JPH03230441A - Alloy type temperature fuse - Google Patents
Alloy type temperature fuseInfo
- Publication number
- JPH03230441A JPH03230441A JP2413090A JP2413090A JPH03230441A JP H03230441 A JPH03230441 A JP H03230441A JP 2413090 A JP2413090 A JP 2413090A JP 2413090 A JP2413090 A JP 2413090A JP H03230441 A JPH03230441 A JP H03230441A
- Authority
- JP
- Japan
- Prior art keywords
- case
- melting point
- flux
- metal piece
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims description 14
- 239000000956 alloy Substances 0.000 title claims description 14
- 239000002184 metal Substances 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 238000002844 melting Methods 0.000 claims abstract description 29
- 230000004907 flux Effects 0.000 claims abstract description 24
- 230000008018 melting Effects 0.000 claims description 27
- 238000003466 welding Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 210000005069 ears Anatomy 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910016334 Bi—In Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- XHFGWHUWQXTGAT-UHFFFAOYSA-N dimethylamine hydrochloride Natural products CNC(C)C XHFGWHUWQXTGAT-UHFFFAOYSA-N 0.000 description 1
- IQDGSYLLQPDQDV-UHFFFAOYSA-N dimethylazanium;chloride Chemical compound Cl.CNC IQDGSYLLQPDQDV-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は合金型温度ヒユーズに関するものである。[Detailed description of the invention] <Industrial application field> The present invention relates to alloy type temperature fuses.
〈従来の技術〉
合金型温度ヒユーズは、一対のり一１〜導体間に低融点
可溶金属片を橋設し、該低融点可溶金属片上にフラック
スを塗布し、該フラックスを塗布した低融点可溶合金片
を絶縁ケース、例えば、セラミックスケースで包囲し、
該ケースの開口部と各リード導体との間を封止材例えば
、エポキシ樹脂によって封止する構成である。而して、
保護すべき電気機器が過電流によって発熱すると、その
発生熱によって低融点可溶金属片が溶融し、該溶融金属
がその表面張力並びにリード導体との間の界面張力等に
よって球状化し、この球状化のために溶融金属が分断し
て機器への通電が遮断される。<Prior art> An alloy type temperature fuse is made by bridging a piece of low melting point fusible metal between a pair of glue 1 and a conductor, applying flux on the low melting point fusible metal piece, and applying the low melting point metal piece to which the flux is applied. Surrounding the fusible alloy piece with an insulating case, for example, a ceramic case,
The opening of the case and each lead conductor are sealed with a sealing material such as an epoxy resin. Then,
When electrical equipment to be protected generates heat due to overcurrent, the generated heat melts the low melting point fusible metal piece, and the molten metal becomes spheroidized due to its surface tension and interfacial tension with the lead conductor, and this spheroidization occurs. As a result, the molten metal is divided and power to the equipment is cut off.
この場合、フラックスは低融点可溶金属片の酸化を防止
し、低融点可溶金属片に多少の酸化物が含まれていても
、フラックスが、加熱溶融下で活性を発現し、その酸化
物を可溶して、溶融金属の球状分断化を促進する。フシ
ックス不存在のもとでは、低融点可溶金属片の表面に酸
化膜が生成し、この酸化膜が堅い表皮となって溶融金属
の球状分断化を阻害するから、合金型温度ヒユーズの円
滑な作動を期待し難い。而して、合金型温度ヒユーズの
作動上、フラックスは不可欠な構成要素である。In this case, the flux prevents the oxidation of the low melting point fusible metal pieces, and even if the low melting point fusible metal pieces contain some oxides, the flux becomes active under heating and melting, and the oxides to promote the spherical fragmentation of molten metal. In the absence of fusics, an oxide film forms on the surface of a piece of low melting point fusible metal, and this oxide film becomes a hard skin that inhibits the spherical fragmentation of the molten metal, making it difficult for alloy-type temperature fuses to operate smoothly. It is difficult to expect it to work. Therefore, flux is an essential component for the operation of alloy type temperature fuses.
く解決しようとする課題〉
」−配合金型温度ヒユーズにおいて、ケース内をフラッ
クスで完全に充填すれば、ヒートサイクル時でのフラッ
クスの熱膨張によって高い内圧が発生し、封止部の破損
が懸念される。従って、通常ケース内にはエアー層を存
在させる必要がある。- If the case of a compound mold temperature fuse is completely filled with flux, high internal pressure will be generated due to thermal expansion of the flux during heat cycles, and there is a concern that the sealing part may be damaged. be done. Therefore, it is usually necessary to provide an air layer within the case.
而るに、温度ヒユーズを機器の高電位部位、例えは、テ
レビ用フライバック）〜ランス等の高圧トランスに取付
けて使用することがあり、その取付条件いかんｔこよっ
ては、温度ヒユーズのヒュースエレメン１へ（低融点可
溶金属片）とケース間にその高電圧の大部分が作用し、
ヒユーズ１１３７１〜表面、特にエッヂ筒所ての電気ス
）ヘレスが過大となって、ケース内空間においてコロナ
放電が発生ずることがあり得、かがるもとては、フラッ
クスの炭化か余儀なくされる。このようにフラックスが
炭化ずれは、上記したフラックスの活性が著しく低下し
、上記溶融金属の速やかな溶融分断を期待し難く、温度
ヒユーズの円滑な作動を保証することは困難である。However, temperature fuses are sometimes used by being attached to high-potential parts of equipment, such as high-voltage transformers such as TV flybacks and lances, and depending on the installation conditions, the fuse element of the temperature fuse may 1 (low melting point fusible metal piece) and the case, most of the high voltage acts,
Fuse 11371 - Electricity on the surface, especially at the edge tube, becomes excessive and corona discharge may occur in the space inside the case. . As described above, when the flux is carbonized, the activity of the flux is significantly reduced, and it is difficult to expect the molten metal to melt and break off quickly, making it difficult to guarantee smooth operation of the temperature fuse.
本発明の目的は、高電位部位で使用する場合、」−２ケ
ース内でのコロナ放電を防止して、フラックスを正常な
状態に保持し、合金型温度ヒユーズの円滑な作動を保証
することにある。The purpose of the present invention is to prevent corona discharge within the case, maintain the flux in a normal state, and ensure smooth operation of the alloy type temperature fuse when used in a high potential area. be.
〈課題を解決するための手段〉
本特許願の第１発明に係る合金型温度ヒユーズは、一対
のリード導体間に低融点可溶金属片を橋設し、該低融点
可溶金属片上にフラックスを塗布し、該フラックス塗布
低融点可溶金属片を導電性ケースて包囲し、該ケースと
一方のリード導体とを電気的に導通したことを特徴とす
る構成であり、第２発明に係る合金型温度ヒユーズは、
ケースに絶縁ケースを使用し、該ケース」二に導電性カ
バーを付設゛シ、該カバーと一方のリード導体とを電気
的に↓正したことを特徴とする構成である。<Means for Solving the Problems> The alloy type temperature fuse according to the first invention of the present patent application has a low melting point fusible metal piece bridged between a pair of lead conductors, and a flux is placed on the low melting point fusible metal piece. The alloy according to the second invention is characterized in that the flux coated low melting point fusible metal piece is surrounded by a conductive case, and the case and one lead conductor are electrically connected. The mold temperature fuse is
The structure is characterized in that an insulating case is used as the case, a conductive cover is attached to the case, and the cover and one lead conductor are electrically connected to each other.
〈実施例の説明〉 以ト、図面により本発明の実施例について説明する。<Explanation of Examples> Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図Ａは第１発明の一実施例を示す縦断面図てあり、
第１図Ｂは第１図Ａにおけるｂ−ｂ断面図である。FIG. 1A is a longitudinal sectional view showing an embodiment of the first invention,
FIG. 1B is a sectional view taken along line bb in FIG. 1A.
第１図Ａ並ひに第１図Ｂにおいて、１４．１２は互に平
行な一対のリード導体であり、通常、銅線を使用する。In FIGS. 1A and 1B, reference numerals 14 and 12 denote a pair of lead conductors parallel to each other, which are usually made of copper wire.
２はリード導体間に溶接によって橋設した低融点可溶金
属片であり、作動温度に応じた組成のものを選定し、例
えば、５ｎ−Ｐｂ系、５ｎＰｂ−Ｂｉ、５ｎ−Ｐｂ−Ｃ
ｄ−５ｎ−ＰｂＩｎ、５ｎ−Ｂｉ−Ｉｎ系合金を使用で
きる。３は低融点可溶金属片上に塗布したフラックスで
あり、ロジンを主成分とし、必要に応じて活性剤（例え
は、ジメチルアミン塩酸塩）を添加したものを使用でき
る。４は一方を開口した導電性ケースであり、低融点可
溶金属片を包囲し、ケースの開口部とリード導体との間
を封止材５、例えば、エポキシ樹脂によって封止しであ
る。この導電性ケースには、黄銅、銅、アルミニュウム
、鉄、ニッケル等の金属ケースの他、絶縁ケース、例え
は、セラミックスケースの外面に導電性層を固設したも
のを使用でき、この導電性層は、前記した銅等の導電性
金属のメツキ、導電性塗料の塗布・焼付けによって施す
ことができる。６は導電性ケース４と上記一対のリード
導体の何れか一方、例えば、１１との間に設けた電気的
導通部であり、ボンド線の溶接、はんだ付け、または、
はんだ、導電性樹脂等の滴下付暮等を施用できる。導電
性ケースとして金属ケースを用いる場合、このケースと
上記リード線とを直接、はんだ付けまたは溶接すること
によって上記の導通部を成形することもてきる。2 is a low melting point fusible metal piece bridged between the lead conductors by welding, and the composition is selected according to the operating temperature, for example, 5n-Pb series, 5nPb-Bi, 5n-Pb-C.
d-5n-PbIn and 5n-Bi-In alloys can be used. 3 is a flux coated on a piece of low melting point fusible metal, which contains rosin as a main component and optionally contains an activator (for example, dimethylamine hydrochloride). Reference numeral 4 denotes a conductive case with one side open, surrounding the low melting point fusible metal piece, and sealing the gap between the opening of the case and the lead conductor with a sealing material 5, such as an epoxy resin. This conductive case can be a metal case made of brass, copper, aluminum, iron, nickel, etc., or an insulating case, such as a ceramic case with a conductive layer fixed on the outer surface. This can be done by plating with a conductive metal such as copper, or by applying and baking a conductive paint. Reference numeral 6 denotes an electrically conductive portion provided between the conductive case 4 and one of the pair of lead conductors, for example, 11, and is formed by welding a bond wire, soldering, or
It is possible to apply drippings of solder, conductive resin, etc. When a metal case is used as the conductive case, the conductive portion can be formed by directly soldering or welding the case and the lead wire.
第２図は第１発明の別実施例を示し、−直線上に配した
一対のリード導体１１．１２間に溶接によって低融点可
溶金属片２を橋設し、該低融点可溶金属片上にフラック
ス３を塗布し、そのうえに、筒型の導電性ケース４を挿
通し、ケース各端と各リード導体との間を封止材５で封
止し、一方のリード導体１１と導電性ケース４との間を
導通部６によって導通しである。この一方のリード導体
と導電性ケースとの導通は、第３図に示すように、一方
のノー１〜導体１１を折曲により導電性ケース４の外面
に接触させ、この接触箇所を半田付け、または溶接する
ことによって行うこともできる。FIG. 2 shows another embodiment of the first invention, in which - a piece of low melting point fusible metal 2 is bridged by welding between a pair of lead conductors 11 and 12 arranged on a straight line, and A cylindrical conductive case 4 is inserted into the cylindrical conductive case 4, and a sealing material 5 is used to seal between each end of the case and each lead conductor. The conductive portion 6 provides electrical continuity between the two. The conduction between one of the lead conductors and the conductive case is established by bending one of the conductors No. 1 to 11 and contacting the outer surface of the conductive case 4, and soldering this contact point, as shown in FIG. Or it can be done by welding.
第４［７ＵＡは第２発明の一実施例を示す縦断面図であ
り、第４図Ｂは第４国人におけるｂ−ｂ断面図である。4 [7UA] is a vertical sectional view showing an embodiment of the second invention, and FIG. 4B is a bb sectional view of a fourth countryman.
第４図Ａ並ひに第４図Ｂにおいて、ＩＩ、 １２はり一
１〜導体、２はリード導体間に橋設した低融点可溶金属
片、３はフラックスであり、それぞれの構成は前記第１
発明と同しである。４ｏは低融点可溶金属片を包囲した
絶縁ケース、例えは、セラミックスケース、５は絶縁ケ
ース各端とリード導体との間を封止した封止材である。In FIG. 4A as well as FIG. 4B, II, 12 beams 1 to 1 conductor, 2 a low melting point fusible metal piece bridged between the lead conductors, 3 a flux, each of which has the same structure as above. 1
It is the same as invention. 4o is an insulating case surrounding the low melting point fusible metal piece, for example a ceramic case, and 5 is a sealing material that seals between each end of the insulating case and the lead conductor.
４２は絶縁ケース−トにＨｑした導電性カバー、例えば
金属カバーであり、このカバー４２と一方のリード導体
１１とを導通部６によって導通しである。この導通部は
一ト記した構成と同一である。Reference numeral 42 denotes a conductive cover, such as a metal cover, attached to the insulating case, and electrical continuity is established between the cover 42 and one of the lead conductors 11 through the conductive portion 6. This conductive portion has the same configuration as described above.
第５図は第２発明の別実施例を示し、ケース４゜に筒状
絶縁ケース、例えば筒状セラミックスケースを使用し、
この筒状絶縁ケースの各端と各リード線１１．１２との
間を封止材５て封止し、リード線留止用耳部４３を有す
る筒状の金属カバー４２を絶縁ケース上に挿入し、一方
のリード導体１１を折曲げ、この折曲リード導体１１を
耳部４３の標縁４３１で挟着しである。FIG. 5 shows another embodiment of the second invention, in which a cylindrical insulating case, for example a cylindrical ceramic case, is used for the case 4°,
A sealing material 5 is used to seal between each end of this cylindrical insulating case and each lead wire 11, 12, and a cylindrical metal cover 42 having ears 43 for securing the lead wire is inserted onto the insulating case. Then, one lead conductor 11 is bent, and this bent lead conductor 11 is sandwiched between the markings 431 of the ears 43.
〈発明の効果〉
本発明に係る合金型温度ヒユーズは上述した通りの構成
であり、ケースに導電性ケース、または導電性カバーを
装着した絶縁ケースを使用し、その導電性ケースまたは
カバーと一方のリード導体とを導通してあり、ケースと
ケース内の低融点可溶金属片とを同電位にてき、ケース
内空間に電気スＩ〜レスか作用するのを排除できるから
、高電圧Ｔζてもケース内でのコロナ放電を回避できて
フラックスによる炭化を防止できる。従って、フラック
スによる溶融金属（低融点可溶金属）の球状化分断作用
をよく保証でき、合金型温度ヒユーズの円滑な作動を確
保てきる。尤も、ケース外面か高電位に曝されるので、
ケース外面と大地電位間の絶縁補強か必要となるか、こ
の補強処理は絶縁テープの巻回等により容易に行い得る
。<Effects of the Invention> The alloy type temperature fuse according to the present invention has the configuration as described above, and uses an insulating case with a conductive case or a conductive cover attached to the case, and connects the conductive case or cover with one side. It is electrically connected to the lead conductor, brings the case and the low melting point fusible metal piece inside the case to the same potential, and eliminates the effect of electric current on the space inside the case, so even if high voltage Tζ Corona discharge inside the case can be avoided and carbonization caused by flux can be prevented. Therefore, the spheroidizing and breaking action of the molten metal (low melting point soluble metal) by the flux can be well guaranteed, and the smooth operation of the alloy type temperature fuse can be ensured. Of course, since the outer surface of the case is exposed to high potential,
Whether reinforcing the insulation between the outer surface of the case and the ground potential is necessary, this reinforcing treatment can be easily performed by winding an insulating tape or the like.
特に、第２発明に係る合金型温度ヒユーズは、従来の合
金型温度ヒユーズの絶縁ケース上に導電性カバーを挿入
することによって実施でき、コロナ放電が問題とならな
い低電位部位での使用、コロナ放電か問題となる高電位
部位での使用の使い分けを容易に行い得る利点もある。In particular, the alloy type temperature fuse according to the second invention can be implemented by inserting a conductive cover onto the insulating case of the conventional alloy type temperature fuse, and can be used in low potential areas where corona discharge is not a problem. Another advantage is that it can be easily used in high-potential areas, which is a problem.
第１図Ａは第１発明の一実施例を示す説明図、第１図Ｂ
は第１図Ａにおけるｂ−ｂ断面図、第２図並ひに第３図
はそれぞれ第１発明の別実施例を示す説明図、第４図Ａ
は第２発明の一実施例を示す説明図、第４図Ｂは第４図
Ａにおけるｂ−ｂ断面図、第５図は第２発明の別実施例
を示す説明図である。
１１、１２・・・リード導体、２・・・低融点可溶金属
片、３・・・フラックス、４・・・導電性ケース、４０
・・・絶縁ケース、４２・・・導電性カバー、６・・・
導通部。
区FIG. 1A is an explanatory diagram showing an embodiment of the first invention, FIG. 1B
1A is a sectional view taken along line bb in FIG. 1A, FIGS.
4B is an explanatory diagram showing an embodiment of the second invention, FIG. 4B is a sectional view taken along line bb in FIG. 4A, and FIG. 5 is an explanatory diagram showing another embodiment of the second invention. 11, 12... Lead conductor, 2... Low melting point fusible metal piece, 3... Flux, 4... Conductive case, 40
...Insulating case, 42...Conductive cover, 6...
Continuity part. Ward
Claims (2)
、該低融点可溶金属片上にフラックスを塗布し、該フラ
ックス塗布低融点可溶金属片を導電性ケースで包囲し、
該ケースと一方のリード導体とを電気的に導通したこと
を特徴とする合金型温度ヒューズ。(1) A piece of low melting point fusible metal is bridged between a pair of lead conductors, a flux is applied on the low melting point fusible metal piece, and the flux coated low melting point fusible metal piece is surrounded by a conductive case,
An alloy type thermal fuse characterized in that the case and one lead conductor are electrically connected.
、該低融点可溶金属片上にフラックスを塗布し、該フラ
ックス塗布低融点可溶金属片を絶縁ケースで包囲し、該
ケース上に導電性カバーを付設し、該カバーと一方のリ
ード導体とを電気的に導通したことを特徴とする合金型
温度ヒューズ。(2) A piece of low melting point fusible metal is bridged between a pair of lead conductors, a flux is applied on the low melting point fusible metal piece, the flux coated low melting point fusible metal piece is surrounded by an insulating case, and An alloy type thermal fuse characterized in that a conductive cover is attached to a case, and the cover and one lead conductor are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024130A JPH0834077B2 (en) | 1990-02-01 | 1990-02-01 | Alloy type thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024130A JPH0834077B2 (en) | 1990-02-01 | 1990-02-01 | Alloy type thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03230441A true JPH03230441A (en) | 1991-10-14 |
| JPH0834077B2 JPH0834077B2 (en) | 1996-03-29 |
Family
ID=12129729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024130A Expired - Lifetime JPH0834077B2 (en) | 1990-02-01 | 1990-02-01 | Alloy type thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0834077B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021167379A1 (en) * | 2020-02-21 | 2021-08-26 | 주식회사 케이포스 | Resistor with integrated fuse |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6065949U (en) * | 1983-10-12 | 1985-05-10 | カルソニックカンセイ株式会社 | temperature switch |
-
1990
- 1990-02-01 JP JP2024130A patent/JPH0834077B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6065949U (en) * | 1983-10-12 | 1985-05-10 | カルソニックカンセイ株式会社 | temperature switch |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0834077B2 (en) | 1996-03-29 |
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