JPH0323612A - Electric component for face-mounting use - Google Patents

Abstract

PURPOSE:To enhance a mounting density by a method wherein joints of lead wires are formed so as to be nearly parallel in mutually opposite directions on the same face inside a nearly projected area of a face faced with a circuit board of a component main body. CONSTITUTION:Joints 4, 4 are arranged in a rectangular shape which surrounds a face nearly identical to a projected face of the bottom 2 of a component main body 1; an interval between opposite bent parts 4b, 4b is a little wider than a thickness of the main body 1; the joints of lead wires 3, 3 are arranged inside a nearly projected face with reference to a circuit board of the main body 1. When this electric component is face-mounted on the circuit board, the main body 1 is supported vertically by the wires 3 which support the main body 1 perpendicularly to a mounting face, and is face-mounted on the circuit board. Thereby, a mounting density can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to surface-mounted electrical components such as capacitors, and relates to lead wires for electrical components mounted on a circuit board.

(Conventional technology) A capacitor surface-mounted on a conventional circuit board? All electrical components are surface-mounted by placing the electrical component body directly on the circuit board and connecting lead wires drawn out from the component body to the circuit board.

(Problems to be Solved by the Invention) In the above conventional structure for connecting electrical components to a circuit board, the lead wire connects the mounting area of the component body placed on the circuit board and the lead wire pulled out from the component body. This requires a large mounting area, resulting in a large circuit board and low mounting density.

The present invention was made in view of the above problems, and the present invention is a circuit board in which the electrical component body is not placed directly on the circuit board, but is placed on its own with lead wires, increasing the packaging density. The present invention provides a surface-mounted electrical component that can be made compact.

[Structure of the invention]

(Means for Solving the Problems) A surface mounting electrical component of the present invention includes an electrical component body having a plurality of lead wires connected to a circuit board, and at least two of the lead wires are connected to a circuit board. are bent from the middle part so as to be able to stand on the circuit board, and form substantially parallel connection parts facing each other in opposite directions on the same plane within the approximate projected area of the surface of the component body facing the circuit board. This is what I did.

(Function) In the surface mounting electrical component of the present invention, when the connecting portion of the lead wire drawn out from the electrical component body is placed on the circuit board, the connecting portion of the lead wire is placed on the surface of the component body facing the circuit board. Since the parts are shaped substantially parallel to each other in opposite directions on the same plane within the approximately projected area of The connection portion of the lead wire is placed in contact with the circuit board within a substantially projected area, the surface mounting area of the electrical components is reduced, the structure is simple, and the surface mounting density of the electrical components can be increased.

(Example) An example of the present invention will be explained using a ceramic capacitor shown in FIGS. 1 to 4.

Reference numeral 1 denotes a substantially disk-shaped electric component body, for example, a ceramic capacitor body, and a pair of lead wires 3, 3 are connected parallel to the disk surface from a bottom surface 2 facing the mounting surface of the circuit board at a part of the circumferential surface. It is being pulled out.

The lead wires 3.3 are folded from the intermediate portion on the same plane perpendicular to the axial direction of the lead wires 3, 3, perpendicular to the thickness direction of the component body 1 and in opposite directions to the first A bent portion 41.0 is formed, and second bent portions 4b, 4·b are formed by bending the first bent portions h, 41 in opposing parallel directions on the same plane. , a connecting portion 4.4 is formed which is bent into a substantially L-shape on the same plane.

The arrangement of the connecting portion 4.4 is a rectangular shape surrounding approximately the same plane as the projection plane of the bottom surface 2 of the component body 1, and the opposing second bent portion 4b
.

When surface mounting this electrical component onto a circuit board,
The connecting parts 4 and 4 of the lead wires 3 and 3 that support the component body 1 perpendicularly are placed in contact with the mounting surface of the circuit board, respectively, and the connecting parts 4 and 4 are connected to the circuit board by soldering or the like. The component body 1 is vertically supported by the lead wires 3.3 and surface-mounted on the circuit board.

Next, another embodiment will be explained using a film capacitor shown in FIG.

h is an electric component body, for example, a film capacitor body, and lead wires 3.3 are drawn out from both ends of the long side of the bottom surface 2 of the flat rectangular component body i;
are bent from the intermediate portions in the same plane perpendicular to the axial direction and in mutually opposite directions perpendicular to the width direction of the component main body h to form first bent parts 43 and 4e, and furthermore, the first bent parts 43 and 4e are formed by bending the The bent portions h, 41 are bent in opposing parallel directions along the long side direction of the component body h on the same plane to form the second bent portion 4b. 4b and is bent into a substantially L-shape.
．． 4 is formed.

The arrangement of the connecting portion 4.4 is a rectangular shape surrounding approximately the same plane as the projection plane of the bottom surface 2 of the component body h, and the opposing second bent portion 4.
The distance between b and 4b is slightly wider than the thickness of the component body 1a.

Next, another embodiment will be explained using a differential electrolytic capacitor as shown in FIGS. 6 and 7.

1b is an electrical component body, for example, an electrolytic capacitor body, and a pair of leads extend in the axial direction from the diameter position of the bottom surface 2 of the cylindrical component body 1b with the axial direction being the vertical direction! 3.3 is pulled out, and this lead wire 3.3 is bent 1113 L at right angles in mutually opposite directions on the same plane perpendicular to the axial direction from the intermediate portion to form the first bent portion b, 4! is formed,
Furthermore, the bent portions 4a and 41 are placed on the same plane on the component body 1b.
are bent at right angles in opposite directions from both ends of the diameter thereof to form second folded portions 4b, 4b, and the bent portions 4b. 4b is bent at right angles in opposing directions on the same plane to form third bent parts 4c, 4c, and the first, second,
The connecting portion 4.4 bent into a pair of substantially U-shapes by the third bent portions 43.4b, 4b is the main body of the component! It forms a rectangle that is substantially inscribed in the projection plane of the bottom surface 2 of b.

The mounting of the electrical components shown in FIGS. 5 to 7 on the circuit board is similar to the embodiment shown in FIGS. 1 to 4 described above.

Note that the number of lead wires for the electrical component is not limited to two, and it is sufficient that at least two lead wires have the above-described structure of the broken ribs.

〔Effect of the invention〕

According to the present invention, at least two lead wires of the electrical component main body are bent from the middle part so that they can stand on the circuit board, and are on the same plane within a substantially projected area of the surface of the component main body facing the circuit board. Since the substantially parallel connecting portions are formed in opposite directions above, the lead wires supporting the electrical component body are mounted upright on the circuit board by the connecting portions, so that the packaging density can be increased. Further, since the connecting portions of the lead wires are formed on the same plane, surface mounting on a circuit board is easy and reliable.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a ceramic capacitor showing an embodiment of the present invention, FIG. 2 is a front view of the same, FIG. 3 is a side view of the same,
Fig. 4 is a top bottom view of the same, Fig. 5 is a perspective view of a film capacitor showing another embodiment, Fig. 6 is a perspective view of an electrolytic capacitor showing still another embodiment, and Fig. 7 is a top bottom view of the same. . 1, 1M, lb...Electrical component body, 3...Lead wire, 4...Connection part.

Claims (1)

[Claims] (1) An electrical component body having a plurality of lead wires connected to a circuit board, wherein at least two of the lead wires are bent from an intermediate portion to a surface of the component body facing the circuit board. 1. An electrical component for surface mounting, characterized in that substantially parallel connection portions are formed in opposite directions on the same surface within a substantially projected area of .