JPH0354858B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention involves pushing up a die on the wafer sheet with a central push-up needle while the wafer sheet is being sucked by a suction body, and moving the pushed-up die through a suction nozzle. This invention relates to a die bonding device that adsorbs and transfers the die.

[Conventional technology]

Conventionally, such die bonding apparatuses include those in which the suction surface of the suction nozzle is flat as shown in FIG.
A pyramid-shaped structure as shown in FIG. 5 is known.

In FIGS. 4 and 5, the wafer sheet 2 to which the die 1 is attached is fixed to a frame (not shown) that moves in the XY directions. A suction body 3 in which a vacuum hole 3a is formed is disposed below the wafer sheet 2, and a central push-up needle 4 for pushing up the die 1 is disposed in the center of the suction body 3. Above the central push-up needle 4, a suction nozzle 5 with a flat suction surface or a suction nozzle 6 with a pyramid-shaped suction surface that suctions the thrust die 1 by vacuum is arranged so as to be movable up and down and in the X and Y directions. The suction nozzles 5 and 6 are urged downward by a spring (not shown).

Next, the operation of this device will be briefly explained. Here, FIG. 5 shows the case of suction error. First, as shown in FIGS. 4a and 5a, the wafer sheet 2
is adsorbed by the adsorbent 3, and there is a slight gap S ₁ (approximately 0.01 to 0.1
mm) (in the case of Fig. 4), and the suction nozzles 5 and 6 are arranged so that the pyramidal inner surface of the suction nozzle 6 and the die 1 to be adsorbed have an S ₂ (approximately 0.3 to 0.5 mm) (in the case of Fig. 5). descend. The gaps S ₁ and S ₂ are provided to prevent the suction nozzle 6 from descending and applying an impact load to the die 1 . Next, as shown in FIGS. 4b and 4c and 5b and 5c, the central push-up needle 4 rises to push up the die 1, and the die 1 is sucked by the suction nozzles 5 and 6.
At this time, the suction nozzles 5 and 6 are raised together with the die 1 against the spring that urges the suction nozzle 5 downward. Thereafter, the central push-up needle 4 descends as shown in FIGS. 4d and 5d.

[Problem that the invention seeks to solve]

The flat suction nozzle 5 shown in _FIG . Since the die 1 pushed up by the push-up needle 4 comes into contact with the suction nozzle 5 in a horizontal state and is sucked, there is no possibility of suction errors.

However, since the suction nozzle 5 has a flat suction surface, the positional deviation of the die 1 with respect to the suction nozzle 5 cannot be corrected. Furthermore, since it comes into contact with the pattern surface of the die 1, the surface of the die 1 is likely to be damaged.
Especially in recent years, with the miniaturization of IC patterns, die 1
Surface scratches are becoming a problem. For these reasons, a pyramid-shaped suction nozzle 6 shown in FIG. 5 is generally used.

However, in the case of the pyramid-shaped suction nozzle 6 shown in FIG. 5, the center thrust needle 4 and the suction nozzle 6 push up and separate the die 1 in a sandwiched state, resulting in cracks and chips at the edges of the die 1. There was a problem.

Furthermore, as is clear from FIG. 5a, when the tip of the suction nozzle 6 descends so that there is a slight gap from the surface of the die 1, the gap S ₂ between the pyramidal inner surface of the suction nozzle 6 and the die 1 to be sucked increases. is large, about 0.3 to 0.5 mm, so that the die 1 pushed up by the central push-up needle 4 often tilts and contacts the suction nozzle 6, as shown in FIGS. When the die 1 tilts and comes into contact with the suction nozzle 6, the die 1
A slight gap is created between the outer periphery of the wafer and the suction nozzle 6, and this gap causes vacuum leakage, resulting in a suction error and the problem that the die 1 cannot be successfully separated from the wafer sheet 2.

SUMMARY OF THE INVENTION An object of the present invention is to provide a die bonding apparatus that can effectively separate a die from a wafer sheet since chipping, cracking, and adsorption errors do not occur in the die.

[Means for solving problems]

The structure of the present invention for solving the above problems of the prior art will be explained with reference to FIGS. 1 and 2, which correspond to embodiments. A cylindrical push-up cylinder 10 is disposed between the suction body 3 and the center push-up needle 4 and is movable up and down, with the center push-up needle 4 at the center. Furthermore, four peripheral push-up needles 11 are arranged on the outside of the push-up cylinder 10 so as to be able to move up and down so as to push up the peripheral portion of the die 1.

[Effect]

As shown in FIG. 1b, the push-up cylinder 10 is first raised. As a result, the four corners of the die 1 have already been peeled off from the wafer sheet 2. Next, as shown in FIG. 3C, only the central push-up needle 4 and the peripheral push-up needles 11 rise to push up the die 1. As a result, the die 1 is placed on the central push-up needle 4 and the peripheral push-up needle 11. At this time, the suction nozzle 6 maintains a small gap with the die 1 being sucked. In this way, the die 1 has a central push-up needle 4 and a peripheral push-up needle 11.
Since it is placed on top, it is attracted to the suction nozzle 6 by the suction force of the suction nozzle 6, as shown in FIG.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Note that the same or equivalent members as in FIGS. 4 and 5 are designated by the same reference numerals, and their explanations will be omitted. A cylindrical push-up cylinder 10 is arranged between the suction body 3 and the center push-up needle 4 so as to be movable up and down, with the center push-up needle 4 at the center. Further, four peripheral push-up needles 11 are arranged on the outside of the push-up cylinder 10 so as to be able to move up and down so as to push up the peripheral portion of the die 1. Here, the push-up cylinder 1
After the die 1 is pushed up by the center push-up needle 4 and the peripheral push-up needle 11, the die 1 is pushed up further by the center push-up needle 4 and the peripheral push-up needle 11.

Next, the effect will be explained. As shown in FIG. 1a, with the wafer sheet 2 being sucked by the suction body 3, as shown in FIG.
The peripheral push-up needle 11 and the center push-up needle 4 rise slightly, and the die 1 to be picked up is pushed up slightly by the push-up cylinder 10. in this way,
When the die 1 is pushed up slightly with the push-up cylinder 10, the four corners of the die 1 are peeled off from the wafer sheet 2. At this time, the tips of the central push-up needle 4 and the peripheral push-up needles 11 are not protruding from the upper surface of the push-up cylinder 10. Simultaneously with, after, or before the above operation, the suction nozzle 6 descends, and a large gap _S3 is maintained between the inner surface of the pyramid of the suction nozzle 6 and the die 1 to be suctioned.

Next, as shown in Figure c, only the central push-up needle 4 and the peripheral push-up needle 11 are further raised. As a result, only the die 1 is pushed upward, and the die 1 is separated from the wafer sheet 2. In this case, the die 1 to be sucked is pushed up higher than the adjacent die 1 by the center push-up needle 4 and the peripheral push-up needle 11, so the lower surface of the suction nozzle 6 does not hit the adjacent die 1, and the die 1 is sucked. The gap _S4 between the die 1 and the pyramidal inner surface of the suction nozzle 6 is 0.01~
The gap can be as small as 0.1mm.

In this way, the die 1 to be sucked is separated from the wafer sheet 2 and placed on the center push-up needle 4 and the peripheral push-up needle 11, so that the die 1 is separated from the wafer sheet 2 and placed on the center push-up needle 4 and the peripheral push-up needle 11. It is adsorbed by the suction nozzle 6 as shown in FIG. After that, as shown in FIG.
Then, the peripheral push-up needle 11 descends below the wafer sheet 2.

As is clear from the above explanation, the four corners of the die 1 have already been peeled off from the wafer sheet 2 by the process shown in FIG. When pushing up the die 1, the die 1 is more easily separated than the wafer sheet 2. In addition, as shown in Figure c, the die 1 placed on the central push-up needle 4 and the peripheral push-up needle 11 is attracted by the suction force of the suction nozzle 6 as shown in Figure d, so that the die 1 is chipped. , no cracking occurs. In addition, in the state shown in figure c,
Since the gap between the die 1 and the pyramidal inner surface of the suction nozzle 6 can be made very small, the die 1 is attracted to the suction nozzle 6 without tilting, and no suction error occurs.

FIG. 3 shows another embodiment of the invention. In the above embodiment, a case has been described in which four peripheral push-up needles 11 are provided, but the number of peripheral push-up needles 11 may be any number that can stably support the die, and the number is not particularly limited. For example, there may be three as shown in FIG. 3a, or eight as shown in FIG. 3b.

In the above embodiment, the central push-up needle 4 and the peripheral push-up needles 11 were raised through the steps b and c in the same figure, but only the push-up cylinder 10 was raised in the step shown in b, and then the same steps were performed. Only the central push-up needle 4 and the peripheral push-up needle 11 may be raised as shown in FIG. c. Furthermore, the present invention is particularly effective in the case of the suction nozzle 6 whose suction surface is pyramid-shaped;
As shown in the figure, the suction nozzle 5 has a flat suction surface.
Of course, this can also be applied. Further, in the illustrated embodiment, the push-up cylinder 10 is formed in a cylindrical shape, but it may also be angular.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, there is provided a push-up tube which is a cylinder centered on the center push-up needle and is arranged to be movable up and down between the adsorbent body and the center push-up needle, and the push-up tube. Equipped with multiple peripheral push-up needles that are movable up and down on the outside of the body, the die can be separated from the wafer sheet without chipping, cracking, or adsorption errors. .

[Brief explanation of drawings]

1A to 1E are operation explanatory diagrams showing one embodiment of the present invention, FIG. 2 is a sectional view taken along the line A-A in FIG.
Figures a and b are layout diagrams of peripheral push-up needles showing other embodiments of the present invention, and Figures 4 a to d and Figures 5 a to d are explanatory diagrams of the operation of conventional examples, respectively. 1: die, 2: wafer sheet, 3: adsorbent,
4: Center push-up needle, 5, 6: Adsorption nozzle, 1
0: Push-up cylinder, 11: Peripheral push-up needle.

Claims (1)

[Claims] 1. An adsorbent that adsorbs the wafer sheet to which the die is attached, a central push-up needle that is disposed inside the adsorbent and pushes up the die on the wafer sheet while the adsorbent is adsorbing the wafer sheet, and and a suction nozzle for adsorbing and transferring a die that has been removed, the push-up tube is arranged vertically movably between the adsorbent body and the center push-up needle with the tube centered on the center push-up needle. A die bonding device comprising: a body; and a plurality of peripheral push-up needles arranged vertically movably outside the push-up cylindrical body.