JPH0322700B2 - - Google Patents
Info
- Publication number
- JPH0322700B2 JPH0322700B2 JP3347183A JP3347183A JPH0322700B2 JP H0322700 B2 JPH0322700 B2 JP H0322700B2 JP 3347183 A JP3347183 A JP 3347183A JP 3347183 A JP3347183 A JP 3347183A JP H0322700 B2 JPH0322700 B2 JP H0322700B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- resin sealing
- sealing frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 55
- 238000007789 sealing Methods 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 46
- 239000004065 semiconductor Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線基板上に樹脂封止枠を接
合してなる半導体搭載用プリント配線基板の製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a printed wiring board for mounting a semiconductor, which is formed by bonding a resin sealing frame onto a printed wiring board.
従来、プリント配線基板上に直接半導体素子を
搭載した後、ワイヤーボンデイングなどの接続技
術により半導体素子と該プリント配線基板の導体
回路とを結線する方法においては、該結線工程の
後に半導体素子を含む結線部分の全体を樹脂によ
り封入する工程（以降この工程を樹脂封止とい
う）が採用されていた。
Conventionally, in the method of directly mounting a semiconductor element on a printed wiring board and then connecting the semiconductor element and a conductor circuit of the printed wiring board using a connection technique such as wire bonding, the wiring including the semiconductor element is connected after the wiring process. A process of enclosing the entire part with resin (hereinafter this process will be referred to as resin sealing) was adopted.
そして、プリント配線基板上に搭載した半導体
を樹脂封止する場合、一般的な方法としてはエポ
キシ樹脂などのように硬化剤を配合した液状、又
はペレツト状の樹脂を半導体素子及びワイヤーボ
ンデイング用の金線などの上に滴下し或いは載置
した後、所定の温度で溶融硬化させる工程が採用
されていた。 When a semiconductor mounted on a printed wiring board is encapsulated with resin, the general method is to apply a liquid or pellet resin containing a hardening agent such as epoxy resin to the semiconductor element and wire bonding material. A process was adopted in which the material was dropped or placed on a wire or the like and then melted and hardened at a predetermined temperature.
この工程においては、前記エポキシ樹脂の溶液
が樹脂封止しようとする当該部分の全面に信頼性
よく被覆され、かつ前記樹脂溶液によつて被覆さ
れてはならない部分が保護されるために、溶融樹
脂の流出を止めるための堰枠（以下樹脂封止枠と
いう）を用いる。該樹脂封止枠は、樹脂封止作業
に先立つてプリント配線基板上の半導体搭載部分
の周囲に載置、接合する。 In this step, the epoxy resin solution reliably covers the entire surface of the part to be resin-sealed, and the parts that should not be covered by the resin solution are protected, so the molten resin A weir frame (hereinafter referred to as a resin sealing frame) is used to stop the outflow of water. The resin sealing frame is placed and bonded around the semiconductor mounting portion on the printed wiring board prior to resin sealing work.
即ち、第５図に示すごとく、上記樹脂封止枠９
は、プリント配線基板８上に、接着剤を介して圧
着接合される。これにより、半導体搭載用プリン
ト配線基板８０を形成する。該樹脂封止枠９は、
プリント配線基板８よりも小さい四角状枠であ
り、その内側に、半導体配置用の開口部９１を有
する。また、プリント配線基板８の上面には導体
回路８６が形成され、該導体回路はスルーホール
８５に接続されている。該スルーホール８５に
は、その内部に導通用の金属メツキ膜が被覆して
ある。 That is, as shown in FIG. 5, the resin sealing frame 9
is pressure-bonded onto the printed wiring board 8 via an adhesive. As a result, a printed wiring board 80 for mounting a semiconductor is formed. The resin sealing frame 9 is
It is a rectangular frame smaller than the printed wiring board 8, and has an opening 91 for semiconductor placement inside thereof. Further, a conductor circuit 86 is formed on the upper surface of the printed wiring board 8 , and the conductor circuit is connected to the through hole 85 . The inside of the through hole 85 is coated with a metal plating film for conduction.
そして、プリント配線基板８と、その上に接合
された樹脂封止枠９の開口部９１との間に形成さ
れる凹部に半導体が搭載される。また、半導体搭
載後に上記凹部内に封止用樹脂が充填される。 Then, a semiconductor is mounted in a recess formed between the printed wiring board 8 and the opening 91 of the resin sealing frame 9 bonded thereon. Furthermore, after mounting the semiconductor, the recess is filled with a sealing resin.
上記樹脂封止枠９の材料としては、プラスチツ
ク材料又はその複合材からなるものを用いる。ま
た、プリント配線基板の材料としては、ガラス繊
維基材を用いたエポキシ樹脂板又は紙基材のフエ
ノール樹脂板などを用いる。また、上記導体回路
は、銅箔層をエツチングすることにより形成して
ある。接着剤としては、熱硬化性樹脂接着剤など
を用いる。 As the material of the resin sealing frame 9, a plastic material or a composite material thereof is used. Further, as a material for the printed wiring board, an epoxy resin board using a glass fiber base material, a phenol resin board using a paper base material, or the like is used. Further, the conductor circuit is formed by etching a copper foil layer. As the adhesive, a thermosetting resin adhesive or the like is used.
一方、半導体搭載用プリント配線基板において
は、第６図に示すごとく、プリント配線基板８の
上下面の導通を図るために、半円筒状の湾曲導体
８５１を設けることが考えられる。この湾曲導体
８５１は、半導体搭載用プリント配線基板８０を
チツプキヤリヤーのように、マザーボード９５等
の他のプリント配線基板に搭載したとき、両者間
の電気的導通を図る部分である。 On the other hand, in a printed wiring board for mounting a semiconductor, as shown in FIG. 6, a semi-cylindrical curved conductor 851 may be provided in order to establish electrical continuity between the upper and lower surfaces of the printed wiring board 8. This curved conductor 851 is a part that provides electrical continuity between the semiconductor mounting printed wiring board 80 when it is mounted on another printed wiring board such as a motherboard 95 like a chip carrier.
即ち、該湾曲導体８５１により、半導体搭載用
プリント配線基板８０におけるプリント配線基板
８の導体回路８６と、マザーボード９５の導体回
路９５１との間が、電気的に接続される。なお、
該湾曲導体８５１は、前記第５図に示したスルー
ホール８５を、その軸方向に切断することにより
形成する。それ故、その壁面に金属メツキ膜を有
する。 That is, the curved conductor 851 electrically connects the conductor circuit 86 of the printed wiring board 8 in the semiconductor mounting printed wiring board 80 and the conductor circuit 951 of the motherboard 95 . In addition,
The curved conductor 851 is formed by cutting the through hole 85 shown in FIG. 5 in its axial direction. Therefore, it has a metal plating film on its wall surface.
〔解決しようとする課題〕
しかしながら、上記技術には次の問題点があ
る。[Problems to be Solved] However, the above technology has the following problems.
即ち、従来の半導体搭載用プリント配線基板
（第５図）においては、上記プリント配線基板８
の外形状に比して樹脂封止枠９のそれが小さい。
そのため、両者は、それぞれ別途に、その外形状
に相応した２種類の金型により作製しなければな
らない。また、このことは、前記第６図に示した
半導体搭載用プリント配線基板についても同様で
ある。 That is, in the conventional printed wiring board for mounting semiconductors (FIG. 5), the printed wiring board 8
The outer shape of the resin sealing frame 9 is smaller than that of the resin sealing frame 9.
Therefore, both must be manufactured separately using two types of molds corresponding to their external shapes. Further, this also applies to the semiconductor mounting printed wiring board shown in FIG. 6 above.
そこで、プリント配線基板８と樹脂封止枠９と
の外形状を同一に成形しておき、次いで両者を接
着剤を介して積層し、その後圧着接合する方法が
考えられる。 Therefore, a method can be considered in which the printed wiring board 8 and the resin sealing frame 9 are molded to have the same external shape, and then the two are laminated with an adhesive and then pressure bonded.
しかし、この方法による場合には次の問題を生
ずる。即ち、プリント配線基板８と樹脂封止枠９
の外形状を単に同じとした場合には、第７図に示
すごとく、プリント配線基板８の湾曲導体８５１
の上に、樹脂封止枠９の外周縁が位置することに
なる。 However, this method causes the following problem. That is, the printed wiring board 8 and the resin sealing frame 9
If the outer shape of the curved conductor 851 of the printed wiring board 8 is simply the same, as shown in FIG.
The outer peripheral edge of the resin sealing frame 9 will be located on top of this.
そのため、上記圧着接合の際の加圧力によつ
て、湾曲導体８５１の上端角部８５３が樹脂封止
枠９によつて強く押さえられ、該上端角部８５３
が欠けを生ずるおそれがある。そして、この欠け
は、湾曲導体８５１の側壁面の金属メツキ膜に、
剥離を生じさせる原因となり、湾曲導体８５１の
導通性を低下させる。 Therefore, the upper end corner 853 of the curved conductor 851 is strongly pressed by the resin sealing frame 9 due to the pressure applied during the crimp bonding, and the upper end corner 853
There is a risk of chipping. Then, this chipping occurs in the metal plating film on the side wall surface of the curved conductor 851.
This causes peeling and reduces the conductivity of the curved conductor 851.
本発明はかかる従来の問題点に鑑み、湾曲導体
に損傷を生じることがなく、生産性の良い半導体
搭載用プリント配線基板の製造方法を提供しよう
とするものである。 In view of these conventional problems, it is an object of the present invention to provide a method for manufacturing a printed wiring board for mounting a semiconductor, which does not cause damage to the curved conductor and has good productivity.
本発明においては、プリント配線基板とその上
に接着剤を介して接合した樹脂封止枠とよりな
り、かつ両者の外形線が同一面上にある半導体搭
載用プリント配線基板を製造する方法において、
まず導体回路を有すると共に外形線上に多数のス
ルーホールを設けたプリント配線基板シートを準
備し、一方、内側に半導体配置用の開口部を有す
ると共に外形線上に上記プリント配線基板シート
のスルーホールと対応する位置に該スルーホール
よりも径の大きい多数の貫通穴を設けた樹脂封止
枠用プラスチツク板を準備する。次いで、上記プ
リント配線基板シートを、上記外形線に沿つて金
型により切断して、該プリント配線基板シートの
外形加工を行うと共にスルーホール内の導体を露
出させた半円筒状の湾曲導体を多数有するプリン
ト配線基板を作製する。また、上記と同一の金型
を用いて、上記樹脂封止枠用プラスチツク板を上
記外形線に沿つて切断して、樹脂封止枠の外形加
工を行うと共に、上記貫通穴により作られた切り
欠き部分を有する樹脂封止枠を作製する。次い
で、上記プリント配線基板と樹脂封止枠とをその
外形線が同一面上となり、またプリント配線基板
の湾曲導体よりも後退した位置に樹脂封止枠の切
り欠き部分が位置するように積層すると共に、両
者の間に接着剤を介在させ、然る後、これらを圧
着し一体化成形する。
In the present invention, in a method for manufacturing a printed wiring board for mounting a semiconductor, which is composed of a printed wiring board and a resin sealing frame bonded thereon via an adhesive, and in which the outlines of both are on the same surface,
First, a printed wiring board sheet is prepared that has a conductor circuit and a large number of through-holes on the outer line, and has an opening for semiconductor placement inside and corresponds to the through-holes of the printed wiring board sheet on the outer line. A plastic plate for a resin-sealed frame is prepared, in which a large number of through-holes having a diameter larger than the through-holes are provided at positions where the resin-sealing frame is to be used. Next, the printed wiring board sheet is cut by a mold along the outline line to process the outer shape of the printed wiring board sheet and to form a large number of semi-cylindrical curved conductors with the conductors in the through holes exposed. A printed wiring board having the following properties is manufactured. Further, using the same mold as above, the plastic plate for the resin-sealed frame is cut along the outline line to process the outer shape of the resin-sealed frame, and the cut made by the through hole is also cut. A resin sealing frame having a cutout portion is produced. Next, the printed wiring board and the resin sealing frame are laminated so that their outlines are on the same plane and the cutout portion of the resin sealing frame is located at a position set back from the curved conductor of the printed wiring board. At the same time, an adhesive is interposed between the two, and then they are pressed together and integrally molded.
本発明において最も注目すべきことは、プリン
ト配線基板と樹脂封止枠との外形線を同一面にす
るため両者は同一の金型を用いて外形加工するこ
と、該外形加工はプリント配線基板のスルーホー
ル、及び樹脂封止枠の貫通穴に沿つた外形線（第
２Ａ図、第３Ａ図参照）において行うこと、上記
貫通穴はスルーホールより大きい直径を有するこ
とにある。 What is most noteworthy about the present invention is that the printed wiring board and the resin molding frame are shaped using the same mold in order to make their outlines on the same surface. What is done in the outline along the through hole and the through hole of the resin sealing frame (see FIGS. 2A and 3A) is that the through hole has a larger diameter than the through hole.
そして、得られた半導体搭載用プリント配線基
板においては、上記外形加工によつてスルーホー
ルにおいて形成された湾曲導体は、貫通穴におい
て形成されたり切り欠き部分よりも中側に位置し
ている（第１図参照）。 In the obtained printed wiring board for mounting a semiconductor, the curved conductor formed in the through hole by the above-mentioned external processing is formed in the through hole or is located on the inside side of the notch part (the curved conductor is (See Figure 1).
本発明においては、プリント配線基板は、導体
回路及びスルーホールを設けたプリント配線基板
シート（第２Ａ図）を外形加工することにより得
られる。この外形加工により、スルーホールは半
円筒状の湾曲導体に形成される。（第２Ｂ図）。
In the present invention, the printed wiring board is obtained by externally processing a printed wiring board sheet (FIG. 2A) provided with conductor circuits and through holes. By this external processing, the through hole is formed into a semi-cylindrical curved conductor. (Figure 2B).
また、樹脂封止枠は、半導体配置用の開口部を
有すると共に上記多数の貫通穴を設けたプラスチ
ツク板に外形加工を施すことにより得られる。こ
の外形加工により、貫通穴は半円筒状の切り欠き
部分に形成される（第３Ｂ図）。 Further, the resin sealing frame is obtained by externally processing a plastic plate having an opening for arranging the semiconductor and having the above-mentioned large number of through holes. By this external processing, the through hole is formed in a semi-cylindrical notch (FIG. 3B).
そして、上記いずれの外形加工も、プリント配
線基板シートの外形線、プラスチツク板の外形線
において行う。両外形線は、同じ大きさである。
また、該外形加工は、それぞれ同じ金型を用いて
行う。それ故、プリント配線基板及び樹脂封止枠
の外形加工の精度が良い。また、同一の金型を用
いて外形加工できるので生産性も向上し、コスト
も低い。 All of the above-mentioned contour processing is performed on the contour lines of the printed wiring board sheet and the contour lines of the plastic board. Both outlines have the same size.
Further, the external shape processing is performed using the same mold. Therefore, the accuracy of external processing of the printed wiring board and the resin sealing frame is high. In addition, since the same mold can be used to process the external shape, productivity is improved and costs are low.
また、上記貫通穴はスルーホールよりも大きい
径を有するので、貫通穴により形成された半円筒
状の切り欠き部分の径はスルーホールにより形成
された湾曲導体よりも大きい。 Further, since the through hole has a larger diameter than the through hole, the diameter of the semi-cylindrical cutout portion formed by the through hole is larger than the diameter of the curved conductor formed by the through hole.
そのため、プリント配線基板の上に接着剤を介
して樹脂封止枠を積層し、これらを圧着接合する
時には、切り欠き部分は湾曲導体よりも外側に位
置することとなる。 Therefore, when a resin sealing frame is laminated on a printed wiring board via an adhesive and these are bonded together by pressure, the cutout portion is located outside the curved conductor.
それ故、上記接合時にプリント配線基板と接着
剤とを圧着しても、プリント配線基板における湾
曲導体の上端角部は樹脂封止枠によつて何ら押圧
されない。それ故、従来のごとく、湾曲導体の上
端角部が圧着時に欠けを生じ、更には湾曲導体の
金属メツキ膜が剥離することもない。 Therefore, even if the printed wiring board and the adhesive are pressed together during the above bonding, the upper end corners of the curved conductors in the printed wiring board are not pressed at all by the resin sealing frame. Therefore, the upper end corner of the curved conductor does not chip during crimping, and the metal plating film of the curved conductor does not peel off, as in the conventional case.
また、プリント配線基板及び樹脂封止枠は金型
で打ち抜き加工した後、これらを一体化成形して
いる。そのため、それぞれの板厚は前記第５図に
示した従来のプリント配線基板の板厚の約２分の
１以下の比較的薄いものであつてもよい。 Further, the printed wiring board and the resin sealing frame are punched out using a mold and then integrally molded. Therefore, the thickness of each board may be relatively thin, approximately one-half or less of the thickness of the conventional printed wiring board shown in FIG. 5.
そのため、金型を用いた打ち抜き切断加工によ
る切断面にいわゆるバリなどのガラス繊維の切り
ヒゲが突出しにくくなる。つまり従来の板厚の厚
いプリント配線基板に比較して切断面がきわめて
良好に仕上がる利点がある。 Therefore, it becomes difficult for glass fiber chips such as so-called burrs to protrude on the cut surface obtained by punching and cutting using a mold. In other words, it has the advantage that the cut surface can be finished very well compared to conventional thick printed wiring boards.
また、板厚が薄いので、金型の消耗がきわめて
少なくてすみ、金型寿命が著しく延びるなどの利
点がある。 Furthermore, since the plate thickness is thin, there is an advantage that wear and tear on the mold is extremely small, and the life of the mold is significantly extended.
したがつて、本発明によれば、湾曲導体に損傷
を生ずることがなく、生産性の良い、また外形加
工の精度が良い半導体搭載用プリント配線基板の
製造方法を提供することができる。 Therefore, according to the present invention, it is possible to provide a method for manufacturing a printed wiring board for mounting a semiconductor, which does not cause damage to the curved conductor, has high productivity, and has high precision in external processing.
本発明の実施例にかかる、半導体搭載用プリン
ト配線基板の製造方法につき、第１図〜第４図を
用いて説明する。
A method of manufacturing a printed wiring board for mounting a semiconductor according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.
まず、本例において製造される半導体搭載用プ
リント配線基板３は、第１図に示すごとく、プリ
ント配線基板１と樹脂封止枠２とを接着剤（図示
略）を介して積層接合してなる。 First, as shown in FIG. 1, the semiconductor mounting printed wiring board 3 manufactured in this example is formed by laminating and bonding a printed wiring board 1 and a resin sealing frame 2 via an adhesive (not shown). .
プリント配線基板１は導体回路１６とこれに接
続された湾曲導体１１とを有する。また、樹脂封
止枠２は半導体配置用の開口部２１と切り欠き部
分２２とを有する。 The printed wiring board 1 has a conductor circuit 16 and a curved conductor 11 connected to the conductor circuit 16. Further, the resin sealing frame 2 has an opening 21 and a cutout portion 22 for arranging a semiconductor.
プリント配線基板１と樹脂封止枠２とはその外
形線、つまり最大外形状が同じである。それ故、
両者を積層したとき、プリント配線基板１の外壁
面１８と、樹脂封止枠２の外壁面２５とは同一面
状にある。また、樹脂封止枠２の切り欠き部分２
２は、プリント配線基板１の湾曲導体１１よりも
外方に位置している。 The printed wiring board 1 and the resin sealing frame 2 have the same outer shape, that is, the same maximum outer shape. Therefore,
When both are laminated, the outer wall surface 18 of the printed wiring board 1 and the outer wall surface 25 of the resin sealing frame 2 are on the same plane. In addition, the cutout portion 2 of the resin sealing frame 2
2 is located outward from the curved conductor 11 of the printed wiring board 1.
上記半導体搭載用プリント配線基板３を製造す
るに当たつては、まず、第２Ａ図に示すごとく、
導体回路１６を有すると共に外形線Ａ上に多数の
スルーホール１１０を設けたプリント配線基板シ
ート１０を準備する。該スルーホール１１０は、
内壁に金属メツキ膜を有すると共に、これらは上
記導体回路１６に接続されている（図示略）。 In manufacturing the semiconductor mounting printed wiring board 3, first, as shown in FIG. 2A,
A printed wiring board sheet 10 having a conductive circuit 16 and having a large number of through holes 110 on an outline A is prepared. The through hole 110 is
It has a metal plating film on its inner wall, and is connected to the conductor circuit 16 (not shown).
次に、該プリント配線基板シート１０は、その
外形線Ａに沿つて、第４図にその概念を示す金型
４により打ち抜き切断（外形加工）する。該金型
４は、下型４１とパンチ４２とよりなる。下型４
１及びパンチ４２は、上記外形線Ａと同径の切断
面４１０，４２０を有する。外形加工に当たつて
は、下型４１上にプリント配線基板シート１０を
載置し、パンチ４２を下降することにより行う。 Next, the printed wiring board sheet 10 is punched and cut (outline processed) along its outline A using a die 4 whose concept is shown in FIG. The mold 4 includes a lower mold 41 and a punch 42. Lower mold 4
1 and the punch 42 have cutting surfaces 410 and 420 having the same diameter as the above-mentioned outline A. The external shape processing is performed by placing the printed wiring board sheet 10 on the lower mold 41 and lowering the punch 42.
上記外形加工により、第２Ｂ図に示すプリント
配線基板１が作製される。該プリント配線基板１
は、上記プリント配線基板シート１０のスルーホ
ール１１０が、その軸方向（プリント配線基板の
厚み方向）に切断されて形成された、半円筒状の
湾曲導体１１を有する。該湾曲導体１１には、ス
ルーホールの金属メツキ膜（導体）が残されてい
る。 By the above-mentioned external processing, the printed wiring board 1 shown in FIG. 2B is manufactured. The printed wiring board 1
has a semi-cylindrical curved conductor 11 formed by cutting the through hole 110 of the printed wiring board sheet 10 in its axial direction (thickness direction of the printed wiring board). In the curved conductor 11, a metal plating film (conductor) of a through hole remains.
一方、樹脂封止枠２は、樹脂封止枠用プラスチ
ツク板２０（第３Ａ図）を外形加工することによ
り作製する。即ち、まず第３Ａ図に示すごとく、
樹脂封止枠用プラスチツク板２０を準備する。こ
のものは、前記スルーホール１１０よりも大きい
直径の貫通穴２２０と、半導体配置用の開口部２
１を有する。貫通穴２２０は、プリント配線基板
シート１０のスルーホール１１０と対応する位置
に設けてある。また、貫通穴２２０の中心線上に
外形線Ａがある。 On the other hand, the resin sealing frame 2 is manufactured by processing the outer shape of a plastic plate 20 for resin sealing frames (FIG. 3A). That is, first, as shown in Figure 3A,
A plastic plate 20 for a resin-sealed frame is prepared. This one has a through hole 220 with a larger diameter than the through hole 110, and an opening 2 for semiconductor placement.
1. The through holes 220 are provided at positions corresponding to the through holes 110 of the printed wiring board sheet 10. Further, there is an outline line A on the center line of the through hole 220.
次に、上記プラスチツク板２０を、その外形線
Ａに沿つて、上記第４図に示した金型４を用い
て、プリント配線基板シート１０と同様に切断
し、外形加工を行なう。これにより、第３Ｂ図に
示すごとく、半円筒状の切り欠き部分２２を有す
る樹脂封止枠２を作製する。 Next, the plastic board 20 is cut along its outline A using the mold 4 shown in FIG. As a result, as shown in FIG. 3B, a resin sealing frame 2 having a semi-cylindrical cutout portion 22 is produced.
次に、上記プリント配線基板１の上に接着剤
（図示略）を介して樹脂封止枠２を積層する。こ
のとき、第１図に示したごとく、プリント配線基
板１の外壁面１８と樹脂封止枠２の外壁面２５と
は、全て同一面上に位置する。その後、加熱圧着
を行ない、両者を接合する。これにより、前記第
１図に示した半導体搭載用プリント配線基板３が
得られる。 Next, the resin sealing frame 2 is laminated on the printed wiring board 1 via an adhesive (not shown). At this time, as shown in FIG. 1, the outer wall surface 18 of the printed wiring board 1 and the outer wall surface 25 of the resin sealing frame 2 are all located on the same plane. Thereafter, heat and pressure bonding is performed to join the two. As a result, the semiconductor mounting printed wiring board 3 shown in FIG. 1 is obtained.
上記のごとく、本例においては、プリント配線
基板１及び樹脂封止枠２は、同じ外形線であり、
その外形加工は、同じ金型４を用いて行う。それ
故、プリント配線基板１及び樹脂封止枠２の生産
性が向上する。また、コストも低くなる。 As mentioned above, in this example, the printed wiring board 1 and the resin sealing frame 2 have the same outline,
The external shape processing is performed using the same mold 4. Therefore, the productivity of the printed wiring board 1 and the resin sealing frame 2 is improved. Moreover, the cost is also lower.
また、樹脂封止枠２の切り欠き部分２２はプリ
ント配線基板１の湾曲導体１１よりも直径が大き
い。そのため、プリント配線基板１の上に樹脂封
止枠を積層し、これらを圧着接合する際には、湾
曲導体１１の上には樹脂封止枠２が位置していな
い。 Further, the cutout portion 22 of the resin sealing frame 2 has a larger diameter than the curved conductor 11 of the printed wiring board 1. Therefore, when the resin sealing frame 2 is laminated on the printed wiring board 1 and the resin sealing frame 2 is pressure bonded to the printed wiring board 1, the resin sealing frame 2 is not located on the curved conductor 11.
それ故、上記圧着の際に、湾曲導体１１の上端
角部１１５に欠けを生じ、更には湾曲導体１１の
金属メツキ膜が剥離することもない。 Therefore, during the above-mentioned crimping, the upper end corner portion 115 of the curved conductor 11 is not chipped, and the metal plating film of the curved conductor 11 is not peeled off.
また、金型４による打ち抜き加工（外形加工）
を行うので、加工精度が良く、切断面にプリント
配線基板中のガラス繊維等のヒゲを生ずることが
ない。 In addition, punching processing (outline processing) using die 4
Because of this, the processing accuracy is good and there is no possibility that hairs such as glass fibers in the printed wiring board will be formed on the cut surface.
第１図〜第４図は実施例の半導体搭載用プリン
ト配線基板を示し、第１図はその斜視図、第２Ａ
図及び第２Ｂ図はプリント配線基板の作製工程を
示し、第２Ａ図はプリント配線基板シートの斜視
図、第２Ｂ図は外形加工されたプリント配線基板
の斜視図、第３Ａ図及び第３Ｂ図は樹脂封止枠の
作製工程を示し、第３Ａ図はプラスチツク板の斜
視図、第３Ｂ図は外形加工された樹脂封止枠の斜
視図、第４図は金型の概念を示す説明図、第５図
は従来の半導体搭載用プリント配線基板の斜視
図、第６図はマザーボードに搭載した状態の半導
体搭載用プリント配線基板の斜視図、第７図は他
の半導体搭載用プリント配線基板の問題点を示す
斜視図である。
１……プリント配線基板、１０……プリント配
線基板シート、１１０……スルーホール、１１…
…湾曲導体、１１５……上端角部、２……樹脂封
止枠、２２……切り欠き部分、２２０……貫通
穴、３……半導体搭載用プリント配線基板、４…
…金型。
1 to 4 show a printed wiring board for mounting a semiconductor according to an embodiment, FIG. 1 is a perspective view thereof, and FIG. 2A is a perspective view thereof.
2A and 2B show the manufacturing process of a printed wiring board, FIG. 2A is a perspective view of a printed wiring board sheet, FIG. 2B is a perspective view of a printed wiring board whose outer shape has been processed, and FIGS. 3A and 3B are 3A is a perspective view of a plastic plate, FIG. 3B is a perspective view of a resin sealing frame whose outer shape has been processed, FIG. 4 is an explanatory diagram showing the concept of a mold, and FIG. Figure 5 is a perspective view of a conventional printed wiring board for mounting semiconductors, Figure 6 is a perspective view of a printed wiring board for mounting semiconductors mounted on a motherboard, and Figure 7 shows problems with other printed wiring boards for mounting semiconductors. FIG. 1...Printed wiring board, 10...Printed wiring board sheet, 110...Through hole, 11...
...Curved conductor, 115...Top corner, 2...Resin sealing frame, 22...Notch, 220...Through hole, 3...Printed wiring board for mounting semiconductor, 4...
…Mold.
Claims (1)
接合した樹脂封止枠とよりなり、かつ両者の外形
線が同一面上にある半導体搭載用プリント配線基
板を製造する方法において、 導体回路を有すると共に外形線上に多数のスル
ーホールを設けたプリント配線基板シートを準備
し、一方、内側に半導体配置用の開口部を有する
と共に外形線上に上記プリント配線基板シートの
スルーホールと対応する位置に該スルーホールよ
りも径の大きい多数の貫通穴を設けた樹脂封止枠
用プラスチツク板を準備し、 次いで、上記プリント配線基板シートを、上記
外形線に沿つて金型により切断して、該プリント
配線基板シートの外形加工を行うと共にスルーホ
ール内の導体を露出させた半円筒状の湾曲導体を
多数有するプリント配線基板を作製し、 また、上記と同一の金型を用いて、上記樹脂封
止枠用プラスチツク板を上記外形線に沿つて切断
して、樹脂封止枠の外形加工を行うと共に、上記
貫通穴により作られた切り欠き部分を有する樹脂
封止枠を作製し、 次いで、上記プリント配線基板と樹脂封止枠と
をその外形線が同一面上となり、またプリント配
線基板の湾曲導体よりも後退した位置に樹脂封止
枠の切り欠き部分が位置するように積層すると共
に、両者の間に接着剤を介在させ、 然る後、これらを圧着し一体化成形することを
特徴とする半導体搭載用プリント配線基板の製造
方法。[Scope of Claims] 1. A method for manufacturing a printed wiring board for mounting a semiconductor, which is composed of a printed wiring board and a resin sealing frame bonded thereon with an adhesive, and in which the outlines of both are on the same plane. In this step, a printed wiring board sheet having a conductor circuit and a large number of through holes on the outer line is prepared, and on the other hand, the printed wiring board sheet has an opening for semiconductor placement inside and the through holes of the printed wiring board sheet on the outer line. A plastic board for a resin sealing frame is prepared with a large number of through-holes having a diameter larger than the through-holes at corresponding positions, and then the printed wiring board sheet is cut using a mold along the outline line. Then, the outer shape of the printed wiring board sheet was processed, and a printed wiring board having a large number of semi-cylindrical curved conductors with the conductors in the through holes exposed was manufactured, and using the same mold as above, cutting the plastic plate for the resin-sealed frame along the outline line to process the outer shape of the resin-sealed frame, and produce a resin-sealed frame having a cutout portion formed by the through hole; Next, the printed wiring board and the resin sealing frame are laminated so that their outlines are on the same plane and the cutout portion of the resin sealing frame is located at a position set back from the curved conductor of the printed wiring board. A method for manufacturing a printed wiring board for mounting a semiconductor, characterized in that an adhesive is interposed between the two, and then the two are pressure-bonded and integrally molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347183A JPS59158579A (en) | 1983-02-28 | 1983-02-28 | Method of producing printed circuit board for placing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347183A JPS59158579A (en) | 1983-02-28 | 1983-02-28 | Method of producing printed circuit board for placing semiconductor |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22963790A Division JPH03114248A (en) | 1990-08-30 | 1990-08-30 | Manufacture of printed wiring board for mounting semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158579A JPS59158579A (en) | 1984-09-08 |
| JPH0322700B2 true JPH0322700B2 (en) | 1991-03-27 |
Family
ID=12387453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3347183A Granted JPS59158579A (en) | 1983-02-28 | 1983-02-28 | Method of producing printed circuit board for placing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158579A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW398165B (en) * | 1997-03-03 | 2000-07-11 | Hitachi Chemical Co Ltd | Circuit boards using heat resistant resin for adhesive layers |
-
1983
- 1983-02-28 JP JP3347183A patent/JPS59158579A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59158579A (en) | 1984-09-08 |
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