JPH03225855A - IC package - Google Patents

IC package

Info

Publication number
JPH03225855A
JPH03225855A JP2165390A JP2165390A JPH03225855A JP H03225855 A JPH03225855 A JP H03225855A JP 2165390 A JP2165390 A JP 2165390A JP 2165390 A JP2165390 A JP 2165390A JP H03225855 A JPH03225855 A JP H03225855A
Authority
JP
Japan
Prior art keywords
package
individual
tube
view
stored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2165390A
Other languages
Japanese (ja)
Inventor
Seiji Takahara
高原　誠司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2165390A priority Critical patent/JPH03225855A/en
Publication of JPH03225855A publication Critical patent/JPH03225855A/en
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent inverse-insertion trouble and enable movement (backlash) of an IC within a individual-package tube by forming the shape of an IC package and that of the individual-package tube in asymmetrical shape. CONSTITUTION:With an IC package, a DIP IC package is stored in an individual-package tube from right direction. As seen from a state 3b, since the individual-package tube and the IC package are constituted in asymmetrical shape when storing from the inverse direction, a protecting part 2a of the individual-package tube and a groove 1c of the IC package do not engage each other, this preventing a proper storage. Also, the move (backlash) of the IC package within the individual-package tube is regulated by a room of this projecting part 2a and the groove 1c, thus preventing storage of IC into the individual-package tube from inverse direction and enabling backlash of IC within the individual-package tube to be reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はＩＣチップを封入するＩＣパッケージに関し
、持ｌこＩＣパッケージを収納する個装チューブへの方
向性規制構造について提供するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an IC package that encapsulates an IC chip, and provides a directionality regulating structure for an individual packaging tube that houses the IC package.

〔従来の技術〕[Conventional technology]

第６図（ａ）〜（ａｌは従来のＩＣパッケージの平面図
・正１図および側面図、第７図（ａｔ（ｈｌは第６図の
ＩＣパッケージを収納する個装チューブの正面図および
側面Ｊ（である。図において、（４ｍ）はＩＣパッケー
ジのプラスチックモールド部、（４ｂ）はＩＣパッケー
ジのリード部、（５ｂ）はＩＣパッケージの止めビンで
ある。第８図は従来のＩＣパッケージを個装チューブに
個装収約される状態を示す斜視図で、図中、（６畠）は
個装チューブ蟇こＩＣパッケージを正方向に収納してい
る状態であり、（６ｂ）は逆方向に収納している状態を
示している。Figures 6(a) to (al are the plan view, front view, and side view of a conventional IC package, and Figure 7 (at (hl) are the front view and side view of the individual packaging tube that houses the IC package in Figure 6. In the figure, (4m) is the plastic mold part of the IC package, (4b) is the lead part of the IC package, and (5b) is the pin of the IC package. Figure 8 shows the conventional IC package. This is a perspective view showing the state in which the IC packages are individually packaged in the individual tubes. In the figure, (6) is the state in which the individually packaged tube IC packages are stored in the forward direction, and (6b) is in the reverse direction. It shows the state where it is stored.

次に動作について説明する。Next, the operation will be explained.

第８図のよう番こ、　ＩＣパッケージと個装チューブの
形状は図示の如くそれぞれ左右対称に形成されている為
、正方向・逆方向の両方向から収納が可能となっていた
。As shown in Figure 8, the shapes of the IC package and the individual packaging tube are symmetrical as shown in the figure, so they can be stored from both the forward and reverse directions.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のＩＣパッケージと個装チューブは以上のように構
成されていたので、逆方向への収納ミスが発生し易く、
ハンドラ・自動組立機等の自動機への装着ミスによるト
ラブルが発生するなどの問題点かあった。Conventional IC packages and individual packaging tubes were constructed as described above, making it easy for mistakes to be made when storing them in the opposite direction.
There were problems such as troubles caused by incorrect attachment to automatic machines such as handlers and automatic assembly machines.

この発明は、上記のような問題点を解消するためになさ
れたもので、個装チューブへのＩＣの逆方向の収納を防
止するとともに、個装チューブ内でのＩＣのがたつきを
ｌｔ＋Ｊ！減できるＩＣパッケージを得ることを目的と
する。This invention was made to solve the above-mentioned problems, and it prevents the IC from being stored in the reverse direction in the individual packaging tube, and also prevents the IC from rattling inside the individual packaging tube! The purpose is to obtain an IC package that can be reduced in size.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るＩＣパッケージは、　ＩＣパッケージの
ブうスチツクモールドの上面または下面に溝を形成する
ことにより、形状に方向性を持たせて非対称型番こし、
さらに、個装チューブの形状も同様に非対称に対向した
位置に凸部を形成し収納時にこの溝と凸部が係合するよ
うにしたものである。The IC package according to the present invention has a groove formed on the top or bottom surface of the book stick mold of the IC package to give directionality to the shape and create an asymmetric model number.
Furthermore, the shape of the individual packaging tube is similarly such that convex portions are formed at asymmetrically opposed positions, and the grooves and the convex portions engage with each other when stored.

Ｃ作用〕 この発明におけるＩＣパッケージの溝は、この溝と、個
装チューブに形成された凸部が係合しなけれは収納出来
ないように構成することにより、ＩＣパッケージが個装
チューブへ逆方向に収納出来なくなる。C effect] The groove of the IC package according to the present invention is configured so that the IC package cannot be stored unless the groove and the convex portion formed on the individual packaging tube engage with each other, so that the IC package can be inserted into the individual packaging tube in the reverse direction. It will not be possible to store it in the

また、個装チューブ内でのＩＣの動λ（がたつ八〕は、
ＩＣパッケージに形成し１こ溝と、個装チューブ内の凸
部の係合により規制され、さらに、ＩＣパッケージ収納
時にはＩＣパッケージが個装チューブの凸部をスライド
して収納される為、ＩＣパッケージやリード部へチュー
ブから力がかかりにくくなる。In addition, the movement λ of the IC in the individual tube is
The IC package is regulated by the engagement of a groove formed on the IC package with a protrusion inside the individual packaging tube, and when the IC package is stored, the IC package slides over the protrusion on the individual packaging tube. This makes it difficult for the tube to apply force to the leads.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第１図（ａｌ〜（０）において、（１畠）はＩＣパッケ
ージのプラスチックモールド部、　（ｌｂ）はＩＣパッ
ケージのリードを示す。またプラスチックモールド部（
１ａ）の上面の中央から一方にすらしｆこ位置には非対
称形状とする為の溝（ＩＣ）を形成している。In Figure 1 (al~(0)), (1 field) shows the plastic mold part of the IC package, and (lb) shows the lead of the IC package.
1a) A groove (IC) is formed at a position extending from the center of the upper surface to one side to create an asymmetrical shape.

第２図は、ム実流側の個装チューブの正面図および側面
図で、図において、（２ａ）はＩＣパッケージの溝（ｌ
ｅ）に噛み合うように構成された個装チューブの凸部、
（２ｂ）はＩＣパッケージ収納部、（２Ｃ）はＩＣパッ
ケージの止めビンを示している。Figure 2 is a front view and a side view of the individual packaging tube on the flow side of the module.
e) a convex portion of the individual packaging tube configured to engage with the
(2b) shows an IC package storage part, and (2C) shows an IC package retaining bin.

次に動作について説明する。Next, the operation will be explained.

ＩＣパッケージは第３図に示すように個装チューブにＤ
ＩＰ　ＩＣパッケージを右方向から収納する。The IC package is placed in an individual tube as shown in Figure 3.
Store the IP IC package from the right side.

（３ａ）図は正方向に収納している状態を示し、（３ｂ
）図は逆方向に収納している状態を示しており、（３ｂ
）図でわかるように逆方向から収納しようとする場合、
個装チューブとＩＣパッケージを非対称に構成している
ｒこめ１個装チューブの凸部（２轟）とＩＣパッケージ
の＋’３４　（１ｅ　ｌとが係合しない為収納出来ない
〔３Ｃ）。し１こΩ・つて、（３畠）図のように正方向
のみ［・か収納出来ない。ｌｆこ、個装チューブ内での
ＩＣバ１゛ノケージの期き（かｆ二つき）はこの凸部（
２ｍｌト４　＋　１　ｅ　ｌ　Ｑ’）ボ裕によって規制
される。まｒこ、ＩＣパッケージを個装チューブへ収納
時には、ＩＣパッケージの溝か個装チューブの凸部をス
ライドして円滑に装入さｎる。(3a) The figure shows the state where it is stored in the forward direction, and (3b)
) The figure shows the state where it is stored in the opposite direction, and (3b
) If you try to store it from the opposite direction as shown in the figure,
The individual packaging tube and IC package are configured asymmetrically, and the convex part (2) of the single packaging tube does not engage with the +'34 (1e l) of the IC package, so it cannot be stored [3C]. However, as shown in the figure, it cannot be stored only in the forward direction. lf This is the convex part (with two parts) when the IC battery 1 cage is placed inside the individual tube.
2 ml + 1 e l Q') is regulated by the volume. When storing an IC package into an individual tube, slide it through the groove of the IC package or the convex portion of the individual tube to insert it smoothly.

ｌ′、：お、上記実施例ではＩＣパッケージのモールド
１且ｌこｍ　（１ｃ　）を形成した場合を示したが一第
４図（ａｌ〜（ｃ＋ｔこ示スヨうにＩＣパッケージのモ
ールド下面に＝ｍ（ｌｄ）を舵戚してぞ）同様の効果が
ある。この場合の（ｌＩ！ｌ公チューブは第５囚（ａｌ
　（ｂ）　）こ示す。図中、（２ｄ〕は凸部である。l': In the above embodiment, the mold 1 cm (1c) of the IC package was formed, but as shown in FIG. m(ld)) has a similar effect. In this case, (lI!l public tube is the fifth prisoner (al
(b)) Show this. In the figure, (2d) is a convex portion.

〔光１８１Ｕ）効果〕 以上Ｊ）ようにこの発明によれは、ＩＣパッケージ・し
）′Ｉ′ｚ状と１１製チユーブの形状を非対称に形成す
るｔどけで実現出来る為、従来と同等価格で実現可能で
ある。[Light 181U) Effect] As described in J) above, this invention can be realized by removing the IC package by asymmetrically forming the shape of the IC package and the shape of the tube made of 11. It is possible.

まｆコ、逆入れ６ζより発生する外観検査・手直し作業
の省力化が行なえ、さらに、ハンドラーや自動組立機等
の自動機を使用する場合の逆入れトラブル防止の為に必
要となる機能（逆方向検出センサｅｒａ　）の省略や、
ジャム率の低減効果も上がる。It is possible to save labor in appearance inspection and rework work that occurs due to reverse loading 6ζ, and it is also necessary to prevent reverse loading troubles when using automatic machines such as handlers and automatic assembly machines (reverse loading). Omission of the direction detection sensor (era),
The jam rate reduction effect also increases.

また、個装チューブ内でのＩＣの動き（がたつき〕を規
制している為、ＩＣリードの曲りや、マーク消え等の外
観不良を低減で款るなどの効果かある。In addition, since the movement (rattling) of the IC within the individual packaging tube is restricted, it has the effect of reducing appearance defects such as bending of the IC lead and disappearing marks.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａ）〜（１３）はこの発明の一実施例によるＩ
Ｃパッケージの平面図・正面図および側面図、第２図（
＆１（ｂｌは第１図のＩＣパッケージを収納する個装チ
ューブの正面図および側面図、第３図は第１図のＩＣパ
ッケージを個装チューブに収納状襲を示す斜視図、第４
図（１）〜（（１１はこの発明の他の実施例によるｒｃ
パッケージの平面図、正面図および側面図、第５図（＆
）　（ｂｌは第４図のＩＣチューブを収納する個装チュ
ーブの正面図および側面図、第６図は従来のＩＣパッケ
ージの平面図・正面図および側面図、第７図は第４図の
ＩＣパッケージを収納する個装チューブの正面図および
側面図、第８図は率６図のＩＣパッケージを個装チュー
ブに収納している状態を示す斜視図である。 図において、（１ｍ）　；プラスチックモールド部、（
ｌｂ）　；リード、（］ｃ＋）（ｌｄｌ　；溝、（２ｍ
）（２ｄ）　；凸部、（２ｂ）；パッケージ収納部、［
２（１１；止めビンを示ス。 なお、図中、同一符号は同一、または相当部分を示す。FIGS. 1(a) to (13) show I according to an embodiment of the present invention.
Plan, front and side views of C package, Figure 2 (
&1 (bl is a front view and a side view of an individual tube that stores the IC package shown in FIG. 1, FIG. 3 is a perspective view showing how the IC package shown in FIG. 1 is stored in the individual tube, and
Figures (1) to ((11) are rcs according to other embodiments of the present invention.
Plan, front and side views of the package, Figure 5 (&
) (bl is a front view and a side view of the individual tube that houses the IC tube shown in Figure 4, Figure 6 is a plan view, front view, and side view of a conventional IC package, and Figure 7 is the IC package shown in Figure 4. A front view and a side view of the individual packaging tube for storing the package, and FIG. 8 is a perspective view showing the state in which the IC package of 6th scale is stored in the individual packaging tube. In the figure, (1 m); plastic mold Part, (
lb) ;Lead, (]c+)(ldl;Groove, (2m
) (2d) ;Convex part, (2b);Package storage part, [
2 (11; indicates a stopper bottle. In the figures, the same reference numerals indicate the same or corresponding parts.

Claims (2)

【特許請求の範囲】[Claims] （１）ＤＩＰタイプのＩＣパッケージの形状に非対称で
ある方向性を持たせたことを特徴とするＩＣパッケージ
。(1) An IC package characterized by having an asymmetrical directionality in the shape of a DIP type IC package. （２）ＩＣパッケージの上面または下面に、方向性を持
たせるように非対称となる位置に溝を形成したことを特
徴とするＩＣパッケージ。(2) An IC package characterized in that grooves are formed at asymmetric positions on the top or bottom surface of the IC package to provide directionality.
JP2165390A 1990-01-30 1990-01-30 IC package Pending JPH03225855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2165390A JPH03225855A (en) 1990-01-30 1990-01-30 IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2165390A JPH03225855A (en) 1990-01-30 1990-01-30 IC package

Publications (1)

Publication Number Publication Date
JPH03225855A true JPH03225855A (en) 1991-10-04

Family

ID=12061010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2165390A Pending JPH03225855A (en) 1990-01-30 1990-01-30 IC package

Country Status (1)

Country Link
JP (1) JPH03225855A (en)

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