JPH03230539A - Wire bonding equipment - Google Patents

Abstract

PURPOSE:To improve workability by equipping a lever with a linear motor, driving a wire clamper by changing a current for the linear motor, and controlling the clamping pressure of a wire. CONSTITUTION:When a current is supplied to a linear motor 11, a lever 2 is revolved clockwise around a rotary shaft 6 as a center, and a clamping piece 3 fixed to the tip pinches a wire 7. When an inverse direction current is supplied to the linear motor 11, the lever 2 is revolved counterclockwise around the rotary shaft 6 as a center; the clamp piece 3 fixed to the tip is opened and release the wire 7. Further the quantity of current supplied to the linear motor 11 is changed in response to the diameter of a wire to be used, and the thrust of the linear motor 11 is controlled, thereby pinching the wire 7 with adequate pressure. Hence, when the wire diameter is changed, mechanical adjustment is unnecessitated, and workability can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wire bonding device for connecting a semiconductor element and an external electrode using a wire (gold wire, steel wire, etc.).

BACKGROUND ART FIG. 2 shows the configuration of a wire clamper of a conventional wire bonding apparatus. 1 is a solenoid that drives the wire clamper, 2 is a lever that operates a clamp piece 3 provided at one end, and 4 is a clamp piece 3. 5 is a pressure adjustment knob that adjusts the pressure of spring 4; 6 is a rotation axis that is the rotation center of t<, -2; 7 is a gold wire and copper clamped by clamp piece 3. A wire such as a wire, 8 is a wire guide for guiding the wire 7 to the clamp piece 3, 9 is an ultrasonic horn for bonding the wire 7 to a semiconductor element and an external electrode, and 10 is a capillary for crimping the wire 7.

Next, its operation will be explained.

When the clamp piece 3 is energized, the solenoid 1 is driven, and the lever 2 moves around the rotation shaft 6, which opens the clamp piece 3. When the clamp piece 3 is closed, the energization is cut off, the solenoid 1 returns to its original position, and the lever 2 is moved by the force of the spring 4. moves around the rotation axis 6 and closes.

The pressure with which the clamp piece 3 tightens the wire 7 is the force of the spring 4
depends on the power of - Therefore, when the force of the spring 4 is strong, the clamp piece 3 tightly tightens the wire 7, which damages and deforms the wire 7. In order to prevent this deformation, it is necessary to apply an appropriate pressure to tighten the wire 7. This pressure is adjusted by the pressure adjustment knob 5. Conventionally, the pressure adjustment knob 5 was adjusted every time the diameter of the wire 7 changed to vary the force of the spring 4.

Problems to be Solved by the Invention However, in the above conventional configuration, the pressure adjustment knob 5
By adjusting the force of the spring 4 and controlling the force that tightens the wire 7, deformation of the wire 7 can be prevented and the wire 7 can be tightened.
In order to appropriately control the tightening force of the wire 7, each time the wire diameter of the wire 7 is changed, the pressure adjustment knob 5 must be used to adjust the tightening force.
The problem was that we had to adjust the power of the

The present invention has been made to solve the above-mentioned conventional problems, and it is an object of the present invention to provide a wire bonding device with excellent workability that does not require adjustment of the clamping pressure even when the wire is replaced.

Means for Solving the Problems In order to achieve the above object, the present invention provides a lever with a linear motor, and changes the current to the linear motor to drive the wire clamper and control the clamping pressure of the wire. This is what I did.

According to the present invention, the force for tightening the wire can be controlled by varying the current supplied to the linear motor, thereby improving the workability of the bonding apparatus.

Embodiments Hereinafter, regarding embodiments of the present invention, parts that are the same as those in FIG. 1 and FIG. That is, in the present invention, a linear motor 11 is used in place of the conventional solenoid 1 to drive the lever 2. Therefore, in the present invention, the spring 4 and pressure adjustment knob 5 that have been used in the past are not necessary.

As a characteristic of the linear motor 11, the relationship between its thrust and the current supplied to the linear motor 11 is proportional, and the direction of the thrust can be changed by changing the direction of the current. Therefore, by changing the direction and amount of current supplied to the linear motor 11, the force that tightens the wire 7 can be controlled.

Next, its operation will be explained.

When a current is supplied to the linear motor 11, the lever 2 rotates clockwise about the rotation shaft 6, and the clamp piece 3 attached to the tip thereof clamps the wire 7. Furthermore, when a current in the opposite direction is supplied to the linear motor 11, the lever 2 rotates counterclockwise about the rotation shaft 6, and the clamp piece 3 attached to the tip thereof opens to release the wire 7.

Furthermore, the linear motor 11 can be adjusted according to the wire diameter used.
By varying the amount of current supplied to the linear motor 11 and controlling the thrust of the linear motor 11, the wire 7 can be held with an appropriate pressure.

Effects of the Invention As is clear from the above embodiments, the present invention enables the clamping pressure of the wire to be controlled by current control, and there is no need to perform mechanical adjustment even when the wire diameter changes. This has the advantage that the workability of the bonding device can be improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a wire clamper portion of a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of a wire clamper portion of a conventional wire bonding apparatus. 2... Lever 3... Clamp piece, 7... Wire, 9... Ultrasonic horn, 10... Capillary, 11... ...Linear motor.

Claims (1)

[Claims] A wire bonding device that feeds a wire through a clamp piece provided at one end of a lever and a capillary provided to an ultrasonic horn, and crimps the wire to an electrode of a semiconductor element, etc., in which a linear motor is used to drive the lever,
A wire bonding device in which the opening and closing of the wire holding by the clamp piece and the fastening force can be adjusted by controlling the direction and amount of current supplied to the linear motor.