JPH0322077B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-shaped circuit component placement device used when mounting chip-shaped circuit components on a circuit board.

[Prior art] A plurality of suction parts are provided to correspond to the mounting positions of a plurality of chip-shaped circuit parts (electronic parts such as capacitors and resistors) on a circuit board, and the plurality of circuit parts are simultaneously mounted on the suction parts. A method of adsorbing and supplying it to a predetermined position on a circuit board is known. When mounting circuit components using this method, multiple circuit components are placed in advance on a placement board (template) separate from the circuit board, and then the multiple circuit components are simultaneously transferred onto the circuit board. This makes it possible to efficiently mount a plurality of circuit components.

By the way, if multiple types of component placement boards (templates) are prepared for multiple circuit board devices, costs will inevitably increase. In order to solve this problem, the applicant has proposed a chip-like component placement device that consists of a combination of a placement plate and a component storage case. In this chip-shaped component placement device, the placement plate has a large number of mounting holes for component storage cases, so it is possible to manufacture various circuit board devices by changing the mounting position of the component storage cases. become.

[Problems to be Solved by the Invention] However, in the conventional component placement device, the component storage case is provided with two mounting projections, which prevent the component storage case from rotating. There was a problem that it was not possible to make detailed changes.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip-shaped circuit component placement device that can solve the above-mentioned problems.

[Means for Solving the Problems] To achieve the above object, the present invention provides a method for mounting a plurality of chip-shaped circuit components on a circuit board, in which the plurality of circuit components are mounted at a location different from the circuit board. A device for pre-arrangement, comprising a placement plate provided with a plurality of polygonal holes and a plurality of component storage cases detachably attached to the holes of the placement plate, the component storage case This relates to a chip-shaped circuit component placement device having a component storage recess and one polygonal protrusion that can be fitted into the hole of the placement plate at a plurality of angular positions. Note that it is desirable that each polygon be a regular polygon that is an integral multiple of 4.

[Function] The projection of the component storage case according to the above invention and the hole of the arrangement plate have a function of preventing rotation of the component storage case. By changing the direction of the polygonal protrusions on the parts storage case, the arrangement direction of the parts storage case can be changed.

[Embodiment] Next, a mounting device and a mounting method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.

The mounting device of this embodiment is configured to simultaneously mount a plurality of chip-shaped circuit components 1 on the same circuit board. The circuit component 1 is, for example, a cylindrical ceramic capacitor.

A component supply device 3 for supplying the circuit components 1 to the component placement device 2 is constructed by fitting a conveying pipe 6 into a through hole 5 of a fixed plate 4 . Pipe 6 is a supply source for circuit components 1 (not shown)
is connected to.

The component placement device 2 includes a placement board 7, which can also be called a template, and a plurality of component storage cases 8.
It consists of a suction device 9 and a suction path forming member 10.
The circuit components 1 must be placed on the placement board 7 in correspondence with the placement locations of the circuit components on the circuit board. At this time, if multiple types of circuit component placement devices 2 are prepared for multiple types of circuit boards, the cost will inevitably increase. Therefore, in this embodiment, a large number of through holes 11 are provided in the arrangement plate 7 in a matrix, and the engaging protrusions 12 of the component storage case 8 are removably fitted into the through holes 11. This makes it possible to change the position and type of the component storage case 8 in response to changes in the component placement position and component type on the circuit board.

The through hole 11 of the arrangement plate 7 is formed into a regular octagonal planar shape as shown in an enlarged view in FIG.
2 is also a regular octagon so that it fits into the regular octagonal through hole 11.
It is formed into a square shape.

The component storage recess 13 of the component storage case 8 has a bottom surface 15 provided with a suction hole 14a and a component storage detection hole 14b. The suction hole 14a communicates with the suction device 9 via a suction path. The bottom surface 15 is inclined along the longitudinal direction of the circuit component 1, as shown in FIG. That is, the bottom surface 15 is located near the first wall surface 13a of the recess 13 in FIG.
It is sloped so that it becomes gradually lower toward 4a. The component storage detection hole 14b is formed smaller than the suction hole 14a, and is provided so as to be located on the same straight line as the opening 14c on the end surface of the protrusion 12. This makes it possible to optically or mechanically detect the presence or absence of the circuit component 1 using the component storage detection hole 14b. When optically detecting the presence or absence of the circuit component 1, a light emitting element is placed above or below the component storage recess 13, a light receiving element is placed below or above the component storage recess 13, and the light emitted from the light emitting element is detected. It is checked whether it is possible to reach the light receiving element through the hole 14b. When detecting the presence or absence of the circuit component 1 mechanically, a rod-shaped sensor is inserted toward the detection hole 14b from the opening 14c, and it is checked whether the sensor collides with the circuit component 1 or not.

The pipe 6 has a recess 1 in FIG. 1 so that the circuit component 1 inserted through the pipe 6 falls in a predetermined direction
3 (above the inclined bottom surface 15).

Next, a method for mounting the circuit component 1 on a circuit board using this mounting device will be explained.

First, the component storage case 8 is attached to the placement board 7 so as to correspond to the placement of the circuit components 1 on the circuit board. The orientation of the circuit component 1 on the circuit board can be changed in angular intervals of 45 degrees. Even if the orientation of the circuit components 1 is varied in this manner, the required component arrangement on the circuit board can be obtained by changing the arrangement angle of the component storage case 8 at 45 degree intervals as shown in FIG. . In addition, since there is only one protrusion 12 for attaching the component storage case 8 to the placement plate 7, the position of the component storage case 8 on the placement plate 7 can be set more precisely than in the conventional case with two protrusions. It becomes possible to do so. In addition, the protrusion 12
Even if there is only one, the outer circumferential shape is octagonal and is fitted into the octagonal hole 11, so no deviation in direction occurs.

Next, the component supply device 3 movably supported is guided onto the component placement device 2 positioned on a support stand (not shown), the suction device 9 is operated, and the pipe is sucked through the suction hole 14a. Insert circuit component 1 into 6. The circuit component 1 is connected to the recess 1 through the pipe 6.
It will be put into 3. At this time, the circuit component 1 easily falls down based on the leftward suction of the circuit component 1 based on the suction hole 14a and the downward left slope of the bottom surface 15 of the recess, and the circuit component 1 is attached to the left wall surface 13a of the storage recess 13. The circuit component 1 is positioned so that the left end surface of the circuit component 1 is in contact with the left end surface. Although suction is also generated by the component storage detection hole 14b, compared to the suction hole 14a, the component storage detection hole 14b
Since it is formed much smaller, the suction caused by this can be ignored.

When the placement of the circuit components 1 in the component placement device 2 is completed, the component suction device 16 as shown in FIG.
The circuit component 1 is taken out from the recess 13 and transferred onto the circuit board 17. The component suction device 16 is a fifth
As shown in the figure, it consists of a plurality of adsorbents 18, a plurality of holders 19, a mounting plate 20, and a vacuum suction device (not shown). To explain in detail how to mount the circuit component 1 using this component suction device 16, the tapered tip of the suction body 18, which has been placed in advance to correspond to the planned circuit component placement position on the circuit board 17, is inserted into the recess 13. Insert it and press it against circuit component 1. Even if there is some variation in the height position of the circuit components 1, since the adsorbent body 18 is an elastically deformable object made of rubber, it can absorb these variations and contact or contact all the component circuits 1. Can be brought close together. Suction hole 14 of storage case 8
Stop the suction by a, and open the through hole 21 of the adsorbent 18.
By performing suction by
At the same time, it is adsorbed and held. Either or both of the circuit board 17 and the component suction device 16 are moved in the horizontal direction to align the xy plane positioning reference made on the circuit board 17 with the xy plane positioning reference provided on the mounting plate 20. By doing so, their positions in the x and y directions are aligned. Thereafter, the circuit board 17 is moved by vertically moving one or both of the component suction device 16 and the circuit board 17.
The circuit component 1 is pressed onto an adhesive surface having a temporary adhesive function, such as cream solder, at a desired position. Note that even if there is variation in the height position of the lower surface of each circuit component 1, the adsorption body 18 is elastically deformed, so that the variation can be absorbed. After that, the parts suction device 16
is relatively spaced from the circuit board 17, and the circuit component 1 is coupled to the wiring conductor 22 with solder (not shown) as shown in FIG.

[Modifications] The present invention is not limited to the above-described embodiments, and, for example, the following modifications are possible.

(1) As shown in FIG. 7, the shape of the protrusion 12 may be a regular square. Further, various polygons such as other regular polygons (for example, 16 sides) having an integral multiple of 4 may be used. In this case, it is desirable that the parts storage case 8 be made into a polygon that can be rotated by 90 degrees.

(2) When mounting square chip parts, it can also be applied when mounting round chip parts and square chip parts at the same time.

[Effects of the Invention] As is clear from the above, only one protrusion is provided for attaching the component storage case to the arrangement plate, and this protrusion is formed in a polygonal shape, and the hole in the arrangement plate is Since the parts storage case is also polygonal, the direction of the parts storage case can be changed by changing the engagement angle positional relationship between the projection and the hole. As a result, it becomes possible to manufacture a plurality of types of circuit devices with different component placements on the circuit board using the same placement board and component storage case.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a component supply device and a component placement device in a mounting device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a component storage case.
Fig. 3 is a partially enlarged plan view of the arrangement board, Fig. 4 is a plan view showing different arrangement states of the component storage case, and Fig. 5 is a plan view showing different arrangement states of the parts storage case.
The figure is a cross-sectional view showing how a circuit component is sucked by a suction device and mounted on a circuit board, Figure 6 is a cross-sectional view showing a circuit board with circuit components mounted, and Figure 7 is a deformation of the protrusion of the component storage case. It is a sectional view showing an example. 1...Circuit components, 2...Component placement device, 7...
Placement plate, 8...Component storage case, 9...Suction device, 12...Protrusion, 13...Recess, 17...Circuit board.

Claims (1)

[Scope of Claims] 1. A device for pre-arranging a plurality of chip-shaped circuit components 1 at a location different from the circuit board 17 in order to mount the plurality of chip-shaped circuit components 1 on the circuit board 17. It consists of a placement plate 7 provided with a plurality of polygonal holes 11 and a plurality of component storage cases 8 that are detachably attached to the polygonal holes 11 of the placement plate 7, and the component storage The case 8 has a component storage recess 13 and the polygonal hole 11 of the arrangement plate 7.
It has one polygonal protrusion 12 for fitting into the polygonal hole 11, and the polygonal protrusion 12 is formed so that it can take a plurality of angular positions in the circumferential direction of the polygonal hole 11. Chip-shaped circuit component placement equipment.