JPH03230595A - Flexible printed circuit board - Google Patents

Flexible printed circuit board

Info

Publication number
JPH03230595A
JPH03230595A JP2657490A JP2657490A JPH03230595A JP H03230595 A JPH03230595 A JP H03230595A JP 2657490 A JP2657490 A JP 2657490A JP 2657490 A JP2657490 A JP 2657490A JP H03230595 A JPH03230595 A JP H03230595A
Authority
JP
Japan
Prior art keywords
film
flexible printed
printed circuit
circuit board
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2657490A
Other languages
Japanese (ja)
Inventor
Yasufumi Miyake
康文 三宅
Haruhiko Kitamura
北村 晴彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2657490A priority Critical patent/JPH03230595A/en
Publication of JPH03230595A publication Critical patent/JPH03230595A/en
Pending legal-status Critical Current

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the breakage of a wire from being generated even by repeating a bend or a stretch by positioning the peak portion or the through portion of a waveform in the end portion of the approximate boundary of the waveform of a film-like insulator on the terminal portions of a band-like conductor. CONSTITUTION:A metallic foil such as a copper foil is adhered to a film 1 which is a base film by using an epoxy resin adhesive and, by applying etching thereto, a prescribed conductor circuit 3 formed. On the other hand, a semicircular projected portion 16 is formed by processing a portion wherein the boundary end portion 11 of a film which is used as a cover lay film to which the epoxy resin adhesive is applied in advance overlaps the upper surface of a linear conductor terminal portion 3a laminated on a board 2 to be adhered. Then, a flexible printed circuit board is manufactured by laminating the cover lay film 5 with the adhesive on the base film 1. At this time, a positioning is conducted so that the semicircular projected portion 16 of the cover lay film 5 is laminated on the upper surface of the linear conductor terminal portion 3a. Thus, the concentration of stress is dispersed and the conductor circuit 3 can be prevented from being broken.

Description

【発明の詳細な説明】 (産業上の利用分野〕 この発明は、高精度な電子機器等に使用されるフレキシ
ブルプリントM板に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a flexible printed M board used in high-precision electronic equipment and the like.

〔従来の技術〕[Conventional technology]

フレキシブルプリン)!板は、ワープロ等のオフィス機
器をはじめ、広い分野にわたって使用されている。この
種のフレキシブルプリント基板6は、通常、第4図に示
すように、ポリエステル。
Flexible pudding)! Boards are used in a wide range of fields, including office equipment such as word processors. This type of flexible printed circuit board 6 is usually made of polyester, as shown in FIG.

ポリイミド等のプラスチック絶縁フィルムからなルベー
スフイルム1に、接着剤層2を介して銅箔、アルミニウ
ム箔等の金属箔を貼着しエツチングして導体回路3を形
成し、さらに、上記導体回路3上に、カバーレイフィル
ム用接着剤層4を介してポリマーフィルムからなるカバ
ーレイフィルム5bを積層することにより形成されてい
る。この基板6では、上記導体回路3の端部が露出する
よう、カバーレイフィルム5bの端部が除去されている
。3aは導体回路3から上記露出部に帯状に延びる線状
導体端子部である。このようなフレキシブルプリント基
板6は、通常、上記線状導体端子部3aの部分を、他の
フレキシブルプリント基板に接続するために折り曲げた
りして使用されている。
A conductor circuit 3 is formed by pasting a metal foil such as copper foil or aluminum foil through an adhesive layer 2 to a base film 1 made of a plastic insulating film such as polyimide, and etching it. It is formed by laminating a coverlay film 5b made of a polymer film on the coverlay film with an adhesive layer 4 for coverlay film interposed therebetween. In this substrate 6, the end of the coverlay film 5b is removed so that the end of the conductor circuit 3 is exposed. 3a is a linear conductor terminal portion extending in a strip shape from the conductor circuit 3 to the exposed portion. Such a flexible printed circuit board 6 is usually used by bending the linear conductor terminal portion 3a in order to connect it to another flexible printed circuit board.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、近年、電子機器の小形および軽量化に伴い、
これら電子機器に使用されるフレキシブルプリント基板
も過酷な条件(折り曲げ角度の極小化)で使用されるよ
うになっている。
By the way, in recent years, as electronic devices have become smaller and lighter,
The flexible printed circuit boards used in these electronic devices are also being used under harsh conditions (minimization of bending angles).

しかしながら、上記のような構造のフレキシブルプリン
ト基板6は、第4図に示すように、カバーレイフィルム
5bの境界端部が直線的に形成されているため、上記フ
レキシブルプリント基板6の実装時に端子部3aを矢印
Y方向に折り曲げるとカバーレイフィルム5bの境界端
部がら急角度に折れ曲がり、;線状導体端子部3aの屈
曲部分(カバーレイフィルム5bの境界端部)7に応力
(ストレス)が集中し、断線破壊が生じるという問題を
有している。また、上記フレキシブルプリント基板にお
いて、実装時に断線が生しなくても、時間の経過ととも
に、そのフレキシブルプリント基板6を用いた電子機器
の作動中におけるフレキシブルプリント基板6の屈曲、
延伸の繰り返しによりフレキシブルプリント基板6の屈
曲部分7にストレスが集中し金属疲労により断線すると
いう不都合な事態が生じる。このような断線が生じる結
果、電子機器の信顛性が大幅に低下するこのような屈曲
における導体回路3の破断を防止するために、第5図(
a)および(b)に示すような提案がなされている。す
なわち、ベースフィルム1の両面に接着剤層2を積層し
、そのいずれが−方の面に導体回路3を形成する。そし
て、この導体回路3の表面および上記ベースフィルム1
の他面に絶縁被膜N8,9を設け、導体回路3の形成さ
れていない面の絶縁被覆層8の一部を除去してベースフ
ィルムlの一部分を露呈する。この場合、絶縁被覆層8
の一部の除去跡である境界端部8aは鋸歯状に形成され
ている。このように、絶縁被膜層8の境界端部8aを鋸
歯状に形成すると、第5図(b)において鋸歯状部を矢
印Z方向に折り曲げても、直線的に折り曲がらないこと
から、屈曲部分にストレスが集中せず導体回路3の断線
を防止することができる。
However, in the flexible printed circuit board 6 having the above structure, as shown in FIG. 4, the boundary edge of the coverlay film 5b is formed in a straight line. When 3a is bent in the direction of arrow Y, the boundary edge of the coverlay film 5b is bent at a sharp angle; stress is concentrated on the bent portion 7 of the linear conductor terminal portion 3a (the boundary edge of the coverlay film 5b). However, there is a problem in that wire breakage occurs. In addition, in the above-mentioned flexible printed circuit board, even if there is no disconnection during mounting, the flexible printed circuit board 6 may bend over time during operation of an electronic device using the flexible printed circuit board 6.
Repeated stretching causes stress to concentrate on the bent portion 7 of the flexible printed circuit board 6, causing an inconvenient situation in which the wire breaks due to metal fatigue. As a result of such disconnection, the reliability of electronic equipment is significantly reduced. In order to prevent the conductor circuit 3 from breaking due to such bending,
Proposals as shown in a) and (b) have been made. That is, the adhesive layer 2 is laminated on both sides of the base film 1, and the conductor circuit 3 is formed on either side of the negative side. The surface of this conductor circuit 3 and the base film 1
Insulating coatings N8 and 9 are provided on the other surface, and a portion of the insulating coating layer 8 on the surface on which the conductor circuit 3 is not formed is removed to expose a portion of the base film l. In this case, the insulation coating layer 8
The boundary end 8a, which is a part of the removal trace, is formed in a sawtooth shape. In this way, when the boundary end 8a of the insulating coating layer 8 is formed in a sawtooth shape, even if the sawtooth part is bent in the direction of arrow Z in FIG. 5(b), it will not be bent linearly. Since stress is not concentrated on the conductor circuit 3, breakage of the conductor circuit 3 can be prevented.

しかし、このように絶縁被膜層8の境界端部8aを鋸歯
状に形成したフレキシブルプリン)M板10を用いても
、実装時に折り曲げたりすると、境界端部8a付近で導
体回路3の破断が実際に生じ、やはり屈曲による導体回
路3の破断を効果的に防止することは困難である。
However, even if the flexible printed M board 10 in which the boundary edge 8a of the insulating coating layer 8 is formed into a sawtooth shape is used, if it is bent during mounting, the conductor circuit 3 may actually break near the boundary edge 8a. It is also difficult to effectively prevent the conductor circuit 3 from breaking due to bending.

この発明は、このような事情に鑑みなされたもので、屈
曲による断線の生起しないフレキシブルプリント基板の
提供をその目的とする。
The present invention was made in view of the above circumstances, and an object of the present invention is to provide a flexible printed circuit board that does not cause disconnection due to bending.

[課題を解決するための手段] 上記の目的を達成するため、この発明のフレキシブルプ
リント基板は、複数の帯状導体が基板面上に所定間隔を
保って並設され、上記基板面が端部を残してフィルム状
絶縁体により被覆されたフレキシブルプリント基板にお
いて、上記基板面の端部上に複数の帯状導体の端部が並
列状で露呈しており、かつ上記フィルム状絶縁体の境界
端部が、それらの帯状導体の端部を横切るように形成さ
れているとともに略波形形状に設定され、その波形の冬
山の部分もしくは各谷の部分が上記露呈している各帯状
導体の端部上に位置決めされているという構成をとる。
[Means for Solving the Problems] In order to achieve the above object, the flexible printed circuit board of the present invention has a plurality of strip-shaped conductors arranged in parallel on the board surface at a predetermined interval, and the board surface has an end portion. In a flexible printed circuit board that is covered with a film-like insulator, the ends of a plurality of strip-shaped conductors are exposed in parallel on the edge of the board surface, and the boundary end of the film-like insulator is exposed. , are formed to cross the ends of those strip conductors and are set in a substantially waveform shape, and the peak portion or each valley portion of the waveform is positioned on the exposed end of each strip conductor. It is structured as follows.

〔作用] すなわち、この発明のフレキシブルプリント基板は、上
記提案のものとは異なり、基板面の端部に露呈している
各帯状導体の各端部上に、それぞれ、フィルム状絶縁体
の波形境界端部における波形の各山部もしくは谷部が位
置している。すなわち、帯状導体の各端部とフィルム状
絶縁体の波形の冬山部(もしくは各谷部)とが対応した
状態になっている。したがって、基板屈曲時にフィルム
状絶縁体の境界端部が急角度で折れ曲がることがなく、
屈曲部分に応力が集中しない。そのため、この発明のフ
レキシブルプリント基板は、上記提案に係るものよりも
屈曲に対して強い抵抗力をもっており、実装時に屈曲の
みならず実装後の屈曲、延伸の繰り返しによっても断線
が生じない。
[Function] That is, the flexible printed circuit board of the present invention, unlike the above-mentioned proposal, has a wave-shaped boundary of a film-like insulator on each end of each band-shaped conductor exposed at the end of the board surface. Each peak or valley of the waveform at the end is located. In other words, each end of the band-shaped conductor corresponds to the peak portion (or each valley portion) of the waveform of the film-shaped insulator. Therefore, the boundary edge of the film insulator does not bend at a steep angle when the board is bent.
Stress is not concentrated at the bent part. Therefore, the flexible printed circuit board of the present invention has a stronger resistance to bending than the one according to the above proposal, and does not cause wire breakage not only by bending during mounting but also by repeated bending and stretching after mounting.

つぎに、この発明を実施例にもとづいて詳細に説明する
Next, the present invention will be explained in detail based on examples.

第1図は、この発明の一実施例を示す断面斜視図である
。このフレキシブルプリント基板では、ベースフィルム
1の端部および線状導体端子部3aの上面端部が露呈す
るようカバーレイフィルム5が積層され、上記カバーレ
イフィルム5の境界端部11が、線状導体端子部3aを
横切るように形成されかつ半円状凸部16に設定されて
いる。
FIG. 1 is a cross-sectional perspective view showing one embodiment of the present invention. In this flexible printed circuit board, the coverlay film 5 is laminated so that the end of the base film 1 and the upper end of the linear conductor terminal part 3a are exposed, and the boundary end 11 of the coverlay film 5 is A semicircular convex portion 16 is formed so as to cross the terminal portion 3a.

そして、上記半円状凸部16は上記露呈している線状導
体端子部3a上に位置決めされている。なお、上記フレ
キシブルプリント基板は、基本的には第4図と同様の構
造を有するものであり、同一部分には同一符号を付して
いる。
The semicircular convex portion 16 is positioned on the exposed linear conductor terminal portion 3a. The flexible printed circuit board basically has the same structure as that shown in FIG. 4, and the same parts are given the same reference numerals.

このフレキシブルプリント基板は、例えばつぎのように
して製造される。すなわち、ベースフィルムとなるフィ
ルム1上に銅箔等の金属箔をエポキシ樹脂系接着剤を用
いて貼着し、これにエツチングを施すことにより所定の
導体回路3を形成する。一方、予めカバーレイフィルム
として用いるフィルムにエポキシ樹脂系接着剤を塗工し
たものの境界端部11の、貼着する基板1に積層されて
いる線状導体端子部3a上面と重なる部分に金型加工、
トムソン加工を行うことにより半円状凸部16を形成す
る。つぎに、導体回路3が形成されたベースフィルム1
上に、境界端部11に半円状凸部16の設けられた接着
剤付カバーレイフィルム5を積層することにより製造さ
れる。このとき、線状導体端子部3aの上面に接着剤付
カバーレイフィルム5の半円状曲部分16が積層される
ように位置決めする必要がある。
This flexible printed circuit board is manufactured, for example, as follows. That is, a metal foil such as a copper foil is adhered onto a film 1 serving as a base film using an epoxy resin adhesive and etched to form a predetermined conductor circuit 3. On the other hand, a mold is formed on the boundary end 11 of a film used as a coverlay film coated with an epoxy resin adhesive in advance, in a portion that overlaps with the upper surface of the linear conductor terminal portion 3a laminated on the substrate 1 to be adhered. ,
A semicircular convex portion 16 is formed by Thomson processing. Next, the base film 1 on which the conductor circuit 3 is formed
It is manufactured by laminating an adhesive-backed coverlay film 5 on which a semicircular convex portion 16 is provided at the boundary end portion 11. At this time, it is necessary to position the semicircular curved portion 16 of the adhesive-backed coverlay film 5 so that it is laminated on the upper surface of the linear conductor terminal portion 3a.

このようにして得られるフレキシブルプリント基板は、
複数の線状導体端子部3aの上面に接着剤付カバーレイ
フィルム5の境界端部11に設けられた半円状凸部16
が位置決めされているため、実装時に接着剤付カバーレ
イフィルム5の境界端部1■から折り曲げたりしても急
角度に屈曲せず、境界端部11の半円状凸部16と他の
部分の2個所で緩やかに屈曲する。したがって、応力の
集中が分散し導体回路3の破断を防止することができる
The flexible printed circuit board obtained in this way is
A semicircular convex portion 16 provided at the boundary end portion 11 of the coverlay film 5 with adhesive on the upper surface of the plurality of linear conductor terminal portions 3a.
is positioned, so even if the coverlay film 5 with adhesive is bent from the boundary edge 1■ during mounting, it will not bend at a steep angle, and the semicircular convex portion 16 of the boundary edge 11 and other parts It bends gently at two places. Therefore, concentration of stress is dispersed and breakage of the conductor circuit 3 can be prevented.

第2図はこの発明のフレキシブルプリント基板の他の実
施例を示している。このフレキシブルプリント基板は、
接着剤付カバーレイフィルム5Cの境界端部11aに半
円状切り欠き部12が設けられており、上記半円状切り
欠き部12が線状導体端子部3a上に位置決めされてい
る。なお、上記実施例において同一部分には同一符号を
付している。
FIG. 2 shows another embodiment of the flexible printed circuit board of the present invention. This flexible printed circuit board is
A semicircular notch 12 is provided at the boundary end 11a of the adhesive-backed coverlay film 5C, and the semicircular notch 12 is positioned over the linear conductor terminal 3a. Note that in the above embodiments, the same parts are given the same reference numerals.

第3図はこの発明のフレキシブルプリン)M板のさらに
他の実施例を示している。このフレキシブルプリント基
板では、接着剤付カバーレイフィルム5aの境界端部1
5が波形形状に形成されており、線状導体端子部3a上
に上記波形形状の山部が位置決めされている。
FIG. 3 shows still another embodiment of the flexible pudding M board of the present invention. In this flexible printed circuit board, the boundary end 1 of the coverlay film 5a with adhesive is
5 is formed in a wavy shape, and the peak portion of the wavy shape is positioned on the linear conductor terminal portion 3a.

なお、接着剤付カバーレイフィルムの境界端部の形状と
しては、上記第1図に示すような半円状凸部を有するも
の、第2図に示すような半円状切り欠き部を有するもの
、および第3図に示すような波形形状に限定するもので
はなく、例えば第3図に示すように波形状、鋸歯状、矩
形状等があげられ、このような略波形形状が形成された
境界端部を有するカバーレイフィルムを用いその境界端
部の谷部もしくは山部が線状導体端子部3a上に位置決
めされることにより上記実施例と同様の効果が得られる
Note that the shape of the boundary end of the coverlay film with adhesive is one having a semicircular convex part as shown in Fig. 1 above, and one having a semicircular notch part as shown in Fig. 2. , and is not limited to the waveform shape as shown in FIG. 3, but includes, for example, a waveform, sawtooth shape, rectangular shape, etc. as shown in FIG. 3, and a boundary formed with such a substantially waveform shape Effects similar to those of the above embodiment can be obtained by using a coverlay film having edges and positioning the troughs or peaks of the boundary edges over the linear conductor terminals 3a.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明のフレキシブルプリント基板は
、帯状導体端子部上にフィルム状絶縁体の略波形境界端
部における波形の各山部も(しは谷部が位置決めされて
いるため、フィルム状絶縁体の境界端部で折り曲げたり
しても急角度で折れ曲がることがなく屈曲部分の応力の
集中が分散される。このため屈曲に対して強い抵抗力を
有しており、実装時の屈曲のみならず実装後の屈曲、延
伸の繰り返しによっても断線が生じない。
As described above, in the flexible printed circuit board of the present invention, since each peak (or trough) of the waveform at the substantially waveform boundary end of the film insulator is positioned on the strip conductor terminal portion, the film Even if it is bent at the boundary edge of the insulator, it will not bend at a sharp angle, and the concentration of stress at the bent part will be dispersed.For this reason, it has strong resistance to bending, and only bends during mounting. Moreover, even after repeated bending and stretching after mounting, wire breakage does not occur.

つぎに、具体例について説明する。Next, a specific example will be explained.

〔具体例1〕 厚み25μmのポリイミドフィルム(カプトン100 
H、デュポン社製)をベースフィルムおよびカバーレイ
フィルム材料として準備すると同時に、厚み17.5μ
mの銅箔(1/20Z電解銅箔)を準備した。一方、上
記カバーレイフィルム材料として使用する接着剤付ポリ
イミドフィルムの境界端部に、トムソン加工により第1
図に示すような半円状凸部16を設けた。そして、ベー
スフィルム1上に、エポキシ樹脂系接着剤を使用して上
記銅箔を貼着し、その状態でエツチングを施し所定の導
体回路3を形成した。つぎに、線状導体端子部3a上に
上記接着剤付カバーレイフィルム5の境界端部11の半
円状凸部16が重なるように位置決めし、接着剤付カバ
ーレイフィルム5cを積層し、温度150°C,1時間
で硬化させ第3図に示すようなフレキシブルプリント基
板を得た。
[Specific Example 1] Polyimide film with a thickness of 25 μm (Kapton 100
H, manufactured by DuPont) as the base film and coverlay film material, and at the same time, a film with a thickness of 17.5μ
m copper foil (1/20Z electrolytic copper foil) was prepared. On the other hand, the boundary edge of the polyimide film with adhesive used as the above-mentioned coverlay film material was treated with a first layer by Thomson processing.
A semicircular convex portion 16 as shown in the figure was provided. Then, the copper foil was adhered onto the base film 1 using an epoxy resin adhesive and etched in that state to form a predetermined conductor circuit 3. Next, the coverlay film 5 with adhesive is positioned so that the semicircular convex portion 16 of the boundary end 11 overlaps the linear conductor terminal 3a, the coverlay film 5c with adhesive is laminated, and the temperature is It was cured at 150°C for 1 hour to obtain a flexible printed circuit board as shown in FIG.

〔具体例2〕 第2図に示すように境界端部11に半円状切り欠き部1
2が設けられた接着剤付カバーレイフィルム5cを用い
、線状導体端子部3aの上面に上記カバーレイフィルム
5cの境界端部の半円状切り欠き部12が重なるように
接着剤付カバーレイフィルム5cを位置決めし重ねた。
[Specific Example 2] As shown in FIG.
2 is provided with an adhesive-backed coverlay film 5c, and the adhesive-backed coverlay film 5c is placed so that the semicircular notch 12 at the boundary end of the coverlay film 5c overlaps the upper surface of the linear conductor terminal portion 3a. The film 5c was positioned and stacked.

それ以外は実施例1と同様にして第2図に示すようにフ
レキシブルプリント基板を得た。
A flexible printed circuit board as shown in FIG. 2 was obtained in the same manner as in Example 1 except for the above.

〔比較例1〕 境界端部が直線状の接着剤付カバーレイフィルム5bを
用いた。それ以外は実施例1と同様にして第4図に示す
ようなフレキシブルプリント基板を得た。
[Comparative Example 1] An adhesive-attached coverlay film 5b having a straight boundary edge portion was used. Other than that, a flexible printed circuit board as shown in FIG. 4 was obtained in the same manner as in Example 1.

〔比較例2〕 第5図(a)および(b)に示すように、ベースフィル
ム1の片面に導体回路3を形成し、この導体回路3表面
および上記ベースフィルム1の他面にカバーレイフィル
ム8.9を接着剤を介して形成されたフレキシブルプリ
ント基板を得た。この際、導体回路3の形成されていな
い面に設けられるカバーレイフィルム8の境界端部は鋸
歯状に形成されている。そして、この境界端部の鋸歯状
の凹凸と線状導体端子部3aとは図示のように合致して
いない。
[Comparative Example 2] As shown in FIGS. 5(a) and 5(b), a conductor circuit 3 is formed on one side of the base film 1, and a coverlay film is formed on the surface of the conductor circuit 3 and the other side of the base film 1. A flexible printed circuit board was obtained using 8.9 using an adhesive. At this time, the boundary edge of the coverlay film 8 provided on the surface where the conductor circuit 3 is not formed is formed in a sawtooth shape. The sawtooth-like unevenness of this boundary end portion and the linear conductor terminal portion 3a do not match as shown in the figure.

上記のようにして得られた具体例1.2品およヒ比較例
1,2品を用いて、カバーレイフィルム形成面方向く第
1図の矢印P方向、第2図の矢印X方向、第4図の矢印
Y方向、第5図(b)の矢印Z方向〉にカバーレイフィ
ルム境界端部から折′り曲げる屈曲性破断試験を行い、
それぞれの耐破壊特性を評価した。その結果を、下記の
表に示した。なお、上記耐破断特性は、500gの荷重
で折り曲げ角度0.38R,135°による折り曲げを
繰り返すという試験を行い、線状導体端子部の破断の生
じた回数を示すことにより評価した。
Using the specific examples 1 and 2 and comparative examples 1 and 2 obtained as described above, in the direction of the coverlay film forming surface, in the direction of arrow P in FIG. 1, in the direction of arrow X in FIG. A bending rupture test was performed by bending the coverlay film from the boundary edge in the direction of arrow Y in FIG. 4 and in the direction of arrow Z in FIG. 5(b).
The fracture resistance properties of each were evaluated. The results are shown in the table below. The above-mentioned breakage resistance was evaluated by conducting a test in which bending was repeated at bending angles of 0.38R and 135° under a load of 500g, and by indicating the number of times the linear conductor terminal portion broke.

上記の表の結果から明らかなように、実施測高はいずれ
も屈曲破断回数が比較測高に比べて大幅に向上しており
、高信頼性が得られることがわかる。
As is clear from the results in the table above, the number of bending breaks in all of the implemented height measurements was significantly improved compared to the comparative height measurements, indicating that high reliability was obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例を示す構成図、第2図はこ
の発明の他の実施例を示す構成図、第3図はこの発明の
さらに他の実施例を示す構成図、第4図の従来のフレキ
シブルプリント基板を示す構成図、第5図(a)は従来
のフレキシブルプリント基板を示す上面図、第5図(b
)はこのAA′断面図である。 1・・・ベースフィルム 3・・・導体回R3a・・・
線状導体端子部 5・・・接着剤付カバーレイフィルム
11・・・カバーレイフィルム境界端部 16・・・半
円状凸部
FIG. 1 is a block diagram showing one embodiment of this invention, FIG. 2 is a block diagram showing another embodiment of this invention, FIG. 3 is a block diagram showing still another embodiment of this invention, and FIG. 5(a) is a top view showing a conventional flexible printed circuit board, and FIG. 5(b) is a top view showing a conventional flexible printed circuit board.
) is this AA' sectional view. 1...Base film 3...Conductor circuit R3a...
Linear conductor terminal portion 5... Coverlay film with adhesive 11... Coverlay film boundary end portion 16... Semicircular convex portion

Claims (1)

【特許請求の範囲】[Claims] (1)複数の帯状導体が基板面上に所定間隔を保つて並
設され、上記基板面が端部を残してフィルム状絶縁体に
より被覆されたフレキシブルプリント基板において、上
記基板面の端部上に複数の帯状導体の端部が並列状で露
呈しており、かつ上記フィルム状絶縁体の境界端部が、
それらの帯状導体の端部を横切るように形成されている
とともに略波形形状に設定され、その波形の各山の部分
もしくは各谷の部分が上記露呈している各帯状導体の端
部上に位置決めされていることを特徴とするフレキシブ
ルプリント基板。
(1) In a flexible printed circuit board in which a plurality of band-shaped conductors are arranged in parallel on a board surface at predetermined intervals, and the board surface is covered with a film-like insulator except for the ends, the ends of the board surface are covered with a film-like insulator. The ends of the plurality of strip conductors are exposed in parallel, and the boundary end of the film insulator is
It is formed to cross the ends of these strip conductors and is set in a substantially waveform shape, and each peak or valley of the waveform is positioned on the exposed end of each strip conductor. A flexible printed circuit board characterized by:
JP2657490A 1990-02-05 1990-02-05 Flexible printed circuit board Pending JPH03230595A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2657490A JPH03230595A (en) 1990-02-05 1990-02-05 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2657490A JPH03230595A (en) 1990-02-05 1990-02-05 Flexible printed circuit board

Publications (1)

Publication Number Publication Date
JPH03230595A true JPH03230595A (en) 1991-10-14

Family

ID=12197324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2657490A Pending JPH03230595A (en) 1990-02-05 1990-02-05 Flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPH03230595A (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499578U (en) * 1991-01-28 1992-08-27
JPH09289369A (en) * 1996-02-19 1997-11-04 Asahi Optical Co Ltd FPC board
JPH10341068A (en) * 1997-06-06 1998-12-22 Sony Corp Printed wiring board and electronic component mounting method
JP2005311106A (en) * 2004-04-22 2005-11-04 Nitto Denko Corp Printed circuit board
JP2006190989A (en) * 2005-01-06 2006-07-20 Samsung Electronics Co Ltd Carrier film, display device having the same, and manufacturing method thereof
KR100735439B1 (en) * 2005-10-18 2007-07-04 삼성전기주식회사 FPCB with reinforced connector
JP2007208200A (en) * 2006-02-06 2007-08-16 Canon Inc Junction structure of printed wiring board and bonding method of printed wiring board
JP2011253979A (en) * 2010-06-03 2011-12-15 Sumitomo Electric Printed Circuit Inc Connecting structure of printed wiring board, wiring board connector and electronic device
KR101143530B1 (en) * 2010-08-09 2012-05-09 삼성전기주식회사 Printed circuit board and method for manufacturing the same
WO2013027542A1 (en) * 2011-08-23 2013-02-28 住友電工プリントサーキット株式会社 Flexible printed circuit board and method for producing flexible printed circuit board
CN103118488A (en) * 2011-11-17 2013-05-22 深圳市比亚迪电子部品件有限公司 Flexible printed circuit board
JP2013135172A (en) * 2011-12-27 2013-07-08 Sumitomo Electric Printed Circuit Inc Printed wiring board and connection structure of printed wiring board
JP2013254550A (en) * 2012-06-08 2013-12-19 Dainippon Printing Co Ltd Flexure substrate for suspension
JP2013254549A (en) * 2012-06-08 2013-12-19 Dainippon Printing Co Ltd Flexure substrate for suspension
JP2014013638A (en) * 2011-10-03 2014-01-23 Dainippon Printing Co Ltd Suspension flexure substrate
KR20160129241A (en) * 2015-04-30 2016-11-09 엘지이노텍 주식회사 Printed circuit board, lens driving unit and camera module including the same
JP2018040977A (en) * 2016-09-08 2018-03-15 株式会社ジャパンディスプレイ Display device
CN108551720A (en) * 2015-12-29 2018-09-18 广东欧珀移动通信有限公司 Flexible PCB and mobile terminal
WO2019043933A1 (en) * 2017-09-04 2019-03-07 三菱電機株式会社 Flexible substrate and optical module
CN112363292A (en) * 2015-04-30 2021-02-12 Lg伊诺特有限公司 lens shifter
WO2022102161A1 (en) * 2020-11-12 2022-05-19 株式会社フジクラ Printed wiring board
JPWO2023171294A1 (en) * 2022-03-08 2023-09-14

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499578U (en) * 1991-01-28 1992-08-27
JPH09289369A (en) * 1996-02-19 1997-11-04 Asahi Optical Co Ltd FPC board
JPH10341068A (en) * 1997-06-06 1998-12-22 Sony Corp Printed wiring board and electronic component mounting method
JP2005311106A (en) * 2004-04-22 2005-11-04 Nitto Denko Corp Printed circuit board
JP2006190989A (en) * 2005-01-06 2006-07-20 Samsung Electronics Co Ltd Carrier film, display device having the same, and manufacturing method thereof
KR100735439B1 (en) * 2005-10-18 2007-07-04 삼성전기주식회사 FPCB with reinforced connector
JP2007208200A (en) * 2006-02-06 2007-08-16 Canon Inc Junction structure of printed wiring board and bonding method of printed wiring board
JP2011253979A (en) * 2010-06-03 2011-12-15 Sumitomo Electric Printed Circuit Inc Connecting structure of printed wiring board, wiring board connector and electronic device
KR101143530B1 (en) * 2010-08-09 2012-05-09 삼성전기주식회사 Printed circuit board and method for manufacturing the same
WO2013027542A1 (en) * 2011-08-23 2013-02-28 住友電工プリントサーキット株式会社 Flexible printed circuit board and method for producing flexible printed circuit board
JP2013045818A (en) * 2011-08-23 2013-03-04 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board and method of manufacturing flexible printed wiring board
JP2014013638A (en) * 2011-10-03 2014-01-23 Dainippon Printing Co Ltd Suspension flexure substrate
CN103118488A (en) * 2011-11-17 2013-05-22 深圳市比亚迪电子部品件有限公司 Flexible printed circuit board
JP2013135172A (en) * 2011-12-27 2013-07-08 Sumitomo Electric Printed Circuit Inc Printed wiring board and connection structure of printed wiring board
JP2013254549A (en) * 2012-06-08 2013-12-19 Dainippon Printing Co Ltd Flexure substrate for suspension
JP2013254550A (en) * 2012-06-08 2013-12-19 Dainippon Printing Co Ltd Flexure substrate for suspension
KR20230069063A (en) * 2015-04-30 2023-05-18 엘지이노텍 주식회사 Lens driving unit and camera module including the same
CN112363292A (en) * 2015-04-30 2021-02-12 Lg伊诺特有限公司 lens shifter
US11237352B2 (en) 2015-04-30 2022-02-01 Lg Innotek Co., Ltd. Lens moving apparatus and camera module and optical device including the same
KR20160129241A (en) * 2015-04-30 2016-11-09 엘지이노텍 주식회사 Printed circuit board, lens driving unit and camera module including the same
CN112363292B (en) * 2015-04-30 2023-08-18 Lg伊诺特有限公司 lens shifter
US11988892B2 (en) 2015-04-30 2024-05-21 Lg Innotek Co., Ltd. Lens moving apparatus and camera module and optical device including the same
CN108551720A (en) * 2015-12-29 2018-09-18 广东欧珀移动通信有限公司 Flexible PCB and mobile terminal
JP2018040977A (en) * 2016-09-08 2018-03-15 株式会社ジャパンディスプレイ Display device
WO2019043933A1 (en) * 2017-09-04 2019-03-07 三菱電機株式会社 Flexible substrate and optical module
JPWO2019043933A1 (en) * 2017-09-04 2019-11-07 三菱電機株式会社 Flexible substrate and optical module
WO2022102161A1 (en) * 2020-11-12 2022-05-19 株式会社フジクラ Printed wiring board
JPWO2023171294A1 (en) * 2022-03-08 2023-09-14
WO2023171294A1 (en) * 2022-03-08 2023-09-14 株式会社村田製作所 Stretchable device

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