manufacture resin-sealed semiconductor devices with an overall thickness of 1.27 mm or less. The purpose is to obtain.

[Means for Solving the Problems] A manufacturing apparatus for a resin-sealed semiconductor device according to the present invention includes die pad position detection means provided in a lower mold below the die pad and detecting the position of the die pad, In addition to the die pad position detection means, a die pad position detection means is provided for detecting the position of the die pad and supplying a detection signal thereof to the die pad position control means.

[Function] In this invention, the die pad positions in the upper and lower molds are
The die pad position control means provided below the die pad can arbitrarily control the displacement before and during injection of the mold resin. Similarly, the die pad position detection means provided in the lower mold can detect changes in the die pad position in real time before or during mold resin injection, and by supplying this information to the die pad position control means, the die pad position can be detected. Optimal settings can be made at all times.

[Embodiments] FIGS. 1 and 2 are cross-sectional views showing each embodiment of the present invention, and (1) to (9) are exactly the same as those in the conventional device described above. (10) is a movable pin provided in the lower mold (4) below the die pad (2) and controls the position of the die pad (2); (11) is this movable pin (10);
). This is a movable pin control section, and these movable pins (10) and movable pin control section (11) serve as die pad position control means. (12) is a position detection sensor provided in the lower mold (4) and detects the position of the tiepan nod (2), and (13) is connected to this position detection sensor (12) and the movable pin control section (11). , a feedback control section receives the die pad position detection signal from the position detection sensor (12) and feeds it back to the movable pin control section (11) to control the movable pin 00), and these position detection sensors (12) The phytoback control section (13) serves as die pad position detection means.

In the resin-sealed semiconductor device manufacturing apparatus configured as described above, a die pad (2) and a lid frame (
5) is placed on the lower mold (4), and then the lower mold (4) is clamped together with the second mold (6). At this point, the amount of retraction of the die pad (2) is controlled in advance so that the die pad (2) is slightly above the midpoint of the cavity (9). After clamping the upper mold (6) and lower mold (4),
The movable pin (10) is pushed up and brought into contact with the die pad (2), controlled so that the die pad (2) is at the midpoint, and then the mold resin (8) is injected. Mold resin (8
) is completed, the movable pin (10) is moved back before the mold resin (8) has hardened and its viscosity has increased. On the other hand, a die pad position detection sensor (12) provided in the lower mold (4) constantly monitors and detects the position of the die pad (2) before and during injection of the mold resin (8). Position detection sensor (12) and die pad (
2) The detection signal is fed back to the movable pin (10) via the phytoback control unit (13) and the movable pin control unit (11) so that the distance becomes the set value, and the typer.

control so that the position of the door (2) is optimal.

[Effects of the Invention] As explained above, the present invention provides die pad position control means for controlling the die pad position in the lower mold below the die pad, and in addition to this die pad position control means, it controls the position of the tie pad. By providing a die pad position detection means in the lower mold, displacement of the tie pad can be reduced, and the position of the die pad can be further feedback controlled by detecting the tie pad position in real time. This has the effect of allowing sealed semiconductor devices to be manufactured stably and with high precision at a high yield.

[Brief explanation of drawings]

1 and 2 are cross-sectional views of each embodiment of the present invention, and FIG. 3 is a cross-sectional view showing a conventional resin-sealed semiconductor device manufacturing apparatus. In the figure, (1) is a semiconductor element, (2) is a die pad, (3) is a gold wire, (4) is a lower mold, (5) a beam dome, (6) is an upper mold, and (8) is a lower mold. ) is mold resin, (lO
) is a movable pin, (11) is a movable pin control section, (12) is a position detection sensor, and (13) is a foot bank control section. In each figure, the same reference numerals indicate the same or corresponding parts. Agent Dosho Soga 3 - Gold wire 6 - Upper mold 1o - Movable bottle

Claims (1)

[Claims] (1) A die pad on which a semiconductor element to be resin-sealed is mounted, a lead frame obtained by electrically connecting the semiconductor element and leads by wire bonding via a gold wire, and an upper mold; a lower mold provided corresponding to the upper mold and on which the die pad and the lead frame are placed; and a die pad position provided in the lower mold below the die pad and controlling the position of the die pad. 1. A manufacturing apparatus for a resin-sealed semiconductor device, comprising: a control means.