JPH03227332A - Production of laminated board - Google Patents
Production of laminated boardInfo
- Publication number
- JPH03227332A JPH03227332A JP2021753A JP2175390A JPH03227332A JP H03227332 A JPH03227332 A JP H03227332A JP 2021753 A JP2021753 A JP 2021753A JP 2175390 A JP2175390 A JP 2175390A JP H03227332 A JPH03227332 A JP H03227332A
- Authority
- JP
- Japan
- Prior art keywords
- nonwoven fabric
- resin
- laminate
- copper
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 13
- 239000000835 fiber Substances 0.000 claims abstract description 12
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 12
- 229920000728 polyester Polymers 0.000 claims abstract description 12
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- 229920003986 novolac Polymers 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229930003836 cresol Natural products 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 238000005452 bending Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- -1 maleic anhydride Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Moulding By Coating Moulds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、耐熱性に優ｎ、プリント配縁叛の製造におけ
ろ作業性が良く、かつ固定的多面形状に加工可能な積層
板及び銅張積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention provides a laminate and a laminate that have excellent heat resistance, good workability in the production of printed gables, and can be processed into a fixed multifaceted shape. Regarding copper clad laminates.
最近−Ｘ子！ｆ！！器の高密度、軽２薄、短−Ｊ・化に
伴い、各種のプリント板が要求さｎている。特にフェノ
ール樹脂積層板、エボキン樹脂積層板、ポリイミド樹脂
積層板等の硬質積層板を用いたプリント配線板、成るい
はポリイミドフィルム、ポリエステルフィルムをベース
とするフレキシブル配線板が多く利用さｎている。Recently - X-ko! f! ! As devices become more dense, lighter, thinner, and shorter, various types of printed circuit boards are required. In particular, printed wiring boards using rigid laminates such as phenol resin laminates, Evoquin resin laminates, and polyimide resin laminates, or flexible wiring boards based on polyimide films and polyester films are often used.
又、電子機器の上述のような情勢のなかで、固定的多面
形状に加工可能なプリント配＃板が要求さｎている。In addition, in the above-mentioned situation of electronic equipment, there is a demand for a printed circuit board that can be processed into a fixed multifaceted shape.
固定的多面形状に加工可能な積層板を作るには、上述の
硬質基板によっては不可能であり、！たフレキシブル配
線板は多面形状に加工可能ではあるが、その形状を維持
することはできない。この解決には、％開昭５９−１８
４５８７に示さｎているように、ポリエステル繊維混抄
のガラス繊維カ）らなる不織布に熱硬化性樹脂を含浸し
て得ろ丞相を用いる方法がある。しかし、この方法では
、樹脂の可撓性が適度でない場合には、プリント配線板
の＃造時にラインよで撓みを生じ作業性が悪くなる。又
、可そ性の影響で光分なはんだ耐熱性を得難く、半導体
及び抵抗等の部品の実装にも通しない○
本発明は、耐熱性に優ｎ、プリント配線板の製造におけ
る作業性が良く、かつ固定的多面形状に加工可能な積層
板の製造方法を提供することを目的とする。It is impossible to create a laminate that can be processed into a fixed multifaceted shape using the above-mentioned rigid substrate. Although the flexible wiring board can be processed into a multifaceted shape, the shape cannot be maintained. To solve this problem,
As shown in No. 4587, there is a method of impregnating a nonwoven fabric made of glass fibers mixed with polyester fibers with a thermosetting resin and using a filtrate obtained by impregnating a thermosetting resin. However, in this method, if the flexibility of the resin is not appropriate, bending occurs along the lines during manufacturing of the printed wiring board, resulting in poor workability. In addition, it is difficult to obtain optical soldering heat resistance due to the influence of fragility, and it cannot be used for mounting components such as semiconductors and resistors. It is an object of the present invention to provide a method for manufacturing a laminate that can be easily processed into a fixed multifaceted shape.
上記の目的を達成するために得た本発明は、ポリエステ
ル繊維混抄ガラス不織布に、タレゾールノボラック型エ
ポキシ樹脂を５〜１５％含有する可撓性熱硬化性樹脂を
含浸乾燥して得たプリプレグを用いてなる積層板又は銅
張積層板の製造方法である。The present invention, which was obtained to achieve the above object, uses a prepreg obtained by impregnating and drying a flexible thermosetting resin containing 5 to 15% of Talesol novolak type epoxy resin to a glass nonwoven fabric mixed with polyester fiber. This is a method for manufacturing a laminate or copper-clad laminate using the method.
可撓性熱硬化性樹脂は、エポキシ樹脂、不飽和ポリエス
テル樹脂、フェノール樹脂、メラミン樹脂、ポリイミド
樹脂等？用いろ。エポキシ樹脂を用いろ場合は、内部用
そ化でｆ注した可撓性エポキシ樹脂を用いろ。すなわち
、ダイマー１！ｆ性エポキシ樹脂、ポリエステル変性エ
ポキシ樹脂、ポリアミンｆ性エポキシ樹脂、あるいはポ
リフタジエン変性エポキシ樹脂を用い、こｎらを組合わ
せて用いることもできる０不飽和ポリエステル樹脂を用
いる場合は、酸成分としては、無水マレイン酸などの不
飽和二塩基酸無水物、あるいはテレフタール酸などの飽
和二塩基酸でよい０又、グリコール成分としては、エチ
レングリコール、プロピレングリコール、ジエチＶング
リコールを用いることができる０モノマーはスチレンモ
ノマーでよいＯ
０Ｔ撓性熱硬化性樹脂を難燃性とするためには、可撓性
臭素化エポキシ樹脂を用いるか、臭素化付物を添加また
は反応させる０
タレゾールノボラック型エポキシ樹脂は通常のものでよ
く、上記の可撓性熱硬化性樹脂に対して５〜１５％全添
加する０５％以下では、熱硬化性樹脂の可撓性のために
、プリント配線板の製造時のエツチング工程及び印桐工
程において撓み會生じ１作業性が悪くなるおそｎがあり
、又可そ件のため光分なはんだ耐熱性を得ろことができ
ないことがある。１５％以上では、折り曲は加工の際、
亀裂及び破損を生ずるおそｎがある。Flexible thermosetting resins include epoxy resins, unsaturated polyester resins, phenolic resins, melamine resins, polyimide resins, etc.? Use it. If you use epoxy resin, use a flexible epoxy resin that has been cured for internal use. That is, dimer 1! f-type epoxy resin, polyester-modified epoxy resin, polyamine f-type epoxy resin, or polyphtadiene-modified epoxy resin. When using a zero-unsaturated polyester resin, which can also be used in combination, the acid component is: The monomer may be an unsaturated dibasic acid anhydride such as maleic anhydride, or a saturated dibasic acid such as terephthalic acid.As the glycol component, ethylene glycol, propylene glycol, or diethyl glycol may be used. Styrene monomers may be used.To make flexible thermosetting resins flame retardant, flexible brominated epoxy resins are used or brominated adducts are added or reacted.Talesol novolac type epoxy resins are Ordinary materials may be used, and if the total addition is 5 to 15% to the above flexible thermosetting resin, and if the amount is less than 0.5%, due to the flexibility of the thermosetting resin, etching during production of printed wiring boards may be required. There is a possibility that bending may occur in the process and the paulownia process, resulting in poor workability, and it may not be possible to obtain sufficient solder heat resistance due to the fragility. At 15% or more, bending will occur during processing.
There is a risk of cracking and damage.
ポリエステル繊維混抄ガラス不織布をニ一般Ｋｆ用さｎ
るものでよいが、ポリエステル繊維混抄率を５〜９０％
とし、好ましくは３０〜７０％がよい０
ポリエステル繊維のガラス繊維に対する接層性をよくす
るためＫはバインダーを用いる０バインダーとしては、
エポキシ樹脂、ポリエステル樹脂、アクリルエステルａ
！ｌ脂等の樹脂又はセルロース繊維が適当である。Polyester fiber blended glass non-woven fabric is used for general Kf.
However, the polyester fiber mixing ratio should be 5 to 90%.
K is a binder, preferably 30 to 70%. In order to improve the adhesion of polyester fibers to glass fibers, K is a binder. As a binder,
Epoxy resin, polyester resin, acrylic ester a
! Resins such as lubricant or cellulose fibers are suitable.
上記のタレゾールノボラック型エボキン樹脂會含有する
可撓注熱硬化性樹ａを上記のポリエステル繊維混抄のガ
ラス繊維不織布に所定′ｊＩｋ含浸乾保して得たプリプ
レグを所足枚数重ね合わせ、加熱加圧成形して積層板を
作る。又、積層板の製造と同様にプリプレグを重ね、さ
らに外層に＠箔を菖ね合わせ２加熱加圧成形して銅張積
層板を作る。A sufficient number of prepregs obtained by impregnating and drying the flexible injection thermosetting resin a containing the Talesol novolac type Evokin resin on the glass fiber nonwoven fabric made of a polyester fiber blend with a predetermined amount of Ik and drying them are superimposed and heated. Press to make a laminate. Also, in the same manner as in the production of laminates, prepregs are layered, and @ foil is added to the outer layer, which is then heated and pressure-molded twice to produce a copper-clad laminate.
上記の樹脂含浸ｉｔ（工、プリプレグに対して４０〜９
０％、望ましくは６０〜８０％とす６゜銅ｗ３は、通常
のものでよいが、引張破断ひずみが２０％以上、好筐し
くに２７％以上がよい。粗化した＠陥あるいは汲看剤付
き鋼箔を用いると５＠箔と基材との接層を強くすること
ができる。The above resin impregnated it (40~9 for prepreg)
0%, preferably 60 to 80%. The 6° copper w3 may be of ordinary type, but it should have a tensile strain at break of 20% or more, preferably 27% or more. If a roughened steel foil is used, the contact between the foil and the base material can be strengthened.
成形した積層板を加工してプリント配ｌｆＭ板とし。The formed laminate is processed into a printed LFM board.
成るいは＠張積層８ｉはエツチング加工してプリント配
線板とする。又、プリント配線板の半導体、抵抗等の部
品穴を工、常法によってドリル加工、打抜加工で形成す
る。Alternatively, the laminate 8i is etched to form a printed wiring board. In addition, holes for components such as semiconductors and resistors in printed wiring boards are formed by drilling and punching using conventional methods.
本発明の、タレゾールノボラック型エポキシ樹脂を含有
する可撓性熱硬化性樹脂ｔポリエステル締維混抄ガラス
繊維の不織布に含浸乾燥して得たプリプレグによってな
ろ稍／Ｉ板は、タレゾールノボラック型エボキノ樹脂全
便用するためにプリント配線数の製造における作業性が
良くかつはんだ耐熱性に優ｎている。又、ポリエステル
繊維混抄ガラス繊維を用いる結果として固定的多面形状
に加工可能な積層板となる。The flexible thermosetting resin containing Talesol novolac type epoxy resin of the present invention is made of a prepreg obtained by impregnating and drying a nonwoven fabric of glass fiber mixed with polyester fibers. Since the resin is used entirely, workability in manufacturing printed wiring is good and the soldering heat resistance is excellent. Furthermore, as a result of using glass fiber mixed with polyester fiber, a laminate plate that can be processed into a fixed multifaceted shape can be obtained.
ポリエステル繊維５０％、ガラス繊維４０％。 50% polyester fiber, 40% glass fiber.
エボキン樹脂バインダー１０％ヶ混合抄造して得た不織
布に、タレゾールノボラック型エボキン樹脂１０％及び
エポキシ化ポリブタジェン３０％を含有するブロム含有
Ｘ４２０％のビスフェノールＡ型エポキシ樹脂ワニスを
含浸乾燥してプリプレグを得た。このプリプレグ２枚と
＠陥とを重ね会わせ加熱加圧成形して板厚α４ｍｍの片
ｒｆｉ鯛張槓ノ＃ｉ板を得た０その特性を表１ＶＣ示す
〇
（比較例）実施例と同様の不織布に、エポキシ化ポリブ
タジェン６０％全含有するブロム含有″４２０％のビス
フェノールＡ型エポキシ樹脂ワニスを含浸乾燥してプリ
プレグ全得た。さらに、このプリプレグを実施例と同様
にして板厚Ｑ、４ｍｍの片面＠張積層板を得た。その特
性を表１に示す〇プリント配線板製造時の作業性：
○印刷工程での撓みなし
△印紗Ｊ工程で撓み、印刷不用
はんだ耐熱性 ：ＪＩＳ Ｃ６４８１による折り曲げ
加工性＝６φの内棒で１８０°の折り曲げをする○クラ
ックなし△クラック発生
〔発明の効果〕
本発明によって得た積層板又は＠張積膚板は、表１に示
すようにプリント配線板製造時の作業性が良く、かつは
んだ耐熱性良好で、折り曲げ加工性が良く固？的多面形
状に加工ＯＪ能である。A nonwoven fabric obtained by mixing 10% Evokin resin binder and making a paper is impregnated with 20% bromine-containing Obtained. These two sheets of prepreg and the bottom were overlapped and heated and press-molded to obtain a single RFI sea bream #i board with a thickness of α4 mm.The characteristics are shown in Table 1VC〇 (Comparative example) Same as the example The nonwoven fabric was impregnated with a bisphenol A type epoxy resin varnish containing 60% epoxidized polybutadiene and 420% bromine and dried to obtain a whole prepreg.Furthermore, this prepreg was prepared in the same manner as in the example to obtain a plate thickness Q of 4 mm. A single-sided @stretched laminate was obtained. Its properties are shown in Table 1 〇 Workability during printed wiring board manufacturing: ○ No deflection in the printing process △ Deflection in the stamp J process, solder heat resistance without printing: JIS C6481 Bending workability = 180° bending with an inner rod of 6φ ○ No cracks △ Cracks generated [Effects of the invention] The laminate or clad laminate obtained by the present invention can be printed wiring as shown in Table 1. It has good workability during plate manufacturing, good soldering heat resistance, good bending workability, and OJ ability to be processed into a rigid multifaceted shape.
比較例は、可撓性熱硬化性８４脂にクレゾールノボラッ
ク型エボキン樹脂を含有しないが、プリント配ＷＩＩ板
製造時の作条性悪く、はんだ耐熱性が劣ろ○In the comparative example, the flexible thermosetting 84 resin does not contain cresol novolac type Evokin resin, but the fabrication properties during the production of printed wiring board WII boards are poor, and the soldering heat resistance is poor.
Claims (2)
含有する可撓性熱硬化性樹脂を、ポリエステル繊維混抄
ガラス繊維の不織布に含浸乾燥してなるプリプレグを用
いて加熱加圧成形することを特徴とする積層板又は銅張
積層板の製造方法。1. 5-15% cresol novolak type epoxy resin
A method for producing a laminate or a copper-clad laminate, comprising heating and press-molding a prepreg obtained by impregnating and drying a nonwoven fabric of glass fiber mixed with polyester fiber with a flexible thermosetting resin.
プリント配線板。2. A printed wiring board using the laminate or copper-clad laminate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021753A JPH03227332A (en) | 1990-01-31 | 1990-01-31 | Production of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021753A JPH03227332A (en) | 1990-01-31 | 1990-01-31 | Production of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03227332A true JPH03227332A (en) | 1991-10-08 |
Family
ID=12063823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021753A Pending JPH03227332A (en) | 1990-01-31 | 1990-01-31 | Production of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03227332A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG121911A1 (en) * | 2003-07-04 | 2006-05-26 | Risho Kogyo Kk | Epoxy resin laminate board as a reinforcing material for flexible printed wiring board |
-
1990
- 1990-01-31 JP JP2021753A patent/JPH03227332A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG121911A1 (en) * | 2003-07-04 | 2006-05-26 | Risho Kogyo Kk | Epoxy resin laminate board as a reinforcing material for flexible printed wiring board |
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