JPH0322420B2 - - Google Patents
Info
- Publication number
- JPH0322420B2 JPH0322420B2 JP4333282A JP4333282A JPH0322420B2 JP H0322420 B2 JPH0322420 B2 JP H0322420B2 JP 4333282 A JP4333282 A JP 4333282A JP 4333282 A JP4333282 A JP 4333282A JP H0322420 B2 JPH0322420 B2 JP H0322420B2
- Authority
- JP
- Japan
- Prior art keywords
- bis
- prepolymer
- cyanate ester
- resin
- maleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004643 cyanate ester Substances 0.000 claims description 14
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 8
- 239000004693 Polybenzimidazole Substances 0.000 claims description 8
- 229920002480 polybenzimidazole Polymers 0.000 claims description 8
- 150000001412 amines Chemical class 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 6
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 2
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- -1 diphenyl ester Chemical class 0.000 description 10
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 239000001294 propane Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical group C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical group C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical group CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FHESUNXRPBHDQM-UHFFFAOYSA-N diphenyl benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OC=2C=CC=CC=2)=CC=1C(=O)OC1=CC=CC=C1 FHESUNXRPBHDQM-UHFFFAOYSA-N 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical group OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- HMHLDAMOJGEOMQ-UHFFFAOYSA-N (1-cyanato-4-phenylcyclohexa-2,4-dien-1-yl) cyanate Chemical group C1=CC(OC#N)(OC#N)CC=C1C1=CC=CC=C1 HMHLDAMOJGEOMQ-UHFFFAOYSA-N 0.000 description 1
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 description 1
- YDCUTCGACVVRIQ-UHFFFAOYSA-N (3,6-dicyanatonaphthalen-1-yl) cyanate Chemical compound N#COC1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 YDCUTCGACVVRIQ-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical group C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 1
- OFIWROJVVHYHLQ-UHFFFAOYSA-N (7-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 OFIWROJVVHYHLQ-UHFFFAOYSA-N 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- GEEGPFGTMRWCID-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylbutane-1,1-diamine Chemical compound CCCC(N(C)C)N(C)C GEEGPFGTMRWCID-UHFFFAOYSA-N 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- SIQHSJOKAUDDLN-UHFFFAOYSA-N 2-methyl-1-propylimidazole Chemical compound CCCN1C=CN=C1C SIQHSJOKAUDDLN-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- UCNCZASVJWGNBZ-UHFFFAOYSA-N 3-(2-ethyl-5-methyl-1h-imidazol-4-yl)propanenitrile Chemical compound CCC1=NC(CCC#N)=C(C)N1 UCNCZASVJWGNBZ-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- LQGSWLJZAKVBJH-UHFFFAOYSA-N 4,4'-dichlorodiphenylmethane Chemical compound C1=CC(Cl)=CC=C1CC1=CC=C(Cl)C=C1 LQGSWLJZAKVBJH-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- CJXRYVQHINFIKO-UHFFFAOYSA-N 4-[1-(4-aminophenyl)-1-phenylethyl]aniline Chemical compound C=1C=C(N)C=CC=1C(C=1C=CC(N)=CC=1)(C)C1=CC=CC=C1 CJXRYVQHINFIKO-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- UBKRDXUXTYBRHS-UHFFFAOYSA-N 4-[2-(4-amino-3-methylphenyl)propan-2-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=CC=2)=C1 UBKRDXUXTYBRHS-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- ZTKDMNHEQMILPE-UHFFFAOYSA-N 4-methoxy-n,n-dimethylaniline Chemical compound COC1=CC=C(N(C)C)C=C1 ZTKDMNHEQMILPE-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- KSSJBGNOJJETTC-UHFFFAOYSA-N COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC Chemical compound COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC KSSJBGNOJJETTC-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 241001214257 Mene Species 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Chemical group C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- YKONYNBAMHVIMF-UHFFFAOYSA-N [2,6-dichloro-4-[2-(3,5-dichloro-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Cl)=C(OC#N)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(OC#N)C(Cl)=C1 YKONYNBAMHVIMF-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- SNYVZKMCGVGTKN-UHFFFAOYSA-N [4-(4-cyanatophenoxy)phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OC1=CC=C(OC#N)C=C1 SNYVZKMCGVGTKN-UHFFFAOYSA-N 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- AUYQDAWLRQFANO-UHFFFAOYSA-N [4-[(4-cyanatophenyl)methyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1CC1=CC=C(OC#N)C=C1 AUYQDAWLRQFANO-UHFFFAOYSA-N 0.000 description 1
- PPZSVSGWDQKBIW-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphanyloxyphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OP(OC=1C=CC(OC#N)=CC=1)OC1=CC=C(OC#N)C=C1 PPZSVSGWDQKBIW-UHFFFAOYSA-N 0.000 description 1
- HYAOCWBXRFEHDV-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphoryloxyphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1OP(OC=1C=CC(OC#N)=CC=1)(=O)OC1=CC=C(OC#N)C=C1 HYAOCWBXRFEHDV-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical group CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical class OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- YJFHTKQOASXZIF-UHFFFAOYSA-N cyanic acid;pyrrole-2,5-dione Chemical compound OC#N.O=C1NC(=O)C=C1 YJFHTKQOASXZIF-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- 229960002380 dibutyl phthalate Drugs 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- NWADXBLMWHFGGU-UHFFFAOYSA-N dodecanoic anhydride Chemical group CCCCCCCCCCCC(=O)OC(=O)CCCCCCCCCCC NWADXBLMWHFGGU-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical group C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- DLAPQHBZCAAVPQ-UHFFFAOYSA-N iron;pentane-2,4-dione Chemical compound [Fe].CC(=O)CC(C)=O DLAPQHBZCAAVPQ-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002825 nitriles Chemical group 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 125000005590 trimellitic acid group Chemical class 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
本発明は、耐熱性、接着性、機械的強度、耐薬
品性等にすぐれ、特に耐熱性の接着剤として有用
な硬化性樹脂組成物に関し、詳しくは
a 分子中に2個以上のシアナト基を有する多官
能性シアン酸エステル、該シアン酸エステルプ
レポリマー或いは該シアン酸エステルとアミン
とのプレポリマー、
または前記aおよび
b 分子中に2個以上のマレイミド基を有する多
官能性マレイミド、該マレイミドプレポリマー
或いは該マレイミドとアミンとのプレポリマー
と
c ポリベンズイミダゾール
を必須成分としてなる硬化性樹脂組成物である。
ポリベンズイミダゾールは、耐熱性接着剤として
公知のすぐれた接着剤であるが、高融点であり、
使用する場合高温を必要とし、作業性、加工性等
に劣るものであつた。
他方、シアン酸エステル樹脂(前記a)また
は、シアン酸エステル−マレイミド樹脂(前記a
+b)は、耐熱性樹脂として公知であり、作業
性、加工性などすぐれたものであるが、接着用樹
脂として用いる場合、そのままでは可とう性等が
劣るという欠点があつた。又、従来の可とう性の
付与の方法では高温下に於る劣化が大きくなつた
り、耐薬品性が劣るなどの欠点が生じるものであ
つた。
本発明は、上記シアン酸エステル樹脂またはシ
アン酸エステル−マレイミド樹脂の特性を劣化さ
すことなく特に接着剤として有用な樹脂を開発す
べく鋭意研究した結果完成したものである。
以下、本発明の構成成分その他について説明す
る。
まず、本発明のc成分のポリベンズイミダゾー
ルとは、例えば、芳香族の1級テトラアミンと芳
香族ジカルボン酸のジフエニルエステルもしくは
芳香族ジ酸クロライドなどの誘導体とを重縮合さ
せて製造される公知の樹脂である。芳香族の1級
テトラミンとして3,3′,4,4′−テトラアミノ
ビフエニル(二.3,3′−ジアミノベンジジン)
を、芳香族ジカルボン酸のジフエニルエステルと
して、イソフタル酸ジフエニルエステルとを用い
た場合には、下式(2)で示される分子量数万のポリ
マーとされる。
次に、本発明のa;シアン酸エステル樹脂、又
はa+b;シアン酸エステル−マレイミド樹脂に
ついて説明する。
a成分の多営能性シアン酸エステルとして、好
適な化合物は下記一般式(2)で表わされるものであ
る。
R(−O−C≡N)m ……(2)
〔式中のmは2以上、通常5以下の整数であり
Rは芳香族性の有機基であつて、上記シアン酸エ
ステル基は該有機基Rの芳香環に結合しているも
の〕
具体的に例示すれば1,3−または1,4−ジ
シアナトベンゼン、1,3,5−トリシアナトベ
ンゼン、1,3−、1,4−、1,6−、1,8
−、2,6−または2,7−ジシアナトナフタレ
ン、1,3,6−トリシアナトナフタレン、4,
4−ジシアナトビフエニル、ビス(4−シアナト
フエニル)メタン、2,2−ビス(4−シアナト
フエニル)ブロパン、2,2−ビス(3,5−ジ
クロロ−4−シアナトフエニル)プロパン、2,
2−ビス(3,5−ジプロモ−4−シアナトフエ
ニル)プロパン、ビス(4−シアナトフエニル)
エーテル、ビス(4−シアナトフエニル)チオエ
ーテル、ビス(4−シアナトフエニル)スルホ
ン、トリス(4−シアナトフエニル)ホスフアイ
ト、トリス(4−シアナトフエニル)ホスフエー
ト、およびノボラツクとハロゲン化シアンとの反
応により得られるシアン酸エステルなどである。
これらの他に特公昭41−1928、特公昭43−18468、
特公昭44−4791、特公昭45−11712、特公昭46−
41112、特公昭47−26853および特開昭51−63149
などに記載のシアン酸エステルも用いうる。
又、上述した多官能性シアン酸エステルを、鉱
酸、ルイス酸、炭酸ナトリウム或いは塩化リチウ
ム等の塩類、トリプチルホスフイン等のリン酸エ
ステル類等の触媒の在存下に重合させて得られる
プレポリマーとして用いる事ができる。これらの
プレポリマーは、前記シアン酸エステル中のシア
ン基が三量化する事によつて形成されるsym−ト
リアジン環を、一般に分子中に有している。本発
明においては、数平均分子量400〜6000の前記プ
レポリマーを用いるのが好ましい。
本発明のb成分の多官能性マレイミドとは、下
記一般式(3)
〔式中、Rは2価、通常5価以下の芳香族又は
脂環族性有機基であり、X1,X2は水素、ハロゲ
ン、またはアルキル基であり、mは2以上、通常
5以下である。〕
で表わされる化合物である。上式で表わされるマ
レイミドは無水マレイン酸とアミノ基を2〜5個
有するポリアミンとを反応させてマレアミド酸を
調製し、次いでマレアミド酸を脱水環化させるそ
れ自体公知の方法で製造することができる。用い
るポリアミン類は芳香族アミンであることが最終
樹脂の耐熱性等の点で好ましいが、樹脂の可撓性
や柔軟性が望ましい場合には、脂環族アミンを単
独あるいは組合せて使用してもよい。また、多価
アミン類は第1級アミンであることが反応性の点
で特に望ましいが、第2級アミンも使用できる。
好適なアミン類としては、メタまたはパラフエニ
レンジアミン、メタまたはパラキシリレンジアミ
ン、1,4−または1,3−シクロヘキサンジア
ミン、ヘキサヒドロキシリレンジアミン、4,
4′−ジアミンビフエニル、ビス(4−アミノフエ
ニル)メン、ビス(4−アミノフエニル)エーテ
ル、ビス(4−アミノフエニル)スルホン、ビス
(4−アミノ−3−メチルフエニル)メタン、ビ
ス(4−アミノ−3,5−ジメチルフエニル)メ
タン、ビス(4−アミノフエニル)シクロヘキサ
ン、2,2−ビス(4−アミノフエニル)プロパ
ン、2,2−ビス(4−アミノ−3−メチルフエ
ニル)プロパン、ビス(4−アミノ−3−クロロ
フエニル)メタン,2,2−ビス(3,5−ジプ
ロモ−4−アミノフエニル)プロパン、ビス(4
−アミノフエニル)フエニルメタン、3,4−ジ
アミノフエニル−4′−アミノフエニルメタン、
1,1−ビス(4−アミノフエニル)−1−フエ
ニルエタン、s−トリアジン環をもつたメラミン
類、アニリンとホルマリンとを反応させてベンゼ
ン環をメチレン結合で結んだポリアミン類等であ
る。
本発明においては、上述した多官能性マレイミ
ドは、所謂モノマーの形で使用する代りにプレポ
リマーもしくは前記したポリアミンとのプレポリ
マーの形で用いることもできる。
本発明では上記成分の他のその他の成分とし
て、エポキシ樹脂、(メタ)アクリル酸のエステ
ル、(メタ)アクリル酸のエポキシエステル、(メ
タ)アクリル酸のアルケニルエステルなどの(メ
タ)アクリル酸のエステル及びそれらのプレポリ
マー;ジアリルフタレート.ジビニルベンゼン.
ジアリルベンゼン.トリアルケニルイソシアヌレ
ートなどのポリアリル化合物及びそのプレポリマ
ー:ジシクロペンタンジエン及びそのプレポリマ
ー:フエノール樹脂:ポリビニルホルマール、ポ
リビニルアセタール、ポリビニルプチラールなど
のポリビニルアセタール樹脂;OH基もしくは
COOH基をもつたアクリル樹脂、シリコン樹脂、
アルキツド樹脂;ポリプタジエン.プタジエン−
アクリロニトリル共重合体、ポリクロロプレン、
プタジエン−スチレン共重合体、ポリイソプレ
ン、プチルゴム、天然ゴムなどの液状−elastic
なゴム類、ポリイミド重合体などを適宜使用でき
るものである。
本発明の樹脂組成物はそれ自体加熱により結合
し網状化して耐熱性樹脂となる性質を有している
が、架橋網状化を促進する目的で、通常は触媒を
含有させて使用する。このような触媒としては、
2−メチルイミダゾール、2−ウンデシルイミダ
ゾール、2−ヘプタデシルイミダゾール、2−フ
エニルイミダゾール、2−エチル−4−メチルイ
ミダゾール、1−ベンジル−2メチルイミダゾー
ル、1−プロピル−2−メチルイミダゾール、1
−シアノエチル−2−メチルイミダゾール、1−
シアノエチル−2−エチル−4−メチルイミダゾ
ール、1−シアノエチル−2−ウンデシルイミダ
ゾール、1−シアノエチル−2−フエニルイミダ
ゾール、1−グアナミノエチル2−メチルイミダ
ゾールで例示されるイミダゾール類、さらには、
これらのイミダゾール類のトリメリト酸付加体な
ど;N,N−ジメチルベンジルアミン、N,N−
ジメチルアニリン、N,N−ジメチルトルイジ
ン、N,N−ジメチル−p−アニシジン、p−ハ
ロゲノ−N,N−ジメチルアニリン、2−N−エ
チルアニリノエタノール、トリ−n−プチルアミ
ン、ピリジン、キノリン、N−メチルモルホリ
ン、トリエタノールアミン、トリエチレンジアミ
ン、N,N,N′,N′−テトラメチルプタンジア
ミン、N−メチルピペリジンなどの第3級アミン
類;フエノール、クレゾール、キシレノール、レ
ゾルシン、カテコール、フロログルシン等のフエ
ノール類;ナフテン酸鉛、ステアリン酸鉛、ナフ
テン酸亜鉛、オクチル酸亜鉛、オレイン酸スズ、
ジプチル錫マレエート、ナテン酸マンガン、ナフ
テン酸コバルト、アセチルアセトン鉄などの有機
金属塩;SnCl2、ZnCl3,AlCl3などの無機金属
塩;過酸化ベンゾイル、ラウロイルパーオキサイ
ド、カプリ ルパーオキサイド、アセチルパーオ
キサイド、パラクロロベンゾイルパーオキサイ
ド、ジーターシヤリープチルジーパーフタレート
などの過酸化物;無水マレイン酸、無水フタル
酸、無水ラウリル酸、無水ピロメリツト酸、無水
トリメリト酸、ヘキサヒドロ無水フタル酸、ヘキ
サヒドロ無水トリメリツト酸、ヘキサヒドロ無水
ピロメリツト酸などの酸無水物、更にはアゾピス
ニトリルなどのアゾ化合物類などが挙げられる。
触媒の添加量は、一般的な意味での触媒量の範囲
で十分であり、たとえば全組成物に対して10重量
%以下の量で使用されればよい。
本発明の硬化性樹脂組成物の調製方法は、通常
の溶剤を用いる方法または無溶剤で各成分の粉体
などをa、またはa+b成分の溶融条件下で混合
する方法などで行う。
本発明の硬化性の樹脂組成物を硬化させるため
の温度は、硬化剤や触媒の有無、組成成分の塩類
などによつても変化するが、通常100〜300℃の範
囲で選ばれればよい。成形品、積層品、接着構造
物等の製造に用いられる場合には、加熱硬化に際
して圧力を加えることが好ましく、一般的に言つ
て0.1〜500Kg/cm2の範囲内で適宜選ばれる。
本発明の組成物には、組成物本来の特性が損な
われない範囲で、所望に応じて種々の添加を配合
することができる。これらの添加物としては、繊
維補強基材、充填剤、染顔料、滑剤、カツプリン
グ剤、難燃剤等公知の各種添加剤類が挙げられ
る。
以下実施例、比較例によつて本発明を具体的に
説明する。
実施例 1
2,2−ビス(4−アナトフエニル)プロパン
1000gを150℃で4時間予備反応させたプレポリ
マーにポリベンズイミダゾール(商品名,
Imidite;Whittaker社製)1000gを加え、これ
らをN,N−ジメチルホルムアミドとN,N−ジ
メチルアセトアミドの混合溶剤に溶解させた。こ
れに触媒としてオクチル酸亜鉛0.1gを加え均一
に撹拌混合した。
これをステンレス鋼に塗り、加熱、乾燥して樹
脂をB−Stageとした後さらにこの上にステンレ
ス鋼を乗せ、5Kg/cm2の圧力をかけながら175℃
3時間硬化させた。この接着層の測定結果を第1
表に示す。
実施例 2
2,2−ビス(4−アナトフエニル)プロパン
500gとビス(4−マレイミドフエニル)メタン
500gを150℃で45分間予備反応させた。これに
3,3′,4,4′−テトラアミノビフエニルとイソ
フタル酸ジフエニルエステルで合成したポリベン
ズイミダゾール(熱軟化温度約360℃)400gを加
え80℃のロールで均一に混合した。これを実施例
1と同様にしてステンレス鋼に塗り、もう1枚の
ステンレス鋼を上に重ねて5Kg/cm2の圧力を加え
ながら175℃、2時間、さらに240℃、4時間硬化
させた。この接着層の測定結果を第1表に示す。
なお、ポリベンズイミダゾール単独では熱軟化
温度が約360℃のため加工性に劣り、接着させる
場合、高温(360℃以上)、高圧を要する。
比較例 1
実施例2で得られた2,2−ビス(4−シアナ
トフエニル)プロパンとビス(4−マレイミドフ
エニル)メタンとのプレポリマーに触媒オクチル
酸亜鉛0.1gを加他は同様にしてステンレス鋼を
接着させた。試験結果を第1表に示す。
比較例 2
実施例1で得られた2,2−ビス(4−シアナ
トフエニル)プロパンのプレポリマー1000gにポ
リビニルブチラール(重合度2000)200gを加え、
これをメチルエチルケトンに溶解させて均一とし
た後、ステンレス鋼に塗り、加熱、乾燥させてB
−Stageとした後、上にステンレス鋼をのせ、5
Kg/cm2の圧力で175℃2時間、200℃1時間硬化さ
せた。この接着層の測定結果を第1表に示す。
The present invention relates to a curable resin composition that has excellent heat resistance, adhesiveness, mechanical strength, chemical resistance, etc. and is particularly useful as a heat-resistant adhesive. a polyfunctional cyanate ester, a prepolymer of the cyanate ester, or a prepolymer of the cyanate ester and an amine; or a and b; a polyfunctional maleimide having two or more maleimide groups in the molecule; This is a curable resin composition comprising a polymer or a prepolymer of the maleimide and amine, and c-polybenzimidazole as essential components.
Polybenzimidazole is an excellent adhesive known as a heat-resistant adhesive, but it has a high melting point and
When used, high temperatures were required, and workability and processability were poor. On the other hand, cyanate ester resin (a) or cyanate-maleimide resin (a)
+b) is known as a heat-resistant resin and has excellent workability and processability, but when used as an adhesive resin, it has the disadvantage of poor flexibility etc. if used as is. Furthermore, conventional methods for imparting flexibility have had drawbacks such as increased deterioration at high temperatures and poor chemical resistance. The present invention was completed as a result of intensive research aimed at developing a resin particularly useful as an adhesive without deteriorating the properties of the cyanate ester resin or cyanate ester-maleimide resin. The constituent components and other components of the present invention will be explained below. First, polybenzimidazole as component c of the present invention is a known polybenzimidazole produced by, for example, polycondensing an aromatic primary tetraamine with a derivative such as diphenyl ester of an aromatic dicarboxylic acid or an aromatic diacid chloride. It is a resin. 3,3',4,4'-tetraminobiphenyl (2,3,3'-diaminobenzidine) as aromatic primary tetramine
When isophthalic acid diphenyl ester is used as the diphenyl ester of an aromatic dicarboxylic acid, a polymer having a molecular weight of several tens of thousands is represented by the following formula (2). Next, a cyanate ester resin or a+b cyanate ester-maleimide resin of the present invention will be explained. A preferred compound as the multifunctional cyanate ester of component a is one represented by the following general formula (2). R(-O-C≡N)m...(2) [In the formula, m is an integer of 2 or more and usually 5 or less, R is an aromatic organic group, and the cyanate ester group is Bonded to the aromatic ring of the organic group R] Specific examples include 1,3- or 1,4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-, 1,4 -, 1,6-, 1,8
-, 2,6- or 2,7-dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene, 4,
4-dicyanatobiphenyl, bis(4-cyanatophenyl)methane, 2,2-bis(4-cyanatophenyl)propane, 2,2-bis(3,5-dichloro-4-cyanatophenyl)propane, 2,
2-bis(3,5-dipromo-4-cyanatophenyl)propane, bis(4-cyanatophenyl)
Ether, bis(4-cyanatophenyl) thioether, bis(4-cyanatophenyl) sulfone, tris(4-cyanatophenyl) phosphite, tris(4-cyanatophenyl) phosphate, and cyanate ester obtained by reaction of novolak with cyanogen halide, etc. It is.
In addition to these, Tokuko Sho 41-1928, Tokko Sho 43-18468,
Tokuko 1979-4791, Tokuko 11712 to Tokko 45, Tokuko 46 to
41112, JP 47-26853 and JP 51-63149
Cyanic acid esters described in et al. can also be used. Alternatively, the polyfunctional cyanate ester described above can be polymerized in the presence of a catalyst such as a mineral acid, a Lewis acid, a salt such as sodium carbonate or lithium chloride, or a phosphate ester such as triptylphosphine. It can be used as a prepolymer. These prepolymers generally have a sym-triazine ring in the molecule, which is formed by trimerization of the cyanide group in the cyanate ester. In the present invention, it is preferable to use the prepolymer having a number average molecular weight of 400 to 6,000. The polyfunctional maleimide as component b of the present invention is represented by the following general formula (3). [Wherein, R is a divalent, usually a pentavalent or less aromatic or alicyclic organic group, X 1 and X 2 are hydrogen, halogen, or an alkyl group, and m is 2 or more and usually 5 or less. It is. ] It is a compound represented by The maleimide represented by the above formula can be produced by a method known per se, in which maleic anhydride and a polyamine having 2 to 5 amino groups are reacted to prepare maleamic acid, and then the maleamic acid is cyclodehydrated. . The polyamines used are preferably aromatic amines in terms of heat resistance of the final resin, but if flexibility and flexibility of the resin are desired, alicyclic amines may be used alone or in combination. good. Furthermore, it is particularly desirable that the polyvalent amines be primary amines in terms of reactivity, but secondary amines can also be used.
Suitable amines include meta or paraphenylene diamine, meta or para xylylene diamine, 1,4- or 1,3-cyclohexane diamine, hexahydroxylylene diamine, 4,
4'-Diaminebiphenyl, bis(4-aminophenyl)mene, bis(4-aminophenyl)ether, bis(4-aminophenyl)sulfone, bis(4-amino-3-methylphenyl)methane, bis(4-amino-3 ,5-dimethylphenyl)methane, bis(4-aminophenyl)cyclohexane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-amino-3-methylphenyl)propane, bis(4-amino -3-chlorophenyl)methane, 2,2-bis(3,5-dipromo-4-aminophenyl)propane, bis(4-chlorophenyl)methane,
-aminophenyl) phenylmethane, 3,4-diaminophenyl-4'-aminophenylmethane,
These include 1,1-bis(4-aminophenyl)-1-phenylethane, melamines having an s-triazine ring, and polyamines made by reacting aniline with formalin and linking benzene rings with methylene bonds. In the present invention, the above-mentioned polyfunctional maleimide can be used in the form of a prepolymer or a prepolymer with the above-mentioned polyamine instead of being used in the form of a so-called monomer. In the present invention, other components other than the above-mentioned components include epoxy resins, esters of (meth)acrylic acid such as esters of (meth)acrylic acid, epoxy esters of (meth)acrylic acid, and alkenyl esters of (meth)acrylic acid. and prepolymers thereof; diallyl phthalate. Divinylbenzene.
Diallylbenzene. Polyallyl compounds such as trialkenyl isocyanurate and their prepolymers: Dicyclopentanediene and its prepolymers: Phenol resins: Polyvinyl acetal resins such as polyvinyl formal, polyvinyl acetal, and polyvinyl petyral; OH groups or
Acrylic resin with COOH group, silicone resin,
Alkyd resin; polyptadiene. Putadiene
Acrylonitrile copolymer, polychloroprene,
Liquid-elastic materials such as putadiene-styrene copolymer, polyisoprene, butyl rubber, natural rubber, etc.
Rubbers, polyimide polymers, etc. can be used as appropriate. The resin composition of the present invention itself has the property of becoming a heat-resistant resin by being bonded and reticulated by heating, but in order to promote crosslinking and reticulation, it is usually used in the form of a catalyst. Such a catalyst is
2-Methylimidazole, 2-undecylimidazole, 2-heptadecyl imidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-propyl-2-methylimidazole, 1
-cyanoethyl-2-methylimidazole, 1-
Imidazoles exemplified by cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-guanaminoethyl-2-methylimidazole, and further,
Trimellitic acid adducts of these imidazoles, etc.; N,N-dimethylbenzylamine, N,N-
Dimethylaniline, N,N-dimethyltoluidine, N,N-dimethyl-p-anisidine, p-halogeno-N,N-dimethylaniline, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline, Tertiary amines such as N-methylmorpholine, triethanolamine, triethylenediamine, N,N,N',N'-tetramethylbutanediamine, N-methylpiperidine; phenol, cresol, xylenol, resorcin, catechol, phloroglucin Phenols such as lead naphthenate, lead stearate, zinc naphthenate, zinc octylate, tin oleate,
Organic metal salts such as diptyltin maleate, manganese nathenate, cobalt naphthenate, iron acetylacetone; inorganic metal salts such as SnCl 2 , ZnCl 3 , AlCl 3 ; benzoyl peroxide, lauroyl peroxide, capryl peroxide, acetyl peroxide, Peroxides such as parachlorobenzoyl peroxide, tertiary butyl phthalate; maleic anhydride, phthalic anhydride, lauric anhydride, pyromellitic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, hexahydro trimellitic anhydride, hexahydro anhydride Examples include acid anhydrides such as pyromellitic acid, and azo compounds such as azopisnitrile.
The amount of the catalyst to be added is sufficient within the general range of the catalyst amount, for example, it may be used in an amount of 10% by weight or less based on the total composition. The curable resin composition of the present invention is prepared by a method using a conventional solvent or a method in which powders of each component are mixed without a solvent under conditions in which components a or a+b are melted. The temperature for curing the curable resin composition of the present invention may vary depending on the presence or absence of a curing agent or catalyst, the salts of the composition components, etc., but is generally selected within the range of 100 to 300°C. When used in the production of molded products, laminates, adhesive structures, etc., it is preferable to apply pressure during heat curing, and generally speaking, the pressure is appropriately selected within the range of 0.1 to 500 kg/cm 2 . Various additives can be added to the composition of the present invention as desired, as long as the original properties of the composition are not impaired. Examples of these additives include various known additives such as fiber reinforcing base materials, fillers, dyes and pigments, lubricants, coupling agents, and flame retardants. The present invention will be specifically explained below using Examples and Comparative Examples. Example 1 2,2-bis(4-anatophenyl)propane
Polybenzimidazole (trade name,
1000 g of Imidite (manufactured by Whittaker) were added, and these were dissolved in a mixed solvent of N,N-dimethylformamide and N,N-dimethylacetamide. To this was added 0.1 g of zinc octylate as a catalyst, and the mixture was stirred and mixed uniformly. This was applied to stainless steel, heated and dried to bring the resin to B-Stage, then stainless steel was placed on top of this and heated to 175°C while applying a pressure of 5 kg/cm 2.
It was allowed to cure for 3 hours. The measurement results of this adhesive layer are
Shown in the table. Example 2 2,2-bis(4-anatophenyl)propane
500g and bis(4-maleimidophenyl)methane
500g was pre-reacted at 150°C for 45 minutes. To this was added 400 g of polybenzimidazole (thermal softening temperature: about 360°C) synthesized from 3,3',4,4'-tetraaminobiphenyl and isophthalic acid diphenyl ester and mixed uniformly with a roll at 80°C. This was applied to stainless steel in the same manner as in Example 1, and another sheet of stainless steel was placed on top and cured at 175° C. for 2 hours and then at 240° C. for 4 hours while applying a pressure of 5 kg/cm 2 . The measurement results of this adhesive layer are shown in Table 1. Note that polybenzimidazole alone has a heat softening temperature of about 360°C, so it has poor processability, and bonding requires high temperature (360°C or higher) and high pressure. Comparative Example 1 0.1 g of zinc octylate catalyst was added to the prepolymer of 2,2-bis(4-cyanatophenyl)propane and bis(4-maleimidophenyl)methane obtained in Example 2, and stainless steel was prepared in the same manner as above. Glued the steel. The test results are shown in Table 1. Comparative Example 2 200 g of polyvinyl butyral (degree of polymerization 2000) was added to 1000 g of the 2,2-bis(4-cyanatophenyl)propane prepolymer obtained in Example 1,
After dissolving this in methyl ethyl ketone and making it homogeneous, it was applied to stainless steel, heated and dried.
- After setting it to Stage, place stainless steel on top and 5
It was cured at 175°C for 2 hours and at 200°C for 1 hour under a pressure of Kg/cm 2 . The measurement results of this adhesive layer are shown in Table 1.
【表】【table】
【表】
るかないかを見る。
[Table] See whether it is true or not.
Claims (1)
多官能性シアン酸エステル、該シアン酸エステ
ルプレポリマー或いは該シアン酸エステルとア
ミンとのプレポリマー、 または前記aおよび b 分子中に2個以上のマレイミド基を有する多
官能性マレイミド、該マレイミドプレポリマー
或いは該マレイミドとアミンとのプレポリマー
と c ポリベンズイミダゾール を必須成分としてなる硬化性樹脂組成物。[Scope of Claims] 1 a A polyfunctional cyanate ester having two or more cyanato groups in the molecule, a prepolymer of the cyanate ester, or a prepolymer of the cyanate ester and an amine, or the a and b molecules described above. A curable resin composition comprising a polyfunctional maleimide having two or more maleimide groups therein, a prepolymer of the maleimide, or a prepolymer of the maleimide and an amine, and polybenzimidazole as essential components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4333282A JPS58160351A (en) | 1982-03-18 | 1982-03-18 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4333282A JPS58160351A (en) | 1982-03-18 | 1982-03-18 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58160351A JPS58160351A (en) | 1983-09-22 |
| JPH0322420B2 true JPH0322420B2 (en) | 1991-03-26 |
Family
ID=12660873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4333282A Granted JPS58160351A (en) | 1982-03-18 | 1982-03-18 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160351A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107429059B (en) * | 2015-03-27 | 2020-10-23 | 东京应化工业株式会社 | Energy-sensitive resin composition |
-
1982
- 1982-03-18 JP JP4333282A patent/JPS58160351A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58160351A (en) | 1983-09-22 |
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