JPH01278097A - Arrangement apparatus for chip-shaped circuit component - Google Patents

Abstract

PURPOSE:To easily position a circuit component by forming two or more recessed parts used to house the circuit component in such a way that facing intervals of their wall faces have inclined parts which become gradually narrow as these parts approach bottom faces from entrances of the recessed parts. CONSTITUTION:Each recessed part 13 used to house a square chip-shaped circuit component 1 has a first pair of facing wall faces 13a, 13b, a second pair of wall faces 13c, 13d perpendicular to them and a bottom face 15; a width of the bottom face 15 is decided in such a way that it nearly coincides with a width of the square chip-shaped circuit component 1. A width of an entrance of the recessed part 13 is decided in such a way that it is wider than a width of the bottom face 15; an inclined part 23 is formed in such a way that a facing interval of the first pair of wall faces 13a, 13b becomes gradually narrow as it approaches the bottom face 15 from the entrance of the recessed part 13. By this setup, the first pair of wall faces 13a, 13b function as a guide for the circuit component 1; the circuit component 1 can be positioned easily by means of a comparatively simple constitution.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Applications] The present invention relates to a chip-shaped circuit component placement device used when mounting chip-shaped circuit components on a circuit board.

[Prior art] A plurality of suction parts are provided to correspond to the mounting positions of a plurality of chip-shaped circuit parts (electronic parts such as capacitors and resistors) on a circuit board, and the plurality of circuit parts are simultaneously mounted on the suction part. A method of adsorbing and supplying it to a predetermined position on a circuit board has already been used. When mounting circuit components using this type of method, multiple circuit components must be mounted on a mounting board separate from the circuit board (
By placing a plurality of circuit components in advance on a template (template) and then transferring the plurality of circuit components onto the circuit board at the same time, it becomes possible to efficiently mount the plurality of circuit components.

By the way, the circuit components must be placed accurately in the component storage recesses of the placement board.For this reason, conventionally, as disclosed in Japanese Patent Application Laid-Open No. 59-152698, the circuit components have been suctioned with a suction device. Then, it moved so as to touch the wall surface of the recess in the X direction, and also moved so as to touch the wall surface of the rear recess in the Y direction, thereby achieving positioning in both the X and Y directions.

[Problem M to be solved by the invention] However, if the process of moving the circuit components in the It's been long.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a chip-shaped circuit component placement device that can easily position circuit components with a relatively simple configuration.

[Means for Solving the Problems] To achieve the above object, the present invention provides a method for mounting a plurality of chip-shaped circuit components on a circuit B board, in which the plurality of circuit components are mounted at a location different from the circuit board. The apparatus is a device for pre-arranging circuit components, and has a plurality of recesses for accommodating the circuit components, and a part or all of the 'a number of recesses are formed to accommodate square chip-shaped circuit components. , the recess for accommodating the square chip-shaped circuit component has a first pair of opposing wall surfaces and a second pair of wall surfaces and a bottom surface that are perpendicular to the first pair of wall surfaces. , the width of the bottom surface is determined to substantially match the width of the square chip-shaped circuit component, the width of the entrance of the recess is determined to be larger than the width of the bottom surface, and The distance between the opposing wall surfaces gradually narrows as it approaches the bottom surface from the entrance of the recess.
The present invention relates to a chip-shaped circuit component placement device in which the first pair of wall surfaces are formed to have a 4q portion.

[Function] Since the bottom surface of the recess in the above invention is approximately equal to the width of the square chip-shaped circuit component, this bottom surface can be used as a reference placement location for the circuit component. Since the first pair of wall surfaces have portions that gradually become narrower as they approach the bottom surface, they function as guides for the circuit components. Since the entrance of the recess has a larger width than the bottom surface, circuit components can be easily taken in and taken out.

Embodiment Next, a mounting device and a mounting method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.

The mounting device of this embodiment is configured to mount a plurality of chip-shaped circuit components 1 on the same circuit board at the same time.The circuit component 1 is, for example, a rectangular multilayer capacitor.

A component supply device 3 for supplying the circuit components 1 to the component placement device 2 is constructed by fitting a conveying vibro into a through hole 5 of a fixed plate 4.

The vibro is connected to a source of circuit components 1 (not shown).

The component placement device 2 includes a placement plate 7, which can also be called a template, a plurality of component storage cases 8, a suction device 9,
and a suction path forming member 10.

The circuit components 1 must be placed on the placement board 7 in correspondence with the placement locations of the circuit components on the P1 board. At this time, multiple types of circuit component placement devices 2 are installed to correspond to the multiple types of circuit boards. Preparing it will inevitably increase costs. Therefore, in this embodiment, a large number of through holes 11 are provided in the arrangement plate 7 in the form of a matrix, and the engaging protrusions 12 of the component storage case 8 are fitted into the through holes 11 so as to be freely inserted. This makes it possible to change the position and type of the component storage case 8 in response to changes in the component placement position and component type on the circuit board.

The component storage recess 13 of the component storage case 8 has six through holes 14 having a bottom surface 15 provided with a first through hole 14 for suction.
communicates with the suction bag f9 via a suction path. The bottom surface 15 is inclined along the longitudinal direction of the circuit component 1, as shown in FIGS. 2 and 3.

That is, the bottom surface 15 is inclined so as to gradually become lower in the direction of the through hole 14 in FIG. The recess 13 has a first pair of wall surfaces 13a, 13b along the longitudinal direction of the circuit component 1, and a second pair of wall surfaces 13c, 13d perpendicular thereto. A first pair of wall surfaces 13a, 13b facing each other
As is clear from FIG. 1, it has an inclined portion 23 in which the opposing distance gradually narrows toward the bottom surface 15. The opposing interval at the lowest end of this first pair of wall surfaces 13a, 13b, that is, the bottom surface 1
The width of the groove almost matches the width of the circuit component 1.

The width of the entrance of the recess 13, i.e. the first pair of walls 1 at the entrance.
The opposing interval between 3a and 13b is larger than the width of the bottom surface 15.

The opposing distance between the second pair of wall surfaces 13c and 13d is the circuit component 1.
One wall surface 13c of the second pair of wall surfaces 13c and 13d, which is larger than the length of , serves as a reference surface for positioning the circuit component 1, and is therefore formed substantially vertically. The other wall surface 13d does not need to be vertical, but is vertical in this embodiment.

The vibro is placed near the right end of the recess 13 in FIG.
above the inclined bottom surface 15).

Next, a method for mounting the circuit component 1 on the IS board using this mounting device will be explained. First, a component supply bag is movably supported on the component placement device 2 positioned on a support stand (not shown). ! I3 is guided, the suction device 9 is operated, and the circuit component 1 is introduced into the vibro while being suctioned through the through hole 14.0 The circuit component 1 is introduced into the recess 13 via the vibro. At this time, the circuit component 1 easily falls over due to the leftward suction of the circuit component 1 based on the through hole 14 and the downward leftward inclination of the bottom surface 15 of the recess.

The width direction of the inserted circuit component 1 is the first pair of wall surfaces 13a.
, 13b.

As a result, the circuit component 1 is stored in a state in which the back surface of the circuit component 1 matches the bottom surface 15 of the recess 13, and the positioning of the circuit component 1 in the Y direction in FIG. 4 is achieved. Furthermore, since the inserted circuit component 1 is sucked to the left side in FIG. As a result, positioning of the circuit component 1 in the X-axis direction with reference to the left wall surface 13c of the recess 13 in FIG. 4 is achieved.

When the placement of the circuit component 1 in the component placement device 2 is completed, the circuit component 1 is taken out from the recess 13 by a component suction device 16 as shown in FIG. 5 and transferred onto the circuit board 17.
As shown in FIG. 5, the component suction device 16 includes a plurality of suction bodies 18, a plurality of holders 19, a mounting plate 20, and a vacuum suction device (not shown). This parts suction device 1
To explain in detail how to mount the circuit component 1 using the circuit board 17, the tapered tip of the suction body 18, which has been placed in advance to correspond to the planned circuit component placement position on the circuit board 17, is inserted into the recess 13, and the circuit Even if there is some variation in the height position of the four-circuit component 1 pressed against the component 1, since the adsorbent 18 is an elastically deformable object made of rubber,
These variations can be absorbed and all the circuit components 1 can be brought into contact with or close to each other. Through hole 14 of storage case 8
By stopping the suction by the through hole 21 of the suction body 1.8, one or both of the circuit board 17 and the component suction device 16, which simultaneously suction and hold a plurality of circuit components 1, are horizontally moved. The XY plane positioning reference provided on the circuit board 17 is aligned with the XY plane positioning reference provided on the board 20 to align the positions of both in the X and Y directions. Thereafter, by moving one or both of the component suction device 16 and the circuit board 17 in a vertical direction, the circuit component 1 is placed on the adhesive surface having a temporary adhesive function such as cream solder at a desired position of the circuit board 17. Press against it. Note that even if there is variation in the height position of the lower surface of each circuit component 1, the adsorption body 18 is elastically deformed, so that the variation can be absorbed. After that, the component suction device 16 is moved q distances from the circuit board 17, and the sixth
As shown in the figure, the circuit component 1 is coupled to the wiring conductor 22 with solder (not shown).

The advantages of this embodiment are as follows.

(1) Since the opposing distance between the lower ends of the pair of wall surfaces 13a and 13b substantially matches the width of the circuit component 1, this can be used as a reference for the circuit component. Since it has an inclined portion 23 in which the facing distance gradually narrows toward the bottom surface 15, the positioning of the circuit component 1 in the Y direction can be achieved accurately and easily using this as a guide.

(2) Since the width of the entrance of the recess 13 is larger than the width of the circuit component 1, the circuit component 1 can be taken in and out easily.

(3) Since the through hole 14 communicating with the recess 13 is provided and the circuit component 1 is sucked using this hole, positioning of the circuit component 1 in the X direction can be easily achieved.

(4) Since the tip of the vibro is arranged offset from the center of the recess 13, the circuit component 1 placed in the recess 13 can be easily knocked down.

(5) Since the suction through-hole 14 is arranged to be offset to one side from the center of the recess 13, it is possible to easily tilt the circuit component 1 and bring it into contact with the wall surface 13c.

(6) Since the bottom surface 1 of the recess 13 is inclined toward the wall surface 13c, the circuit component 1 can be easily tilted in a desired direction.

(7) Since the storage case 8 is detachably attached to the arrangement plate 7, various circuits can be configured using the same device.

[Modifications] The present invention is not limited to the above-described embodiments, and for example, the following modifications are possible.

(1) As shown in FIG. 7, a protrusion having an inclined portion 1a may be provided on the bottom surface 15 to make the corner of the circuit component 1 a slippery bottom surface to prevent abnormal placement of the circuit component 1. The shape of the bottom surface 15 may be arcuate, W-shaped, trapezoidal, or the like.

<2) As shown in FIG. 8, a through hole 14a may be provided below the wall surface 13C of the recess 13, and the circuit component 1 may be sucked through the through hole 14a to position the circuit component 1 on the wall surface 13c. In some cases, the through hole 14 in the bottom surface 15 can be omitted.

(3) Instead of suctioning through the through hole 14a, the wall surface 1
Positioning may be achieved by providing a through hole in 3d, introducing compressed air therein and blowing it onto the circuit component 1, and pressing the left end surface of the circuit component 1 against the wall surface 13c of the recess 13.

(4) Instead of providing the recess 13 in the parts storage case 8,
, a recess 13 may be provided in the arrangement plate 7.

(c) As shown in FIG. 9, an inclined portion 23 may be provided between the first pair of wall surfaces 13a and 13b of the recess 13,
Further, as shown in FIG. 10, the inclined portion 23 may be formed to have an arcuate cross section, or as shown in FIG. 11, the entire wall surfaces 13a and 13b may be formed as the inclined portion 23.

(6) Cylindrical circuit component (not shown) and square circuit component 1
It is also applicable when arranging the above and the like in the common arrangement device 2.

(7) Positioning of the circuit component 1 in the recess 13 in the X direction is performed by suctioning the circuit component 1 with the suction tube 18 and moving it in the X direction, as disclosed in Japanese Patent Laid-Open No. 59-152698. May be achieved.

[Effects of the Invention] As is clear from the above, according to the present invention, it is possible to provide a chip-shaped circuit component placement device that allows easy positioning of circuit components.

[Brief explanation of the drawing]

FIG. 1 shows a component supply device and a component placement device in a mounting device according to an embodiment of the present invention.
2 is a sectional view of a portion corresponding to If-Iti in FIG. 1, FIG. 3 is a perspective view of the parts storage case, and FIG. 4 is a plan view of the parts storage case in FIG. 3. , FIG. 5 is a sectional view showing a state in which a circuit component is suctioned by a suction device and mounted on a circuit board. Figure 6 shows when the circuit components are mounted! ! ! 7 is a sectional view showing a modified example of the component storage case; FIG. 8 is a plan view showing another modified example of the component storage case; FIGS. 9, 10, and 11. FIG. 7 is a cross-sectional view showing still other various modifications of the component storage case. DESCRIPTION OF SYMBOLS 1... Circuit component, 2... Component placement device, 7... Placement board, 8... Component storage case, 9... Suction device, 1
0... Suction path forming member, 13... Recessed portion, 13a-1
3d...Wall surface, 15...Bottom surface, 17...B board, 23...Slanted portion.

Claims (1)

[Scope of Claims] [1] An apparatus for pre-arranging a plurality of chip-shaped circuit components at a location different from the circuit board in order to mount the plurality of chip-shaped circuit components on a circuit board, the device comprising: It has a plurality of recesses for accommodating circuit components, some or all of the plurality of recesses are formed to accommodate square chip-shaped circuit components, and the plurality of recesses are formed to accommodate square chip-shaped circuit components. The recess has a first pair of opposing wall surfaces, a second pair of wall surfaces perpendicular to the first pair of wall surfaces, and a bottom surface, and the width of the bottom surface is equal to the width of the square chip-shaped circuit component. The width of the entrance of the recess is determined to be larger than the width of the bottom surface, and the opposing distance between the first pair of wall surfaces is from the entrance of the recess to the bottom surface. A chip-shaped circuit component placement device characterized in that the first pair of wall surfaces are formed to have sloped portions that gradually become narrower as they approach each other.