JPH03220754A - Circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a circuit board on which so-called paired chip semiconductor elements are mounted.

(Prior Art) A paired chip semiconductor element such as a memory element is mounted on a die pad, and is operated by applying a voltage from the die pad.

By the way, the potential of the operating voltage of the paired chip semiconductor device differs depending on the type of the paired chip semiconductor device. For this reason,
In conventional circuit boards, at the time of designing the circuit board, a power supply, a ground, etc. are connected to a die pad on which a paired chip semiconductor element is mounted using a wiring pattern according to the potential of the operating voltage.

(Problem to be Solved by the Invention) However, when supplying voltage to a paired chip semiconductor element in this way, when changing the paired chip semiconductor element, it is only possible to use one that has the same potential as the paired chip semiconductor element before the change. could not. Also, when using a pair chip semiconductor element with a different potential than the original pair chip semiconductor element,
It was necessary to change the design of the wiring pattern.

The present invention was developed based on the above circumstances, and an object of the present invention is to provide a circuit board that can be changed to a semiconductor element having a different potential operating voltage without changing the design of the wiring pattern. .

[Structure of the Invention (Means for Solving the Problems) In order to solve the above problems, the present invention provides a circuit board on which a semiconductor element is mounted on a die pad and operates by applying a voltage from the die pad. , a voltage application connection terminal led out from the die pad, and a plurality of voltage supply connection terminals that are adjacent to the voltage application connection terminal and supply voltages of different potentials, and the voltage application connection terminal and the semiconductor It is connected to one of the voltage supply connection terminals that supplies a voltage at a potential corresponding to the operating voltage of the element.

(Function) In the present invention, when the mounted semiconductor element is changed to a semiconductor element with an operating voltage of a different potential, a voltage supply connection terminal that supplies a voltage corresponding to the operating voltage potential is selected, and this The voltage supply connection terminal and the voltage application connection terminal may be connected by wire bonding, for example. Therefore, it is possible to change to a semiconductor element with a different potential operating voltage without changing the design of the wiring pattern.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a portion of a circuit board according to an embodiment of the present invention.

In the figure, 1 indicates a die pad on which a paired chip semiconductor element such as a memory element is mounted.

A voltage application bonding pad 2 is provided to protrude from one side of the die pad 1. A voltage supplying pad 3 having a ground potential and a voltage supplying pad 4 having a power supply potential are provided near the voltage applying pad 2. Further, around the die pad 1, a large number of leads 5 are provided which are connected to data terminals and the like of a paired chip semiconductor element (not shown) mounted on the die pad 1 by one-way bonding.

When the operating voltage potential of the paired chip semiconductor element mounted on the die pad 1 is the ground potential, the voltage application bonding pad 2 and the voltage supply bonding pad 3 at the ground potential are connected by one-way bonding (not shown). (omitted).

On the other hand, when the potential of the operating voltage of the paired chip semiconductor element mounted on the die pad 1 is the power supply potential, the voltage application bonding pad 2 and the voltage supply bonding pad 4 of the power supply potential are connected by one-way bonding (not shown). (omitted).

Therefore, in the circuit board of this embodiment, it is possible to change to a pair of chip semiconductor elements having operating voltages of different potentials (ground potential and power supply potential) without changing the design of the wiring pattern.

Note that the present invention is not limited to the embodiments described above.

For example, in the above-described embodiment, two types of voltage supply bonding pads, one for the ground potential and one for the power supply potential, are used, but three or more types may be used.

In addition, in the above-described embodiment, a dedicated voltage supply bonding pad was provided, but as shown in FIG. Bonding pad 5a and power supply potential lead/voltage supply bonding pad 5
As b, it may also be used as the lead 5.

Furthermore, in the above embodiment, the voltage application bonding pad 2 and the voltage supply bonding pad 3.4 were connected by one-way bonding, but as shown in FIG. Voltage supply die pads 6.7 having the same function as in 3.4 are provided along different sides of the die pad 1, and the paired chip semiconductor element is placed across either one of these voltage supply die pads 6.7 and the die pad 1. It may be installed as follows.

[Effects of the Invention] As explained above, according to the present invention, when a semiconductor element to be mounted is changed to a semiconductor element with an operating voltage of a different potential, a voltage supplying a voltage of a potential corresponding to the operating voltage potential is applied. All you have to do is select a supply connection terminal and connect this voltage supply connection terminal to the voltage application connection terminal, so you can change to a semiconductor element with a different operating voltage potential without changing the wiring pattern design. can.

[Brief explanation of drawings]

FIG. 1 is a plan view of a portion of a circuit board according to one embodiment of the present invention, and FIGS. 2 and 3 are plan views of a portion of a circuit board according to other embodiments of the invention. 1... Die pad, 2... Bonding pad for voltage application, 3.4... Bonding pad for voltage supply,
5...Lead.

Claims (1)

[Scope of Claims] A circuit board on which a semiconductor element is mounted on a die pad and operates by applying a voltage from the die pad, comprising: a voltage application connection terminal led out from the die pad;
A plurality of voltage supply connection terminals that supply voltages of different potentials are provided adjacent to this voltage application connection terminal, and supply voltages of potentials that correspond to the potentials of the voltage application connection terminals and the operating voltage of the semiconductor element. A circuit board, characterized in that the circuit board is connected to one of the voltage supply connection terminals.