JPH0322446A - Formation of ball for wire bonding - Google Patents
Formation of ball for wire bondingInfo
- Publication number
- JPH0322446A JPH0322446A JP1155799A JP15579989A JPH0322446A JP H0322446 A JPH0322446 A JP H0322446A JP 1155799 A JP1155799 A JP 1155799A JP 15579989 A JP15579989 A JP 15579989A JP H0322446 A JPH0322446 A JP H0322446A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- wire
- discharge
- diameter
- torch electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ICやトランジスタなどの製造工程において
用いられているワイヤボンディング法に関するものであ
り、金属ワイヤ端に作られるボールの形戒方法に関する
ものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wire bonding method used in the manufacturing process of ICs, transistors, etc., and relates to a method for forming a ball formed at the end of a metal wire. It is something.
ワイヤボンディング法において、金属ワイヤには一定の
大きさのボールを形或するために、金属ワイヤの先端部
と放電電極との間に高電圧を印加し、金属ワイヤの先端
部と放電電極との間で放電が起こり、アークの発生によ
り、金属ワイヤの先端部は溶融され、球状を保ちながら
体積を増加していく。In the wire bonding method, in order to form a ball of a certain size on a metal wire, a high voltage is applied between the tip of the metal wire and a discharge electrode. An electric discharge occurs between the metal wires, and an arc is generated, which melts the tip of the metal wire and increases its volume while maintaining its spherical shape.
この場合、発生するアークの安定状態を維持することが
困難であるため、金属ワイヤの先端部に形成されるボー
ルの大きさ,形状を一定とすることができなかった。In this case, it is difficult to maintain a stable state of the generated arc, so the size and shape of the ball formed at the tip of the metal wire cannot be made constant.
そのため、放電電極として、熱電子放出の容易な電極を
用いる手段が特開昭62−136832号に開示されて
いるが、ボール形成時の放電は大気中で行われ、電子放
出の特性が変化し、このため、ボールの大きさ.形状を
一定とすることは難しい。Therefore, a method of using an electrode that easily emits thermionic electrons as a discharge electrode is disclosed in JP-A-62-136832, but the discharge during ball formation is performed in the atmosphere, and the electron emission characteristics change. , hence the size of the ball. It is difficult to keep the shape constant.
本発明は、放電電極の表面状態が変化しても、放電電極
から安定した電子放出を行わせ、一定の大きさ、形状の
ボールを得ることができる方法を提供することを目的と
するものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a method that enables stable electron emission from a discharge electrode and obtains balls of a constant size and shape even if the surface condition of the discharge electrode changes. be.
本発明は、前記目的を達威するために、ワイヤの端部と
トーチ電極との間に高電圧を印加して、ワイヤの端部に
ポールを形成するに際して、高電圧を印加する直前から
印加時にトーチ電極に対して紫外線を照射することを特
徴とするものである。In order to achieve the above object, the present invention applies a high voltage between the end of the wire and the torch electrode to form a pole at the end of the wire. It is characterized in that the torch electrode is sometimes irradiated with ultraviolet light.
本発明では、ワイヤの端部とトーチ電極との間に高電圧
を印加する際に、トーチ電極に対して紫外線を照射する
ことにより、放電の安定性を維持し、ワイヤの端部に形
成されるポールの径を一定の大きさとすることができる
。In the present invention, when a high voltage is applied between the end of the wire and the torch electrode, the torch electrode is irradiated with ultraviolet rays to maintain the stability of the discharge and prevent the formation of The diameter of the pole can be set to a constant size.
以下、本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
第1図において、ボンディグを終えたAuワイヤ1の端
部1aにボールを形戒するため、Auワイヤ1の端部1
aの下部には、トーチ電極2が移動し、Auワイヤ1の
端部1aとトーチ電極2との間に、0.3〜0.5fi
のギャップを設け、このギャップ間に電源3により高電
圧を印加し、ここで発生するアークにより、Auワイヤ
の端部1aを溶融し、球状のポールを形成する。In FIG. 1, in order to form a ball on the end 1a of the Au wire 1 after bonding, the end 1a of the Au wire 1 is
The torch electrode 2 moves to the lower part of a, and there is a gap of 0.3 to 0.5fi between the end 1a of the Au wire 1 and the torch electrode 2.
A high voltage is applied between the gaps by the power source 3, and the arc generated here melts the end portion 1a of the Au wire to form a spherical pole.
この場合、Auワイヤの端部に形成されるボール径が電
流密度により変化することを、本発明者は実験を行った
結果見出した。すなわち、ボール径は放電電流により決
められるが、第2図(a), (b)に示すように、(
a)の放電面積A,が広い場合と、(b)のレジスト5
により放電面積A2を狭くした場合とにおいて、放電面
積A1が広くて電流密度が小さい方は、ボール径が小さ
く形成され、放電面積A2が狭くて電流密度が大きい方
は、ボール径が大きく形成される。In this case, the inventors have found through experiments that the diameter of the ball formed at the end of the Au wire changes depending on the current density. In other words, the ball diameter is determined by the discharge current, but as shown in Figures 2(a) and (b), (
a) when the discharge area A is large, and (b) when the resist 5
In the case where the discharge area A2 is narrowed by Ru.
このようなことから、一定の放電電流の状態において、
Auワイヤの端部に形戒するボール径を一定の小径のも
のとして得るには、広い放電領域を常に安定して維持す
ることが重要である。For this reason, in a state of constant discharge current,
In order to obtain a ball with a constant small diameter formed at the end of the Au wire, it is important to maintain a wide discharge area stably at all times.
本発明においては、一定の小径のボールをAuワイヤの
端部に得るため、紫外線の照射面積で広い放電領域を常
に安定して形成する点に特徴を有する。The present invention is characterized in that a wide discharge area is always stably formed in the ultraviolet irradiation area in order to obtain a ball of a certain small diameter at the end of the Au wire.
本発明を第1図に戻って説明すると、Auワイヤ1の端
部1aに対向するトーチ電極2の面を照射しうるように
、紫外線照射ランプ(以下、UVランプという)4が設
けられており、ギャップ間に電源3により高電圧を印加
する直前から印加中に渡り、UVランプ4によりトーチ
電極2の面に対して紫外線4aを照射する。To explain the present invention by returning to FIG. 1, an ultraviolet irradiation lamp (hereinafter referred to as UV lamp) 4 is provided so as to irradiate the surface of the torch electrode 2 facing the end 1a of the Au wire 1. Immediately before and during the application of a high voltage by the power source 3 between the gaps, the UV lamp 4 irradiates the surface of the torch electrode 2 with ultraviolet rays 4a.
Auワイヤの径が20μmΦであり、これに1倍半のボ
ール径を得るように、0. 3 mmのギャップ間に高
電圧を印加し、紫外線を照射しない従来の場合と、紫外
線4aを照射した本発明の場合において、ボール径のば
らつきの結果を得た。The diameter of the Au wire is 20 μmΦ, and in order to obtain a ball diameter one and a half times that of the Au wire, 0.0 μm is used. A high voltage was applied across a gap of 3 mm, and results of variations in ball diameter were obtained in the conventional case in which no ultraviolet rays were irradiated and in the present invention in which ultraviolet 4a was irradiated.
これによると、従来の場合は、35±4μm1本発明の
場合は、35±1.4μmであり、本発明の場合には紫
外線を照射することにより、仕事関数を一定に維持し、
安定した放電を威しうろことができ、ボール径のばらつ
きがない。According to this, in the conventional case, it is 35 ± 4 μm, and in the case of the present invention, it is 35 ± 1.4 μm, and in the case of the present invention, the work function is maintained constant by irradiating ultraviolet rays,
Stable discharge can be achieved, and there is no variation in ball diameter.
UVランプによる紫外線4aの照射面積は、ギャップ長
0. 3 Mで、20μmΦのAuワイヤの径に対して
通常の高電圧を印加した場合、Q.7n”で充分の効果
をあげることができる。また、放電領域を広くするため
、通常の場合、7 X 1 0−tmm”より大きい紫
外線の照射面積が必要である。The area irradiated with ultraviolet rays 4a by the UV lamp has a gap length of 0. When a normal high voltage is applied to an Au wire with a diameter of 20 μmΦ at 3 M, Q. A sufficient effect can be achieved with 7n''. Furthermore, in order to widen the discharge area, an ultraviolet irradiation area larger than 7 x 10-tmm is usually required.
印加電圧は、ギャソプ長の大小により変わり、ギャップ
長が長くなる程、高い電圧を必要とし、放電開始時には
高電圧を必要とするが、放電維持状態では放電開始時に
比べて低くて良い。The applied voltage varies depending on the length of the gas gap, and the longer the gap length, the higher the voltage is required, and the higher the voltage is required at the start of discharge, but it may be lower in the discharge maintenance state than at the time of start of discharge.
ギャップ長とボール径との関係は、放電電流を一定にし
た場合、ギャソプ長を変えると放電維持電圧が変わり、
ボール径が変化する。通常の印加電圧でボール径の変化
が少ないギャソプ長は、0.3〜0. 5 mのギャソ
プ長であり、この場合、紫外線の照射面積の最適範囲は
0.12〜0.50ml2であった。所定のギャップ長
に対して一定の照射面積が必要であり、照射面積が小さ
過ぎると、その効果は減少する。The relationship between gap length and ball diameter is that when the discharge current is constant, changing the gap length changes the discharge sustaining voltage.
Ball diameter changes. Gasop length that causes little change in ball diameter with normal applied voltage is 0.3 to 0. The gasop length was 5 m, and in this case, the optimal range of ultraviolet irradiation area was 0.12 to 0.50 ml2. A certain irradiation area is required for a given gap length; if the irradiation area is too small, the effectiveness will be reduced.
尚、ボール径の制御は、従来の通り、放電時間や放電電
流により行われる。Note that the ball diameter is controlled by the discharge time and discharge current as in the past.
本発明の構威により、トーチ電極から安定した電子放出
を行わせることができ、一定の小径ボールを形成するこ
とができ、微小面積の電極への接続を効率よくなしうろ
ことにより、ワイヤボンディングの用途を拡げる効果を
有する。With the structure of the present invention, stable electron emission can be performed from the torch electrode, a ball with a constant small diameter can be formed, and the connection to the electrode of a minute area can be made efficiently. It has the effect of expanding its uses.
第1図は本発明を示す概略側面図、
第2図tag, fb)は電流密度とボール径の関係を
示す概略側面図である。
1・・・金属ワイヤ、2・・・トーチ電極、3・・・電
源、4・・・紫外線照射ランプ、4a・・・紫外線。
7FIG. 1 is a schematic side view showing the present invention, and FIG. 2 (tag, fb) is a schematic side view showing the relationship between current density and ball diameter. DESCRIPTION OF SYMBOLS 1... Metal wire, 2... Torch electrode, 3... Power supply, 4... Ultraviolet irradiation lamp, 4a... Ultraviolet rays. 7
Claims (1)
ワイヤの端部にボールを形成するに際して、高電圧を印
加する直前から印加時にトーチ電極に対して紫外線を照
射することを特徴とするワイヤボンディング用ボール形
成方法。By applying a high voltage between the end of the wire and the torch electrode,
A method for forming a ball for wire bonding, which comprises irradiating a torch electrode with ultraviolet rays immediately before and during application of a high voltage when forming a ball at the end of a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155799A JPH0322446A (en) | 1989-06-20 | 1989-06-20 | Formation of ball for wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155799A JPH0322446A (en) | 1989-06-20 | 1989-06-20 | Formation of ball for wire bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0322446A true JPH0322446A (en) | 1991-01-30 |
Family
ID=15613698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1155799A Pending JPH0322446A (en) | 1989-06-20 | 1989-06-20 | Formation of ball for wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322446A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0837750A4 (en) * | 1995-05-26 | 1998-06-10 | ||
| KR100610943B1 (en) * | 2000-11-03 | 2006-08-09 | 앰코 테크놀로지 코리아 주식회사 | Wire bonding method of semiconductor device |
-
1989
- 1989-06-20 JP JP1155799A patent/JPH0322446A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0837750A4 (en) * | 1995-05-26 | 1998-06-10 | ||
| EP1232828A1 (en) * | 1995-05-26 | 2002-08-21 | Formfactor, Inc. | Wire bonding, severing, and ball forming |
| KR100610943B1 (en) * | 2000-11-03 | 2006-08-09 | 앰코 테크놀로지 코리아 주식회사 | Wire bonding method of semiconductor device |
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