JPH0322443A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the damage of a chip, and to improve the reliability of a device by forming a recessed section to a chip support member and fixing the chip to a package by a gas for application of pressure. CONSTITUTION:A chip 4, to which a dicing process is completed and which is expanded, is being transferred to a chip sucking section 2. Since a recessed section is shaped to the end face of the base of a sucking and pressure bead 18, only the peripheral section of the chip 4 is brought into contact by the chip sucking base 19 of the sucking and pressure head 18 when the chip 4 is sucked. A valve 22 is changed over from the state, in which it is closed, to a vacuum system 20, the sucking and pressure head 18 to which the chip 4 is sucked is lifted and stopped at the position of transfer, and a chip sucking and pressure section 17 is moved to a chip loading section 3. The valve 22 brought to the vacuum system is changed over to a closed state, and the chip 4 is released from the state of suction. The valve 22 is changed over to a pressure system, and a gas at fixed pressure such as air is fed to the sucking and pressure head 18.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a semiconductor device.

[Conventional technology]

Figure 4 is a plan view showing the whole of a conventional semiconductor chip (hereinafter referred to as a chip) loading machine, Figure 5 is a top view showing the whole of a conventional die bonding machine, and Figure 6 is a plan view showing the whole of a conventional die bonding machine. FIG. 7 is a cross-sectional view showing a state in which the chip shown in FIG. 5 is mounted in a semiconductor package (hereinafter referred to as a package). In the figure, (1)
is a chip mounting machine, and (2) and (3) are a chip suction part and a chip mounting part in this chip mounting machine (1). (4》 is a plurality of chips that should become a semiconductor device, (
5) is a vinyl sheet (hereinafter referred to as "vinyl sheet") placed in the chip suction part (2), whose periphery is supported by a holder (not shown), and on which the chips (4) placed at predetermined intervals are placed on the upper surface side. (6) is a package made of ceramic, for example, and has a recess on the surface on which the chip (4) is to be placed; (6a) is a package (6);
Chip (4) 5-Chip pasting part to be fixed, (7)
is a container in which packages (6) are placed at predetermined intervals in correspondence with the number of chips (4). (8) is the intermediate part between the chip suction part (2) and the chip mounting part (3), in this case,
Vacuum suction unit with suction and transfer functions arranged on the upper side of the figure, (9> is the chip (4) in the vacuum suction unit (8))
The suction head QO that suctions the suction head (9) is a suction pipe provided in the suction head (9). (self) is the die bonding machine, car is the die bonding machine 0, in this case, the chip pressurizer disposed at the upper center in the figure, and 0 is the chip pressurizer O that is made of a flexible material such as polyfluoroethylene resin. It is a pressure head.

α4 is an adhesive that fixes the chip (4) to the package (6).

Next, the process of mounting the chip (4) on the package (6) will be explained. First, after the dicing process is completed, expanded chips (4) are transferred to the chip adsorption section (2). Next, the vacuum suction unit (8), which is movable up and down and left and right as shown by the arrows, moves to a predetermined position on the chip (4), and the suction head (9>) descends to the top surface of the chip (4). When the suction head (9) comes into contact with the chip (4), a predetermined vacuum pressure is created in the suction pipe QO, and the chip (4) is adsorbed by the suction head (9).At this time,
The suction head (9) contacts the central part of the chip (4) where the pattern is formed. After the suction of the chip (4) is completed, the suction head (9) rises, and when it returns to its original height, the vacuum suction part (8) moves to the chip mounting part (3). Packages (6) are arranged in the chip mounting section (3), and the packages (6) are coated with adhesive α4 in advance on the chip attachment section (60) in the recess. 8) moves to a predetermined position on the package (6), the suction head (9) descends again and the package (
6) Place the chip (4) on top. When the placement of the chip (4) is completed, the vacuum suction section (8) stops suctioning, and the suction head (9) returns to its original position. When these series of cycles are completed, the vacuum suction section (8) returns to the chip suction section (2).
), and the next chip (4) is transferred.

In this way, a series of cycles are repeated one after another until there are no chips (4) left. When all the chips (4) are mounted on the packages (6), the package container (7) is transferred to the die bonding machine (b). Since the chip (4) cannot be mounted with a predetermined strength just by being placed on the package (6), it is necessary to apply pressure from above the chip (4) in the die bonding machine αD. Use this as a chip pressurizer O
Do it with When the chip pressurizer 0 reaches the predetermined position, the pressurizing head O lowers and the entire surface of the chip (4) comes into contact with the entire lower surface of the pressurizing head O as shown in the figure. push. As a result, the chip (4) is fixed to the chip attaching portion (6m) of the package (6). When this is completed, the pressure is increased and the mounting of the chip (4) onto the package (6) is completed. This series of cycles is repeated until all packages (6) are completed. Once this is completed, the chip (4) is packaged (
The step of implementing step 6) is completed.

Thereafter, a predetermined process is further performed to complete the semiconductor device.

[Problem to be solved by the invention]

In the conventional mounting method of the chip (4) on the package (6), when the chip (4) is suctioned, the end surface of the suction head (9) directly contacts and supports the central part of the main surface of the chip (4). Further, during fixation, the end surface of the pressure head 0 directly contacts the main surface of the chip (4) and pressurizes it. Therefore, the main surface of the chip (4) will be damaged. Furthermore, as the chip (4) is repeatedly attracted and pressurized, the end surfaces of the suction head (9) and the pressure head O are contaminated with foreign matter, etc., and damage is accelerated. turn into. As described above, there is a problem in that the reliability of the semiconductor device and the manufacturing yield are lowered due to damage.

This invention was made in order to solve the above-mentioned problems, and it is possible to manufacture a semiconductor device in which a chip can be suitably mounted on a package, reliability is improved, and manufacturing yield is improved. The purpose is to provide a method.

[Means for Solving the Problems] A method for manufacturing a semiconductor device according to the present invention includes supporting the chip with a chip support member that comes into contact with the periphery of the chip, and placing the support member at a predetermined position in a recess provided in a package. The component is mounted by being pressurized and fixed by pressurized gas supplied to the component.

[Effect]

The chip support member in this invention has a recess formed in the end face facing the chip, and does not come into contact with the inner center side when supporting the chip. In addition, when the chip is fixed, the peripheral part of the chip is supported and is pressed by the gas that passes through the support member and is connected, so it has the effect of suppressing damage to the chip surface part.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a plan view showing the entire chip mounting machine according to the present invention, FIG. 2 is a cross-sectional view showing a state in which the chip is adsorbed in FIG. 1, and FIG. 3 is a state in which the chip in FIG. FIG. In the figure, (1)
~ α4 is the same as the conventional one, α is the chip suction part (2),
A chip adsorption unit with adsorption/pressurization and transfer functions is located in the middle of the chip mounting section (3), in this case on the upper side in the figure.
The pressurizing part (self) is a suction/pressurizing part that adsorbs and presses the chip (4) in the adsorption/pressurizing part, and has a concave part formed in the inner center of its end surface. αO is the chip suction table in the adsorption/pressure head (incorporated), (1) and circle are the vacuum system piping and pressurization system piping arranged at the upper part of the adsorption/pressure head (in this case, the upper side in the figure) . @ stands for adsorption/
This valve is installed at the junction of the vacuum system piping (1) and the pressurization system piping at the top of the pressurizing head (self), and is capable of system switching.

Next, the process of mounting the chip (4) on the package (6) will be explained. After the dicing process is completed, the expanded chips (4) are transferred to the chip suction section (2). This chip suction part (2) has a stage that can move in the X direction and the Y direction in the figure, and the α force of the chip suction/pressure part moves to a predetermined position on the chip suction part (2). When the stage is stopped, the X and Y directions of the stage are finely adjusted, and the chip (4) designated from among the plurality of chips is aligned with the chip suction/pressure section (b). After this, the chip adsorption/pressure unit (1?+) descends and stops descending when it comes into contact with the surface of the chip (4). Since a recess is formed on the bottom end surface of the bottom (c), when picking up the chip (4), only the periphery of the chip (4) comes into contact due to the scratches on the adsorption table α of the suction/pressure head 0. Next, the valve@ is switched from the closed state to the vacuum system (1), the adsorption/pressure head (g) adsorbs the chip (4), and the chip (4) is removed from the seat (5). After the adsorption/pressurization unit that has adsorbed the chip (4) rises and stops at the transfer position, the chip adsorption/pressure unit α moves to the chip mounting unit (3).Chip mounting The part (3) has an X-Y stage like the chip suction part (2),
It is possible to align the adsorption/pressure part a with the package (6).

When the chip adsorption/pressure unit (171) has been moved to a predetermined position in the chip mounting unit (3), the package (6) specified from among the plurality of packages is aligned. Sodo descends and places Ji Seop (4) on the chip attachment part of package O, which has been prepared by applying adhesive α◆.Here, the vacuum system is turned on. The valve that was in use was switched to the closed state and the chip (4
) is released from the adsorption state. Next, the valve switches to a pressurized system, and gas at a predetermined pressure, such as air or nitrogen gas, is supplied. Inert gas, etc. is supplied to the adsorption/pressurization head (g). In this case, the chip (4) is fixed to the Ji-Seop attachment part 0 using air at a predetermined pressure.

By doing this, it is possible to apply pressure to the chip (4) with a uniform force without touching the main surface of the chip (4) on the inner center side where the main pattern is arranged. After pressurizing for a predetermined period of time, the valve is closed and the suction/pressure head (g) rises and stops at the initial position. When these series of cycles are completed, the chip adsorption/pressurizing part Q moves again to the chip adsorption part (2), and the next chip (4) is adsorbed. In this way, a series of cycles are repeated one after another until no chips (4) are left. When all the chips (4) are fixed to the package (6), the chips (4)
The process of mounting the package (6) is completed. Thereafter, predetermined processing is further performed to complete the semiconductor device.

With this method, the suction/pressure head (self) can
Since only the peripheral portion of the chip (4) is supported and the inner center thereof is not contacted, damage to the surface portion of the chip (4) is prevented and the surface portion is kept clean. Also, the same adsorption/pressure head (g) can be used to adsorb/press the chips (4).
Since the transfer and pressurization are carried out, the work time can be shortened.

In the description of the above embodiment, the adsorption/pressure head (c) is entirely made of tetrafluoroethylene resin, but in other cases, for example, the part that contacts the chip (4) may be made of If it is made of tetrafluoroethylene resin and other parts are made of metal, or it can be used for adsorption, pressurization, etc.
It is also possible to construct the metal member 0 with a metal body, and at least the portion that contacts the chip (4) is coated with tetrafluoroethylene resin.

In addition, the suction/pressure head (G) has a concave part at the bottom end, and the peripheral part is shaped so as to come into contact with the CHI-SOP (4), but the shape of the concave formed in this end face , can be appropriately modified depending on the pattern formed on the cheese sub (4).

Furthermore, although the chip loading machine (1) is composed of a chip suction part (2) and a chip loading part (3), and these are incorporated into one device, the present invention is not limited to this.
The chip suction part (2) and the chip mounting part (3) may be configured separately and independently, and this is also applied in this case, and the same effects as described above are achieved.

〔Effect of the invention〕

As described above, according to the present invention, the chip support member is provided with a recess, the chip is supported by the recess, and the chip is fixed to the piso cage by the pressurized gas passing through the recess, so that the chip is not damaged. Therefore, the reliability of the semiconductor device can be improved, and the manufacturing yield can be improved.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing the entire chip mounting machine according to the present invention, Fig. 2 is a sectional view showing the state in which the chip is adsorbed in Fig. 1, and Fig. 3 is the state in which the chip in Fig. 1 is mounted on the package. 4 is a plan view showing the entire conventional chip mounting machine, Fig. 5 is a plan view showing the entire conventional die bonding machine, and Fig. 6 shows the chip adsorption state in the fjM4 diagram. 7 is a sectional view showing a state in which the chip in FIG. 5 is mounted on a package. In the figure, (2) is the chip suction part, (3) is the chip mounting part, (4) is the chip, (6) is the package, and (6a) is the chip suction part.
is the chip pasting part, (9) is the suction tube, lllG is the suction tube, α4 is the adhesive, α〃 is the chip adsorption/pressure part,
(g) is the suction/pressure head, and (auto) is the chip suction table. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] The semiconductor chip is supported by a chip support member that comes into contact with the periphery of the semiconductor chip, and is fixed to a predetermined position of a recess provided in the package by applying pressure with pressurized gas supplied through the support member. A method for manufacturing a semiconductor device that is mounted using a semiconductor device.