JPH03226B2 - - Google Patents

Info

Publication number
JPH03226B2
JPH03226B2 JP22080882A JP22080882A JPH03226B2 JP H03226 B2 JPH03226 B2 JP H03226B2 JP 22080882 A JP22080882 A JP 22080882A JP 22080882 A JP22080882 A JP 22080882A JP H03226 B2 JPH03226 B2 JP H03226B2
Authority
JP
Japan
Prior art keywords
resin
laminate
threads
impregnated
impregnated base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22080882A
Other languages
Japanese (ja)
Other versions
JPS59109347A (en
Inventor
Hideto Misawa
Tokio Yoshimitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP22080882A priority Critical patent/JPS59109347A/en
Publication of JPS59109347A publication Critical patent/JPS59109347A/en
Publication of JPH03226B2 publication Critical patent/JPH03226B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

この発明は、IC回路等に用いられる積層板に
関する。 従来、印刷配線板(PWB)として、紙フエノ
ール積層板、紙エポキシ積層板、ガラスエポキシ
積層板、ガラスポリイミド積層板その他の積層板
に銅箔等の金属箔が貼着されてなるもの、あるい
は、セラミツク基板に銅箔等の貼着されてなるも
のが用いられている。しかしながら、前記のよう
な積層板を用いたのでは、印刷配線板の高密度化
や多層(多層配線)化を計つたり、演算速度の高
速化を計つたりすることが困難である。他方、セ
ラミツク基板を用いたのでは、大寸法のものの製
造が難しいとかセラミツク基板が割れ易いといつ
たような理由で、印刷配線板の大きさが限定され
る。 発明者らは、大きさが限定される問題のない積
層板に注目し、積層板の熱膨張率を低下させる、
特に熱時における寸法安定性を向上させることに
よつて、印刷配線板の高密度化および多層化を計
ることができるようにし、積層板の誘導率を低下
させることによつて演算速度の高速化を計ること
ができるようにしようとして研究を重ねた。その
結果、基材に石英質成分を含ませればこれらの問
題が解決されるということを見出し、ここにこの
発明を完成した。 すなわち、この発明は、樹脂含浸基材を所定枚
積層成形してなる積層板であつて、樹脂含浸基材
のうちの少なくとも1枚の基材が石英繊維糸とガ
ラス繊維糸とを用いて製織された複合布であるこ
とを特徴とする積層板をその要旨としている。以
下、この発明を詳しく説明する。 積層板は、樹脂含浸基材(プリプレグ)を所定
枚積層成形することによつてつくられるが、この
発明にかかる積層板は、樹脂含浸基材のうちの少
なくとも1枚の基材が、石英繊維糸とガラス繊維
糸とを用いて製織された複合布となつているとこ
ろが従来のものと異なる。前記のような複合布が
用いられているので、積層板の熱膨張率が低くな
り〔含浸用樹脂としてポリイミド樹脂(ケルイミ
ド601)を使用した場合は10-6mm/mm℃程度〕、特
に熱時における寸法安定性が向上し、誘電率も低
くなる〔含浸用樹脂としてポリイミド樹脂(ケル
イミド601)を使用した場合はほぼ4×106Hz以
下〕のである。しかも、前記のような複合布を用
いるとようにすると、石英繊維糸のみからなる石
英繊維糸を用いた場合に比べ加工性がよい。たと
えば、ポリイミド樹脂(ケルイミド601)を前記
複合布に含浸させてなる樹脂含浸基材を用いてつ
くつた積層板の加工においては、同じ樹脂を石英
繊維布に含浸させてなる樹脂含浸基材を用いてつ
くつた積層板の加工に比べ、加工用ドリル歯の寿
命が1.5倍になることがわかつた。 複合布は、石英繊維糸とガラス繊維糸とが適数
本ずつ交互に配置されるよう製織され、全体的に
みて両者がかたよることなく均等に配置されてい
るものが好ましい。たとえば、第1図および第2
図に示されているような複合布である。第1図に
示されている複合布は、縦糸として石英繊維糸1
とガラス繊維糸2とが2本ずつ交互に配置され、
横糸として両者が1本ずつ交互に配置されたもの
となつている。第2図に示されている複合布は、
縦糸として石英繊維糸1が1本とガラス繊維糸2
が5本交互に配置され、横糸として両者が1本ず
つ交互に配置されたものとなつている。 複合布に使用されている石英繊維糸は、二酸化
ケイ素(SiO2)の含有量(コンテント)が96〜
99%程度と高くなつているのがよい。しかし、こ
の範囲に限定されるものではない。ガラス繊維糸
の種類は特に限定されない。たとえば、E−ガラ
ス(Owens−Corning Fiber Glas社製)等が用
いられる。複合布に含浸させる樹脂としては、従
来一般に使用されているものと同じものが使用さ
れるが、ポリイミド樹脂、エポキシ樹脂、ポリブ
タジエン樹脂が好ましく用いられる。 前記複合布に樹脂を含浸させてなるもの以外の
種類の樹脂含浸基材が用いられる場合、その種類
は特に限定されない。たとえば、ガラス布にエポ
キシ樹脂あるいはポリイミド樹脂を含浸させたも
の、石英繊維糸にポリイミド樹脂を含浸させたも
の等が用いられる。使用される樹脂含浸基材の種
類、その枚数および重ね合わせの位置は、積層板
の使用目的等に応じて適宜決められる必要があ
る。 なお、必要に応じて、積層板の一面あるいは両
面に銅箔等の金属箔が貼着された金属箔張積層板
をつくる場合、樹脂含浸基材が所定枚積層されて
なる積層体の一面あるいは両面に金属箔を合わせ
たあと成形するようにしたり、積層板をつくつた
あと、その一面あるいは両面に金属箔を貼着する
ようにする。 この発明にかかる積層板は、このように構成さ
れるものであつて、樹脂含浸基材のうちの少なく
とも1枚の基材が前記のような複合布となつてい
るので、熱膨張率が低く、特に、熱時での寸法安
定性に優れている。したがつて、印刷配線板の高
密度化や多層化を計ることが容易にできるように
なる。そして、この積層板を備えた印刷配線板
は、リードなしのICチツプ(セラミツクタイプ、
プラスチツクタイプ等)キヤリア用として使用す
るのに非常に適している。また、誘導率が低いの
で演算の高速化を計ることも容易にできるように
なる。そのうえ、加工性も比較的よい。 つぎに、実施例および比較例について説明す
る。 〔実施例〕 つぎのようにして、両面に銅箔が貼着された実
施例の積層板をつくつた。 基材となる複合布として、石英繊維糸とガラス
繊維糸とが1本ずつ交互に配置されるようにして
平織され、厚みが0.18mm、縦糸の配置が42本/25
mm、横糸の配置が32本/25mmとなつたものを用い
た。前記のような複合布に、その樹脂量が50重量
%となるようポリイミドを含浸させて樹脂含浸基
材をつくつた。この樹脂含浸基材6枚を重ね、さ
らにその上下面に厚みが35μmの銅箔を合わせた
のち、165℃、70Kg/cm2の条件で90分間加熱、加
圧することによつて積層成形し、積層板を得た。 両面に銅箔が貼着された比較例の積層板を、厚
み0.18mmのガラス布を基材として用いたほかは実
施例と同様にしてつくつた。 実施例および比較例の積層板について、それぞ
れ熱膨張率と誘電率とを測定した。測定結果を第
1表に示す。
The present invention relates to a laminate used for IC circuits and the like. Conventionally, printed wiring boards (PWB) include paper phenol laminates, paper epoxy laminates, glass epoxy laminates, glass polyimide laminates, and other laminates with metal foils such as copper foil attached, or A ceramic substrate with copper foil or the like attached is used. However, by using the above-mentioned laminate, it is difficult to increase the density of the printed wiring board, increase the number of layers (multilayer wiring), or increase the calculation speed. On the other hand, if a ceramic substrate is used, the size of the printed wiring board is limited because it is difficult to manufacture a large-sized one and the ceramic substrate is easily broken. The inventors focused on a laminate that does not have the problem of limited size, and reduced the thermal expansion coefficient of the laminate.
In particular, by improving dimensional stability under heat, it is possible to increase the density and multilayer of printed wiring boards, and by lowering the dielectricity of the laminate, it is possible to increase the calculation speed. We conducted repeated research in an attempt to make it possible to measure the As a result, it was discovered that these problems could be solved by including a quartz component in the base material, and the present invention was hereby completed. That is, the present invention provides a laminate formed by laminating and molding a predetermined number of resin-impregnated base materials, in which at least one of the resin-impregnated base materials is woven using quartz fiber yarn and glass fiber yarn. The gist of the product is a laminate that is characterized by being made of a composite fabric. This invention will be explained in detail below. A laminate is made by laminating and molding a predetermined number of resin-impregnated base materials (prepreg), and in the laminate according to the present invention, at least one of the resin-impregnated base materials is made of quartz fiber. It differs from conventional fabrics in that it is a composite fabric woven using yarn and glass fiber yarn. Since the above-mentioned composite fabric is used, the thermal expansion coefficient of the laminate is low (approximately 10 -6 mm/mm°C when polyimide resin (Kelimide 601) is used as the impregnating resin), and it is particularly resistant to heat. The dimensional stability during heating is improved, and the dielectric constant is also lowered (approximately 4×10 6 Hz or less when polyimide resin (Kelimide 601) is used as the impregnating resin). Moreover, when a composite fabric such as the one described above is used, workability is better than when using a quartz fiber yarn made only of quartz fiber yarn. For example, when processing a laminate made using a resin-impregnated base material made by impregnating the composite cloth with polyimide resin (Kelimide 601), a laminate made using a resin-impregnated base material made by impregnating a quartz fiber cloth with the same resin is used. It was found that the life of the machining drill teeth was 1.5 times longer than when machining ivy laminates. Preferably, the composite fabric is woven so that an appropriate number of quartz fiber threads and glass fiber threads are alternately arranged, and the two are evenly arranged as a whole without shifting. For example, Figures 1 and 2
It is a composite fabric as shown in the figure. The composite fabric shown in Figure 1 has 1 quartz fiber yarn as the warp.
and glass fiber threads 2 are arranged alternately,
One each of the two weft threads are arranged alternately. The composite fabric shown in FIG.
One quartz fiber thread 1 and glass fiber thread 2 are used as warp threads.
Five threads are arranged alternately, and one thread of each is arranged alternately as a weft thread. The quartz fiber yarn used in composite fabrics has a silicon dioxide (SiO 2 ) content of 96~
It is better if it is as high as 99%. However, it is not limited to this range. The type of glass fiber yarn is not particularly limited. For example, E-glass (manufactured by Owens-Corning Fiber Glas) or the like is used. As the resin to be impregnated into the composite cloth, the same resins as those commonly used in the past are used, and polyimide resins, epoxy resins, and polybutadiene resins are preferably used. When a type of resin-impregnated base material other than the composite cloth impregnated with a resin is used, the type is not particularly limited. For example, glass cloth impregnated with epoxy resin or polyimide resin, quartz fiber thread impregnated with polyimide resin, etc. are used. The type of resin-impregnated base material to be used, the number of the base materials, and the position of overlapping must be appropriately determined depending on the intended use of the laminate. In addition, when making a metal foil-clad laminate in which metal foil such as copper foil is adhered to one or both sides of the laminate, one or both sides of the laminate formed by laminating a predetermined number of resin-impregnated base materials may Metal foil is applied to both sides and then molded, or after a laminate is made, metal foil is attached to one or both sides. The laminate according to the present invention is constructed as described above, and since at least one of the resin-impregnated base materials is made of the composite cloth as described above, the laminate has a low coefficient of thermal expansion. In particular, it has excellent dimensional stability under heat. Therefore, it becomes possible to easily increase the density and multilayer of printed wiring boards. Printed wiring boards equipped with this laminated board are leadless IC chips (ceramic type,
Very suitable for use as a carrier (plastic type, etc.). Furthermore, since the induction factor is low, it becomes easy to increase the speed of calculation. Moreover, the workability is relatively good. Next, Examples and Comparative Examples will be described. [Example] In the following manner, a laminated board according to an example in which copper foil was adhered to both sides was produced. The composite fabric that serves as the base material is plain woven with alternating quartz fiber threads and glass fiber threads, with a thickness of 0.18 mm and a warp arrangement of 42/25 threads.
mm, with a weft arrangement of 32 threads/25 mm. A resin-impregnated base material was prepared by impregnating the composite cloth as described above with polyimide so that the resin amount was 50% by weight. Six sheets of this resin-impregnated base material were stacked, and copper foil with a thickness of 35 μm was placed on the top and bottom surfaces, and then laminated by heating and pressurizing at 165 ° C and 70 Kg / cm 2 for 90 minutes, A laminate was obtained. A comparative laminate having copper foil adhered to both sides was produced in the same manner as in the example except that glass cloth with a thickness of 0.18 mm was used as the base material. The thermal expansion coefficient and dielectric constant of the laminates of Examples and Comparative Examples were measured. The measurement results are shown in Table 1.

【表】 第1表より、実施例の積層板は比較例のものに
比べ熱膨張率および誘電率が低いことがわかる。
[Table] From Table 1, it can be seen that the laminates of the examples have lower coefficients of thermal expansion and dielectric constants than those of the comparative examples.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は、それぞれ、この発明に
かかる積層板に用いられる複合布の1例の構造説
明図である。 1…石英繊維糸、2…ガラス繊維糸。
FIGS. 1 and 2 are structural explanatory diagrams of an example of a composite fabric used in a laminate according to the present invention. 1...Quartz fiber thread, 2...Glass fiber thread.

Claims (1)

【特許請求の範囲】 1 樹脂含浸基材を所定枚積層成形してなる積層
板であつて、樹脂含浸基材のうちの少なくとも1
枚の基材が石英繊維糸とガラス繊維糸とを用いて
製織された複合布であることを特徴とする積層
板。 2 複合布が、石英繊維糸とガラス繊維糸とが適
数本ずつ交互に配置されるよう製織されたもので
ある特許請求の範囲第1項記載の積層板。
[Scope of Claims] 1. A laminate formed by laminating and molding a predetermined number of resin-impregnated base materials, wherein at least one of the resin-impregnated base materials
A laminate board characterized in that the base material of the sheet is a composite cloth woven using quartz fiber threads and glass fiber threads. 2. The laminate according to claim 1, wherein the composite fabric is woven such that an appropriate number of quartz fiber threads and glass fiber threads are alternately arranged.
JP22080882A 1982-12-15 1982-12-15 Laminated board Granted JPS59109347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22080882A JPS59109347A (en) 1982-12-15 1982-12-15 Laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22080882A JPS59109347A (en) 1982-12-15 1982-12-15 Laminated board

Publications (2)

Publication Number Publication Date
JPS59109347A JPS59109347A (en) 1984-06-25
JPH03226B2 true JPH03226B2 (en) 1991-01-07

Family

ID=16756880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22080882A Granted JPS59109347A (en) 1982-12-15 1982-12-15 Laminated board

Country Status (1)

Country Link
JP (1) JPS59109347A (en)

Also Published As

Publication number Publication date
JPS59109347A (en) 1984-06-25

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