JPH03242544A - humidity sensor - Google Patents

humidity sensor

Info

Publication number
JPH03242544A
JPH03242544A JP3875590A JP3875590A JPH03242544A JP H03242544 A JPH03242544 A JP H03242544A JP 3875590 A JP3875590 A JP 3875590A JP 3875590 A JP3875590 A JP 3875590A JP H03242544 A JPH03242544 A JP H03242544A
Authority
JP
Japan
Prior art keywords
copper particles
dispersed
silica
humidity
stirred
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3875590A
Other languages
Japanese (ja)
Inventor
Masahisa Ikejiri
昌久 池尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP3875590A priority Critical patent/JPH03242544A/en
Publication of JPH03242544A publication Critical patent/JPH03242544A/en
Pending legal-status Critical Current

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  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

PURPOSE:To make a highly accurate sensor easy to use with a low resistance value at a low cost by using a silica film in which copper particles are dispersed as moisture sensing film. CONSTITUTION:25ml of ethanol and 4ml of 0.02N hydrochloric acid are added to 50ml of tetraethoxysilane [Si(OC2H5)4] and stirred up for one hour to hydrolyze the tetraethoxysilane. Then, 10ml of glycerine and 13.5g fine powder silica are added and stirred up for 30 min. Moreover, 23g of copper particles are added and stirred up for 30 min. to make a silica sol in which the copper particles are dispersed. A dip coating of the silica sol thus obtained is applied on an alumina substrate 1 having a comb-shaped electrode 2 formed thereon, dried at 100 deg.C for 10 min. and sintered at 450 deg.C for 30 min. Thus, a silica film 3 in which the copper particles are dispersed is formed to produce a moisture sensing film.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、湿度に対応して素子の電気的特性が変化する
ことにより湿度を検出する湿度センサに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a humidity sensor that detects humidity by changing the electrical characteristics of an element in response to humidity.

[従来の技術] 近年、湿度計測、湿度制御を必要とする分野が増加し、
湿度センサの重要性が認められるようになった。
[Conventional technology] In recent years, the number of fields requiring humidity measurement and humidity control has increased.
The importance of humidity sensors is now recognized.

兄度に対応して素子の電気的特性が変化することにより
湿度を検出する湿度センサには、電解質系、金属系、高
分子系、セラミックス系等があり、それぞれいろいろな
系が研究されているが、現在実用化されているものは、
高分子系およびセラミックス系の湿度センサである。い
ずれも、素子に対する水の吸脱着により、素子の抵抗値
または静電容量が変化する性質を利用したものである。
Humidity sensors that detect humidity by changing the electrical characteristics of the element in response to temperature include electrolyte-based, metal-based, polymer-based, ceramic-based, etc., and various systems are being researched. However, what is currently in practical use is
These are polymer-based and ceramic-based humidity sensors. All of these utilize the property that the resistance value or capacitance of the element changes due to adsorption and desorption of water to the element.

[発明が解決しようとする課題] しかし、従来の湿度センサは、抵抗値が高いため、精度
の良い湿度計を製造するためには、高度な回路技術およ
び実装技術を必要とした。
[Problems to be Solved by the Invention] However, since conventional humidity sensors have a high resistance value, advanced circuit technology and packaging technology are required in order to manufacture a highly accurate hygrometer.

そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは、抵抗値の低い湿度センサを提供
するところにある。
The present invention is intended to solve these problems, and its purpose is to provide a humidity sensor with a low resistance value.

[課題を解決するための手段] 本発明の湿度センサは、銅粒子を分散させたシリカ膜を
感湿膜として用いることを特徴とする。
[Means for Solving the Problems] The humidity sensor of the present invention is characterized in that a silica film in which copper particles are dispersed is used as a humidity sensitive film.

シリカ膜に銅粒子を分散させることにより、抵抗値の低
い湿度センサを得ることができる。
By dispersing copper particles in a silica film, a humidity sensor with low resistance can be obtained.

いやすいことがわかる。It turns out that it is easy to use.

[実施例コ テトラエトキシシラン(S i (OC2H6)4) 
50mlにエタノール25m1.0.02N塩酸4ml
を加え、1時間攪拌することによりテトラエトキシシラ
ンを加水分解した後、グリセリン10m1、微粉末シリ
カ13.5gを加え、30分間攪拌し、さらに銅粒子2
3gを加え、30分間攪拌することにより、銅粒子を分
散させたシリカゾルを作製した。Pt−Pd櫛形電極を
スクリーン印刷により形成したアルミナ基板上に、この
ゾルをデイツプコーティングし、100℃で10分間乾
燥し、450°Cで30分間焼結し、銅粒子を分散させ
たシリカ膜を形成した。
[Example Cotetraethoxysilane (S i (OC2H6)4)
50ml 25ml ethanol1.0.02N hydrochloric acid 4ml
was added and stirred for 1 hour to hydrolyze tetraethoxysilane, then 10 ml of glycerin and 13.5 g of finely powdered silica were added, stirred for 30 minutes, and then copper particles 2
A silica sol in which copper particles were dispersed was prepared by adding 3 g and stirring for 30 minutes. This sol was dip-coated on an alumina substrate on which Pt-Pd comb-shaped electrodes were formed by screen printing, dried at 100°C for 10 minutes, and sintered at 450°C for 30 minutes to form a silica film with copper particles dispersed therein. was formed.

このようにして製作した湿度センサの斜視図を第1図に
示す。第1図において、1は基板、2は電極、3は銅粒
子を分散させたシリカ膜である。
A perspective view of the humidity sensor manufactured in this manner is shown in FIG. In FIG. 1, 1 is a substrate, 2 is an electrode, and 3 is a silica film in which copper particles are dispersed.

本湿度センサの感湿特性を第2図に示す。第2図より、
本発明の湿度センサは、抵抗値が低く、使[発明の効果
] 以上述べたように本発明の湿度センサは、銅粒子を分散
させたシリカ膜を感湿膜として用いるので、抵抗値が低
いため、高度な回路技術および実装技術は必要なく、使
いやすい。したがって、底コスト、高精度な湿度センサ
として、湿度計測、湿度制御を必要とする分野に広く応
用することができる。
Figure 2 shows the humidity sensitivity characteristics of this humidity sensor. From Figure 2,
The humidity sensor of the present invention has a low resistance value and is easy to use. [Effects of the Invention] As described above, the humidity sensor of the present invention has a low resistance value because it uses a silica film in which copper particles are dispersed as a moisture-sensitive film. Therefore, advanced circuit technology and mounting technology are not required and it is easy to use. Therefore, it can be widely applied as a low-cost, high-precision humidity sensor to fields requiring humidity measurement and humidity control.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の湿度センサの斜視図。 1・・・基板 2・・・電極 3・・・銅粒子を分散させたシリカ膜 第2図は、本発明の湿度センサの感湿特性図。 以上 FIG. 1 is a perspective view of the humidity sensor of the present invention. 1... Board 2...electrode 3... Silica film with copper particles dispersed in it FIG. 2 is a diagram showing the humidity sensitivity characteristics of the humidity sensor of the present invention. that's all

Claims (1)

【特許請求の範囲】[Claims] 銅粒子を分散させたシリカ膜を感湿膜として用いること
を特徴とする湿度センサ。
A humidity sensor characterized by using a silica film in which copper particles are dispersed as a moisture-sensitive film.
JP3875590A 1990-02-20 1990-02-20 humidity sensor Pending JPH03242544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3875590A JPH03242544A (en) 1990-02-20 1990-02-20 humidity sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3875590A JPH03242544A (en) 1990-02-20 1990-02-20 humidity sensor

Publications (1)

Publication Number Publication Date
JPH03242544A true JPH03242544A (en) 1991-10-29

Family

ID=12534109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3875590A Pending JPH03242544A (en) 1990-02-20 1990-02-20 humidity sensor

Country Status (1)

Country Link
JP (1) JPH03242544A (en)

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