JPH03230490A - Insulation type pulse heater device - Google Patents
Insulation type pulse heater deviceInfo
- Publication number
- JPH03230490A JPH03230490A JP2474590A JP2474590A JPH03230490A JP H03230490 A JPH03230490 A JP H03230490A JP 2474590 A JP2474590 A JP 2474590A JP 2474590 A JP2474590 A JP 2474590A JP H03230490 A JPH03230490 A JP H03230490A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heater device
- heater
- pulse
- pulse heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 210000003298 dental enamel Anatomy 0.000 claims description 14
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 4
- 239000000037 vitreous enamel Substances 0.000 abstract 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000002788 crimping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は絶縁型パルスヒータ装置に係り、特にパルスヒ
ータ装置のヒータチップの構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an insulated pulse heater device, and particularly to the structure of a heater chip of a pulse heater device.
プリント基板上にフラットタイプのＩＣチップを実装す
る際、一般的にプリント基板上の配線パターンとＩＣチ
ップの接続ピンをハンダリフロー方式により接着する時
、パルスヒータ装置を使用する。パルスヒータ装置は加
熱先端部であるヒータチップにパルス的に大電流を流し
、これによりジュール熱を発生させて、ヒータチップの
圧着部をパルス的に高温にして圧着するものである。When mounting a flat type IC chip on a printed circuit board, a pulse heater device is generally used when bonding the wiring pattern on the printed circuit board and the connection pins of the IC chip by a solder reflow method. A pulse heater device applies a large current in pulses to a heating tip, which is a heating tip, thereby generating Joule heat, and heats the pressure-bonding portion of the heater chip to a high temperature in a pulse-like manner.
第２図にパルスヒータ装置のヒータチップの構造とプリ
ント基板上にＩＣチップを接着する場合の略図を示す。FIG. 2 shows the structure of a heater chip of a pulse heater device and a schematic diagram of the case where an IC chip is bonded onto a printed circuit board.
ヒータチップ２０の材料は通常モリブデンである。The material of heater chip 20 is typically molybdenum.
プリント基板４０の配線パターン４１上にＩＣチップ３
０の複数の接続ピン３１をハンダ付けする際、ヒータチ
ップ２０の圧着部２１を接続ピン３１上に圧着させつつ
、パルス電流を流し、接続ピン３１又は配線パターン４
１の先端に盛られたハンダを溶融固着する。The IC chip 3 is placed on the wiring pattern 41 of the printed circuit board 40.
When soldering the plurality of connection pins 31 of 0, a pulse current is applied while crimping the crimp part 21 of the heater chip 20 onto the connection pin 31, and the connection pin 31 or the wiring pattern 4 is soldered.
Melt and fix the solder on the tip of 1.
ところが、ＩＣチップ３０のような加熱圧着されるもの
（以下ワークという）がヒータチップ２０に用いるモリ
ブデンより良導体の場合、パルス電流の一部がヒータチ
ップ２０からワークに流れてしまうため、下記の理由に
より従来のヒータチップ２０を用いるとき問題が存在す
る。However, if the thing to be heat-pressed and bonded (hereinafter referred to as the workpiece), such as the IC chip 30, is a better conductor than the molybdenum used for the heater chip 20, part of the pulse current will flow from the heater chip 20 to the workpiece, for the following reason. Therefore, problems exist when using conventional heater chips 20.
例えばＩＣチップ３０の複数の接続ピン３１をハンダ付
けする場合、この接続ピン３１の中に接地端子や電源端
子の如く、ピン間の抵抗の小さい複数のコモンピンがあ
ると、これらの接続ピン３１を同時にリフローする時に
ヒータチップ２０を流れるパルス電流の一部が接続ピン
を介してＩＣチップ３０の中を流れることがある。この
結果、不必要な過大電流が流れたＩＣチップ３０は素子
破壊をおこす。For example, when soldering a plurality of connection pins 31 of an IC chip 30, if there are a plurality of common pins with low resistance between the pins, such as a ground terminal or a power supply terminal, these connection pins 31 may be soldered. At the same time, a portion of the pulse current flowing through the heater chip 20 may flow through the IC chip 30 through the connection pins during reflow. As a result, the IC chip 30 through which unnecessary excessive current flows will cause element destruction.
従って、本発明の目的は前記の問題点を改善するため、
例えばＩＣチップの接続ピンのハンダ付は等に用いるパ
ルスヒータ装置のヒータチップを被加熱体（ワーク）か
ら絶縁して、被加熱体に電流が流れないようにしたヒー
タチップを提供するものである。Therefore, an object of the present invention is to improve the above-mentioned problems.
For example, the heater chip of a pulse heater device used for soldering the connecting pins of an IC chip is insulated from the object to be heated (workpiece) so that no current flows to the object to be heated. .
上記目的を達成するため、本発明者らは鋭意研究の結果
、パルスヒータ装置のヒータチップの少なくとも圧着部
を絶縁被覆することによって、例えばモリブデンから成
るヒータチップが良導体であるワークのハンダ付は等に
も利用できることを見出した。In order to achieve the above object, the present inventors conducted extensive research and found that by insulating coating at least the crimp part of the heater chip of a pulse heater device, it is possible to easily solder workpieces in which the heater chip made of molybdenum is a good conductor. I found out that it can also be used.
この絶縁被覆は、例えばホーロー加工に用いるエナメル
の如く、良熱伝導性を有するとともに、少なくとも７０
０℃以上の高い耐熱性を有する絶縁体であることが望ま
しい。This insulating coating has good thermal conductivity, such as enamel used in enamel processing, and has at least 70%
It is desirable that the insulator has high heat resistance of 0° C. or higher.
本発明の一実施例を第１図によって説明する。 An embodiment of the present invention will be described with reference to FIG.
第１図はパルスヒータ装置のヒータチップを示す。FIG. 1 shows a heater chip of a pulse heater device.
第１図において、ｌはヒータチップで、その材料は例え
ばモリブデンである。１１は圧着部であって、ハンダ付
けの際ワークに接触する。１２は絶縁コートであって、
例えばホーロー用エナメルから成る。In FIG. 1, l is a heater chip, the material of which is molybdenum, for example. Reference numeral 11 denotes a crimping portion, which comes into contact with the workpiece during soldering. 12 is an insulating coat,
For example, it is made of enamel for enamel.
この実施例で用いたホーロー用エナメルは、特性が耐熱
温度が８５０〜９００℃、熱伝導率が０゜０１４ ｗ
／ ｃｍ ’Ｃ１絶縁耐圧２ＫＶ／２００７７ｍの電子
部品のホーロー用エナメルである。The enamel for enamel used in this example has a heat resistance temperature of 850 to 900°C and a thermal conductivity of 0°014 W.
/ cm 'C1 Enamel for electronic parts enamel with dielectric strength voltage 2KV/20077m.
実施例の構成により、必要な熱伝導性を損なうことなく
、ワークに対して十分な絶縁効果を得ることが出来る。With the configuration of the embodiment, a sufficient insulation effect can be obtained for the workpiece without impairing the necessary thermal conductivity.
ところでハンダをリフローする場合、２５０℃位に加熱
することが必要であり、このためパルスヒータチップを
６００℃位にしなければならない。By the way, when reflowing solder, it is necessary to heat the solder to about 250°C, and therefore the pulse heater chip must be heated to about 600°C.
従って、７００℃以上の耐熱性が好ましい。Therefore, heat resistance of 700° C. or higher is preferable.
本発明の如く構成することにより、ヒータチップの少な
くとも圧着部は絶縁されているため、加熱圧着されるワ
ークが良導体であっても加熱することのできるパルスヒ
ータ装置が得られる。By configuring as in the present invention, since at least the crimping portion of the heater chip is insulated, it is possible to obtain a pulse heater device that can heat even if the workpiece to be heated and crimped is a good conductor.
また複数のコモンピンを有するＩＣチップ等の半導体素
子のハンダ付けにおいても本発明のパルスヒータ装置を
用いることにより半導体素子を破壊することなくハンダ
付けすることができる。Further, even when soldering a semiconductor element such as an IC chip having a plurality of common pins, by using the pulse heater device of the present invention, the semiconductor element can be soldered without destroying the semiconductor element.
さらにヒータチップの少なくとも圧着部をホーロー用エ
ナメル等による絶縁体で被覆することによって、ヒータ
チップの最も高温になる部分のモリブデン表面の酸化が
防止でき、ヒータチップの長寿命化が図れる。Further, by covering at least the crimp portion of the heater chip with an insulator such as enamel for enamel, oxidation of the molybdenum surface of the portion of the heater chip that becomes the highest temperature can be prevented, and the life of the heater chip can be extended.
第１図は本発明のヒータチップの構成図、第２図は従来
例のヒータチップの構成と使用例を示す図である。
１−ヒータチップ、
１１・−・圧着部、
１２−絶縁コート。
図面の浄書
第
図
手続ネ甫正書（方式）
％式％
１、事件の表示 平成２年特許願第２４７４５号２、発
明の名称 絶縁型パルスヒータ装置３、補正をする者
事件との関係 特許出願人
住 所 東京都中央区日本橋−丁目１３番１号名 称
（３０６）ティーデイ−ケイ株式会社代表者 佐 藤
博
４、代理人FIG. 1 is a diagram showing the configuration of a heater chip of the present invention, and FIG. 2 is a diagram showing the configuration and usage example of a conventional heater chip. 1-Heater chip, 11--Crimp part, 12-Insulating coat. Engraving of drawings Procedures for engraving of drawings (method) % formula % 1. Indication of the case 1990 Patent Application No. 24745 2. Title of the invention Insulated pulse heater device 3. Person making the amendment Relationship with the case Patent Applicant Address: 13-1 Nihonbashi-chome, Chuo-ku, Tokyo Name:
(306) Sato, Representative of TDC Co., Ltd.
Hiroshi 4, agent
Claims (3)
着部を絶縁被覆したことを特徴とする絶縁型パルスヒー
タ装置。(1) An insulated pulse heater device characterized in that at least the crimped portion of the heater chip of the pulse heater device is coated with insulation.
たことを特徴とする請求項（１）記載の絶縁型パルスヒ
ータ装置。(2) The insulated pulse heater device according to claim 1, wherein enamel for enamel is used as the insulating coating.
るホーロー用エナメルを用いたことを特徴とする請求項
（１）記載の絶縁型パルスヒータ装置。(3) The insulated pulse heater device according to claim 1, characterized in that the insulating coating is made of enamel for enamel that is heat resistant to 700° C. or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2474590A JPH03230490A (en) | 1990-02-03 | 1990-02-03 | Insulation type pulse heater device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2474590A JPH03230490A (en) | 1990-02-03 | 1990-02-03 | Insulation type pulse heater device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03230490A true JPH03230490A (en) | 1991-10-14 |
Family
ID=12146681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2474590A Pending JPH03230490A (en) | 1990-02-03 | 1990-02-03 | Insulation type pulse heater device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03230490A (en) |
-
1990
- 1990-02-03 JP JP2474590A patent/JPH03230490A/en active Pending
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