JPH0323930U - - Google Patents
Info
- Publication number
- JPH0323930U JPH0323930U JP8306489U JP8306489U JPH0323930U JP H0323930 U JPH0323930 U JP H0323930U JP 8306489 U JP8306489 U JP 8306489U JP 8306489 U JP8306489 U JP 8306489U JP H0323930 U JPH0323930 U JP H0323930U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- camera
- width
- detection point
- image processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 13
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
Landscapes
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例であり、本考案に係
る装置の概略図、第２図及び第３図は本考案の方
法を示す説明図、第４図は従来のテープボンデイ
ング装置の検出方法を示す図である。
１……カメラ、１ａ……カメラヘツド、１ｂ…
…レンズ、１ｃ……照明灯、２……ＸＹテーブル
駆動機構、３……ＸＹθテーブル駆動機構、４…
…テープ、５……チツプ、６……画像処理手段、
７……モニタ、８……テーブル制御部、９……検
出スタート点、１０……リード、１１……検出基
準点、１２……リード先端最終検出点、１３……
設定エリア、１４，１５……検出点。
Figure 1 is an embodiment of the present invention, and is a schematic diagram of the apparatus according to the present invention, Figures 2 and 3 are explanatory diagrams showing the method of the present invention, and Figure 4 is a conventional tape bonding apparatus for detection. FIG. 2 is a diagram illustrating the method. 1...Camera, 1a...Camera head, 1b...
...Lens, 1c...Lighting light, 2...XY table drive mechanism, 3...XYθ table drive mechanism, 4...
...Tape, 5... Chip, 6... Image processing means,
7...Monitor, 8...Table control unit, 9...Detection start point, 10...Lead, 11...Detection reference point, 12...Lead tip final detection point, 13...
Setting area, 14, 15...detection point.
Claims (1)
該カメラを搭載しＸ方向及びＹ方向に移動可能な
ＸＹテーブル駆動機構と、前記カメラにより撮像
された情報を２値化する２値化回路及び該情報を
記憶し制御する制御回路等で構成される画像処理
手段とを備え、前記画像処理手段は、前記カメラ
により撮像された被ボンデイング部品の情報を２
値化回路により２値化した後、予め求められてい
るリードの検出点からリードの幅及び長手方向を
求め、該リードの幅方向と異なる方向に前記カメ
ラを走査させて、リード先端を検出するようにし
たことを特徴とするボンデイング装置。 (2) 前記画像処理手段は、前記リードの検出点
からリードの幅及び長手方向を求め、該リードの
幅方向と直交する方向に前記カメラを走査するよ
うにしたことを特徴とする請求項１記載のボンデ
イング装置。 (3) 前記画像処理手段は、前記リードの検出点
からリードの幅及び長手方向を求め、該リードの
幅方向と直交する方向を基準として所定角度を有
する方向に前記カメラを走査するようにしたこと
を特徴とする請求項１記載のボンデイング装置。 (4) 前記画像処理手段は、前記カメラにより撮
像された被ボンデイング部品の情報を２値化回路
により２値化した後、予め求められているリード
の検出点からリードの幅及び長手方向を求め、該
リードの幅方向と異なる方向に前記カメラを走査
させてリード幅方向の中点を検出し、該検出点か
らリード先端方向に所定回数前記カメラを走査さ
せてリード先端を検出するようにしたことを特徴
とする請求項１記載のボンデイング装置。 (5) 前記画像処理手段は、前記カメラにより撮
像された被ボンデイング部品の情報を２値化回路
により２値化した後、予め求められているリード
の検出点からリードの幅及び長手方向を求め、該
リードの幅方向と異なる方向に前記カメラを走査
させてリード幅方向の中点を検出し、該検出点か
らリード先端方向に所定回数前記カメラを走査さ
せてリード先端を検出した後、該検出点から前記
制御回路により所定のリード幅を検出可能な設定
範囲を設けてリード幅方向と直交する方向に前記
カメラを走査させるようにしたことを特徴とする
請求項４記載のボンデイング装置。[Scope of claim for utility model registration] (1) A camera that takes an image of the parts to be bonded;
It is comprised of an XY table drive mechanism that mounts the camera and is movable in the X and Y directions, a binarization circuit that binarizes information captured by the camera, and a control circuit that stores and controls the information. and an image processing means, wherein the image processing means converts information of the bonding target part imaged by the camera into two parts.
After being binarized by a digitization circuit, the width and longitudinal direction of the lead are determined from a predetermined detection point of the lead, and the camera is scanned in a direction different from the width direction of the lead to detect the tip of the lead. A bonding device characterized by: (2) Claim 1, wherein the image processing means determines the width and longitudinal direction of the lead from the detection point of the lead, and scans the camera in a direction orthogonal to the width direction of the lead. Bonding equipment as described. (3) The image processing means determines the width and longitudinal direction of the lead from the detection point of the lead, and scans the camera in a direction having a predetermined angle with respect to a direction perpendicular to the width direction of the lead. The bonding apparatus according to claim 1, characterized in that: (4) The image processing means binarizes the information of the bonded component imaged by the camera using a binarization circuit, and then determines the width and longitudinal direction of the lead from a predetermined detection point of the lead. , the camera is scanned in a direction different from the width direction of the lead to detect the middle point in the width direction of the lead, and the camera is scanned a predetermined number of times in the direction of the lead tip from the detection point to detect the lead tip. The bonding apparatus according to claim 1, characterized in that: (5) The image processing means binarizes the information of the bonded component imaged by the camera using a binarization circuit, and then determines the width and longitudinal direction of the lead from a predetermined detection point of the lead. , the camera is scanned in a direction different from the width direction of the lead to detect the middle point in the lead width direction, and the camera is scanned a predetermined number of times in the direction of the lead tip from the detection point to detect the lead tip; 5. The bonding apparatus according to claim 4, wherein a setting range is provided in which a predetermined lead width can be detected by the control circuit from a detection point, and the camera is caused to scan in a direction perpendicular to the lead width direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8306489U JPH0735390Y2 (en) | 1989-07-17 | 1989-07-17 | Bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8306489U JPH0735390Y2 (en) | 1989-07-17 | 1989-07-17 | Bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0323930U true JPH0323930U (en) | 1991-03-12 |
| JPH0735390Y2 JPH0735390Y2 (en) | 1995-08-09 |
Family
ID=31630424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8306489U Expired - Lifetime JPH0735390Y2 (en) | 1989-07-17 | 1989-07-17 | Bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735390Y2 (en) |
-
1989
- 1989-07-17 JP JP8306489U patent/JPH0735390Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0735390Y2 (en) | 1995-08-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |